ESREF 2020: 31ST EUROPEAN SYMPOSIUM ON RELIABILITY OF ELECTRON DEVICES, FAILURE PHYSICS AND ANALYSIS

A
Abdul Wahab, Yasmin	Effect of integrated anneal optimizations of electroplated Cu thin films Interconnects
Abe, Seiya	Shoot-through protection for an inverter consisting of the next-generation IGBTs with gate impedance reduction
Aeppli, Gabriel	Title –High-resolution non-destructive three-dimensional imaging of integrated circuits
Agbo, Sunday Nereus	UIS performance and ruggedness of stand-alone and cascode SiC JFETs
Aguiar, Ygor Quadros	Comparing Analytical and Monte-Carlo-based Simulation Methods for Logic Gates SET Sensitivity Evaluation Design Exploration of Majority Voter Architectures based on the Signal Probability for TMR Strategy Optimization in Space Applications Reliability-driven pin assingment optimization to improve in-orbit soft-error rate
Aguirre, Fernando Leonel	Hot-carrier-injection resilient RF power amplifier using adaptive bias
Ahmadi, Bahar	Non-destructive Automatic Die-Level Defect Detection of Counterfeit Microelectronics using Machine Vision Correlative microscopy workflow for precise targeted failure analysis of multi-layer ceramic capacitors
Aichinger, Thomas	Monitoring of Parameter Stability of SiC MOSFETs in Real Application Tests
Aithal, Avinash	Analysis of cyclic spontaneous switchings in GaN & SiC cascodes by snappy turn-off currents
Akbarzadeh, Omid	Effect of integrated anneal optimizations of electroplated Cu thin films Interconnects
Al-Masry, Zeina	Remaining Useful Lifetime estimation for Electronic Power modules using an analytical degradation model
Alatise, Olayiwola	UIS performance and ruggedness of stand-alone and cascode SiC JFETs Analysis of cyclic spontaneous switchings in GaN & SiC cascodes by snappy turn-off currents
Alayli, Nadim	Thermo-Mechanical Assessment of Silver Sintering for Attaching Power Components in Embedded PCB New power module concept in PCB-Embedded technology with silver sintering die attach
Andjelkovic, Marko	Prediction of Solar Particle Events with SRAM-Based Soft Error Rate Monitor and Supervised Machine Learning
Arabi, Faical	Effect of Thermal and Vibrational Combined Ageing on QFN Terminal Pads Solder Reliability Thermo-Mechanical Assessment of Silver Sintering for Attaching Power Components in Embedded PCB
Araki, Noritoshi	Reliability improvement for palladium coated copper wire using additive element
Armagnat, Paul	Analog and Mixed-Signal Circuits simulation for product level EMMI analysis
Armani, Jean Marc	Effects of gamma radiation on suspended silicon nanogauges bridge used for MEMS transduction
Artegiani, Elisa	Influence of copper and CdTe thickness in the reliability of CdS/CdTe solar cells
Artola, Laurent	Circuit Design using Schmitt Trigger to Reliability Improvement
Auchlin, Maxime	Can automotive MEMS be reliably used in space applications? An assessment method under sequential bi-parameter testing
Autran, Jean-Luc	Comparing Analytical and Monte-Carlo-based Simulation Methods for Logic Gates SET Sensitivity Evaluation Design Exploration of Majority Voter Architectures based on the Signal Probability for TMR Strategy Optimization in Space Applications Reliability-driven pin assingment optimization to improve in-orbit soft-error rate
Auvray, Etienne	Analog and Mixed-Signal Circuits simulation for product level EMMI analysis
Azambuja, Jose Rodrigo	Improving GPU register file reliability with a comprehensive ISA extension
Azimi, Sarah	On the Analysis of radiation-induced Failures in the AXI Interconnect Module
B
Baba, Yoshiro	Effect of the cell size reduction on the threshold voltage of UMOSFETs
Badia, Jose M.	Evaluating the Soft Error Sensitivity of a GPU-based SoC for Matrix Multiplication
