TALK KEYWORD INDEX
This page contains an index consisting of author-provided keywords.
( | |
(000−1) surface | |
- | |
- 4H SiC | |
- scanning tunneling luminescence microscopy | |
- step-bunched | |
- sub-gap electroluminescence | |
- surface defects | |
1 | |
1.2 kV | |
1.2 kV 4H-SiC MOSFET | |
1.2kV SiC MOSFETs | |
150mm | |
2 | |
200mm | |
200mm 4H-SiC | |
200mm SiC | |
2D electron gas | |
2D Material | |
2D materials | |
2D SiC | |
2D simulations | |
3 | |
3-dimensional observation | |
3.3 kV SiC VDMOSFET | |
3.3kV | |
3.3kV MOSFET robustness to BPD faulting | |
3.3kV SiC MOSFET | |
3C SiC | |
3C-SiC | |
3C-SiC micro-structures | |
3D simulation | |
3rd quadrant | |
4 | |
4-H SiC | |
4H | |
4H SiC | |
4H silicon carbide | |
4H- Silicon Carbide | |
4H-SiC | |
4H-SiC BJT | |
4H-SiC epitaxial layer characterization | |
4H-SiC MOSFET | |
4H-SiC Power MOSFETs | |
4H-SiC Taiko Wafers | |
6 | |
650V | |
6H-SiC | |
8 | |
8 inch substrate | |
8-inch SiC | |
800°C SiC MOSFET characterization | |
A | |
a-face | |
a-SiCOI | |
ab initio theory | |
Accelarated testing | |
Accelerated Tests | |
Accelerated wafer-level BVR reliability test | |
Acquisition | |
Activation | |
Activation energy | |
Adhesion | |
Advanced power cycling | |
aerospace | |
AFM | |
AI | |
air pocket design | |
Al | |
Al implantation | |
Al ion implantation | |
Al+ implantation | |
Al2O3 | |
Al2O3/LaAlO3/SiO2 | |
ALD | |
AlGaN | |
AlN | |
alpaha particles | |
Alpha particle | |
Aluminium Gallium Oxide | |
aluminum | |
Aluminum doping | |
aluminum implantation | |
Ammonothermal | |
amorphous Si | |
amorphous SiC | |
Amorphous silicon carbide | |
amplifier | |
Analytical Modelling | |
Annealing | |
anode hole injection | |
Anomalous Hall coefficient | |
ANSYS thermomechanical simulations | |
Arcing | |
Atomic Force Microscopy | |
Atomic Layer Deposition | |
Atomic step structure | |
atomic step velocity | |
atomically flat surface | |
ATP Probe | |
automotive | |
avalanche | |
Avalanche breakdown | |
Avalanche capability | |
B | |
back grinding | |
Backside contact | |
Backside Ohmic contact | |
Band-to-band-tunneling | |
basal plane dislocation | |
Basal Plane Dislocation (BPD) | |
beam position monitors | |
Beam shaping | |
beamline instrumentation | |
Bias-temperature instability | |
Bidirectional Power Device | |
Bidirectional Switch | |
bilayer dielectric | |
binary-collision approximation | |
biomedical devices | |
biosensor | |
biotechnology | |
bipolar AC stress | |
bipolar degradation | |
Bipolar Devices | |
Bipolar reliability | |
Bipolar technology | |
birefringence | |
Birefringence imaging | |
BMA cell | |
body diode | |
body diode SiC MOSFETs | |
bonded substrate | |
Boron carbide | |
Bosch | |
Boule testing | |
BPD | |
BPD free | |
Breakdown Field | |
bright photon emission | |
buffer | |
buffer layer | |
Bulk crystal growth | |
bulk growth | |
Bulk inclusion | |
Burgers vector | |
buried p+ layer | |
Burn-in Screening | |
byproduct | |
C | |
c-axis | |
C-V | |
cantilever | |
Capacitance | |
Capacitance curves | |
Capacitance-Voltage | |
Capacitive charge | |
Capacitive charge (Qc) | |
Capacitor | |
capacity expansion | |
Capping | |
capture cross section | |
carbon aggregates | |
carbon dioxide (CO2) | |
Carbon flux | |
carbon in oxide | |
Carbon vacancy | |
Carbothermal reduction | |
carrier lifetime | |
catalyst-referred etching | |
catalyzed chemical etching | |
Cathodoluminescence | |
CC-DLTS | |
