ESREF 2020: 31ST EUROPEAN SYMPOSIUM ON RELIABILITY OF ELECTRON DEVICES, FAILURE PHYSICS AND ANALYSIS
TALK KEYWORD INDEX

This page contains an index consisting of author-provided keywords.

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- Copper layer
- Packaging
- PCB-Embedded
- Power module
- Silver sintering
2
2N
3
3-D thermal network model
3D flash memory
3D ICs
3D Image processing
3D NAND flash
3D NAND flash memory
4
4N
A
accelerated aging test
accelerated life tests
Accelerated Stress Testing
accelerated testing
acceptor ionization
Accumulative testing
acoustic microscopy
active thermal management
Adaptive Bias
Adaptive DE
Addtive manufacturing
adhesion strength degradation
AEC-Q
Aging
Aging indicator
AIA
AlGaN barrier
AlGaN/GaN HEMTs
ALT
Aluminum Electrolytic Capacitor
Analog simulation
analysis of catastrophic failure
analysis of degradation data
analytical method
Anisotropy
anneal optimization
AP-SoC
Application Stress Testing
Arrhenius
Artificial intelligence
asynchronous circuits
Au wire
AuPd wire
Automatic Defect detection
automotive electronics packaging
avalanche breakdown
avalanche mode
Avalanche Ruggedness
AXI
B
Backside Si trenching
Ball bond shear test
BAMFIT
Bar
Battery degradation
Bayesian parameter estimation
BEOL thermal distribution
BIMOS transistor
body diode SiC MOSFET
Bond wire
Bond wires degradation
Bonding
bonding wire
breakdown meachanisms
bridges in parallel
BTI
BTS
buffer trapping
Burn-in
C
C-rate dependency
C-V analysis
Capacitive RF-MEMS
Capacitors
Capasitive MEMS
Carrier multiplication factor
carrier profiling
Cascode
CdTe solar cells
CFD
channel size
Charge trapping
Circuit Design
Circuit-level design
clustering
CMOS
CMUT
cohesive zone model
Cold plate
collector-emitter voltage
Combined aging
compact
Compact thermal network
compensation
complex system
component
Component-of-the-Shelf (COTS)
Condition monitoring
Conducted EMI
Connectors
constitutive model
Contact Resistance
converters
converters in parallel
copper contacts degradation
Copula function
Correlative microscopy
corrosion
Cortex-M4 processor
COTS
counterfeit detection
counterfeit electronics
coupling liquid
Crack
crack growth
Crack Propagation
Cracks
Critical energy
cross-sectional nanoindentation
Crystal Defects
crystalline silicon solar cell
Cu-Al ball bond
current balance
current collapse
current filament
Current Flow Reversal Control
Current reference circuit
current sampling delay
current surge
cyclic stress test in design
D
damage
damage effects
Damage Mechanism
Damage Model
Damage Model Calibration
Damage Model Fitting
Damage recovery
DC shift
DC/DC
DDR4 memory
de-trapped carrier
Deep levels
Defect
Defect oriented testing
Defects
defects behaviour under electron beam irradation
defects reduction
Degradation
Degradation Monitoring
degradation process
Derating factor
devices
Diamond
Die attach
dielectric
Dielectric charging
different thickness CdTe
different thickness Cu
digital circuits
digital twin
Diode-clamped three-level inverter;
direct bonded copper layout
discolations
Double Pulse
double-sided cooled
DPA
Drift zone
dye penetrant test
Dynamic characteristics
dynamic operational condition
Dynamic R_DSON
dynamic RDSon
dynamic recurrent neural network
Dynamic Response
E
E-Mode
Effective temperature
Electrical contact resistance
electrical ruggedness
electrification projects
electro-thermal model
electro-thermal modelling
electrochemical impedance spectroscopy
electrochemical plating
electroluminescence
electromigration
Electron devices
electronic converters
electronic devices
Electronic failure analysis
electronics
emc
Emission microscopy
Emission simulation
End-pointing
Energy-absorption impedance
Enhancing Reliability
equivalent input disturbance;
error
error detecting scheme
error detection and correction
ESD
established technologies
Etch selectivity
Evaluation
Excitation control modes
Experimental platform based on FPGA
experiments
Extended Drain MOSFET
F
Failure Analyses
Failure analysis
Failure Analysis Tool
Failure diagnosis
failure mechanism
Failure modes
Failure rate
Fault diagnosis
fault injection
Fault isolation
Fault tolerance
fault-diagnosis
Fault-tolerant control
FBGA solder ball defect
FC PVC
FD-SOI
FDSOI
FE Simulations
FEA
FEM
FEM Simulations
FEOL TDDB
ferroelectric tunneling-field-effect-transistor
FGPA
Fiber optic diamond sensor probe
Field emission
Field Plate failure
field plate type UMOSFET
field programmable gate array
film
FinFET
Finite Element Methods
Finite element modeling
finite element simulation
