PROGRAM
Days: Sunday, September 17th Monday, September 18th Tuesday, September 19th Wednesday, September 20th Thursday, September 21st Friday, September 22nd
Sunday, September 17th
View this program: with abstractssession overviewtalk overview
08:00-10:30 Session 1: Tutorial Day 1-2
Chair:
Location: Ulisse
08:00 | Fundamentals of SiC Complementary MOSFETs and JFETs for Advanced IC Applications (abstract) |
09:15 | High Temperature Devices for Aerospace Applications (abstract) |
11:00-12:30 Session 2: Tutorial Day 3
Chair:
Location: Ulisse
11:00 | 2D materials integration on silicon carbide: a root beyond power electronics (abstract) |
13:30-16:00 Session 3: Tutorial Day 4-5
Chair:
Location: Ulisse
13:30 | How SiC brings an added value to MEMS devices ? (abstract) |
14:45 | Novel photonic applications of SiC (abstract) |
16:30-18:00 Session 4: Tutorial Day 6
Chair:
Location: Ulisse
16:30 | Silicon Carbide Biotechnology There is more to SiC than power electronics! (abstract) |
Monday, September 18th
View this program: with abstractssession overviewtalk overview
09:00-10:30 Session 6: Plenary I
Chairs:
Location: Auditorium Sirene
09:00 | Technology and Business Development of SiC MOSFET: Retrospect and Prospect (abstract) |
09:40 | Accelerating SiC Mass Commercialization |
11:00-12:30 Session 7A: Devices 1: Novel devices and integration concepts
Chairs:
Location: Auditorium Sirene
11:00-12:30 Session 7B: Defects 1: Extended defects in SiC materials I
Chairs:
Location: Ulisse
11:00 | Study on quantification of correlation between current density and UV irradiation intensity, leading to bar shaped 1SSF expansion |
11:20 | 3-dimensional observation of dislocations in 4H-SiC using focused light birefringence |
11:40 | Wafer-level identification of stacking faults in 4H-SiC epilayers and accurate analysis of overlaid complex structures by high-speed photoluminescence and HR-STEM PRESENTER: Moonkyong Na |
12:00 | Estimation of Influence on Carbon Vacancy regarding 4H-SiC Substrate grown by HTCVD method PRESENTER: Hideyuki Uehigashi |
12:30-14:00 Lunch
Location: Agrumeto
14:00-15:20 Session 8: Plenary II
Chairs:
Location: Auditorium Sirene
14:00 | The golden age of SiC: Turning the potential of SiC into opportunities for energy conversion applications (abstract) |
14:40 | SmartSiC™: a greener, faster and better technology for SiC (abstract) |
16:00-18:00 Session 10A: Poster Session Mo.A
Location: Nettuno
SiC crystal growth behavior via physical vapor transport method dependent on mass transport of sublimed vapor in the SiC source (invited poster) |
Peculiar behaviors of the step-terrace structure formed by single bilayer steps on the (000−1) surface |
Quality improvement of SiC substrate surface with using non-abrasive CMP slurry |
Evidence of twin mediated growth in the CVD of <110> oriented polycrystalline SiC |
Effect of the Source Composition on PVT SiC in Graphite and TaC Coated Crucibles |
Growth of 6 inches V-doped semi-insulating SiC single crystals using V-doped SiC powder as a source via PVT method |
Design optimization of insulating materials for 4H-SiC crystal Ingot growth |
Dislocation behaviors during the initial stage of physical vapor transport growth of 4H-SiC on an off-oriented seed crystal |
Temperature-Dependent Hall Coefficient in Band Conduction Region for Heavily Al-Doped 4H-SiC |
Low-resistivity (1mOhm-cm) 3C-SiC grown by hot-filament CVD |
Channeling, Lateral Range and Diffusion Simulation Capabilities for Ion Implantation Recipe Design |
A Meister solution for optimized grinding of laser split silicon carbide surfaces (abstract) |
Submicron Hyperion Diamond for Silicon Carbide Wafer Polishing (abstract) |
HYPREZ Wafering Solutions: A Novel Approach for Grinding to Clean CMP Solution (abstract) |
Comparative optical metrologies of implanted SiC wafers |
Keypoints for the development of polycrystalline SiC as quasi-substrate for the fabrication of SiC wafers |
High-temperature α-spectroscopy with 4H-SiC based sensors |
Vertical current transport in monolayer MoS2 heterojunctions with 4H-SiC fabricated by sulfurization of ultra-thin MoOx films |
16:00-18:00 Session 10B: Poster Session Mo.B
Location: Foyer Sirene
16:00-18:00 Session 10C: Poster Session Mo.C
Location: Foyer Ulisse
16:01-18:00 Session 11: Poster Session Mo.D
Location: Le Ginestre
Density control of single-photon sources formed at a SiO2/SiC interface (invited poster) |
SiC Sample-and-Hold Circuit for SiC CMOS Image Sensors |