Cell pitch | |
CFD simulation | |
Channel length | |
Channel Mobility | |
Channel resistance | |
Channeling | |
channeling ion implantation | |
characterisation | |
Characterization | |
Charge carrier capture | |
charge pumping | |
Charge transition levels | |
charge trapping and detrapping | |
Charge-based wafer inspection | |
Chemical Mechanical Planarization | |
Chemical mechanical polishing | |
Chemical mechanical polishing (CMP) | |
chemical vapor deposition | |
Chloride-based chemistry | |
Chlorine oxidation | |
Circuit Board | |
Circuit Breaker | |
circuit model | |
Circuit Simulation | |
Circular TLM | |
CJFET | |
cleaning | |
CMOS | |
CMOS Image Sensor | |
CMOS Inverter | |
CMOS technology | |
CMP | |
CMP process | |
CO oxidation | |
Co-60 | |
CO2 oxidation | |
CO2-annealing | |
coating | |
coil position | |
Color | |
Color centers | |
Commercialization | |
Compact modeling | |
compensating center | |
compressed sensing | |
Conductance | |
Conductance method | |
Conduction Loss | |
Conduction Mechanism | |
confocal photoluminescence spectroscopy | |
Constant current stress | |
Constant voltage stress | |
consumables | |
Contact | |
contact resistance | |
contamination | |
Contraction | |
Controlled spalling | |
convolutional neural network | |
Cooperativity | |
Corona | |
Corona-Kelvin method | |
Cost of Ownership | |
cost reduction | |
Critical Regime | |
Critical stress time | |
critical temperature | |
Cryogenic | |
cryogenic temperatures | |
Crystal damage and recovery | |
Crystal Defects | |
Crystal growth | |
Crystallization Behavior | |
Crystallographic defects | |
Current sensor | |
current spreading | |
Current Transport | |
curvature | |
CVD | |
CVD Epitaxial growth | |
CVD-SIC block | |
D | |
damage free | |
damage-free dicing | |
DCDC converter | |
deep implantation | |
Deep Level Transient Spectroscopy | |
deep level trap | |
Deep-Level Transient Spectroscopy | |
Defect | |
defect analysis | |
defect characterization | |
Defect curing | |
defect density | |
defect engineering | |
defect imaging | |
defect inspection | |
Defect interaction in SiC | |
Defect maps | |
Defect Mechanisms | |
Defect recognition | |
defect reduction | |
Defect structure | |
defectivity | |
Defects | |
Defects from High Carrier Injection | |
degradation | |
delamination | |
density functional theory | |
Deposited Gate Oxide | |
Depth profiling techniques | |
Design | |
Design of Experiments | |
Design optimization | |
detector stability | |
deterministic divacancy synthesis | |
device characterization | |
Device fabrication | |
Device Modeling | |
Device packaging design for high temperature testing | |
device simulation | |
devices | |
Dewetting | |
DFT modeling | |
Diamond | |
diamond size | |
dicing | |
Dielectric Breakdown | |
dielectric constant | |
Dielectric stack | |
dielectrics | |
Diffusion | |
Diffusion Barrier | |
Diode | |
dipole scattering | |
Direct bonding of SiO2 and SiC | |
Directionality | |
Dislocation | |
Dislocation Density | |
dislocation formation | |
dislocation loops | |
Dislocation multiplication | |
dislocation propagation | |
dislocations | |
Distributed circuit model | |
divacancy | |
divacancy quantum defects | |
DLTS | |
DMOS | |
DMP | |
Dopant Activation | |
Doped HfO2 | |
Doping | |
Doping characterization | |
doping contrast | |
Doping density variation | |
Doping Dependence | |
double donor | |
Double Pulse Test Switching (DPTS) | |
