PROGRAM FOR THURSDAY, SEPTEMBER 21ST
Days:
previous day
next day
all days
View: session overviewtalk overview
08:30-10:30 Session 22A: Process 5: Deposited Oxides
Chairs:
Location: Auditorium Sirene
08:30-10:30 Session 22B: Material 3: Surface processing and epi growth
Chairs:
Location: Ulisse
11:00-12:30 Session 23A: Devices 4: Short circuit, avalanche and reliability
Chairs:
Location: Auditorium Sirene
11:00-12:30 Session 23B: Process 6: Metal/SiC interface
Chairs:
Location: Ulisse
11:00 | Carrier transport and barrier height of S+-implanted SiC Schottky barrier diodes |
11:20 | Reduction of contact resistivity at non-alloyed SiC ohmic contacts based on understanding of tunneling phenomena |
11:40 | Formation of non-alloyed ohmic contacts on heavily Al+-implanted p-type SiC PRESENTER: Kotaro Kuwahara |
12:00 | Stacking faults and space charge limited current in 4H-SiC Schottky diodes |
12:30-14:00 Lunch
Location: Agrumeto
14:00-16:00 Session 24A: Defects 3: Interface defects and carrier lifetime
Chairs:
Location: Auditorium Sirene
14:00-16:00 Session 24B: Applications 2
Chairs:
Location: Ulisse
14:00 | Lifetime Modeling of the 4H-SiC MOS Interface in the HTRB Condition Under the Influence of Screw Dislocations (invited paper) ABSTRACT. TBA |
14:30 | Unique Failure Mode of SiC MOSFETs under Accelerated HTRB |
14:50 | 3rd Quadrant Surge Current SOA of SiC MOSFETs with Different Voltage Classes PRESENTER: Mohamed Alaluss |
15:10 | Power Cycling Performance of 3.3 kV SiC-MOSFETs and the Impact of the Thermo-Mechanical Stress on Humidity Induced Degradation |
16:30-18:30 Session 25A: Posters Session Th.D
Location: Le Ginestre
16:30-18:30 Session 25B: Poster Session Th.A
Location: Nettuno
Influence of Channel Length and Gate oxide Thickness Variations in 3300 V 4H-SiC VDMOSFET |
Analysis of Gain Fluctuation for SiC Amplifier with Radiation Hardness |
Optimization of Single-Event Burnout Resistance 1.2 kV SiC Schottky Barrier Diode |
Anisotropic stress observation of 4H-SiC Trench-Test MOSFET structures by Scanning Near-field Optical Raman Microscope |
Ultra-High-Voltage SiC-IGBT for Modular-Multilevel-Converters in HVDC |
Comparison of Si CMOS and SiC CMOS Operational Amplifiers |
Gamma-ray irradiation effects on 4H-SiC n/p MOSFETs with POA treatment. |
Minimum Channel Length for Suppressing Short-Channel Effects in SiC JFETs |
Amorphous silicon-carbide modulator based on the thermo-optic effect |
Modeling the charging of gate oxide under high electric field |
Implicit differentiable models for wide temperature range SiC Schottky diode characterization |
AFM-sMIM analysis of the recombination enhancing layer for bipolar-degradation-free SiC MOSFETs |
Analytical Modeling of Conduction, Blocking and Breakdown Operation of a Monolithically Integrated 4H-SiC Circuit Breaker Device Technology |
Unclamped inductive switching response of SiC MOSFETs under extreme slow transient |
Early-stage reliability evaluation of passivation stack and termination designs in SiC MPS diodes PRESENTER: Davood Momeni |
500°C High-Temperature Characteristics of TiN-gate SiC n/p MOSFETs |
Radiation Dose Response of 4H-SiC UV Sensor for MGy-Class Radiation Hardened CMOS UV Imager |
Temperature-Dependent Evaluation of Commercial 1.2 kV, 40 mΩ 4H-SiC MOSFETs: A Comparative Study between Planar, One-side Shielded Trench, and Double Trench Gate Structures |
16:30-18:30 Session 25C: Poster Session Th.B
Location: Foyer Sirene
Impact of Different Schottky Barrier Diode Ratios on Static and Dynamic Characteristics of embedded SBD-MOSFET at Different Temperatures |
