TALK KEYWORD INDEX
This page contains an index consisting of author-provided keywords.
| ( | |
| (000−1) surface | |
| - | |
| - 4H SiC | |
| - scanning tunneling luminescence microscopy | |
| - step-bunched | |
| - sub-gap electroluminescence | |
| - surface defects | |
| 1 | |
| 1.2 kV | |
| 1.2 kV 4H-SiC MOSFET | |
| 1.2kV SiC MOSFETs | |
| 150mm | |
| 2 | |
| 200mm | |
| 200mm 4H-SiC | |
| 200mm SiC | |
| 2D electron gas | |
| 2D Material | |
| 2D materials | |
| 2D SiC | |
| 2D simulations | |
| 3 | |
| 3-dimensional observation | |
| 3.3 kV SiC VDMOSFET | |
| 3.3kV | |
| 3.3kV MOSFET robustness to BPD faulting | |
| 3.3kV SiC MOSFET | |
| 3C SiC | |
| 3C-SiC | |
| 3C-SiC micro-structures | |
| 3D simulation | |
| 3rd quadrant | |
| 4 | |
| 4-H SiC | |
| 4H | |
| 4H SiC | |
| 4H silicon carbide | |
| 4H- Silicon Carbide | |
| 4H-SiC | |
| 4H-SiC BJT | |
| 4H-SiC epitaxial layer characterization | |
| 4H-SiC MOSFET | |
| 4H-SiC Power MOSFETs | |
| 4H-SiC Taiko Wafers | |
| 6 | |
| 650V | |
| 6H-SiC | |
| 8 | |
| 8 inch substrate | |
| 8-inch SiC | |
| 800°C SiC MOSFET characterization | |
| A | |
| a-face | |
| a-SiCOI | |
| ab initio theory | |
| Accelarated testing | |
| Accelerated Tests | |
| Accelerated wafer-level BVR reliability test | |
| Acquisition | |
| Activation | |
| Activation energy | |
| Adhesion | |
| Advanced power cycling | |
| aerospace | |
| AFM | |
| AI | |
| air pocket design | |
| Al | |
| Al implantation | |
| Al ion implantation | |
| Al+ implantation | |
| Al2O3 | |
| Al2O3/LaAlO3/SiO2 | |
| ALD | |
| AlGaN | |
| AlN | |
| alpaha particles | |
| Alpha particle | |
| Aluminium Gallium Oxide | |
| aluminum | |
| Aluminum doping | |
| aluminum implantation | |
| Ammonothermal | |
| amorphous Si | |
| amorphous SiC | |
| Amorphous silicon carbide | |
| amplifier | |
| Analytical Modelling | |
| Annealing | |
| anode hole injection | |
| Anomalous Hall coefficient | |
| ANSYS thermomechanical simulations | |
| Arcing | |
| Atomic Force Microscopy | |
| Atomic Layer Deposition | |
| Atomic step structure | |
| atomic step velocity | |
| atomically flat surface | |
| ATP Probe | |
| automotive | |
| avalanche | |
| Avalanche breakdown | |
| Avalanche capability | |
| B | |
| back grinding | |
| Backside contact | |
| Backside Ohmic contact | |
| Band-to-band-tunneling | |
| basal plane dislocation | |
| Basal Plane Dislocation (BPD) | |
| beam position monitors | |
| Beam shaping | |
| beamline instrumentation | |
| Bias-temperature instability | |
| Bidirectional Power Device | |
| Bidirectional Switch | |
| bilayer dielectric | |
| binary-collision approximation | |
| biomedical devices | |
| biosensor | |
| biotechnology | |
| bipolar AC stress | |
| bipolar degradation | |
| Bipolar Devices | |
| Bipolar reliability | |
| Bipolar technology | |
| birefringence | |
| Birefringence imaging | |
| BMA cell | |
| body diode | |
| body diode SiC MOSFETs | |
| bonded substrate | |
| Boron carbide | |
| Bosch | |
| Boule testing | |
| BPD | |
| BPD free | |
| Breakdown Field | |
| bright photon emission | |
| buffer | |
| buffer layer | |
| Bulk crystal growth | |
| bulk growth | |
| Bulk inclusion | |
| Burgers vector | |
| buried p+ layer | |
| Burn-in Screening | |
| byproduct | |
| C | |
| c-axis | |
| C-V | |
| cantilever | |
| Capacitance | |
| Capacitance curves | |
| Capacitance-Voltage | |
| Capacitive charge | |
| Capacitive charge (Qc) | |
| Capacitor | |
| capacity expansion | |
| Capping | |
| capture cross section | |
| carbon aggregates | |
| carbon dioxide (CO2) | |
| Carbon flux | |
| carbon in oxide | |
| Carbon vacancy | |
| Carbothermal reduction | |
| carrier lifetime | |
| catalyst-referred etching | |
| catalyzed chemical etching | |
| Cathodoluminescence | |