Baeg, Sanghyeon	FBGA solder ball defect effect on DDR4 data signal rise time and ISI measured by loading the data line with a capacitor
Bahman, Amir Sajjad	Parameters sensitivity analysis of Silicon Carbide buck converters to extract features for condition monitoring
Bak, Geunyong	FBGA solder ball defect effect on DDR4 data signal rise time and ISI measured by loading the data line with a capacitor
Baker, Nick	Effect of short-circuit degradation on the remaining useful lifetime of SiC MOSFETs and its failure analysis
Bakeroot, Benoit	Exploration of Gate Trench Module for Vertical GaN devices
Bakeroot, Benoit	Role of the AlGaN barrier on the long-term gate reliability of power HEMTs with p-GaN gate
Balasubramanian, P.	Asynchronous early output majority voter and a relative-timed asynchronous TMR implementation
Barbato,	Non Thermally-Activated Transients and Buffer Traps in GaN Transistors With p-Type Gate: a New Method for Extracting the Activation Energy
Barbato, Alessandro	A Novel On-Wafer Approach to Test the Stability of GaN-based Devices in Hard Switching Conditions: Study of Hot-Electron Effects
Barbato, Marco	Influence of copper and CdTe thickness in the reliability of CdS/CdTe solar cells
Barnes, Andrew	0.5µm GaN RF power bar technology space evaluation
Bary, Laurent	Analysis Of Drain Current Transient Stability Of AlGaN/GaN HEMT stressed under HTOL & HTRB, By Random Telegraph Noise And Low Frequency Noise Characterizations
Bayat, Dara Zaman	Can automotive MEMS be reliably used in space applications? An assessment method under sequential bi-parameter testing
Belabbas, Imad	Radiation-enhanced glide of 30o Shockley partial dislocations in gallium nitride heterostructures
Belloch, Jose A.	Evaluating the Soft Error Sensitivity of a GPU-based SoC for Matrix Multiplication
Belnoue, Olivier	Thermo-Mechanical Assessment of Silver Sintering for Attaching Power Components in Embedded PCB New power module concept in PCB-Embedded technology with silver sintering die attach
Ben Romdhane, Emna	Impact of Crystalline Orientation of Lead-Free Solder Joints on Thermomechanical Response and Reliability of Ball Grid Array Components
Bender, Emmanuel	Reliability Prediction of FinFET FPGAs by MTOL
Benfica, Juliano	Conducted EMI Susceptibility Analysis of a COTS Processor as Function of Aging
Bensebaa, Said	Robustness Evaluation Of PCB-Embedded Power Dies Using Solderless Pressed Metal Foam
Bensoussan, Alain	Reliability Prediction of FinFET FPGAs by MTOL
Berkani, Mounira	Robustness Evaluation Of PCB-Embedded Power Dies Using Solderless Pressed Metal Foam
Bernard, Mathieu	Reliability Analysis in GeTe and GeSbTe based Phase-Change Memory 4kb Arrays targeting Storage Class Memory Applications
Bernstein, Joseph B.	Reliability Prediction of FinFET FPGAs by MTOL
Berthelot, Audrey	Effects of gamma radiation on suspended silicon nanogauges bridge used for MEMS transduction Robustness of a M&NEMS Pressure Sensor up to 522°C
Bertoncello, Matteo	Influence of copper and CdTe thickness in the reliability of CdS/CdTe solar cells
Betzwar, Agnieszka	A lifetime assessment and prediction method for large area solder joints
Bi, Jinshun	Impact of electrical stress on total ionizing dose effects on graphene nano-disc non-volatile memory devices Accumulative total ionizing dose (TID) and transient dose rate (TDR) effects on planar and vertical ferroelectric tunneling-field-effect-transistors (TFET)
Birmpiliotis, Dimitrios	A study of hopping transport during discharging in SiNx films for MEMS capacitive switches A study of material stoichiometry on charging properties of SiNx films for potential application in RF MEMS capacitive switches