Double Pulse Testing | |
Double side polishing | |
Double Trench | |
Double-Pulse Testing | |
drain-source capacitance | |
Drift resistance | |
drift-zone doping | |
Dry Etching | |
dry polishing | |
duble p base structure | |
Dynamic AGE-ing (DA) | |
Dynamic capacitance | |
Dynamic Characterization | |
Dynamic On-Resistance | |
E | |
EBSD | |
Edge coupler | |
Edge grinding | |
EDMR | |
EDS | |
effective mass approximation | |
Effects of etching processing parameters | |
ELDRS | |
electric vehicle | |
Electrical Characteristics | |
Electrical characteristics of device | |
electrical characterization | |
electrical impedance spectroscopy | |
electrical spin detection | |
electrically detected magnetic resonance | |
Electrically-active defects | |
Electrification | |
Electro plating | |
electrochemical etching | |
electron drift mobility | |
electron nuclear double resonance | |
electron radiations | |
Electron traps | |
electronic stopping | |
electrons | |
electroplating | |
Electrothermal imbalance | |
Embedded SBD | |
Embedded sensor | |
energy conversion efficiency | |
Energy-filter | |
engineered substrate | |
Engineered substrates | |
eoitaxy | |
Epi stacking fault defect | |
Epi-ready surface | |
epigraphene | |
Epitaxial Defects | |
Epitaxial growth | |
Epitaxy | |
equilibrium diffusion | |
equivalent circuit | |
Etch | |
Etch Optimisation | |
etch pit density | |
Etching | |
Etching Chemistry | |
ETV-ICP-OES | |
EV | |
Excimer laser | |
excitation dependence | |
excitonic features | |
Excluding oxidation process | |
exhaust tube | |
expansion velocity | |
extended defects | |
Extreme temperature electronics | |
F | |
Failure Analysis | |
failure modes | |
Fast Sublimation Growth Process Monocrystalline | |
Fast Switching | |
Femtosecond laser | |
Ferroelectric materials | |
Field Effect Mobility | |
FinFET effect | |
Finite Element Analysis (FEA) | |
first principles calculations | |
flexibility | |
flexural strength | |
floating | |
focus ring | |
Formation energy | |
forward bias degradation | |
Forward voltage drop | |
Fowler-Nordheim tunneling | |
Frequency | |
FSGP-M | |
FTIR | |
Furnace | |
future technology | |
G | |
GaAs | |
gain | |
gain fluctuation | |
Gallium Nitride | |
Gallium Oxide | |
Gamma Radiation | |
gamma-ray | |
GaN | |
GaN cap | |
Gate All Around | |
Gate Breakdown | |
Gate current | |
Gate driver | |
gate finger | |
gate leakage | |
Gate oxide | |
gate oxide breakdown | |
Gate oxide carbon control | |
gate oxide failure | |
Gate oxide integrity | |
gate oxide quality improvement | |
Gate oxide reliability | |
Gate Oxide Screening | |
Gate reliability | |
Gate Ringing | |
gate runner | |
Gate Trench | |
GCT | |
Graphen | |
Graphene | |
graphite felt | |
graphite materials | |
Grinding | |
grinding energy | |
grinding wheel | |
Grounding | |
growth | |
growth front shape reconstruction | |
H | |
H2 treatment | |
H2 treatment and Interface nitrogen | |
HAADF-STEM | |
halide CVD | |
Hall Effect | |
harsh environments | |
HCl | |
Heavily Al-doped 4H-SiC | |
Heavy ion | |
Heavy ions | |
Heavy-ions | |
helium ion implantation | |
HEMT | |
hetero epitaxy | |
Heteroepitaxy | |
Heterogeneous integration | |
heterojunction | |
heterojunctions | |
heterostructure | |
high carrier lifetime | |
High cycle fatigue zone | |
high energy | |
high energy ion implantation | |
high power | |
high readout contrast | |
High rigid grinding | |
high temperature | |