| CC-DLTS | |
| Cell pitch | |
| CFD simulation | |
| Channel length | |
| Channel Mobility | |
| Channel resistance | |
| Channeling | |
| channeling ion implantation | |
| characterisation | |
| Characterization | |
| Charge carrier capture | |
| charge pumping | |
| Charge transition levels | |
| charge trapping and detrapping | |
| Charge-based wafer inspection | |
| Chemical Mechanical Planarization | |
| Chemical mechanical polishing | |
| Chemical mechanical polishing (CMP) | |
| chemical vapor deposition | |
| Chloride-based chemistry | |
| Chlorine oxidation | |
| Circuit Board | |
| Circuit Breaker | |
| circuit model | |
| Circuit Simulation | |
| Circular TLM | |
| CJFET | |
| cleaning | |
| CMOS | |
| CMOS Image Sensor | |
| CMOS Inverter | |
| CMOS technology | |
| CMP | |
| CMP process | |
| CO oxidation | |
| Co-60 | |
| CO2 oxidation | |
| CO2-annealing | |
| coating | |
| coil position | |
| Color | |
| Color centers | |
| Commercialization | |
| Compact modeling | |
| compensating center | |
| compressed sensing | |
| Conductance | |
| Conductance method | |
| Conduction Loss | |
| Conduction Mechanism | |
| confocal photoluminescence spectroscopy | |
| Constant current stress | |
| Constant voltage stress | |
| consumables | |
| Contact | |
| contact resistance | |
| contamination | |
| Contraction | |
| Controlled spalling | |
| convolutional neural network | |
| Cooperativity | |
| Corona | |
| Corona-Kelvin method | |
| Cost of Ownership | |
| cost reduction | |
| Critical Regime | |
| Critical stress time | |
| critical temperature | |
| Cryogenic | |
| cryogenic temperatures | |
| Crystal damage and recovery | |
| Crystal Defects | |
| Crystal growth | |
| Crystallization Behavior | |
| Crystallographic defects | |
| Current sensor | |
| current spreading | |
| Current Transport | |
| curvature | |
| CVD | |
| CVD Epitaxial growth | |
| CVD-SIC block | |
| D | |
| damage free | |
| damage-free dicing | |
| DCDC converter | |
| deep implantation | |
| Deep Level Transient Spectroscopy | |
| deep level trap | |
| Deep-Level Transient Spectroscopy | |
| Defect | |
| defect analysis | |
| defect characterization | |
| Defect curing | |
| defect density | |
| defect engineering | |
| defect imaging | |
| defect inspection | |
| Defect interaction in SiC | |
| Defect maps | |
| Defect Mechanisms | |
| Defect recognition | |
| defect reduction | |
| Defect structure | |
| defectivity | |
| Defects | |
| Defects from High Carrier Injection | |
| degradation | |
| delamination | |
| density functional theory | |
| Deposited Gate Oxide | |
| Depth profiling techniques | |
| Design | |
| Design of Experiments | |
| Design optimization | |
| detector stability | |
| deterministic divacancy synthesis | |
| device characterization | |
| Device fabrication | |
| Device Modeling | |
| Device packaging design for high temperature testing | |
| device simulation | |
| devices | |
| Dewetting | |
| DFT modeling | |
| Diamond | |
| diamond size | |
| dicing | |
| Dielectric Breakdown | |
| dielectric constant | |
| Dielectric stack | |
| dielectrics | |
| Diffusion | |
| Diffusion Barrier | |
| Diode | |
| dipole scattering | |
| Direct bonding of SiO2 and SiC | |
| Directionality | |
| Dislocation | |
| Dislocation Density | |
| dislocation formation | |
| dislocation loops | |
| Dislocation multiplication | |
| dislocation propagation | |
| dislocations | |
| Distributed circuit model | |
| divacancy | |
| divacancy quantum defects | |
| DLTS | |
| DMOS | |
| DMP | |
| Dopant Activation | |
| Doped HfO2 | |
| Doping | |
| Doping characterization | |
| doping contrast | |
| Doping density variation | |
| Doping Dependence | |
| double donor | |
| Double Pulse Test Switching (DPTS) | |