Flash memory cell
flexible lithium ion battery
Floquet theory
fluoresence
fluorocarbon
FPGA
Fretting wear
Front-end time dependent dielectric breakdown
G
Gallium Nitride
GaN
GaN HEMT
GaN HEMTs
GaN High Electron Mobility Transistors (HEMTs)
GaN micropipes
GaN Power amplifiers
GaN power HEMT
GaN vertical
GaN-HEMTs
gate contact length
Gate driver
gate oxide
Gate threshold voltage instability
gate trapping
gate trench module
gate-drive circuits
Gated diode
Gaussian Process Regression
GeSbTe
GeTe
GH50
glass
GPU
Graphene
gray market
H
H5 inverter
Hamming code
Hard Switching
hardening techniques
Heatsink
heavy ion
Hemt
High Frequency (100 kHz)
high humidity high temperature power cycling
High power module
High sensitivity measurement
high temperature
high temperature electronics
High temperature reverse bias
high-K
Hopping conduction
Hot Carriers
Hot Electrons
Hot-Carrier
hot-electron
Hotspot
HTOL
HTRB
HTSL
Hybrid modulation
I
I-V characteristic
IC debug
IEMI
IGBT
IGBT module
IGBT Power Module
IGBT Semiconductors
IGBTs
Image Alignment
impedance measurements
impedance-source inverter
Improved DC Current Flow Controller (CFC)
Improved Ideal DC Current Source
Incremental Capacity
Inspection
insulated gate bipolar transistor
Insulated gate bipolar transistor modules (IGBT)
Integrating electric
inter-turn short circuit
interface defect
Interface reliability
interference between word lines
Intermittent errors
internal gate resistance
Intersymbol interference(ISI)
Inverter
inverters
Ion flux data
ISA extension
isopropanol
J
J integral
junction breakdown junction engineering
Junction temperature
L
l=Lifetime Prediction
Large-signal EMI
Laser
Latent damages
layouts
Lead-free solder joint
lectronic equipment
LFN
Li-ion battery
LICA
life prediction
lifetime
lifetime modelling
Lifetime prediction
Lifetime prognostic
Light Emitting Diode
Limitations
Lithium-ion battery
lithium-ion battery discharge time
LLC resonant converter
Local deep level transient spectroscopy
Logical Masking Effect
long short-term memory
long-term reliability
Long-term reliability prediction
low power
low power design
low TMR and low voltage
Lumen Degradation
M
M3D
Machine learning
machine side converter (MSC)
magnesium concentration
magnetic field imaging
Majority voter
Manufacture parameters
materials for harsh environments
matrix eigenvalue
mechanical
mechanical fatigue
mechanical properties
MEMS
Meshed Multi-terminal HVDC (M2TDC)
Metal etch
Metallized film capacitor (MFC)
mibot
micoelectronics reliability
Microelectronics reliability
microstructure
Mission Profile
mixed-signal simulation
mobile ion
mode identification
model-based prognostics
modeling
modified Engelmaier fatigue model
modular multilevel converter (MMC)
Modular Test System
modulation strategy
Moisture
moisture uptake
Monte Carlo analysis
MOSFET
Motor drives
multi-chip SiC power module
multi-field coupling
Multi-layer ceramic capacitors
multi-performance degradation products
Multi-phase PMSM
multi-switches faults
multiphysics
multiple failure mechanisms
Multiple quantum well
Multiple short-circuits
MUT
N
Nanoindentation
nanolaminate
Nickel
nMOS
non-intrusive sensing method
Non-volatile memory
Nondestructive evaluation
NTC
O
Off-grid cascade photovoltaic-storage system
OFF-state trapping
Online junction temperature estimation
operating mode
Operating modes analysis
Optical Interference fringe
P
p-GaN gate
p-type GaN HEMT
package
Packaging
parallel connection
paralleled LLC resonant converter system
parasitic parameters
partial discharge
particle swarm optimization
passivation
PCB Embedding
PCB-Embedding
PCC wire
PCM
PDSOI
Peak Tracking
Performance
performance degradation
performance degradation evaluation
permanent-magnet synchronous generator (PMSG)
pGaN HEMT
phase change memory
Phase transformation
photoemission
photomultiplier tube
Photovoltaic (PV) module
Physical Model
physics of failure model
Piezoresistive transduction
Pin Assignment
Planar-gate SiC-MOSFET
plasma generation
Platinum
PMSM
Point defects
Polarization Super Junction Technology
positive charge storage
potential-induced degradation
Power
Power converter
Power Cycling
Power cycling test
Power device
Power devices
Power die
Power electronics
Power modules
Power Modules Aging
Power semiconductor device
Power SiC device reliability
Power supplies
Pre-insertion scheme
Press-pack
Pressure and liquid tolerant
pressure sensor
Process variability
process variation
Prognostics
proton
Pull test
pulsed drain current
pulsed I-V
punch-through effect
PV inverter
