PROGRAM
Days: Sunday, October 4th Monday, October 5th Tuesday, October 6th Wednesday, October 7th Thursday, October 8th
Sunday, October 4th
View this program: with abstractssession overviewtalk overview
09:00-10:00 Session Information: Important Notice
- Time schedule for all sessions is based on the Central European Summer Time Zone (CEST)
- ATTENTION: The HOPIN platform will be up and running based on Greek time (Central Europe +1)
09:00-10:30 Session Τ1: Tutorial 1
Chair:
Location: Stage (Room for All)
09:00 | III-Nitrides Substrates and Defect Characterization in Nitride Materials for Power Devices (abstract) |
10:45-12:15 Session T2: Tutorial 2
Chair:
Location: Stage (Room for All)
10:45 | Vertical GaN devices and reliability (abstract) |
12:50-13:35 Session KN1: Keynote: Konstantinos Emmanouil
Chair:
Location: Stage (Room for All)
12:50 | Reliability in the era of electrification in aviation: a systems approach (abstract) |
14:00-15:30 Session KN2: Keynotes: Gabriel Aeppli & Aris Christou
Chair:
Location: Stage (Room for All)
14:00 | Title –High-resolution non-destructive three-dimensional imaging of integrated circuits (abstract) |
14:45 | Reliability Limitations from Crystal Defects in Thick GaN Epitaxial Layers for Power Electronics (abstract) |
Monday, October 5th
View this program: with abstractssession overviewtalk overview
09:00-10:20 Session aA-1: Quality and reliability assessment techniques and methods for devices and systems
Chairs:
Location: Room A
09:00 | Impact of electrical stress on total ionizing dose effects on graphene nano-disc non-volatile memory devices (abstract) |
09:20 | CSME: A Novel Cycle-Sensing Margin Enhancement Scheme for High Yield STT-MRAM (abstract) |
09:40 | A Novel BIST for Monitoring Aging / Temperature by Self-Triggered Scheme to Improve the Reliability of STT-MRAM (abstract) |
10:00 | Monitoring of Parameter Stability of SiC MOSFETs in Real Application Tests (abstract) |
10:20 | Extraction of Wearout Model Parameters using On-Line Test of an SRAM (abstract) |
09:00-10:20 Session bF1: Silicon power devices, IGBTs, thyristors
Chairs:
Location: Room B
09:00 | Analysis of the aging mechanism occurring at the bond-wire contact of IGBT power devices during power cycling (abstract) |
09:20 | Single-pulse observation of photoemission during avalanche breakdown in insulated gate bipolar transistor (abstract) |
09:40 | Thermal Behaviour Evolution of an IGBT Chip After Aging Measured by Thermoreflectance (abstract) |
10:00 | Shoot-through protection for an inverter consisting of the next-generation IGBTs with gate impedance reduction (abstract) |
10:20 | Modular dynamic pulse stress test system for discrete high power semiconductors (abstract) |
09:00-10:50 Session cF2-1: Wide bandgap power Devices: SiC and Ga2O3 device reliability - Invited Alberto Castellazzi
Chairs:
Location: Room C
09:00 | On the use of soft gamma radiation to characterize the pre-breakdown carrier multiplication in SiC power MOSFETs and its correlation to the TCR failure rate as measured by neutron irradiation (abstract) |
09:20 | Surge Current Capability of Ultra-Wide-Bandgap Ga2O3 Schottky Diodes (abstract) |
09:40 | A non-invasive SiC MOSFET Junction Temperature Estimation Method based on the Transient Light Emission from the Intrinsic Body Diode (abstract) |
10:00 | Gate-damage accumulation and off-line recovery in SiC power MOSFETs with soft short-circuit failure mode (abstract) |
10:20 | Fail-to-open short-circuit failure mode in SiC power MOSFETs, device characterization and system level exploitaton (abstract) |
11:10-13:20 Session aE-1: Reliability of die-attach, modules and assemblies - Invited Nicola Delmonte
Chairs:
Location: Room A