| Double Pulse Testing | |
| Double side polishing | |
| Double Trench | |
| Double-Pulse Testing | |
| drain-source capacitance | |
| Drift resistance | |
| drift-zone doping | |
| Dry Etching | |
| dry polishing | |
| duble p base structure | |
| Dynamic AGE-ing (DA) | |
| Dynamic capacitance | |
| Dynamic Characterization | |
| Dynamic On-Resistance | |
| E | |
| EBSD | |
| Edge coupler | |
| Edge grinding | |
| EDMR | |
| EDS | |
| effective mass approximation | |
| Effects of etching processing parameters | |
| ELDRS | |
| electric vehicle | |
| Electrical Characteristics | |
| Electrical characteristics of device | |
| electrical characterization | |
| electrical impedance spectroscopy | |
| electrical spin detection | |
| electrically detected magnetic resonance | |
| Electrically-active defects | |
| Electrification | |
| Electro plating | |
| electrochemical etching | |
| electron drift mobility | |
| electron nuclear double resonance | |
| electron radiations | |
| Electron traps | |
| electronic stopping | |
| electrons | |
| electroplating | |
| Electrothermal imbalance | |
| Embedded SBD | |
| Embedded sensor | |
| energy conversion efficiency | |
| Energy-filter | |
| engineered substrate | |
| Engineered substrates | |
| eoitaxy | |
| Epi stacking fault defect | |
| Epi-ready surface | |
| epigraphene | |
| Epitaxial Defects | |
| Epitaxial growth | |
| Epitaxy | |
| equilibrium diffusion | |
| equivalent circuit | |
| Etch | |
| Etch Optimisation | |
| etch pit density | |
| Etching | |
| Etching Chemistry | |
| ETV-ICP-OES | |
| EV | |
| Excimer laser | |
| excitation dependence | |
| excitonic features | |
| Excluding oxidation process | |
| exhaust tube | |
| expansion velocity | |
| extended defects | |
| Extreme temperature electronics | |
| F | |
| Failure Analysis | |
| failure modes | |
| Fast Sublimation Growth Process Monocrystalline | |
| Fast Switching | |
| Femtosecond laser | |
| Ferroelectric materials | |
| Field Effect Mobility | |
| FinFET effect | |
| Finite Element Analysis (FEA) | |
| first principles calculations | |
| flexibility | |
| flexural strength | |
| floating | |
| focus ring | |
| Formation energy | |
| forward bias degradation | |
| Forward voltage drop | |
| Fowler-Nordheim tunneling | |
| Frequency | |
| FSGP-M | |
| FTIR | |
| Furnace | |
| future technology | |
| G | |
| GaAs | |
| gain | |
| gain fluctuation | |
| Gallium Nitride | |
| Gallium Oxide | |
| Gamma Radiation | |
| gamma-ray | |
| GaN | |
| GaN cap | |
| Gate All Around | |
| Gate Breakdown | |
| Gate current | |
| Gate driver | |
| gate finger | |
| gate leakage | |
| Gate oxide | |
| gate oxide breakdown | |
| Gate oxide carbon control | |
| gate oxide failure | |
| Gate oxide integrity | |
| gate oxide quality improvement | |
| Gate oxide reliability | |
| Gate Oxide Screening | |
| Gate reliability | |
| Gate Ringing | |
| gate runner | |
| Gate Trench | |
| GCT | |
| Graphen | |
| Graphene | |
| graphite felt | |
| graphite materials | |
| Grinding | |
| grinding energy | |
| grinding wheel | |
| Grounding | |
| growth | |
| growth front shape reconstruction | |
| H | |
| H2 treatment | |
| H2 treatment and Interface nitrogen | |
| HAADF-STEM | |
| halide CVD | |
| Hall Effect | |
| harsh environments | |
| HCl | |
| Heavily Al-doped 4H-SiC | |
| Heavy ion | |
| Heavy ions | |
| Heavy-ions | |
| helium ion implantation | |
| HEMT | |
| hetero epitaxy | |
| Heteroepitaxy | |
| Heterogeneous integration | |
| heterojunction | |
| heterojunctions | |
| heterostructure | |
| high carrier lifetime | |
| High cycle fatigue zone | |
| high energy | |
| high energy ion implantation | |
| high power | |
| high readout contrast | |
| High rigid grinding | |
| high temperature | |
| high temperature gate bias | |