high temperature gate bias | |
high temperature IC | |
high temperature ion implantation | |
High Throughput | |
High Voltage | |
High Volume Production | |
High- temperature electronics | |
High-k | |
high-k dielectric | |
high-k dielectrics | |
High-k gate dielectric | |
high-k materials | |
High-low | |
high-pressure SF6 plasma | |
High-speed Photoluminescence mapping | |
High-speed switching | |
High-Temperature | |
high-temperature annealing | |
high-temperature chemical vapor deposition | |
high-temperature gas source method | |
high-temperature irradiation | |
high-temperature physical properties | |
Hole traps | |
homo epitaxy | |
hot filament | |
hot-zone design | |
HPSI | |
HPSI 4H-SiC wafer charaterization | |
HRXRD study | |
HT Anneal and P+ Implant Process Parameters | |
HTCVD | |
HTGB | |
HTRB | |
Humidity | |
HVDC | |
HVPE | |
Hybrid device | |
I | |
I2t | |
ICP | |
ICP-OES | |
Ideality | |
Identification of stacking faults | |
Idss leakage current | |
IFSM Ruggedness | |
IGBT | |
IGCT | |
implant | |
Implantation | |
Implantation process | |
Implicit differentiable models | |
Impurities | |
In-grown stacking fault | |
Inclined line-like defects | |
Incomplete Ionization | |
Inductively Coupled Plasma | |
Industrialization | |
infrared metrology | |
Infrared thermography | |
instability | |
Integrated Circuit | |
integrated circuits | |
integrated optics | |
Integrated photonics | |
Interatomic potential | |
interface | |
interface carbon defect | |
Interface characterization | |
interface defect of SiC/SiO2 | |
Interface defects | |
Interface engineering | |
Interface nitrogen | |
Interface state density | |
interface states | |
interface states density | |
Interface Trap Density | |
Interface traps | |
intersystem crossing | |
Intrinsic body diode | |
Inverse Laplace Transform | |
Inverter | |
Ion | |
ion beam trimming | |
Ion implantation | |
ion slicing | |
Ionic charges | |
Ionization energies | |
irradiated SiC | |
irradiation | |
isolation | |
isotopic enrichment | |
isotopic purity | |
J | |
JBS | |
JBS diode | |
JFET | |
JFET Diode | |
Junction depth | |
junction-controlled-diode | |
K | |
KGD | |
Known Good Die | |
KPFM | |
L | |
Laplace deep level transient spectroscopy (LDLTS) | |
Laplace-transform photoinduced transient spectroscopy (LPITS) | |
laser ablation processing | |
Laser Anneal | |
Laser annealing | |
Laser doping | |
Laser Separation | |
laser split | |
Lateral | |
Lateral MOSFET | |
Lateral SiC MOSFETs | |
Lateral straggling | |
layer transfer | |
Leakage current | |
Lifetime estimation | |
Lift-Off | |
Lindblad Master Equation | |
Liquid Si | |
Long Inverted Silicon Pyramids substrates | |
Long-term reliability | |
low angle grain boundary | |
low resistivity | |
Low Specific On resistance | |
Low Temperature | |
low-energy muons | |
Low-ohmic contacts | |
lower pressure thermal oxidation | |
M | |
m-face | |
machine learning | |
Macrostep | |
Macrostep growth | |
magnetometer | |
magnetometers | |
magnetometry | |
Manufacturing | |
MAPCE | |
Mass transport | |
Material characterization | |
Material Loss | |
material loss free | |
material removal rate | |
Material testing | |
MCTS | |
mechanical polish | |
Memory Effect | |
MEMS | |
Merged PiN Schottky diode | |
Mesa structure | |
metal mask | |
metal oxides | |
Metalization | |
metallic via | |
Metallization | |
Metrology | |
Micro-pipe | |
micro-PL | |
micro-Raman | |
microfabrication | |