11:10 | CFD Modelling of Additive Manufacturing Liquid Cold Plates for More Reliable Power Press-Pack Assemblies (abstract) |
11:30 | Combined Experimental-FEM Investigation of Electrical Ruggedness in Double-Sided Cooled Power Modules (abstract) |
11:50 | Vibration-induced dynamic characteristics modeling of electrical contact resistance for connectors (abstract) |
12:10 | Investigation of the mechanical properties of corroded sintered silver layers by using Nanoindentation (abstract) |
12:30 | New power module concept in PCB-Embedded technology with silver sintering die attach (abstract) |
12:50 | 3D and compact thermal modeling in power electronics: an overview (abstract) |
11:10-13:30 Session bC: Progress in failure analysis - defect detection and analysis
Chairs:
Location: Room B
11:10 | Radiation-enhanced glide of 30o Shockley partial dislocations in gallium nitride heterostructures (abstract) |
11:30 | Profiling of carriers in a 3D flash memory cell with nanometer-level resolution using scanning nonlinear dielectric microscopy (abstract) |
11:50 | Reliable Endpoint Technique on Si trenching for Backside Circuit Edit (abstract) |
12:10 | Magnetic field imaging and light induced capacitance alteration for failure analysis of Cu-TSV interconnects (abstract) |
12:30 | Analog and Mixed-Signal Circuits simulation for product level EMMI analysis (abstract) |
12:50 | On the replacement of water as coupling medium in scanning acoustic microscopy analysis of sensitive electronics components (abstract) |
11:10-13:30 Session cB: Failure mechanisms and reliability of micro- and nanoelectronics
Chair:
Location: Room C
11:10 | A Single-Trap Study of PBTI in SiON nMOS Transistors (abstract) |
11:30 | Reliability Analysis in GeTe and GeSbTe based Phase-Change Memory 4kb Arrays targeting Storage Class Memory Applications (abstract) |
11:50 | Hot-Carrier Degradation in P- and N- Channel EDMOS for Smart Power Application (abstract) |
12:10 | Single event upset for monolithic 3-D integrated 6T SRAM based on a 22 nm FD-SOI technology: Effects of channel size and temperature (abstract) |
12:30 | Methodology to Evaluate the Critical Blocks in an Integrated Circuit based on the Temperature (abstract) |
12:50 | Analysis of the successive breakdown statistics of multilayer Al2O3/HfO2 gate stacks using the time-dependent clustering model (abstract) |
13:10 | Research on 3D NAND flash reliability from the perspective of threshold voltage distribution (abstract) |
14:00-15:30 Session Poster 1a: A - Quality and reliability assessment techniques and methods for devices and systems
Location: Poster Room
14:00 | Modeling and analysis of the catastrophic failure and degradation data (abstract) |
14:00 | A reliability evaluation method for multi-performance degradation products based on the Wiener process and Copula function (abstract) |
14:00 | Optimal Sampling for Accelerated Testing in 14nm FinFET Ring Oscillators (abstract) |
14:00 | Life-cycle Reliability Design Optimization of High-power DC Electromagnet-ic Devices Based on Time-dependent Non-probabilistic Convex Model Pro-cess (abstract) |
14:00 | A high-efficiency threshold voltage distribution test method based on the reliability of 3D NAND flash memory (abstract) |
14:00 | A novel accelerated life-test method under thermal cyclic loadings for electronic devices considering multiple failure mechanisms (abstract) |
14:00 | An error detecting scheme with input offset regulation for Enhancing Reliability of ultralow-voltage SRAM (abstract) |
14:00 | FPGA-based reliability testing and analysis for 3D NAND flash memory (abstract) |
14:00 | FBGA solder ball defect effect on DDR4 data signal rise time and ISI measured by loading the data line with a capacitor (abstract) |