| high temperature IC | |
| high temperature ion implantation | |
| High Throughput | |
| High Voltage | |
| High Volume Production | |
| High- temperature electronics | |
| High-k | |
| high-k dielectric | |
| high-k dielectrics | |
| High-k gate dielectric | |
| high-k materials | |
| High-low | |
| high-pressure SF6 plasma | |
| High-speed Photoluminescence mapping | |
| High-speed switching | |
| High-Temperature | |
| high-temperature annealing | |
| high-temperature chemical vapor deposition | |
| high-temperature gas source method | |
| high-temperature irradiation | |
| high-temperature physical properties | |
| Hole traps | |
| homo epitaxy | |
| hot filament | |
| hot-zone design | |
| HPSI | |
| HPSI 4H-SiC wafer charaterization | |
| HRXRD study | |
| HT Anneal and P+ Implant Process Parameters | |
| HTCVD | |
| HTGB | |
| HTRB | |
| Humidity | |
| HVDC | |
| HVPE | |
| Hybrid device | |
| I | |
| I2t | |
| ICP | |
| ICP-OES | |
| Ideality | |
| Identification of stacking faults | |
| Idss leakage current | |
| IFSM Ruggedness | |
| IGBT | |
| IGCT | |
| implant | |
| Implantation | |
| Implantation process | |
| Implicit differentiable models | |
| Impurities | |
| In-grown stacking fault | |
| Inclined line-like defects | |
| Incomplete Ionization | |
| Inductively Coupled Plasma | |
| Industrialization | |
| infrared metrology | |
| Infrared thermography | |
| instability | |
| Integrated Circuit | |
| integrated circuits | |
| integrated optics | |
| Integrated photonics | |
| Interatomic potential | |
| interface | |
| interface carbon defect | |
| Interface characterization | |
| interface defect of SiC/SiO2 | |
| Interface defects | |
| Interface engineering | |
| Interface nitrogen | |
| Interface state density | |
| interface states | |
| interface states density | |
| Interface Trap Density | |
| Interface traps | |
| intersystem crossing | |
| Intrinsic body diode | |
| Inverse Laplace Transform | |
| Inverter | |
| Ion | |
| ion beam trimming | |
| Ion implantation | |
| ion slicing | |
| Ionic charges | |
| Ionization energies | |
| irradiated SiC | |
| irradiation | |
| isolation | |
| isotopic enrichment | |
| isotopic purity | |
| J | |
| JBS | |
| JBS diode | |
| JFET | |
| JFET Diode | |
| Junction depth | |
| junction-controlled-diode | |
| K | |
| KGD | |
| Known Good Die | |
| KPFM | |
| L | |
| Laplace deep level transient spectroscopy (LDLTS) | |
| Laplace-transform photoinduced transient spectroscopy (LPITS) | |
| laser ablation processing | |
| Laser Anneal | |
| Laser annealing | |
| Laser doping | |
| Laser Separation | |
| laser split | |
| Lateral | |
| Lateral MOSFET | |
| Lateral SiC MOSFETs | |
| Lateral straggling | |
| layer transfer | |
| Leakage current | |
| Lifetime estimation | |
| Lift-Off | |
| Lindblad Master Equation | |
| Liquid Si | |
| Long Inverted Silicon Pyramids substrates | |
| Long-term reliability | |
| low angle grain boundary | |
| low resistivity | |
| Low Specific On resistance | |
| Low Temperature | |
| low-energy muons | |
| Low-ohmic contacts | |
| lower pressure thermal oxidation | |
| M | |
| m-face | |
| machine learning | |
| Macrostep | |
| Macrostep growth | |
| magnetometer | |
| magnetometers | |
| magnetometry | |
| Manufacturing | |
| MAPCE | |
| Mass transport | |
| Material characterization | |
| Material Loss | |
| material loss free | |
| material removal rate | |
| Material testing | |
| MCTS | |
| mechanical polish | |
| Memory Effect | |
| MEMS | |
| Merged PiN Schottky diode | |
| Mesa structure | |
| metal mask | |
| metal oxides | |
| Metalization | |
| metallic via | |
| Metallization | |
| Metrology | |
| Micro-pipe | |
| micro-PL | |
| micro-Raman | |
| microfabrication | |
| microlens arrays | |