Gate resistance integration in SiC MOSFETs: performance simulations under different implementation methods |
A Physics-based Model for Inversion Layer Mobility in SiC MOSFETs |
A 1200V Low Forward Voltage Drop Silicon Carbide Diode with Trenched Junction-Pinched Barrier Rectifier Structure (TBR) |
Investigation of Parasitic PN Junction Turn-on in 4H-SiC TMBS with P-Shielding |
Effect evaluation and modeling of p-type contact resistance of SiC MOSFET on switching characteristics |
Stress fields distribution and simulation in 3C-SiC resonators. |
Junction-Controlled-Diode-Embedded SiC-MOSFET for Improving Third Quadrant and Turn-on Characteristics PRESENTER: Xuan Li |
Study of parasitic effects in SiC MOSFET switching circuits by comparing measurement and simulation |
A Geometry-Scalable Physically-Based SPICE Compact Model for SiC MPS Diodes Including the Snapback Mechanism |
Frequency investigation of SiC MOSFETs C-V curves with biased Drain |
Device modeling of 4H-SiC pin-photodiodes with shallow implanted Al-emitters for VUV sensor applications |
Single event effects in 3.3 kV 4H-SiC MOSFETs due to MeV ion impact |
Accuracy of Split C-V Characterization of SiC Power MOSFETs |
Fabrication of 6500 V SiC MOSFETs and Applications in the Solid State Transformer |
High Accuracy SPICE Model of 3rd Quadrant Behavior on Both Planar and Trench SiC Power MOSFET |
Comparative Performance Evaluation of High-Voltage Bidirectional, Conventional and Superjunction Planar DMOSFETs in 4H-SiC |
Coupled non-destructive methods, Kelvin Force Probe microscopy and µ-Raman to characterize doping in 4H-SiC power devices |
A Voltage Adjustable Diode Integrated SiC Trench MOSFET With Barrier Control Gate PRESENTER: Xuan Li |
18:00-18:30 Session 12: Industrial Keynote
Chairs:
Location: Auditorium Sirene
18:00 | Driving Clean Energy Adoption and Sustainability: The Pivotal Role of Silicon Carbide Power Electronics Technology (abstract) |
18:30-20:30 Session 13A: Industrial Session A
Chairs:
Location: Auditorium Sirene
18:30 | LPE + ASM – Combination powers SiC growth (abstract) |
18:35 | SiC epi fabrication – 150 & 200 mm G10-SiC epitaxy platform |
18:40 | Trace element analysis of purified graphite material (abstract) |
18:45 | 4H-SiC substrates using the Fast Sublimation Growth Process (abstract) |
18:50 | Screen UV Laser Anneal Technology for next generation of SiC Devices (abstract) |
18:55 | INNOVATION OF DEVICE AND 8-INCH WAFER AS GAME CHANGERS OF SIC MARKET (abstract) PRESENTER: Poshun Chiu |
19:00 | Noncontact High Throughput, High Precision, Electrical Metrology for Wide Bandgap Semiconductors based on Corona Charge Photoneutralization Kinetics |
19:05 | WBG Semiconductor Industry Status and Prospects |
19:10 | In-line characterization of SiC epitaxial layers using high resolution surface photovoltage spectroscopy (HR-SPS) |
19:15 | Application of advanced characterization techniques to SmartSiC™ product for substrate-level device performance optimization |
19:20 | SmartSiC™ substrate: increasing SiC MOSFETs current density from device to module level |
19:25 | How to improve power device / module development efficiency (abstract) |
19:30 | Advanced Carbon film for high-voltage power, high-performance SiC devices |
19:35 | 650 V SiC Power MOSFETs with Statistically Tight VTH Control and RDS,ON of 1.92 mΩ-cm2 PRESENTER: Jaehoon Park |
19:40 | Diamond Grit Size Effects on Grinding of Silicon Carbide Wafers (abstract) |
19:45 | Centrotherm High Temperature Annealing and Oxidation Furnaces (abstract) |
19:50 | Rapid industrialization of SiC trench technologies (abstract) |
18:30-20:30 Session 13B: Industrial Session B
Chairs:
Location: Ulisse
18:30 | Atomic Diffusion Bonding using nitride films and oxide films (abstract) |
18:35 | High-speed, high-resolution, non-contact resistivity and anomaly imaging of boules and wafers (abstract) |
18:40 | Novel Silicon Carbide (SiC) Chemical Mechanical Planarization (CMP) Solutions for Enhanced Performance and Cost of Ownership (abstract) |
18:45 | Ion Implantation Application Overview and Product Requirements for SiC Wafers and Devices (abstract) |
18:50 | How process scaling offers maximum flexibility of SiC wafering along the complete process chain |
18:55 | Sonic Lift-off to Enable Substrate Reuse of Wide Bandgap Semiconductors |
19:00 | Streamlining SiC Boule Fabrication - Optimized Wafer Ready Material |