Increasing 4H-SiC Trench Depth by Improving the Dry-Etch Selectivity Towards the Oxide Hard Mask |
Analysis of Lattice Damage in 4H-SiC Epiwafers Implanted with High Energy Al Ions at Elevated Temperatures |
Plasma Treatment after NiSi-based Ohmic Contact Formation on 4H-SiC to Enhance Adhesion of Subsequent Backside Metallization PRESENTER: Tom Becker |
Metal Contact Processing Experiments Towards Realizing 500 °C Durable RF 4H-SiC BJTs |
Impact of the p base junction depth on electrical properties of 4H SiC trench MOSFETs with the double p base structure |
Impact of Al ion implantation on 4H-SiC epitaxial layer |
Ohmic contact resistance in SiC diodes with Ti and NiSi P+ contacts |
Optimization of Reflectance Spectroscopy for Transparent Layers on 4H-SiC |
Comparison of polar-face and non-polar faces 4H-SiC/SiO2 interfaces revealed by magnetic resonance and related techniques |
Prediction of contact resistance of 4H–SiC by machine learning using optical microscope images after laser doping |
High-quality micro/nano structures of 4H-SiC patterning by vector femtosecond laser |
A novel approach for thin 4H-SiC foil realization using controlled spalling from a 4H-SiC wafer |
Temperature dependence of gate oxide breakdown and C-V properties on 4H-SiC between room temperature and 500 °C |
Performance improvement by carbon-dioxide supercritical fluid treatment for 4H-SiC Vertical Double Diffusion MOSFETs |
Long Term Reliability and Deterioration Mechanisms of High Temperature Metal Stacks on 4H-SiC |
A comparison between different post grinding processes on 4H-SiC wafers |
Characterization of aluminum and nitrogen implants into silicon carbide using Fourier transform infrared spectroscopy |
A Comparative Study of the Analytical and Finite Elements Approaches to investigate the Equivalent Thickness of Large 4H-SiC Taiko Wafers |
16:30-18:30 Session 25D: Poster Session Th.C
Location: Foyer Ulisse
Excited carrier concentration dependence of surface recombination velocities for 4H-SiC with and without passivation |
Detection of Very Fast Interface Traps at 4H-SiC/AlN and 4H-SiC/Al2O3 Interfaces |
Study on electron trap states of Al implanted Ni/SiC Schottky barrier diodes using DLTS |
Ga2O3/SiC Heterostructure Schottky Diodes |
Effect of Sub-micron-sized Micropipes on Electric Properties of SiC Devices |
Structural Analysis of Novel Butterfly Defect in 4H-SiC Substrates |
Investigation of dislocation behaviors in 4H-SiC under thermal treatment |
DFT modeling of crystallographic defects in SiC polytypes |
Characterization of Growth Sectors in Gallium Nitride Substrate Wafers |
Systematic tracking of defects from substrate to final device by full wafer mapping techniques |
Dependence of the silicon carbide radiation resistance on the irradiation temperature. |
Epitaxial defectivity characterization combining surface voltage and photoluminescence mapping. |
Extended defects and stress relaxation in 3C-SiC grown on compliance Si substrates |
An investigation into the enhancement of carrier lifetime in thick 4H-SiC epitaxial layers for bipolar devices |
Birefringence image simulation of dislocations in a SiC crystal considering three-dimensional stress fields. |
Investigation of BPD Faulting under Extreme Carrier Injection in Room vs High Temperature Implanted 3.3kV SiC MOSFETs |
The role of Dit(E) and the capture cross section on the C-V characteristics of 4H-SiC MOS capacitors PRESENTER: Helton Goncalves de Medeiros |