| micropipe | |
| microresonator fabrication | |
| Microring resonator | |
| microstructure | |
| Minority carrier transient spectroscopy | |
| mirror electron microscope | |
| Mist-CVD | |
| Mobility | |
| mobility model | |
| MOCVD | |
| Model | |
| modeling | |
| Modelling | |
| modular multilevel converters | |
| module | |
| module architecture | |
| Molecular dynamics | |
| molecular dynamics simulations | |
| Monolithic Integration | |
| Morphological analysis | |
| MOS | |
| MOS Capacitor | |
| MOS Capacitors | |
| MOS Cell | |
| MOS channel mobility | |
| MOS devices | |
| MOS interface | |
| MOS structure | |
| MoS2 | |
| MOScapacitor | |
| MOSFET | |
| MOSFET processing | |
| MOSFETs | |
| MOSFETs in parallel | |
| motor drive | |
| MPS diode | |
| MRR | |
| Multi-Epi | |
| Multi-Layer Epi | |
| multi-physics modeling | |
| Multi-Wafer Reactor | |
| muon spin spectroscopy | |
| N | |
| n-channel | |
| nano-FTIR | |
| Nanofabrication | |
| nanopipe | |
| Nanosecond Laser Annealing | |
| nanosheets | |
| Near interface traps | |
| Near-field Raman | |
| near-interface traps | |
| Negative Vth Shift | |
| neural interface | |
| neural interfaces | |
| neutron detectors | |
| neutron irradiation | |
| NiAl | |
| NiAl alloy contacts | |
| Nickel contact | |
| Nickel silicidation | |
| Nickel silicide | |
| Nickel Silicide formation | |
| NIOTs | |
| NiSi and Ti P+ Contacts | |
| Nitridation | |
| nitrogen | |
| Nitrogen Plasma | |
| Nitrogen surface doping | |
| nitrogen vacancy pair | |
| NO annealing | |
| non alloyed | |
| non-abrasive slurry | |
| Non-alloyed ohmic contact | |
| Non-contact CV | |
| non-polar face | |
| non-radiative spin relaxation | |
| non-stoichiometric source | |
| noncontact | |
| nonpolar face | |
| Novel Defect | |
| Novel high-k gate dielectric | |
| nuclear magnetic resonance | |
| nuclear spin | |
| numerical modeling | |
| numerical simulation | |
| O | |
| ODMR | |
| off-axis seed crystal | |
| Ohmic | |
| Ohmic contact | |
| Ohmic contacts | |
| On-line monitoring | |
| on-resistance of Power MOSFET | |
| On-state Resistance | |
| Ones-sided shielded Trench | |
| Optical Beam Induced Current | |
| Optical BJT | |
| optical cavities | |
| Optical excitation | |
| Optical inspection | |
| optical method | |
| optical microscope image | |
| Optical Microscopy | |
| optical modeling | |
| Optical Properties | |
| optical spectroscopy | |
| optically detected magnetic resonance | |
| optimization | |
| Oxidation | |
| Oxidation processes | |
| Oxide Defects | |
| Oxide traps | |
| oxygen defect | |
| P | |
| p base | |
| P+ Ohmic Contact Resistance | |
| p-channel | |
| p-channel MOSFET | |
| p-diode model | |
| p-n junctions | |
| P-shielding | |
| p-type | |
| p-type contact resistance | |
| p-type poly-Si gate | |
| p-type SiC | |
| package architecture | |
| Packaging | |
| pad | |
| Parallel SiC MOSFETs | |
| paralleling | |
| Parameter optimization | |
| Parasitic Turn On | |
| passivation | |
| Patterned Substrate | |
| Patterned surface | |
| PbC center | |
| Peripheral Protection | |
| permittivity | |
| phase field | |
| phase transformation | |
| phase-change | |
| photo physics | |
| Photo-electrochemical etching | |
| photo-modulated reflectance | |
| photocurrent detected magnetic resonance | |
| Photodiode | |
| photoelectrochemical oxidation | |
| photolithography | |
| photoluminescence | |
| Photoluminescence spectroscopy | |
| photomask layout | |
| photon-assisted electron injection | |
| Photonic | |
| photonic devices | |
| Physical model | |
| physical vapor transport growth | |
| PiN Diodes | |
| pin-diode | |
| Pinched Barrier Rectifier (PBR) | |
| Pixel Devices | |
| Planar | |
| Planar MOSFET | |
| planetary science | |
| plasma etching | |