microlens arrays | |
micropipe | |
microresonator fabrication | |
Microring resonator | |
microstructure | |
Minority carrier transient spectroscopy | |
mirror electron microscope | |
Mist-CVD | |
Mobility | |
mobility model | |
MOCVD | |
Model | |
modeling | |
Modelling | |
modular multilevel converters | |
module | |
module architecture | |
Molecular dynamics | |
molecular dynamics simulations | |
Monolithic Integration | |
Morphological analysis | |
MOS | |
MOS Capacitor | |
MOS Capacitors | |
MOS Cell | |
MOS channel mobility | |
MOS devices | |
MOS interface | |
MOS structure | |
MoS2 | |
MOScapacitor | |
MOSFET | |
MOSFET processing | |
MOSFETs | |
MOSFETs in parallel | |
motor drive | |
MPS diode | |
MRR | |
Multi-Epi | |
Multi-Layer Epi | |
multi-physics modeling | |
Multi-Wafer Reactor | |
muon spin spectroscopy | |
N | |
n-channel | |
nano-FTIR | |
Nanofabrication | |
nanopipe | |
Nanosecond Laser Annealing | |
nanosheets | |
Near interface traps | |
Near-field Raman | |
near-interface traps | |
Negative Vth Shift | |
neural interface | |
neural interfaces | |
neutron detectors | |
neutron irradiation | |
NiAl | |
NiAl alloy contacts | |
Nickel contact | |
Nickel silicidation | |
Nickel silicide | |
Nickel Silicide formation | |
NIOTs | |
NiSi and Ti P+ Contacts | |
Nitridation | |
nitrogen | |
Nitrogen Plasma | |
Nitrogen surface doping | |
nitrogen vacancy pair | |
NO annealing | |
non alloyed | |
non-abrasive slurry | |
Non-alloyed ohmic contact | |
Non-contact CV | |
non-polar face | |
non-radiative spin relaxation | |
non-stoichiometric source | |
noncontact | |
nonpolar face | |
Novel Defect | |
Novel high-k gate dielectric | |
nuclear magnetic resonance | |
nuclear spin | |
numerical modeling | |
numerical simulation | |
O | |
ODMR | |
off-axis seed crystal | |
Ohmic | |
Ohmic contact | |
Ohmic contacts | |
On-line monitoring | |
on-resistance of Power MOSFET | |
On-state Resistance | |
Ones-sided shielded Trench | |
Optical Beam Induced Current | |
Optical BJT | |
optical cavities | |
Optical excitation | |
Optical inspection | |
optical method | |
optical microscope image | |
Optical Microscopy | |
optical modeling | |
Optical Properties | |
optical spectroscopy | |
optically detected magnetic resonance | |
optimization | |
Oxidation | |
Oxidation processes | |
Oxide Defects | |
Oxide traps | |
oxygen defect | |
P | |
p base | |
P+ Ohmic Contact Resistance | |
p-channel | |
p-channel MOSFET | |
p-diode model | |
p-n junctions | |
P-shielding | |
p-type | |
p-type contact resistance | |
p-type poly-Si gate | |
p-type SiC | |
package architecture | |
Packaging | |
pad | |
Parallel SiC MOSFETs | |
paralleling | |
Parameter optimization | |
Parasitic Turn On | |
passivation | |
Patterned Substrate | |
Patterned surface | |
PbC center | |
Peripheral Protection | |
permittivity | |
phase field | |
phase transformation | |
phase-change | |
photo physics | |
Photo-electrochemical etching | |
photo-modulated reflectance | |
photocurrent detected magnetic resonance | |
Photodiode | |
photoelectrochemical oxidation | |
photolithography | |
photoluminescence | |
Photoluminescence spectroscopy | |
photomask layout | |
photon-assisted electron injection | |
Photonic | |
photonic devices | |
Physical model | |
physical vapor transport growth | |
PiN Diodes | |
pin-diode | |
Pinched Barrier Rectifier (PBR) | |
Pixel Devices | |
Planar | |
Planar MOSFET | |
planetary science | |