19:05 | Analysis of Key Factors in High Aspect Ratio Etching of SiC Gate Trench with SF6/O2 Inductively Coupled Plasma |
19:10 | New Generation SiC MPS Diodes with Low Schottky Barrier Height |
19:15 | Total SiC Polishing Process Optimization for Cost of Ownership |
19:20 | Rapid Diamond Mechanical Polishing of SiC Substrates using the IRINO-PRO-C Structured Composite Polishing Pad |
19:25 | Enabling Next Generation WBG Semiconductors Using CVD Technology |
19:30 | Testing challenges for latest SiC devices (abstract) |
19:35 | Answers to SiC wafer and device production challenges (abstract) |
19:40 | SiC Power Device Manufacturing “EFIITRON” ion implanter for Advanced SiC Drift Zone Doping (abstract) |
19:45 | Improvement of SiC film thickness and wafer thickness uniformity by ion beam trimming |
Tuesday, September 19th
View this program: with abstractssession overviewtalk overview
08:30-10:30 Session 14A: Process 1: MOS I
Chairs:
Location: Auditorium Sirene
08:30 | Evaluation and Optimization of the MOS Interface in SiC Power DMOSFETs (invited paper) (abstract) PRESENTER: James A. Cooper |
09:00 | Different temperature dependence of mobility in n- and p-channel 4H-SiC MOSFETs PRESENTER: Xilun Chi |
09:20 | Demonstration of Low Interface Trap Density (~3×1011eV-1cm-2) SiC/SiO2 MOS Capacitor with Excellent Performance using H2+NO POA Treatment for SiC Power Devices |
09:40 | Thermal oxidation of 4H-SiC(0001) surface in a pure CO2 ambient |
10:00 | Carbon dangling-bond energy levels at 4H-SiC(0001)/SiO2 interface determined by EDMR, C–V and first-principles calculation |
08:30-10:30 Session 14B: Defects 2: Extended defects in SiC materials I
Chairs:
Location: Ulisse
08:30 | The Role of Defects on SiC Device Performance and Ways to Mitigate Them (invited paper) PRESENTER: Hrishikesh Das |
09:00 | Mechanism of Stacking Fault multiplication 4H-SiC Epitaxial Layers via an Interaction with Screw and Mixed Dislocations |
09:20 | Effect of Etching Chemistry on Quantification of Dislocation Densities in n+ 4H Silicon Carbide Substrates |
09:40 | Investigating Dislocation Arrays Induced by Seed Scratches during PVT 4H-SiC Crystal Growth using Synchrotron X-Ray Topography |
10:00 | Detailed characterization of defects in SiC using novel birefringence imaging toward identification of device-killer defects |
11:00-12:30 Session 15A: Process 2: MOS II
Chairs:
Location: Auditorium Sirene
11:00 | High-mobility SiC p-channel MOSFETs on nonpolar faces PRESENTER: Kyota Mikami |
11:20 | Increasing mobility in 4H-SiC MOSFETs with deposited oxide by in-situ nitridation of SiC surface PRESENTER: Anthony O'Neill |
11:40 | SNDM study of MOS interface state densities on 3C-SiC and 4H-SiC stacked structure |
12:00 | Improved interface properties in SiC(0001) MOS structures by plasma nitridation of SiC surface prior to SiO2 deposition |
11:00-12:30 Session 15B: Quantum 1: Optical and electrical quantum techniques
Chairs:
Location: Ulisse
11:00 | Vanadium in SiC: the spin for telecom quantum networks (invited paper) (abstract) |
11:30 | Silicon carbide as a host of color centers emitting at telecom bands |
11:50 | Controlling the properties of single photon emitters at SiO2/SiC interfaces by oxidation and annealing |
12:10 | Carbon cluster emitters in silicon carbide |
12:30-14:00 Lunch
Location: Agrumeto
14:00-16:00 Session 16A: Devices 2: SiC MOSFETs technology and modelling
Chairs:
Location: Auditorium Sirene
14:00 | Pushing SiC to its limit: examining the advances in SiC MOSFET technology that will drive cost reduction (invited paper) (abstract) PRESENTER: Peter Gammon |
14:30 | 1.2 kV SiC MOSFET with Low Specific ON-Resistance And High immunity to Parasitic Turn-On |
14:50 | Calibration of Aluminum ion implantation Monte-Carlo model for TCAD simulations in 4H-SiC |
15:10 | Advanced Design Concepts for Next Generation High Voltage SiC MOSFETs with Improved Electrical Performance |
15:30 | Revised Channel Mobility Model for Predictive TCAD Simulations of 4H-SiC MOSFETs |
14:00-16:00 Session 16B: Material 1: The SiC/liquid interface: challenges in controlling SiC growth from solution
Chairs:
Location: Ulisse
14:00 | The SiC/liquid interface: challenges in controlling SiC growth from solution (invited paper) PRESENTER: Didier Chaussende |
14:30 | Analysis of the Effect of Solvent Composition on Suppression of Inclusion in SiC Solution Growth |
14:50 | Influence of the size distribution of the SiC powder source on the shape of the crystal growth interface during PVT growth of 4H-SiC boules |