| Plasma treatment | |
| Plasmonic | |
| PMR | |
| PN diode | |
| PND | |
| POA | |
| Point defects | |
| polar face | |
| polarity | |
| Polarized light microscopy | |
| Polish | |
| Polish Grinding | |
| Polishing | |
| polycrystalline SiC | |
| polycrystalline Silicon Carbide | |
| Polytype stability | |
| polytypes | |
| Porosification | |
| Porous SiC | |
| Positive and negative polarization stress | |
| Positively beveled mesa termination | |
| Post-deposition annealing | |
| Power | |
| power cycling | |
| power cycling test | |
| Power device | |
| Power devices | |
| Power module | |
| Power Modules | |
| Power MOSFET | |
| Power MOSFETs | |
| Power semiconductor | |
| power SiC | |
| Power switching cells | |
| powertrain | |
| pre-treatment process | |
| precipitates | |
| precision | |
| predictive modeling | |
| preferential orientation | |
| Prismatic dislocations | |
| process interruptions | |
| process simulation | |
| Process variation | |
| processes | |
| Processing | |
| Production line | |
| Protection | |
| protection overcoat design | |
| proton implantation | |
| proton irradiation | |
| protons | |
| pulsed electron paramagnetic resonance spectroscopy | |
| pulsed forward current | |
| purification | |
| purified graphite | |
| PVD | |
| PVT | |
| PVT growth | |
| PVT SiC | |
| Q | |
| Q-factor | |
| QUAD mapping | |
| quality | |
| Quantum | |
| quantum applications | |
| quantum bits | |
| quantum centers | |
| Quantum defects | |
| Quantum devices | |
| Quantum emitter | |
| quantum memory | |
| quantum networks | |
| Quantum Sensing | |
| Quantum well | |
| Quantum well effect | |
| quasi-substrate | |
| R | |
| Rad-hard | |
| Radiation | |
| radiation detector | |
| radiation hard sensors | |
| Radiation Hardening | |
| radiation hardness | |
| radiation sensors | |
| Radiation-Hard | |
| Radiation-hardness | |
| Radiation-Induced characterization | |
| radiaton hard sensors | |
| radiotherapies | |
| Raman com measurement | |
| Raman spectroscopy | |
| Raman/SERS | |
| Range | |
| Rapid growth | |
| rapid thermal processing | |
| RDSON | |
| Reactive Ion Etching | |
| reactive materials | |
| Recombination Enhanced Dislocation Glide | |
| Recovery | |
| recycled powder lump | |
| reduced pressure oxidation | |
| Reflectance Spectroscopy | |
| Regional Coverage | |
| Reliability | |
| Remote Epitaxy | |
| removal | |
| removal rate | |
| repeated surge stress | |
| resistance | |
| resistance integration | |
| resistivity | |
| resistivity map | |
| Resistivity measurement | |
| Reverse recovery | |
| Reverse Recovery Energy | |
| review | |
| RF | |
| RF sputtering | |
| RIE | |
| RONSP | |
| room temperature | |
| Room temperature bonding | |
| roughness | |
| Rounded Corner | |
| Ruggedness | |
| S | |
| Sandwich | |
| SBD-MOSFET | |
| scaling | |
| Scaling Up | |
| Scanning Capacitance Microscopy | |
| scanning electron microscope | |
| scanning electron microscopy | |
| Scanning Probe Microscopy | |
| Scanning Spreading Resistance Microscopy | |
| Schockley stacking faults | |
| Schottky barrier diode | |
| Schottky Barrier Diodes | |
| Schottky Barrier Height (SBH) | |
| Schottky Barrier Height Inhomogeneity | |
| Schottky contacts | |
| Schottky diode | |
| Schottky diodes | |
| Schottky emission | |
| scratch induced dislocation | |
| SCWT | |
| secondary electron doping contrast | |
| secondary ion mass spectrometry | |
| selection rules in excitation | |
| Selectivity | |
| self heating | |
| Self-aligned channel | |
| SEM | |
| SEM Vision | |
| semi-insulating substrate | |
| Semiconductor substrates | |
| semiconductors | |
| sensing | |
| Sensor | |
| sensors | |
| shallow ion implantation | |
| Shockley-Type Stacking Fault | |
| Short channel effects | |