plasma etching | |
Plasma treatment | |
Plasmonic | |
PMR | |
PN diode | |
PND | |
POA | |
Point defects | |
polar face | |
polarity | |
Polarized light microscopy | |
Polish | |
Polish Grinding | |
Polishing | |
polycrystalline SiC | |
polycrystalline Silicon Carbide | |
Polytype stability | |
polytypes | |
Porosification | |
Porous SiC | |
Positive and negative polarization stress | |
Positively beveled mesa termination | |
Post-deposition annealing | |
Power | |
power cycling | |
power cycling test | |
Power device | |
Power devices | |
Power module | |
Power Modules | |
Power MOSFET | |
Power MOSFETs | |
Power semiconductor | |
power SiC | |
Power switching cells | |
powertrain | |
pre-treatment process | |
precipitates | |
precision | |
predictive modeling | |
preferential orientation | |
Prismatic dislocations | |
process interruptions | |
process simulation | |
Process variation | |
processes | |
Processing | |
Production line | |
Protection | |
protection overcoat design | |
proton implantation | |
proton irradiation | |
protons | |
pulsed electron paramagnetic resonance spectroscopy | |
pulsed forward current | |
purification | |
purified graphite | |
PVD | |
PVT | |
PVT growth | |
PVT SiC | |
Q | |
Q-factor | |
QUAD mapping | |
quality | |
Quantum | |
quantum applications | |
quantum bits | |
quantum centers | |
Quantum defects | |
Quantum devices | |
Quantum emitter | |
quantum memory | |
quantum networks | |
Quantum Sensing | |
Quantum well | |
Quantum well effect | |
quasi-substrate | |
R | |
Rad-hard | |
Radiation | |
radiation detector | |
radiation hard sensors | |
Radiation Hardening | |
radiation hardness | |
radiation sensors | |
Radiation-Hard | |
Radiation-hardness | |
Radiation-Induced characterization | |
radiaton hard sensors | |
radiotherapies | |
Raman com measurement | |
Raman spectroscopy | |
Raman/SERS | |
Range | |
Rapid growth | |
rapid thermal processing | |
RDSON | |
Reactive Ion Etching | |
reactive materials | |
Recombination Enhanced Dislocation Glide | |
Recovery | |
recycled powder lump | |
reduced pressure oxidation | |
Reflectance Spectroscopy | |
Regional Coverage | |
Reliability | |
Remote Epitaxy | |
removal | |
removal rate | |
repeated surge stress | |
resistance | |
resistance integration | |
resistivity | |
resistivity map | |
Resistivity measurement | |
Reverse recovery | |
Reverse Recovery Energy | |
review | |
RF | |
RF sputtering | |
RIE | |
RONSP | |
room temperature | |
Room temperature bonding | |
roughness | |
Rounded Corner | |
Ruggedness | |
S | |
Sandwich | |
SBD-MOSFET | |
scaling | |
Scaling Up | |
Scanning Capacitance Microscopy | |
scanning electron microscope | |
scanning electron microscopy | |
Scanning Probe Microscopy | |
Scanning Spreading Resistance Microscopy | |
Schockley stacking faults | |
Schottky barrier diode | |
Schottky Barrier Diodes | |
Schottky Barrier Height (SBH) | |
Schottky Barrier Height Inhomogeneity | |
Schottky contacts | |
Schottky diode | |
Schottky diodes | |
Schottky emission | |
scratch induced dislocation | |
SCWT | |
secondary electron doping contrast | |
secondary ion mass spectrometry | |
selection rules in excitation | |
Selectivity | |
self heating | |
Self-aligned channel | |
SEM | |
SEM Vision | |
semi-insulating substrate | |
Semiconductor substrates | |
semiconductors | |
sensing | |
Sensor | |
sensors | |
shallow ion implantation | |
Shockley-Type Stacking Fault | |