PV modules
PV panels
PWM
Q
quality GaN
quasi
quasi Z source inverter
R
Radiation
radiation effect
Radiation immunity
Radiation-Hardening-By-Design (RHBD)
Rail potential
real-time monitoring
Rectifier bridge
Rectifier diode
Redistribution of charge
relaxation mechanism
Reliability
reliability analysis
Reliability assessment
Reliability based design optimization
reliability evaluation
Reliability for Subsea Power Semiconductors
reliability issue
Reliability modeling
Reliability Optimization
Reliability Simulation
Reliability testing and analysis
reliability;
repetitive control;
Repetitive critical energy
responsivity
retention time
Reverse conduction
Review
RF MEMS switches
RF PA
Ring Oscillator
roadmap
robotic
Robustness
RON increase
rotatory-wing unmanned aerial vehicles
Row hammer
Rsd increase
RTN
Ruggedness
S
sample size
Sampling
scanning nonlinear dielectric microscopy
SCM
SCR
SDRAM
SEE
SEGR
SEL
self-activated BIST
Self-Switching Diodes
semi-full-bridge (SFB) submodule
semi-insulating
semiconductor
semiconductor DC circuit breaker
Semiconductor material
sensing current
sensing margin
sensitivity analysis
sensitivity evaluation of single event transient
sensor reliability
SET
SEU
SEUs
SHE
Shear Test
shoot-through protection
short channel effects
Short circuit
Short-circuit
short-circuit capability
Short-circuit degradation
Short-circuit robustness
shrinking
Si heterojunction solar cell
Si_MOSFET
SiC Cascode
SiC JFET
SiC MOSFET
SiC MOSFETs
SiC power devices
SiC Power MOSFET
SiC power MOSFETs
SiC-JFET
Signal Probability
signal rise time
significantly
Silicidation
silicon
silicon carbide
Silicon Carbide (SiC)
Silicon nanogauges
Silicon Nitride
Silicone gel
Simplified Hybrid Modelling Approach
simulation
simulation method
simulation methodology
simulation verification
single event effect
Single Event Effects
single event upset
Single Event Upset(SEU)
Single-defects
Single-Event Effects
Single-Event Transient
sinter silver
Sintered Ag
smarprobe
Smart-Power
Smartgrids
smt
SnO2 gas sensor
SoC
Soft error
Soft error rate
Soft gamma radiation
soft switching operation
Soiling sensor
Solar cells
Solar particle event
solder ball void
Solder crack
Solder Fatigue
solder joint
solder joints
Solderless packaging
solutions
Space
Space applications
Spectrometer chain
Speed-falling stage
spin transfer torque magnetic random access memory (STT-MRAM)
SRAM
SST’s structural composition
Stability
stability analysis
standard cells
state of charge
State of Health
static
Stator voltage establishment
storage
storage class memory
Storage reliability
Stray current
stray-inductance imbalance
stress test methods
Surface scanning radiation emission measurement Magnetic field measurement
switched reluctance drive system
switched reluctance motor
switching frequency reduction
System-level reliability
T
TC
TCAD
TCAD simulation
TDDB
technologies
technology
Technology node
temperature
Temperature cycling
temperature dependence modeling
temperature estimation
Temperature monitoring
temperature variation
Terrestrial cosmic radiation
Terrestrial cosmic rays
the equivalent resistance
the Wiener process
thermal
Thermal aging
Thermal and Mechanical Simulation
Thermal cycling
thermal interface material
thermal loading
thermal management
Thermal modeling
Thermal network
thermal runaway
Thermal shocks
thermal stability
thermal stress
ThermoFisher
thermomechanical fatigue
thermoset injection moulding
Thermosonic copper wire bonding
thin film metallization
Though SiC
Three dimensional SRAM
Threshold voltage distribution
threshold voltage distribution test
threshold voltage rise phenomena
throughput
TID radiation
Time-dependent convex model process
Time-dependent PCE
Time-dependent RBDO
time-domain analysis
time-domain stability analysis
timing error detection
TiW diffusion barrier
TLP
Tomography
total ionizing dose effects
transient dose rate effects
transient drain current
Transient thermal response
Transmission electron microscopy techiques
trap
trap carrier
trapping effects
Traps
Trench-gate SiC-MOSFET
TRIAC
triple modular redundancy
Triple-Modular Redundancy
Trsnforming
TSEP
TSV
U
uHAST
ultra
ultralow-voltage SRAM
Ultrasonic wave
Uncertainties
Unclamped Inductive Switching
Urban rail transit
usage variation
V
variability
Vbd
vce-method
Vertical
vertical MOS devices
Vibration
virtual junction temperature measurement
vsd-method
VTH transient
VTH variation
W
Wavelet
Weibull
Weibull statistics
wideband gap
wind power system
wind turbine
Wire Bond
X
X-ray irradiation
Z
Zynq-7000