15:10 | Optimization of Temperature Distribution and Flow Distribution using Machine Learning for 8-Inch SiC Crystal Growth by TSSG Method |
15:30 | Development of Precise Simulation and Machine Learning Models for 4H-SiC Bulk Growth by HTCVD |
16:30-18:30 Session 17A: Poster Session Tu.D
Location: Le Ginestre
16:30-18:30 Session 17B: Poster Session Tu.A
Location: Nettuno
Addition of transition metal into CMP slurry for forming ultra-flat SiC crystal surface |
High-quality SiC crystal growth by temperature gradient control at initial growth stage |
The role of air-pocket in crucible structure for high quality SiC crystal growth |
Confirmation of the growth mechanism of the buffer layer in epitaxial graphene on SiC. |
Buffer layer dependence of defectivity in 200mm 4H-SiC homoepitaxy |
4H-SiC crystal growth using recycled SiC powder source |
Investigating the Influence of Post-Deposition Annealing on the Electrical Properties of Lithium Phosphate Deposited on Silicon Carbide PRESENTER: Hyung-Jin Lee |
Resistivity as a witness of local crystal growth conditions (abstract) |
Characterization of SiC films epitaxially grown by MOCVD with varying nitrogen doping levels on 4H-SiC substrate. |
Suppressing the memory effect in Al doped 3C-SiC grown using chlorinated chemistry |
Masterization of poly-SiC characterization and properties for SmartSiCTM substrates enabling high performance power devices |
Doping Efficiency and Long-Term Stability of Various SiC Epitaxial Reactors and Process Chemistries |
A novel contactless SiC wafer planarization processing after mechanical slicing by dynamical thermal annealing processes |
The Rise of 2D SiC Semiconductors |
Preparation of Millimeter Scale 6H-SiC Single Crystal by Carbothermal Reduction: From the DFT Calculation to Experiment |
Safe handling of viscous byproduct formed in exhaust tube by halide CVD for epitaxial growth of silicon carbide films |
Innovative slurry for high removal rate single step SiC CMP enabling improved polishing throughput. (abstract) |
16:30-18:30 Session 17C: Poster Session Tu.B
Location: Foyer Sirene
Enhancement of 1700V 4H-SiC P-shielding Trench Gate MOSFET using Multi-Epitaxial layer |
Design optimization and reliability evaluation in 1.2 kV SiC trench MOSFET with deep P structure |
The first optimisation of a 16 kV 4H-SiC N-type IGCT |
Design of Monolithically Integrated Temperature Sensors in Silicon Carbide VJFETs |
Dynamic Bias-Temperature Instability Testing in SiC MOSFETs |
Gate Ringing and Dynamic Capacitance of SiC MOSFETs |
Demonstration of 800 °C SiC MOSFETs for Extreme Temperature Applications |
Improved blocking capability of 1.2 kV SiC trench MOSFETs using trenched source and buried p+ layer |
Non-Linear Gate Stack Effect on the Short Circuit Performance of a 1.2-kV SiC MOSFET |
Comparing 4H-SiC NPN Buffer Layers by Epitaxial Growth and Implantation for Neural Interface Isolation |
Analysis of On-State and Short-Circuit Capability in 3D Trench SiC MOSFET Designs |
Visualization of P+ JTE embedded rings used for peripheral protection of high voltage Schottky diodes by the Optical Beam Induced Current (OBIC) technique |
Design and Characterization of an Optical 4H-SiC Bipolar Junction Transistor |
Raman and Kerr frequency comb in a 4H-silicon-carbide on insulator based microresonator PRESENTER: Adnan Ali Afridi |
Channel density design guidelines for the transient characteristics of SiC trench gate MOSFETs |
Analysis and Optimization of the Super Junction SiC MOSFET Parasitic Capacitances |
Fabrication of wafer-level vacuum-packaged 3C-SiC resonant microstructures grown on <111> and <100> silicon |
Study of the variation of the charge carrier lifetime profile in the drift region of planar 4H-SiC MOSFETs |
16:30-18:30 Session 17D: Poster Session Tu.C
Location: Foyer Ulisse
Wednesday, September 20th
View this program: with abstractssession overviewtalk overview
08:30-10:30 Session 18A: Devices 3: Bipolar operation in SiC technology & late news
Chairs:
Location: Auditorium Sirene
08:30 | Development of Elemental Technologies for SiC Superjunction Structure and SiC-IGBT Voltage Withstanding Layer (invited paper) |
09:00 | Impacts of Single Shockley Stacking Faults on Electrical Characteristics of 4H-SiC PiN Diodes |
09:20 | Comparison of the Surge Current Capabilities of SBD-Embedded and Conventional SiC MOSFETs |