14:00 | Comparisons of SnO2 Gas Sensor Degradation under Elevated Storage and Working Conditions (abstract) |
14:00 | Effect of integrated anneal optimizations of electroplated Cu thin films Interconnects (abstract) |
14:00 | Analysis of counterfeit electronics (abstract) |
14:00 | Smart Manufacturing through Predictive FA (abstract) |
14:00 | Assessing Multi-Output Gaussian Process Regression for Modeling of Non-Monotonic Degradation Trends of Light Emitting Diodes in Storage (abstract) |
14:00-15:30 Session Poster 1b: I - Renewable energy systems reliability
Location: Poster Room
14:00 | Electro-thermal Evaluation and Comparison of Quasi-Z Source Inverter Using Different Modulation Methods in Wind Power System (abstract) |
14:00-15:30 Session Poster 1c: K -Radiation impact on circuits and systems reliability
Location: Poster Room
14:00 | Mitigating single event upset of FPGA for the onboard bus control of satellite (abstract) |
14:00 | Reliability-driven pin assingment optimization to improve in-orbit soft-error rate (abstract) |
14:00 | Single-event induced failure mode of PWM in DC/DC converter (abstract) |
14:00 | Design Exploration of Majority Voter Architectures based on the Signal Probability for TMR Strategy Optimization in Space Applications (abstract) |
14:00 | On the Analysis of radiation-induced Failures in the AXI Interconnect Module (abstract) |
14:00 | Evaluating the Soft Error Sensitivity of a GPU-based SoC for Matrix Multiplication (abstract) |
14:00 | An Investigation of FinFET Single-Event Latch-up Characteristic and Mitigation Method (abstract) |
14:00 | Comparing Analytical and Monte-Carlo-based Simulation Methods for Logic Gates SET Sensitivity Evaluation (abstract) |
Tuesday, October 6th
View this program: with abstractssession overviewtalk overview
09:00-10:40 Session D: Reliability of microwave devices and circuits
Chairs:
Location: Room A
09:00 | Analysis Of Drain Current Transient Stability Of AlGaN/GaN HEMT stressed under HTOL & HTRB, By Random Telegraph Noise And Low Frequency Noise Characterizations (abstract) |
09:20 | 0.5µm GaN RF power bar technology space evaluation (abstract) |
09:40 | Analysis of trap states in AlGaN/GaN self-switching diodes via impedance measurements (abstract) |
10:00 | Hot-carrier-injection resilient RF power amplifier using adaptive bias (abstract) |
10:20 | Degradation mechanism of 0.15 um AlGaN/GaN HETMs: the effects of hot electrons (abstract) |
09:00-10:40 Session I: Renewable energy systems reliability
Chairs:
Location: Room B
09:00 | Thermal Optimized Discontinuous Modulation Strategy for Three Phase Impedance Source Inverter (abstract) |
09:20 | System-level Reliability Assessment for a Direct-drive PMSG Based Wind Turbine with Multiple Converters (abstract) |
09:40 | A fault tolerant switched reluctance motor drive for electric vehicles under multi-switches open-fault conditions (abstract) |
10:00 | Mission profile-oriented configuration of PV panels for lifetime and cost-efficiency of PV inverters (abstract) |
10:20 | PV system performance and failure evaluation of 10 year field-aged 1-MW PV power plant (abstract) |
11:00-12:40 Session aA-2: Quality and reliability assessment techniques and methods for devices and systems
Chairs:
Location: Room A
11:00 | Damage based PoF model of solder joints under temperature cycling and electric coupling condition (abstract) |
11:20 | Fretting wear reliability assessment methodology of gold-plated electrical connectors considering manufacture parameters distribution (abstract) |
11:40 | FEM-Aided Damage Model Calibration Method For Experimental Results (abstract) |