Blaabjerg, Frede	System-level Reliability Assessment for a Direct-drive PMSG Based Wind Turbine with Multiple Converters Wear-out Failure of an IGBT Module in Motor Drives due to Uneven Thermal Impedance of Power Semiconductor Devices Comparative evaluation of mission profile based reliability assessment methods of power modules in motor drive inverter Parameters sensitivity analysis of Silicon Carbide buck converters to extract features for condition monitoring
Blanck, Herve	0.5µm GaN RF power bar technology space evaluation
Boche, Karl	Electrical nanoprobing and EBIC/EBAC technique integrated in your EFA workflow
Boige, Francois	Gate-damage accumulation and off-line recovery in SiC power MOSFETs with soft short-circuit failure mode
Borga, Matteo	Exploration of Gate Trench Module for Vertical GaN devices
Borghese, Alessandro	Gate leakage current sensing for in situ temperature monitoring of p-GaN gate HEMTs Gate-damage accumulation and off-line recovery in SiC power MOSFETs with soft short-circuit failure mode
Bourgeat, Johan	Experimental results on gated diodes and BIMOS ESD devices in 28nm FD-SOI under TLP & TID radiation
Bourgeois, Guillaume	Reliability Analysis in GeTe and GeSbTe based Phase-Change Memory 4kb Arrays targeting Storage Class Memory Applications
Bouw, Diane	0.5µm GaN RF power bar technology space evaluation
Bouyssou, Emilien	Ageing of glass passivated TRIAC devices under thermal and electrical stress
Brandelero, Julio	Effects of Solder Degradation on the Die Temperature Measurement via Internal Gate Resistance
Bravaix, Alain	Hot-Carrier Degradation in P- and N- Channel EDMOS for Smart Power Application
Breglio, Giovanni	Gate leakage current sensing for in situ temperature monitoring of p-GaN gate HEMTs
Breuer, Dirk	Gold Wire Bond Study for Automotive Application
Briat, Olivier	Lithium-ion battery SoH estimation based on incremental capacity peak tracking at several current levels for online application
Brunet-Manquat, P.	Robustness of a M&NEMS Pressure Sensor up to 522°C
Buffolo, Matteo	Degradation mechanisms in high power InGaN semiconductor lasers investigated by electrical, optical, spectral and C-DLTS measurements
Busatto, Giovanni	Physical Mechanisms for Gate Damages Induced by Heavy Ions in SiC power MOSFET
Buttay, Cyril	Surge Current Capability of Ultra-Wide-Bandgap Ga2O3 Schottky Diodes New definition of critical energy for SiC MOSFET robustness under short circuit operations: the repetitive critical energy
Butzen, Paulo F.	Comparing Analytical and Monte-Carlo-based Simulation Methods for Logic Gates SET Sensitivity Evaluation
Buvat, Yoann	Ageing of glass passivated TRIAC devices under thermal and electrical stress
Byeon, Jai-Won	Health monitoring of mechanically fatigued flexible lithium ion battery by electrochemical impedance spectroscopy Ultrasonic monitoring performance degradation of lithium ion battery
C
Cabezuelo, David	A Method to Extract Lumped Thermal Networks of Capacitors for Reliability Oriented Design
Cacho, Florian	Hot-Carrier Degradation in P- and N- Channel EDMOS for Smart Power Application
Cai, Chang	Heavy Ion and Proton Induced Single Event Upsets in 3D SRAM Heavy ion track straggling effect in single event effect numerical simulation of 3D stacked devices An Investigation of FinFET Single-Event Latch-up Characteristic and Mitigation Method
Cai, Guoqing	Online Junction Temperature Estimation Using Integrated NTC Thermistor in IGBT Modules for PMSM Drives
Cai, Hao	CSME: A Novel Cycle-Sensing Margin Enhancement Scheme for High Yield STT-MRAM A Novel BIST for Monitoring Aging / Temperature by Self-Triggered Scheme to Improve the Reliability of STT-MRAM
Cammarata, Marta	Gold Wire Bond Study for Automotive Application
Campabadal, Francesca	Analysis of the successive breakdown statistics of multilayer Al2O3/HfO2 gate stacks using the time-dependent clustering model