| short circuit | |
| Short circuit withstand time | |
| Short Step Bunching (SSB) | |
| short-channel effects | |
| Short-circuit | |
| Si-face | |
| SiC | |
| SiC Bipolar Device | |
| SiC Boule Fabrication | |
| SiC Boule Processing | |
| SiC Boule to Puck Conversion | |
| SiC bulk growth | |
| SiC Charge-Balanced MOSFET | |
| SiC CMOS | |
| SiC crystal growth | |
| SiC defect | |
| SiC defect characterization | |
| SiC diode | |
| SiC Epi | |
| SiC Epitaxy | |
| SiC GTO | |
| SiC Ingot Fabrication | |
| SiC Integrated circuits | |
| SiC layer transfer | |
| SiC Lifetime enhancement | |
| SiC module | |
| SiC MOS | |
| SiC MOS devices | |
| SiC MOSFET | |
| SiC MOSFETs | |
| SiC MPS diode | |
| SiC PN and MPS Diodes | |
| SiC polishing | |
| SiC powder | |
| SiC power device | |
| SiC power MOSFET | |
| SiC power MOSFETs | |
| SiC single crystal | |
| SiC solution growth | |
| SiC source | |
| SiC substrates | |
| SiC surface protection | |
| SiC thermal oxidation | |
| SiC trench MOSFET | |
| SiC trench MOSFETs | |
| SiC wafering | |
| SiC&GaN | |
| SiC-CMOS | |
| SiC-MOSFET | |
| SiC-on-insulator | |
| SiC-on-insulator (SiCOI) | |
| SiC-OpAmp | |
| SiC-SiO2 interface | |
| SiC/SiO2 | |
| SiC/SiO2 interface | |
| SiC/SiO2-interface characterization | |
| Silicidation model | |
| Silicide | |
| silicon carbide | |
| silicon carbide (SiC) | |
| Silicon carbide wafer | |
| Silicon Carbide(SiC) | |
| silicon vacancy | |
| silicon-carbide | |
| Silver Nanoparticles | |
| SIMS | |
| Simulation | |
| simulations | |
| simultaneous data fitting | |
| single bilayer step | |
| single defect | |
| single divacancy defects | |
| single event burnout | |
| Single event burnout (SEB) | |
| single event effect | |
| Single event effects | |
| Single Event Immunity | |
| single photon emitters | |
| single photon emitters (SPEs) | |
| single photon source | |
| Single Shockley Stacking Faults | |
| Single-Event Gate Rupture(SEGR) | |
| single-zone junction termination edge | |
| SiO2 | |
| SiO2/SiC interface | |
| SiO2/SiC interface carbon reduction | |
| SiO2/SiC interfaces | |
| slicing | |
| slicing process | |
| Slicon Carbide | |
| slow transient | |
| Slurry | |
| smart cut | |
| Smart Cut™ | |
| SmartCut | |
| SmartCut™ | |
| SmartSiC | |
| SmartSiCTM | |
| SmartSiCTM Substrate | |
| SmartSiC™ | |
| sMIM | |
| Snapback | |
| SNDM | |
| Software modeling | |
| solid state transformer(SST) | |
| solution growth | |
| Solution properties | |
| solvent inclusion | |
| Space | |
| space explorations | |
| Specific on-resistance | |
| spectroscopy | |
| SPICE | |
| SPICE modeling | |
| Spin Centers | |
| spin coherent control | |
| Spin defect | |
| spin dephasing | |
| Spin dynamics | |
| Spin Magnetic Resonance | |
| Spin-active defects | |
| spins | |
| Split C-V | |
| Spreading Resistance Profiling | |
| Sputter deposition | |
| SSCB | |
| SSF | |
| stability | |
| stacking fault | |
| Stacking Faults | |
| Stacking faults in SiC | |
| Standard molar enthalpy | |
| Static Random Access Memory | |
| Statistical Mechanics | |
| Step bunching | |
| Step debunching | |
| step-bunching | |
| step-terrace structure | |
| Stray Inductance | |
| Stress | |
| Stress & Measure | |
| stress distribution | |
| striations | |
| Strucutre of stacking faluts | |
| Sublimation etching | |
| sublimation process | |
| Substrate | |
| Substrate BPD defect | |
| Substrate Reuse | |
| subsurface damage | |
| Subthreshold drain leakage | |
| subthreshold slope | |
| subthreshold technique | |
| Sulfur | |
| Super Junction | |
| super-junction | |
| supercritical fluid treatment | |
| Superjunction DMOSFET | |
| Superjunction-MOSFETs | |
| Surface | |
| Surface damage | |
| Surface energy | |
| surface finish | |
| surface micromachining | |