Short channel effects | |
short circuit | |
Short circuit withstand time | |
Short Step Bunching (SSB) | |
short-channel effects | |
Short-circuit | |
Si-face | |
SiC | |
SiC Bipolar Device | |
SiC Boule Fabrication | |
SiC Boule Processing | |
SiC Boule to Puck Conversion | |
SiC bulk growth | |
SiC Charge-Balanced MOSFET | |
SiC CMOS | |
SiC crystal growth | |
SiC defect | |
SiC defect characterization | |
SiC diode | |
SiC Epi | |
SiC Epitaxy | |
SiC GTO | |
SiC Ingot Fabrication | |
SiC Integrated circuits | |
SiC layer transfer | |
SiC Lifetime enhancement | |
SiC module | |
SiC MOS | |
SiC MOS devices | |
SiC MOSFET | |
SiC MOSFETs | |
SiC MPS diode | |
SiC PN and MPS Diodes | |
SiC polishing | |
SiC powder | |
SiC power device | |
SiC power MOSFET | |
SiC power MOSFETs | |
SiC single crystal | |
SiC solution growth | |
SiC source | |
SiC substrates | |
SiC surface protection | |
SiC thermal oxidation | |
SiC trench MOSFET | |
SiC trench MOSFETs | |
SiC wafering | |
SiC&GaN | |
SiC-CMOS | |
SiC-MOSFET | |
SiC-on-insulator | |
SiC-on-insulator (SiCOI) | |
SiC-OpAmp | |
SiC-SiO2 interface | |
SiC/SiO2 | |
SiC/SiO2 interface | |
SiC/SiO2-interface characterization | |
Silicidation model | |
Silicide | |
silicon carbide | |
silicon carbide (SiC) | |
Silicon carbide wafer | |
Silicon Carbide(SiC) | |
silicon vacancy | |
silicon-carbide | |
Silver Nanoparticles | |
SIMS | |
Simulation | |
simulations | |
simultaneous data fitting | |
single bilayer step | |
single defect | |
single divacancy defects | |
single event burnout | |
Single event burnout (SEB) | |
single event effect | |
Single event effects | |
Single Event Immunity | |
single photon emitters | |
single photon emitters (SPEs) | |
single photon source | |
Single Shockley Stacking Faults | |
Single-Event Gate Rupture(SEGR) | |
single-zone junction termination edge | |
SiO2 | |
SiO2/SiC interface | |
SiO2/SiC interface carbon reduction | |
SiO2/SiC interfaces | |
slicing | |
slicing process | |
Slicon Carbide | |
slow transient | |
Slurry | |
smart cut | |
Smart Cut™ | |
SmartCut | |
SmartCut™ | |
SmartSiC | |
SmartSiCTM | |
SmartSiCTM Substrate | |
SmartSiC™ | |
sMIM | |
Snapback | |
SNDM | |
Software modeling | |
solid state transformer(SST) | |
solution growth | |
Solution properties | |
solvent inclusion | |
Space | |
space explorations | |
Specific on-resistance | |
spectroscopy | |
SPICE | |
SPICE modeling | |
Spin Centers | |
spin coherent control | |
Spin defect | |
spin dephasing | |
Spin dynamics | |
Spin Magnetic Resonance | |
Spin-active defects | |
spins | |
Split C-V | |
Spreading Resistance Profiling | |
Sputter deposition | |
SSCB | |
SSF | |
stability | |
stacking fault | |
Stacking Faults | |
Stacking faults in SiC | |
Standard molar enthalpy | |
Static Random Access Memory | |
Statistical Mechanics | |
Step bunching | |
Step debunching | |
step-bunching | |
step-terrace structure | |
Stray Inductance | |
Stress | |
Stress & Measure | |
stress distribution | |
striations | |
Strucutre of stacking faluts | |
Sublimation etching | |
sublimation process | |
Substrate | |
Substrate BPD defect | |
Substrate Reuse | |
subsurface damage | |
Subthreshold drain leakage | |
subthreshold slope | |
subthreshold technique | |
Sulfur | |
Super Junction | |
super-junction | |
supercritical fluid treatment | |
Superjunction DMOSFET | |
Superjunction-MOSFETs | |
Surface | |
Surface damage | |
Surface energy | |
surface finish | |