Canato, Eleonora	OFF-state Trapping Phenomena in GaN HEMTs: Interplay Between Gate Trapping, Acceptor Ionization and Positive Charge Redistribution
Cao, Qiuling	Short-circuit and open-circuit faults monitoring of IGBTs in SST using collector-emitter voltage
Cao, Rui	An Improved Lifetime Prediction Method for Metallized Film Capacitor Considering Harmonics and Degradation Process
Cao, Wanyu	Mode Identification for Reliability Improvement of MMC
Capitaine, Armande	Lithium-ion battery SoH estimation based on incremental capacity peak tracking at several current levels for online application
Caria, Alessandro	GaN-based high-periodicity multiple quantum well solar cells: degradation under optical and electrical stress
Casteel, Carroll	Microstructure Evolutions upon Ni(Pt) Silicidation and the Different Responses to the Metal Etch
Castellani, Niccolo	Reliability Analysis in GeTe and GeSbTe based Phase-Change Memory 4kb Arrays targeting Storage Class Memory Applications
Castellazzi, Alberto	Gate-damage accumulation and off-line recovery in SiC power MOSFETs with soft short-circuit failure mode Fail-to-open short-circuit failure mode in SiC power MOSFETs, device characterization and system level exploitaton Combined Experimental-FEM Investigation of Electrical Ruggedness in Double-Sided Cooled Power Modules
Casulli, Fabio	Influence of copper and CdTe thickness in the reliability of CdS/CdTe solar cells
Catalano, Antonio Pio	Combined Experimental-FEM Investigation of Electrical Ruggedness in Double-Sided Cooled Power Modules
Chang, George	Microstructure Evolutions upon Ni(Pt) Silicidation and the Different Responses to the Metal Etch
Chang, Jing-Yao	Packaging Reliability Estimation of High-Power Device Modules by Utilizing Silver Sintering Technology
Chang, Tao-Chih	Packaging Reliability Estimation of High-Power Device Modules by Utilizing Silver Sintering Technology
Chazal, Vanessa	Gate-damage accumulation and off-line recovery in SiC power MOSFETs with soft short-circuit failure mode
Che, Yanbo	Short-circuit and open-circuit faults monitoring of IGBTs in SST using collector-emitter voltage
Chen, Cen	Life-cycle Reliability Design Optimization of High-power DC Electromagnet-ic Devices Based on Time-dependent Non-probabilistic Convex Model Pro-cess
Chen, Cheng	New definition of critical energy for SiC MOSFET robustness under short circuit operations: the repetitive critical energy
Chen, Hao	Solving Time-dependent Reliability-based Design Optimization by Adaptive Differential Evolution Algorithm and Time-dependent Polynomial Chaos Expansions(ADE-T-PCE) Life-cycle Reliability Design Optimization of High-power DC Electromagnet-ic Devices Based on Time-dependent Non-probabilistic Convex Model Pro-cess
Chen, Hong	GaN-based high-periodicity multiple quantum well solar cells: degradation under optical and electrical stress
Chen, Junchao	Prediction of Solar Particle Events with SRAM-Based Soft Error Rate Monitor and Supervised Machine Learning
Chen, Wenjie	Online Junction Temperature Estimation Using Integrated NTC Thermistor in IGBT Modules for PMSM Drives
Chen, Xiaoyu	Research on 3D NAND flash reliability from the perspective of threshold voltage distribution A high-efficiency threshold voltage distribution test method based on the reliability of 3D NAND flash memory
Chen, Xun	Effects of anisotropy on the reliability of TSV microstructure
Chen, Yanfeng	Mode Identification for Reliability Improvement of MMC
Chinone, Norimichi	Single-pulse observation of photoemission during avalanche breakdown in insulated gate bipolar transistor
Chiocchetta, Francesca	Degradation mechanism of 0.15 um AlGaN/GaN HETMs: the effects of hot electrons
Chiorboli, Giovanni	Smart Soiling Sensor for PV Modules
Cho, Seongjun	Novel Failure Traces beyond the Barrier on the Floating Device