| Surface morphology | |
| Surface quantum well | |
| surface recombination | |
| surface roughness | |
| Surface structuring | |
| Surge capability | |
| surge current | |
| Surge Current Robustness | |
| Sustainability | |
| switching characteristics | |
| Switching Energy | |
| switching energy losses | |
| synchrotron diffraction | |
| T | |
| TaC | |
| Tail band trap | |
| TBA1 | |
| TBA2 | |
| TBA3 | |
| TBD | |
| TBD1 | |
| TBD2 | |
| TBD3 | |
| TCAD | |
| TCAD simulation | |
| TCAD simulations | |
| TCS | |
| TDDB | |
| TDTR | |
| Telecom bands | |
| TEM | |
| Temperature | |
| Temperature Dependence | |
| Temperature Dependent Electrical Properties | |
| temperature field | |
| Temperature sensor | |
| Temperature-dependent Hall coefficient | |
| Temperature-dependent resistivity | |
| Testing | |
| thermal boundary resistance | |
| thermal conductivity | |
| thermal decomposition epitaxy | |
| thermal fluid simulation | |
| thermal oxidation | |
| Thermal stability | |
| thermal stress | |
| Thermal treatment | |
| Thermionic effect | |
| thermo-mechanical stress | |
| Thermo-optic modulator | |
| Thermochromic | |
| thick epitaxial growth | |
| Thick epitaxial layers | |
| Thick epitaxy | |
| Thickness | |
| Thin film | |
| thin films | |
| Thin foil | |
| Thin foils | |
| Thinning | |
| third quadrant | |
| threading screw dislocation | |
| Threshold Voltage | |
| threshold voltage drift | |
| Threshold voltage instability | |
| Threshold voltage stability | |
| Threshold-Voltage Instability | |
| throughput | |
| Time-dependent dielectric breakdown | |
| TiN | |
| TMBS | |
| Total ionising Dose | |
| Total ionizing dose (TID) | |
| TPRE | |
| trace element analysis | |
| Traction | |
| transient events | |
| Transient Simulation | |
| transient thermal resistance | |
| transient-enhanced diffusion | |
| transistor | |
| transition metal ion | |
| transmission electron microscope | |
| Transmission Electron Microscopy | |
| Transparent Thin Layers | |
| trap state | |
| trap-assisted tunneling | |
| trapping | |
| Traps | |
| Trench | |
| trench gate | |
| Trench MOSFET | |
| trenched gate | |
| Trenched junction-pinched barrier rectifier (TBR) | |
| TrenchMOS | |
| TSD | |
| TSI Semiconductors | |
| TSSG method | |
| Tunneling | |
| tunneling current | |
| Twin mediated growth | |
| Two-dimensional materials | |
| U | |
| UIS | |
| ultra-high-voltage | |
| Ultraviolet Irradiation | |
| Ultraviolet Photoluminescence | |
| Ultraviolet Photoluminescence Imaging | |
| Unclamped Inductive Switching | |
| uniformity improvement | |
| unipolar AC stress | |
| UV | |
| UV Expansion | |
| UV Imaging | |
| UV irradiation | |
| UV Laser | |
| UV-PL | |
| UVPL | |
| UVPL Imaging | |
| V | |
| V-doped semi-insulating | |
| V-doped SiC source | |
| vacancy | |
| vacancy-related defects | |
| Vacuum-Packaged Resonators | |
| variability | |
| VDMOS | |
| VDMOSFET | |
| Venus | |
| Vertical | |
| vicinal carbon face | |
| vicinal off angle | |
| VIISta® SiC | |
| virtual prototyping | |
| viruses | |
| voltage adjustable diode | |
| Voltage mapping | |
| Voltage overshoot | |
| VTH | |
| Vth instability | |
| Vth stability | |
| VUV | |
| W | |
| wafer | |
| Wafer bonding | |
| wafer dicing | |
| Wafer inspection | |
| Wafer probing | |
| Wafer quality inspection | |
| Wafer Ready Material | |
| Wafer testing | |
| wafer yield | |
| Wafering | |
| Wafering Process | |
| wafers | |
| water jet guided laser | |
| wavefunction | |
| waveguides | |
| Waveguiding | |
| Wide Bandgap | |
| Wide-bandgap power devices | |
| X | |
| X-ray Analysis | |
| X-ray topography | |
| X-rays | |
| Xray monitoring | |
| XRDI | |
| XRT | |
| Y | |
| Yield | |
| Z | |
| Z1 and Z2 defects | |
| µ | |
| µ-Raman | |