09:40 | The impact of gamma irradiation on 4H-SiC bipolar junction inverters under various biasing conditions |
10:00 | Over 600°C operation of a bottom-gate p-JFET with double-well structure fabricated by ion implantation on an n-type SiC epilayer PRESENTER: Shunya Shibata |
08:30-10:30 Session 18B: Material 2: Epitaxial growth
Chairs:
Location: Ulisse
08:30 | High-Volume SiC Epitaxial Layer Manufacturing - Maintaining High Materials Quality of Lab Results in Production (invited paper) PRESENTER: Bernd Thomas |
09:00 | Epitaxial thickness uniformity observation on different 8 inch 4H-SiC substrates. |
09:20 | Formation of basal plane dislocations by stress near epi/sub interface of 150 mm diameter SiC wafers with thick epitaxial layers |
09:40 | The optimisation and characterisation of 4H-SiC layers for high voltage (>10 kV) devices |
10:00 | Investigating the Influence of Various Hydrocarbons on CVD Epitaxial Growth of 4H-SiC: Surface Morphology and Properties PRESENTER: Misagh Ghezellou |
11:00-12:30 Session 19A: Process 3: Laser Processing
Chairs:
Location: Auditorium Sirene
11:00-12:30 Session 19B: Applications 1
Chairs:
Location: Ulisse
11:00 | Threshold Voltage Instability in SiC MOSFETs: Analysis and Modeling (invited paper) PRESENTER: Matteo Meneghini |
11:30 | Effects of high gate voltage stress on threshold voltage stability in planar and trench SiC power MOSFETs |
11:50 | Origin and Recovery of Negative Vth Shift on 4H-SiC MOS Capacitors: an Analysis Based on Inverse Laplace Transform and Temperature-Dependent Measurements |
12:10 | Analysis of Forward Bias Degradation Reduction in 4H-SiC PiN Diodes on Bonded Substrates PRESENTER: Hidetsugu Uchida |
12:30-14:00 Lunch
Location: Agrumeto
14:00-16:00 Session 20A: Process 4: Implantation-based processing
Chairs:
Location: Auditorium Sirene
14:00-16:00 Session 20B: Quantum 2: Single-photon sources and quantum sensing
Chairs:
Location: Ulisse
14:00 | Silicon carbide based optical frequency comb (invited paper) (abstract) |
14:30 | Grayscale hard-mask lithography protocol for the fabrication of high aspect ratio microstructures in silicon carbide |
14:50 | Improved Magnetic Sensing with the Silicon Vacancy in Isotopically-Purified 4H-SiC |
15:10 | Electrical detection of nuclear spins in silicon carbide using silicon vacancy quantum spins in ambient conditions |
15:30 | Ab initio study of oxygen-vacancy defect in 4H-SiC: A potential qubit |
16:30-18:30 Session 21A: Poster Session We.D
Location: Le Ginestre
Experimental demonstration of ultrafast SiC MOSFET overload protection using embedded current and temperature sensors |
Analysis of Electrothermal Imbalance of Hard-Switched Parallel SiC MOSFETs Through Infrared Thermography |
Reliability of SiC MOSFETs in the elastic-plastic deformation regime under fast power pulses |
High-speed Switching Operation of a SiC Power MOSFET at High-temperature Using a SiC CMOS Gate Driver Installed Inside a Power Module |
Photoluminescence analysis of heavy-ion-degraded SiC power MOSFETs |
Study of the bias driven threshold voltage drift of 1.2 kV SiC MOSFETs in power cycling and high temperature gate bias tests PRESENTER: Roman Boldyrjew-Mast |
A Sulfur-doped n-JFET for a reduced logic threshold voltage shift in a SiC CJFET inverter |
Dynamic On-State Resistance and Threshold-Voltage Instability in SiC MOSFETs |
Advanced Stability Analysis based on Virtual Prototyping: Impact of Device Characteristics on Paralleling SiC power MOSFETs |
Venus Surface Environmental Chamber Test of SiC JFET-R Multi-Chip Circuit Board |
Heavy-ion induced gate damage mechanisms in SiC trench MOSFETs |
250 m thick detectors for neutron detection: carrier lifetime, design, electrical characteristics, and detector performances. |
Ultra-thin (<1 µm) Silicon Carbide free-standing membranes as beam intensity and position monitors for soft x-ray beamlines |
Radiation Hardness Study of Silicon Carbide Sensors under High-Temperature Proton Beam Irradiations |
Investigation of potential impact of nitridation process on Single Event Gate Rupture tolerance in SiC MOS Capacitors |
16:30-18:00 Session 21B: Poster Session We.A
Location: Nettuno
Effects of Post-Annealing on Temperature dependent Electrical Characteristics of Ni/(Al0.1Ga0.9)2O3/4H-SiC Schottky Barrier Diodes PRESENTER: Young-Hun Cho |
Understanding the Material Loss in the Laser Based SiC Wafer |
Systematic evaluation of contamination behavior originated from innovative spray coated tantalum carbide coating on graphite parts used in SiC epitaxy processes in comparison to conventional CVD coated ones |