Cho, Wookhyun	Novel Failure Traces beyond the Barrier on the Floating Device
Cho, Yasuo	Profiling of carriers in a 3D flash memory cell with nanometer-level resolution using scanning nonlinear dielectric microscopy Spatial scale dependent impact of non-uniform interface defect distribution on field effect mobility in SiC MOSFETs
Choi, Hoonjoo	PV system performance and failure evaluation of 10 year field-aged 1-MW PV power plant
Choi, Sungson	Failure-analysis method of soldering interfaces in light-emitting diode packages based on time-domain transient thermal response
Choi, Ui-Min	Wear-out Failure of an IGBT Module in Motor Drives due to Uneven Thermal Impedance of Power Semiconductor Devices Comparative evaluation of mission profile based reliability assessment methods of power modules in motor drive inverter
Chou, Kazuhiro	Impact of stray-inductance imbalance on short-circuit capability of multi-chip SiC power modules
Chowdhury, Zaira Zaman	Effect of integrated anneal optimizations of electroplated Cu thin films Interconnects
Christou, Aris	Reliability Limitations from Crystal Defects in Thick GaN Epitaxial Layers for Power Electronics
Ciappa, Mauro	On the use of soft gamma radiation to characterize the pre-breakdown carrier multiplication in SiC power MOSFETs and its correlation to the TCR failure rate as measured by neutron irradiation Experimental setup to monitor non-destructive single ionization events caused in power devices by terrestrial cosmic radiation.
Colvin, Jim	Improved Workflows in Topside and Backside Mechanical Sample Preparation
Coquery, Gérard	Thermo-Mechanical Assessment of Silver Sintering for Attaching Power Components in Embedded PCB
Coudert, Martin	Thermo-Mechanical Assessment of Silver Sintering for Attaching Power Components in Embedded PCB
Coulié, Karine	AC stress reliability study on a novel vertical MOS transistor for non-volatile memory technology
Cova, Paolo	CFD Modelling of Additive Manufacturing Liquid Cold Plates for More Reliable Power Press-Pack Assemblies Smart Soiling Sensor for PV Modules A Method to Extract Lumped Thermal Networks of Capacitors for Reliability Oriented Design
Cui, Shuai	Single-event induced failure mode of PWM in DC/DC converter
Cui, Xiuhai	Lithium-ion Battery Performance Degradation Evaluation in Dynamic Operating Conditions based on a Digital Twin Model Mitigating single event upset of FPGA for the onboard bus control of satellite
Curatola,	Non Thermally-Activated Transients and Buffer Traps in GaN Transistors With p-Type Gate: a New Method for Extracting the Activation Energy A Novel On-Wafer Approach to Test the Stability of GaN-based Devices in Hard Switching Conditions: Study of Hot-Electron Effects
Curos, Laurine	Investigation of critical parameters in power supplies components failure due to electric pulse
Cyrille, Marie Claire	Reliability Analysis in GeTe and GeSbTe based Phase-Change Memory 4kb Arrays targeting Storage Class Memory Applications
Czerny, Bernhard	Interface characterization of Cu-Cu ball bonds by a fast shear fatigue method
D
d'Alessandro, Vincenzo	Combined Experimental-FEM Investigation of Electrical Ruggedness in Double-Sided Cooled Power Modules
Dai, Zhiyong	Modeling and Fault Diagnosis of Multi-phase Winding Inter-turn Short Circuit for Five-phase PMSM based on Improved Trust Region
De Santi,	Non Thermally-Activated Transients and Buffer Traps in GaN Transistors With p-Type Gate: a New Method for Extracting the Activation Energy OFF-state Trapping Phenomena in GaN HEMTs: Interplay Between Gate Trapping, Acceptor Ionization and Positive Charge Redistribution Degradation mechanisms in high power InGaN semiconductor lasers investigated by electrical, optical, spectral and C-DLTS measurements Exploration of Gate Trench Module for Vertical GaN devices GaN-based high-periodicity multiple quantum well solar cells: degradation under optical and electrical stress A Novel On-Wafer Approach to Test the Stability of GaN-based Devices in Hard Switching Conditions: Study of Hot-Electron Effects Reliability of H-terminated diamond MESFETs in high power dissipation operating condition