12:00 | Solving Time-dependent Reliability-based Design Optimization by Adaptive Differential Evolution Algorithm and Time-dependent Polynomial Chaos Expansions(ADE-T-PCE) (abstract) |
12:20 | Circuit Design using Schmitt Trigger to Reliability Improvement (abstract) |
11:00-12:40 Session bE-2: Solder joint reliability
Chairs:
Location: Room B
11:00 | Effect of Thermal and Vibrational Combined Ageing on QFN Terminal Pads Solder Reliability (abstract) |
11:20 | Thermo-Mechanical Assessment of Silver Sintering for Attaching Power Components in Embedded PCB (abstract) |
11:40 | A lifetime assessment and prediction method for large area solder joints (abstract) |
12:00 | Gold Wire Bond Study for Automotive Application (abstract) |
12:20 | A rapid life-prediction approach for solder joints based on modified Engelmaier fatigue model (abstract) |
11:00-12:40 Session cG-1: Photonics
Chairs:
Location: Room C
11:00 | Influence of copper and CdTe thickness in the reliability of CdS/CdTe solar cells (abstract) |
11:20 | Degradation mechanisms in high power InGaN semiconductor lasers investigated by electrical, optical, spectral and C-DLTS measurements (abstract) |
11:40 | GaN-based high-periodicity multiple quantum well solar cells: degradation under optical and electrical stress (abstract) |
12:00 | Smart Soiling Sensor for PV Modules (abstract) |
12:20 | Fault diagnosis of cracks in crystalline silicon photovoltaic modules through I-V curve (abstract) |
13:40-14:00 Session Industrial 1: Imina Technologies SA
Location: Stage (Room for All)
13:40 | Electrical nanoprobing and EBIC/EBAC technique integrated in your EFA workflow (abstract) |
14:00-15:30 Session Poster 2a: F1 - Silicon power devices, IGBTs, thyristors
Location: Poster Room
14:00 | Effect of the cell size reduction on the threshold voltage of UMOSFETs (abstract) |
14:00 | Ageing of glass passivated TRIAC devices under thermal and electrical stress (abstract) |
14:00 | IGBT Aging Monitoring and Remaining Lifetime Prediction Based on Long Short-Term Memory (LSTM) Networks (abstract) |
14:00-15:30 Session Poster 2b: F2 - Wide bandgap power Devices
Location: Poster Room
14:00 | Spatial scale dependent impact of non-uniform interface defect distribution on field effect mobility in SiC MOSFETs (abstract) |
14:00 | Multiple Failure Modes Identification of SiC planar MOSFETs in Short-circuit Operation (abstract) |
14:00 | New definition of critical energy for SiC MOSFET robustness under short circuit operations: the repetitive critical energy (abstract) |
14:00 | Analysis of cyclic spontaneous switchings in GaN & SiC cascodes by snappy turn-off currents (abstract) |
14:00 | UIS performance and ruggedness of stand-alone and cascode SiC JFETs (abstract) |
14:00 | Impact of stray-inductance imbalance on short-circuit capability of multi-chip SiC power modules (abstract) |
14:00 | Effect of short-circuit degradation on the remaining useful lifetime of SiC MOSFETs and its failure analysis (abstract) |
14:00 | Reliability of H-terminated diamond MESFETs in high power dissipation operating condition (abstract) |
14:00 | Gate Threshold Voltage Instability and On-resistance Degradation under Reverse Current Conduction Stress on E-mode GaN-HEMTs (abstract) |
14:00 | Design of E-Mode GaN HEMTs by the Polarization Super Junction (PSJ) Technology (abstract) |
14:00-15:30 Session Poster 2c: F3 - Power electronic auxiliary circuits and system reliability
Location: Poster Room
14:00 | Online Junction Temperature Estimation Using Integrated NTC Thermistor in IGBT Modules for PMSM Drives (abstract) |
14:00 | An active thermal management strategy for switched reluctance drive system with minimizing current sampling delay (abstract) |