SmartSiCTM Substrates: A Boon to Drain Metallization Process |
Polarity effect on the heteroepitaxial growth of BxC on 4H-SiC by CVD |
Rapid growth of SiC single crystals using CVD-SiC block sources via physical vapor transport method |
Effects of Solution Properties on Growth Conditions of SiC Solution Growth |
GaN cap UV spectroscopy assessment in AlGaN/GaN HEMT |
Physical Vapor Deposition of a-SiC thin films for optical applications |
3C-SiC on Si substrates through transformation of Si and C multilayers |
A study of process interruptions during pre- and post-buffer layer epitaxial growth for defect reduction in 4H SiC |
Thermochromic properties of 3C-, 6H- and 4H-SiC polytypes up to 500°C |
Macro step bunching/debunching engineering on 4°-off 4H-SiC (0001) to control the BPD-TED conversion ratio by Dynamic AGE-ing® |
16:30-18:30 Session 21C: Poster Session We.B
Location: Foyer Sirene
Investigating the impact of plasma treatment on the characteristics of NiAl alloy contacts on heavily doped n-type 4H-SiC |
A Comparative Study of the Self-Aligned Channel Processes for 4H-SiC VDMOSFET |
Empirical model of backside low-ohmic nickel contact formation on n-type 4H-SiC |
Dicing process for 4H-SiC wafers by plasma etching using high-pressure SF6 plasma with metal masks |
Shape stability of electrochemically etched 4H-SiC cantilevers after high-temperature annealing |
Laser annealing induced formation of low-ohmic nickel contacts on n-type 4H-SiC by surface roughness dependent laser fluence optimization |
Reduction of the SiC trench sidewalls striations. |
Carbon control method in SIC MOSFET with Chlorine and Vth stability |
Shallow interface states in SiC MOS devices fabricated by oxidation of amorphous silicon thin films |
Efficient Nanotaper Edge Couplers in PECVD Amorphous Silicon Carbide for Integrated Photonics Applications PRESENTER: Yaoqin Lu |
Free-standing 3C-SiC p-type doping by Al ion implantation |
High-Temperature Characterization of Interface and Near-Interface Traps in 4H-SiC MOS Capacitor with Full-Distributed Circuit Model |
Transient-enhanced diffusion of implanted aluminum in 4H-SiC |
Dopant activation comparison in phosphorus and nitrogen implanted 4H-silicon carbide |
High-speed planarization of GaN (0001) substrate using catalyst-referred etching enhanced with positive-biased photoelectrochemical oxidation |
A SiO2/SiC interface formed by direct bonding of SiO2 and SiC |
Evolution of the substitutional fraction on post-implantation annealing in Al/4H-SiC systems |
TDDB in 4H-SiC power MOSFETs under positive and negative constant bias and constant current stresses |
Characteristics of Photoelectrochemical Oxidation Enabling High-efficiency Polishing of Gallium Nitride |
16:30-18:30 Session 21D: Poster Session We.C
Location: Foyer Ulisse
Estimation of electron drift mobility along the c-axis in 4H-SiC by using vertical Schottky barrier diodes |
Analysis of Defect Structures During the Early Stages of PVT Growth of 4H-SiC Crystals |
Investigation of the Trapping and Detrapping Behavior by the On-State Resistance at Low Off-State Drain Bias in Schottky p-GaN Gate HEMTs PRESENTER: Maximilian Goller |
Compressed Sensing for High-Throughput, High-Sensitivity Inspection of Silicon Carbide Wafers |
Early Detection of Bar-Shaped 1SSF before Expansion by PL Imaging |
Analysis of Deep Level Traps in Post-annealed κ-Ga2O3/SiC Heterojunction Diode Grown by Mist-CVD PRESENTER: Tae-Hee Lee |
Charge carrier capture from prominent defect centers in 4H-SiC PRESENTER: Orazio Samperi |
Study of lattice recovery induced by thermal activation processes in P-implanted 4H-SiC epitaxial layers |
Development of Automated 3-channel Inspection Analysis Technique for Defects of SiC Epitaxial Wafers using Optical Inspection, Photoluminescence and X-ray Topography |
Accuracy of EVC Method for the PiN Diode Pattern on SiC Epi-Wafer |
Interatomic potentials with ab-initio accuracy for defect and growth simulations in SiC |
Near interface defect decomposition during NO annealing analyzed by molecular dynamics simulations |
On the Relationship of Epitaxial Defects and Processing Parameters to Yield and Reliability of Gate Oxides on 4H-SiC |
Comparison of novel charge-based wafer inspection technique to optical defect mapping techniques |
In-line charaterization of HPSI SiC wafers using high resolution surface photovoltage spectroscopy (HR-SPS) |