De Santi, Carlo	Degradation mechanism of 0.15 um AlGaN/GaN HETMs: the effects of hot electrons
De Sio, Corrado	On the Analysis of radiation-induced Failures in the AXI Interconnect Module
De Wolf, Ingrid	Magnetic field imaging and light induced capacitance alteration for failure analysis of Cu-TSV interconnects
Decoutere, Stefaan	Role of the AlGaN barrier on the long-term gate reliability of power HEMTs with p-GaN gate Exploration of Gate Trench Module for Vertical GaN devices
Degrenne, Nicolas	Analysis of the aging mechanism occurring at the bond-wire contact of IGBT power devices during power cycling Using of Bond-Wire Resistance as Ageing Indicator of Semiconductor Power Modules Remaining Useful Lifetime estimation for Electronic Power modules using an analytical degradation model
Della Marca, Vincenzo	AC stress reliability study on a novel vertical MOS transistor for non-volatile memory technology
Delmonte, Nicola	CFD Modelling of Additive Manufacturing Liquid Cold Plates for More Reliable Power Press-Pack Assemblies Smart Soiling Sensor for PV Modules 3D and compact thermal modeling in power electronics: an overview A Method to Extract Lumped Thermal Networks of Capacitors for Reliability Oriented Design
Delétage, Jean-Yves	Effect of Thermal and Vibrational Combined Ageing on QFN Terminal Pads Solder Reliability Lithium-ion battery SoH estimation based on incremental capacity peak tracking at several current levels for online application
Deutschmann, Bernd	Monitoring of Parameter Stability of SiC MOSFETs in Real Application Tests
Di Pasquale, Antonio	Physical Mechanisms for Gate Damages Induced by Heavy Ions in SiC power MOSFET
Dienelt, Jens	Gold Wire Bond Study for Automotive Application
DiMarino, Christina	Surge Current Capability of Ultra-Wide-Bandgap Ga2O3 Schottky Diodes
Dornic, Nausicaa	Analysis of the aging mechanism occurring at the bond-wire contact of IGBT power devices during power cycling
Du, He	Effect of short-circuit degradation on the remaining useful lifetime of SiC MOSFETs and its failure analysis
Dubois, Tristan	Investigation of critical parameters in power supplies components failure due to electric pulse
Duchesne, Cyrille	Combined Experimental-FEM Investigation of Electrical Ruggedness in Double-Sided Cooled Power Modules
Dugal, Franc	Reliability test for Subsea Power Semiconductors
Duong, Pham Luu Trung	Assessing Multi-Output Gaussian Process Regression for Modeling of Non-Monotonic Degradation Trends of Light Emitting Diodes in Storage
Dupret, Antoine	Effects of gamma radiation on suspended silicon nanogauges bridge used for MEMS transduction
Durand, Erwan	0.5µm GaN RF power bar technology space evaluation
E
Ebel, Thomas	Design of E-Mode GaN HEMTs by the Polarization Super Junction (PSJ) Technology
Emmanouil, Konstantinos	Reliability in the era of electrification in aviation: a systems approach
Endo, Koichi	Single-pulse observation of photoemission during avalanche breakdown in insulated gate bipolar transistor
Entrena, Luis	Evaluating the Soft Error Sensitivity of a GPU-based SoC for Matrix Multiplication
Ernst, Wolfgang	Row hammer avoidance analysis of DDR3 SDRAM
Eto, Motoki	Reliability improvement for palladium coated copper wire using additive element
F
Fan, Peng	Electro-thermal Evaluation and Comparison of Quasi-Z Source Inverter Using Different Modulation Methods in Wind Power System
Fan, Xiaofu	Mode Identification for Reliability Improvement of MMC