14:00 | Three-level inverters improve reliability based on equivalent input disturbance and repetitive control combinations (abstract) |
14:00 | Simplified Hybrid Reliability Simulation Approach of a VSC DC Grid with Integration of an Improved DC Current Flow Controller (abstract) |
14:00 | Short-circuit and open-circuit faults monitoring of IGBTs in SST using collector-emitter voltage (abstract) |
14:00 | Gate drive circuit for current balancing of parallel-connected SiC-JFETs under avalanche mode (abstract) |
14:00 | Faults and Reliability Analysis of Negative Resistance Converter Traction Power System (abstract) |
14:00 | Mode Identification for Reliability Improvement of MMC (abstract) |
14:00 | Accelerated aging test for gate oxide degradation in SiC MOSFETs for condition monitoring (abstract) |
14:00 | A Time-domain Stability Analysis Method for Paralleled LLC Resonant Converter System Based on Floquet Theory (abstract) |
14:00 | Investigation of Multiple Short-Circuits Characteristics and Reliability in SiC Power Devices used for a Start-up Method of Power Converters (abstract) |
14:00 | Parameters sensitivity analysis of Silicon Carbide buck converters to extract features for condition monitoring (abstract) |
Wednesday, October 7th
View this program: with abstractssession overviewtalk overview
09:00-10:40 Session aJ: Modeling for Reliability
Chair:
Location: Room A
09:00 | Coupled simulations for lifetime prediction of board level packages encapsulated by thermoset injection moulding based on the Coffin-Manson relation (abstract) |
09:20 | Impact of Crystalline Orientation of Lead-Free Solder Joints on Thermomechanical Response and Reliability of Ball Grid Array Components (abstract) |
09:40 | Wear-out Failure of an IGBT Module in Motor Drives due to Uneven Thermal Impedance of Power Semiconductor Devices (abstract) |
10:00 | A 3-D thermal network model for the temperature monitoring of thermal grease as interface material (abstract) |
10:20 | Study of temperature dependence of breakdown voltage and AC TDDB reliability for thick insulator film deposited by plasma process (abstract) |
09:00-10:40 Session bF3: Power electronic auxiliary circuits and system reliability
Chairs:
Location: Room B
09:00 | Study of Moisture Transport in Silicone Gel for IGBT Modules (abstract) |
09:20 | A time-domain stability analysis method for LLC resonant converter based on Floquet theory (abstract) |
09:40 | Modeling and Fault Diagnosis of Multi-phase Winding Inter-turn Short Circuit for Five-phase PMSM based on Improved Trust Region (abstract) |
10:00 | Impact of Sensing Current Density on PN-Junction Based Temperature Estimation Methods for Si and SiC Power Devices (abstract) |
10:20 | Multi-modal Fault-tolerant Control for Single-phase Cascade Off-gird PV-storage System with PV Failure Using Hybrid Modulation (abstract) |
09:00-10:50 Session cF2-2: Wide bandgap power Devices: GaN and Ga2O3 device level reliability - Invited Kornelius Tetzner
Chairs:
Location: Room C
09:00 | Role of the AlGaN barrier on the long-term gate reliability of power HEMTs with p-GaN gate (abstract) |
09:20 | Gate leakage current sensing for in situ temperature monitoring of p-GaN gate HEMTs (abstract) |
09:40 | Non Thermally-Activated Transients and Buffer Traps in GaN Transistors With p-Type Gate: a New Method for Extracting the Activation Energy (abstract) |
10:00 | OFF-state Trapping Phenomena in GaN HEMTs: Interplay Between Gate Trapping, Acceptor Ionization and Positive Charge Redistribution (abstract) |
10:20 | Challenges to Overcome Breakdown Limitations in lateral β-Ga2O3 MOSFET Devices (abstract) |
11:10-11:30 Session Industrial 2: Hitachi Power Solutions Co., Ltd.