surface micromachining | |
Surface morphology | |
Surface quantum well | |
surface recombination | |
surface roughness | |
Surface structuring | |
Surge capability | |
surge current | |
Surge Current Robustness | |
Sustainability | |
switching characteristics | |
Switching Energy | |
switching energy losses | |
synchrotron diffraction | |
T | |
TaC | |
Tail band trap | |
TBA1 | |
TBA2 | |
TBA3 | |
TBD | |
TBD1 | |
TBD2 | |
TBD3 | |
TCAD | |
TCAD simulation | |
TCAD simulations | |
TCS | |
TDDB | |
TDTR | |
Telecom bands | |
TEM | |
Temperature | |
Temperature Dependence | |
Temperature Dependent Electrical Properties | |
temperature field | |
Temperature sensor | |
Temperature-dependent Hall coefficient | |
Temperature-dependent resistivity | |
Testing | |
thermal boundary resistance | |
thermal conductivity | |
thermal decomposition epitaxy | |
thermal fluid simulation | |
thermal oxidation | |
Thermal stability | |
thermal stress | |
Thermal treatment | |
Thermionic effect | |
thermo-mechanical stress | |
Thermo-optic modulator | |
Thermochromic | |
thick epitaxial growth | |
Thick epitaxial layers | |
Thick epitaxy | |
Thickness | |
Thin film | |
thin films | |
Thin foil | |
Thin foils | |
Thinning | |
third quadrant | |
threading screw dislocation | |
Threshold Voltage | |
threshold voltage drift | |
Threshold voltage instability | |
Threshold voltage stability | |
Threshold-Voltage Instability | |
throughput | |
Time-dependent dielectric breakdown | |
TiN | |
TMBS | |
Total ionising Dose | |
Total ionizing dose (TID) | |
TPRE | |
trace element analysis | |
Traction | |
transient events | |
Transient Simulation | |
transient thermal resistance | |
transient-enhanced diffusion | |
transistor | |
transition metal ion | |
transmission electron microscope | |
Transmission Electron Microscopy | |
Transparent Thin Layers | |
trap state | |
trap-assisted tunneling | |
trapping | |
Traps | |
Trench | |
trench gate | |
Trench MOSFET | |
trenched gate | |
Trenched junction-pinched barrier rectifier (TBR) | |
TrenchMOS | |
TSD | |
TSI Semiconductors | |
TSSG method | |
Tunneling | |
tunneling current | |
Twin mediated growth | |
Two-dimensional materials | |
U | |
UIS | |
ultra-high-voltage | |
Ultraviolet Irradiation | |
Ultraviolet Photoluminescence | |
Ultraviolet Photoluminescence Imaging | |
Unclamped Inductive Switching | |
uniformity improvement | |
unipolar AC stress | |
UV | |
UV Expansion | |
UV Imaging | |
UV irradiation | |
UV Laser | |
UV-PL | |
UVPL | |
UVPL Imaging | |
V | |
V-doped semi-insulating | |
V-doped SiC source | |
vacancy | |
vacancy-related defects | |
Vacuum-Packaged Resonators | |
variability | |
VDMOS | |
VDMOSFET | |
Venus | |
Vertical | |
vicinal carbon face | |
vicinal off angle | |
VIISta® SiC | |
virtual prototyping | |
viruses | |
voltage adjustable diode | |
Voltage mapping | |
Voltage overshoot | |
VTH | |
Vth instability | |
Vth stability | |
VUV | |
W | |
wafer | |
Wafer bonding | |
wafer dicing | |
Wafer inspection | |
Wafer probing | |
Wafer quality inspection | |
Wafer Ready Material | |
Wafer testing | |
wafer yield | |
Wafering | |
Wafering Process | |
wafers | |
water jet guided laser | |
wavefunction | |
waveguides | |
Waveguiding | |
Wide Bandgap | |
Wide-bandgap power devices | |
X | |
X-ray Analysis | |
X-ray topography | |
X-rays | |
Xray monitoring | |
XRDI | |
XRT | |
Y | |
Yield | |
Z | |
Z1 and Z2 defects | |
µ | |
µ-Raman |