Monitoring of graphene properties in the process of viral biosensor manufacturing |
Electrical and structural properties of ohmic contacts of SiC diodes fabricated on thin wafers |
Thursday, September 21st
View this program: with abstractssession overviewtalk overview
08:30-10:30 Session 22A: Process 5: Deposited Oxides
Chairs:
Location: Auditorium Sirene
08:30-10:30 Session 22B: Material 3: Surface processing and epi growth
Chairs:
Location: Ulisse
11:00-12:30 Session 23A: Devices 4: Short circuit, avalanche and reliability
Chairs:
Location: Auditorium Sirene
11:00-12:30 Session 23B: Process 6: Metal/SiC interface
Chairs:
Location: Ulisse
11:00 | Carrier transport and barrier height of S+-implanted SiC Schottky barrier diodes |
11:20 | Reduction of contact resistivity at non-alloyed SiC ohmic contacts based on understanding of tunneling phenomena |
11:40 | Formation of non-alloyed ohmic contacts on heavily Al+-implanted p-type SiC PRESENTER: Kotaro Kuwahara |
12:00 | Stacking faults and space charge limited current in 4H-SiC Schottky diodes |
12:30-14:00 Lunch
Location: Agrumeto
14:00-16:00 Session 24A: Defects 3: Interface defects and carrier lifetime
Chairs:
Location: Auditorium Sirene
14:00 | Non-Destructive Characterization of Buried Damage in SiC Substrates". No mater how good bulk SiC substrates and epi processes are, proper polishing/CMP and characterization of the surface and subsurface damage are critical for device yield and reliability (invited paper) (abstract) |
14:50 | Investigation of the near interface oxide defects in a SiO2-SiC system using optical excitation |
15:10 | Unique localization of conduction band wavefunction near SiO2/4H-SiC interface by applied electric field |
15:30 | Doping and Temperature Dependence of Carrier Lifetime in 4H SiC Epitaxial Layers |
14:00-16:00 Session 24B: Applications 2
Chairs:
Location: Ulisse
14:00 | Lifetime Modeling of the 4H-SiC MOS Interface in the HTRB Condition Under the Influence of Screw Dislocations (invited paper) (abstract) |
14:30 | Unique Failure Mode of SiC MOSFETs under Accelerated HTRB |
14:50 | 3rd Quadrant Surge Current SOA of SiC MOSFETs with Different Voltage Classes PRESENTER: Mohamed Alaluss |
15:10 | Power Cycling Performance of 3.3 kV SiC-MOSFETs and the Impact of the Thermo-Mechanical Stress on Humidity Induced Degradation |
16:30-18:30 Session 25A: Posters Session Th.D
Location: Le Ginestre
16:30-18:30 Session 25B: Poster Session Th.A
Location: Nettuno
Influence of Channel Length and Gate oxide Thickness Variations in 3300 V 4H-SiC VDMOSFET |
Analysis of Gain Fluctuation for SiC Amplifier with Radiation Hardness |
Optimization of Single-Event Burnout Resistance 1.2 kV SiC Schottky Barrier Diode |
Anisotropic stress observation of 4H-SiC Trench-Test MOSFET structures by Scanning Near-field Optical Raman Microscope |
Ultra-High-Voltage SiC-IGBT for Modular-Multilevel-Converters in HVDC |
Comparison of Si CMOS and SiC CMOS Operational Amplifiers |
Gamma-ray irradiation effects on 4H-SiC n/p MOSFETs with POA treatment. |
Minimum Channel Length for Suppressing Short-Channel Effects in SiC JFETs |
Amorphous silicon-carbide modulator based on the thermo-optic effect |
Modeling the charging of gate oxide under high electric field |
Implicit differentiable models for wide temperature range SiC Schottky diode characterization |
AFM-sMIM analysis of the recombination enhancing layer for bipolar-degradation-free SiC MOSFETs |
Analytical Modeling of Conduction, Blocking and Breakdown Operation of a Monolithically Integrated 4H-SiC Circuit Breaker Device Technology |
Unclamped inductive switching response of SiC MOSFETs under extreme slow transient |
Early-stage reliability evaluation of passivation stack and termination designs in SiC MPS diodes PRESENTER: Davood Momeni |
500°C High-Temperature Characteristics of TiN-gate SiC n/p MOSFETs |
Radiation Dose Response of 4H-SiC UV Sensor for MGy-Class Radiation Hardened CMOS UV Imager |
Temperature-Dependent Evaluation of Commercial 1.2 kV, 40 mΩ 4H-SiC MOSFETs: A Comparative Study between Planar, One-side Shielded Trench, and Double Trench Gate Structures |
16:30-18:30 Session 25C: Poster Session Th.B
Location: Foyer Sirene
Impact of Different Schottky Barrier Diode Ratios on Static and Dynamic Characteristics of embedded SBD-MOSFET at Different Temperatures |
Increasing 4H-SiC Trench Depth by Improving the Dry-Etch Selectivity Towards the Oxide Hard Mask |