Location: Stage (Room for All)
11:10 | High Throughput Ultrasonic Inspection Apparatus Using Quasi-static Water Surface Contact (abstract) |
11:30-12:50 Session A-3: Quality and reliability assessment techniques and methods for devices and systems
Chairs:
Location: Room A
11:30 | Comparative evaluation of mission profile based reliability assessment methods of power modules in motor drive inverter (abstract) |
11:50 | Non-destructive Automatic Die-Level Defect Detection of Counterfeit Microelectronics using Machine Vision (abstract) |
12:10 | Reliability test for Subsea Power Semiconductors (abstract) |
12:30 | Combined Experimental and Numerical Approach for Investigating the Mechanical Degradation of the Interface between Thin Film Metallization and Si-Substrate after Temperature Cycling Test (abstract) |
11:30-12:50 Session bK-1: Radiation impact on circuits and systems reliability
Chair:
Location: Room B
11:30 | Experimental setup to monitor non-destructive single ionization events caused in power devices by terrestrial cosmic radiation. (abstract) |
11:50 | Asynchronous early output majority voter and a relative-timed asynchronous TMR implementation (abstract) |
12:10 | Physical Mechanisms for Gate Damages Induced by Heavy Ions in SiC power MOSFET (abstract) |
12:30 | Improving GPU register file reliability with a comprehensive ISA extension (abstract) |
11:30-12:50 Session cG-2: MEMS
Chairs:
Location: Room C
11:30 | Can automotive MEMS be reliably used in space applications? An assessment method under sequential bi-parameter testing (abstract) |
11:50 | Robustness of a M&NEMS Pressure Sensor up to 522°C (abstract) |
12:10 | A study of material stoichiometry on charging properties of SiNx films for potential application in RF MEMS capacitive switches (abstract) |
12:30 | Field emission induced-damage in the actuation paths of MEMS capacitive structures (abstract) |
13:20-13:40 Session Industrial 3: Sector Technologies SAS
Location: Stage (Room for All)
13:20 | ThermoFisher Static Optical Fault Isolation Roadmap and Lock- In Thermography for Automotive (abstract) |
13:40-14:00 Session Industrial 4: SmarAct GmbH
Location: Stage (Room for All)
13:40 | Presentation of the new SMARPROBE LX nanoprober system (abstract) |
14:00-15:30 Session Poster 3a: B - Failure mechanisms and reliability of micro- and nanoelectronics
Location: Poster Room
14:00 | Row hammer avoidance analysis of DDR3 SDRAM (abstract) |
14:00 | Reliability Prediction of FinFET FPGAs by MTOL (abstract) |
14:00 | AC stress reliability study on a novel vertical MOS transistor for non-volatile memory technology (abstract) |
14:00-15:30 Session Poster 3b: C - Progress in failure analysis: defect detection and analysis
Location: Poster Room
14:00 | Novel Failure Traces beyond the Barrier on the Floating Device (abstract) |
14:00 | Ultrasonic monitoring performance degradation of lithium ion battery (abstract) |
14:00 | Failure-analysis method of soldering interfaces in light-emitting diode packages based on time-domain transient thermal response (abstract) |
14:00 | Correlative microscopy workflow for precise targeted failure analysis of multi-layer ceramic capacitors (abstract) |
14:00-15:30 Session Poster 3c: E - Packaging and assembly reliability and failure analysis
Location: Poster Room
14:00 | Effects of anisotropy on the reliability of TSV microstructure (abstract) |
14:00 | Reliability improvement for palladium coated copper wire using additive element (abstract) |
14:00 | Robustness Evaluation Of PCB-Embedded Power Dies Using Solderless Pressed Metal Foam (abstract) |
14:00 | Remaining Useful Lifetime estimation for Electronic Power modules using an analytical degradation model (abstract) |
14:00 | Effects of Solder Degradation on the Die Temperature Measurement via Internal Gate Resistance (abstract) |
14:00 | Interface characterization of Cu-Cu ball bonds by a fast shear fatigue method (abstract) |
14:00 | Using of Bond-Wire Resistance as Ageing Indicator of Semiconductor Power Modules (abstract) |
14:00 | Packaging Reliability Estimation of High-Power Device Modules by Utilizing Silver Sintering Technology (abstract) |
14:00 | Influence of Temperature and Humidity on Power Cycling Capability of Power Modules (abstract) |