Analysis of Lattice Damage in 4H-SiC Epiwafers Implanted with High Energy Al Ions at Elevated Temperatures |
Plasma Treatment after NiSi-based Ohmic Contact Formation on 4H-SiC to Enhance Adhesion of Subsequent Backside Metallization PRESENTER: Tom Becker |
Metal Contact Processing Experiments Towards Realizing 500 °C Durable RF 4H-SiC BJTs |
Impact of the p base junction depth on electrical properties of 4H SiC trench MOSFETs with the double p base structure |
Impact of Al ion implantation on 4H-SiC epitaxial layer |
Ohmic contact resistance in SiC diodes with Ti and NiSi P+ contacts |
Optimization of Reflectance Spectroscopy for Transparent Layers on 4H-SiC |
Comparison of polar-face and non-polar faces 4H-SiC/SiO2 interfaces revealed by magnetic resonance and related techniques |
Prediction of contact resistance of 4H–SiC by machine learning using optical microscope images after laser doping |
High-quality micro/nano structures of 4H-SiC patterning by vector femtosecond laser |
A novel approach for thin 4H-SiC foil realization using controlled spalling from a 4H-SiC wafer |
Temperature dependence of gate oxide breakdown and C-V properties on 4H-SiC between room temperature and 500 °C |
Performance improvement by carbon-dioxide supercritical fluid treatment for 4H-SiC Vertical Double Diffusion MOSFETs |
Long Term Reliability and Deterioration Mechanisms of High Temperature Metal Stacks on 4H-SiC |
A comparison between different post grinding processes on 4H-SiC wafers |
Characterization of aluminum and nitrogen implants into silicon carbide using Fourier transform infrared spectroscopy |
A Comparative Study of the Analytical and Finite Elements Approaches to investigate the Equivalent Thickness of Large 4H-SiC Taiko Wafers |
16:30-18:30 Session 25D: Poster Session Th.C
Location: Foyer Ulisse
Excited carrier concentration dependence of surface recombination velocities for 4H-SiC with and without passivation |
Detection of Very Fast Interface Traps at 4H-SiC/AlN and 4H-SiC/Al2O3 Interfaces |
Study on electron trap states of Al implanted Ni/SiC Schottky barrier diodes using DLTS |
Ga2O3/SiC Heterostructure Schottky Diodes |
Effect of Sub-micron-sized Micropipes on Electric Properties of SiC Devices |
Structural Analysis of Novel Butterfly Defect in 4H-SiC Substrates |
Investigation of dislocation behaviors in 4H-SiC under thermal treatment |
DFT modeling of crystallographic defects in SiC polytypes |
Characterization of Growth Sectors in Gallium Nitride Substrate Wafers |
Systematic tracking of defects from substrate to final device by full wafer mapping techniques |
Dependence of the silicon carbide radiation resistance on the irradiation temperature. |
Epitaxial defectivity characterization combining surface voltage and photoluminescence mapping. |
Extended defects and stress relaxation in 3C-SiC grown on compliance Si substrates |
An investigation into the enhancement of carrier lifetime in thick 4H-SiC epitaxial layers for bipolar devices |
Birefringence image simulation of dislocations in a SiC crystal considering three-dimensional stress fields. |
Investigation of BPD Faulting under Extreme Carrier Injection in Room vs High Temperature Implanted 3.3kV SiC MOSFETs |
The role of Dit(E) and the capture cross section on the C-V characteristics of 4H-SiC MOS capacitors PRESENTER: Helton Goncalves de Medeiros |
Friday, September 22nd
View this program: with abstractssession overviewtalk overview
08:30-10:30 Session 26A: Devices 5: High performance SiC MOSFETs concepts
Chairs:
Location: Auditorium Sirene
08:30-10:30 Session 26B: Defects 4: Novel defect characterization techniques
Chairs:
Location: Ulisse
11:00-12:30 Session 27A: Devices 6: Gate dielectric engineering
Chairs:
Location: Auditorium Sirene
11:00 | Suppression of subthreshold drain leakage via implementation of high-κ dielectrics for advanced SiC power MOSFETs PRESENTER: Sami Bolat |
11:20 | High Mobility 4H-SiC p-MOSFET via ultrathin ALD B2O3 interlayer between SiC and SiO2 |
11:40 | Modelling-augmented failure diagnostics in planar SiC MOS devices using TDDB measurements |
12:00 | Extraction of SiO2/4H-SiC interface trap charge by TCAD simulation |
11:00-12:30 Session 27B: Material 4: Emerging growth technologies
Chairs:
Location: Ulisse
12:30-14:00 Lunch
Location: Agrumeto
14:00-14:40 Session 28: Plenary III
Chairs:
Location: Auditorium Sirene
14:00 | Next step in SiC technology (abstract) |