14:00-15:30 Session Poster 3d: G - Optoelectronics, Micro-Electro-Mechanical actuators and MEMS
14:00 | Barrier properties analysis of Cu/TiW/ITO electrode for Si heterojunction solar cell under thermal aging (abstract) |
14:00-15:30 Session Poster 3e: H - ESD, EOS, Latch-up, EMC-EMI in integrated and power circuits
Location: Poster Room
14:00 | Conducted EMI mitigation in transformerless PV inverters based on intrinsic MOSFET parameters (abstract) |
14:00 | Experimental results on gated diodes and BIMOS ESD devices in 28nm FD-SOI under TLP & TID radiation (abstract) |
14:00 | Conducted EMI Susceptibility Analysis of a COTS Processor as Function of Aging (abstract) |
14:00-15:30 Session Poster 3f: L - Batteries, capacitors & passives
Location: Poster Room
14:00 | A power transfer model-based method for lithium-ion battery discharge time prediction of electric rotatory-wing UAV (abstract) |
14:00 | Reliability analysis of excitation control modes of a synchronous condenser during grid-integration at the speed-falling stage (abstract) |
14:00 | A Method to Extract Lumped Thermal Networks of Capacitors for Reliability Oriented Design (abstract) |
14:00 | Health monitoring of mechanically fatigued flexible lithium ion battery by electrochemical impedance spectroscopy (abstract) |
Thursday, October 8th
View this program: with abstractssession overviewtalk overview
09:00-10:20 Session aK-2: Radiation impact on circuits and systems reliability
Chairs:
Location: Room A
09:00 | Heavy Ion and Proton Induced Single Event Upsets in 3D SRAM (abstract) |
09:20 | Accumulative total ionizing dose (TID) and transient dose rate (TDR) effects on planar and vertical ferroelectric tunneling-field-effect-transistors (TFET) (abstract) |
09:40 | Heavy ion track straggling effect in single event effect numerical simulation of 3D stacked devices (abstract) |
10:00 | Prediction of Solar Particle Events with SRAM-Based Soft Error Rate Monitor and Supervised Machine Learning (abstract) |
09:20-10:20 Session cH: ESD, EOS, Latch-up, EMC-EMI in integrated and power circuits
Chair:
Location: Room C
09:20 | Microstructure Evolutions upon Ni(Pt) Silicidation and the Different Responses to the Metal Etch (abstract) |
09:40 | A comparison study on electromagnetic susceptibility of current reference circuits with scaling-down technologies and schemes (abstract) |
10:00 | Investigation of critical parameters in power supplies components failure due to electric pulse (abstract) |
10:20-10:40 Session Industrial 5: John P. Kummer GmbH
Location: Stage (Room for All)
10:20 | Improved Workflows in Topside and Backside Mechanical Sample Preparation (abstract) |
11:00-12:50 Session aF2-3: Power electronic auxiliary circuits and system reliability - Invited Martin Kuball
Chairs:
Location: Room A
11:00 | Peculiar Failure Mechanisms in GaN Power Transistors (abstract) |
11:20 | Exploration of Gate Trench Module for Vertical GaN devices (abstract) |
11:40 | A Novel On-Wafer Approach to Test the Stability of GaN-based Devices in Hard Switching Conditions: Study of Hot-Electron Effects (abstract) |
12:00 | Investigation of the Current Collapse behaviour in GaN Power HEMTs with highly adjustable pulse and measurement concept (abstract) |
12:30 | Gallium Nitride on Diamond (abstract) |
11:00-12:20 Session bL: Batteries, capacitors and passives
Chair:
Location: Room B
11:00 | Lithium-ion Battery Performance Degradation Evaluation in Dynamic Operating Conditions based on a Digital Twin Model (abstract) |
11:20 | Lithium-ion battery SoH estimation based on incremental capacity peak tracking at several current levels for online application (abstract) |
11:40 | Reliability-Oriented Optimization of Aluminum Electrolytic Capacitor Considering Uncertain Mission Profile (abstract) |
12:00 | An Improved Lifetime Prediction Method for Metallized Film Capacitor Considering Harmonics and Degradation Process (abstract) |
11:00-12:00 Session cG-2: MEMS
Chairs:
Location: Room C
11:00 | Effects of gamma radiation on suspended silicon nanogauges bridge used for MEMS transduction (abstract) |
11:20 | Capacitive micromachined ultrasonic transducers leak detection by dye penetrant test (abstract) |
11:40 | A study of hopping transport during discharging in SiNx films for MEMS capacitive switches (abstract) |