Fan, Zhengwei	Effects of anisotropy on the reliability of TSV microstructure
Favata, Joseph	Correlative microscopy workflow for precise targeted failure analysis of multi-layer ceramic capacitors
Fay Soares, Matheus	Conducted EMI Susceptibility Analysis of a COTS Processor as Function of Aging
Fayyaz, Asad	Gate-damage accumulation and off-line recovery in SiC power MOSFETs with soft short-circuit failure mode
Federspiel, Xavier	Hot-Carrier Degradation in P- and N- Channel EDMOS for Smart Power Application
Feng, Hua	Research on 3D NAND flash reliability from the perspective of threshold voltage distribution FPGA-based reliability testing and analysis for 3D NAND flash memory A high-efficiency threshold voltage distribution test method based on the reliability of 3D NAND flash memory
Feng, Shiwei	A comparison study on electromagnetic susceptibility of current reference circuits with scaling-down technologies and schemes
Fiegna, Claudio	Role of the AlGaN barrier on the long-term gate reliability of power HEMTs with p-GaN gate
Findenig, Bettina	Monitoring of Parameter Stability of SiC MOSFETs in Real Application Tests
Flandre, Denis	Experimental results on gated diodes and BIMOS ESD devices in 28nm FD-SOI under TLP & TID radiation
Fogsgaard, Martin B.	FEM-Aided Damage Model Calibration Method For Experimental Results
Fornara, Pascal	AC stress reliability study on a novel vertical MOS transistor for non-volatile memory technology
Franc, Bernard	Analysis Of Drain Current Transient Stability Of AlGaN/GaN HEMT stressed under HTOL & HTRB, By Random Telegraph Noise And Low Frequency Noise Characterizations
Franke, Jörg	Investigation of the Current Collapse behaviour in GaN Power HEMTs with highly adjustable pulse and measurement concept
Franke, Wulf-Toke	Design of E-Mode GaN HEMTs by the Polarization Super Junction (PSJ) Technology
Frémont, Hélène	Impact of Crystalline Orientation of Lead-Free Solder Joints on Thermomechanical Response and Reliability of Ball Grid Array Components Effect of Thermal and Vibrational Combined Ageing on QFN Terminal Pads Solder Reliability
Fu, Chuang	Mode Identification for Reliability Improvement of MMC
Fu, Guicui	Damage based PoF model of solder joints under temperature cycling and electric coupling condition
Fu, Houqiang	GaN-based high-periodicity multiple quantum well solar cells: degradation under optical and electrical stress
Fujimoto, Shinji	Reliability improvement for palladium coated copper wire using additive element
G
G. Vasileiadis, Isaak	Radiation-enhanced glide of 30o Shockley partial dislocations in gallium nitride heterostructures
Galy, Philippe	Experimental results on gated diodes and BIMOS ESD devices in 28nm FD-SOI under TLP & TID radiation
Gao, Jiantou	Single-event induced failure mode of PWM in DC/DC converter
Gao, Zhan	Degradation mechanism of 0.15 um AlGaN/GaN HETMs: the effects of hot electrons
Gaquière, Christophe	Analysis of trap states in AlGaN/GaN self-switching diodes via impedance measurements
Gardelis, Spiros	Field emission induced-damage in the actuation paths of MEMS capacitive structures
Garrione, Julien	Reliability Analysis in GeTe and GeSbTe based Phase-Change Memory 4kb Arrays targeting Storage Class Memory Applications
Gass, Volker	Can automotive MEMS be reliably used in space applications? An assessment method under sequential bi-parameter testing
Gautier, Gaël	Ageing of glass passivated TRIAC devices under thermal and electrical stress
Geens, Karen	Exploration of Gate Trench Module for Vertical GaN devices
Geilenkäuser, Rolf	Gold Wire Bond Study for Automotive Application
Geng, Yingsan	Multiple Failure Modes Identification of SiC planar MOSFETs in Short-circuit Operation
Georgakas, Angelos	Modular dynamic pulse stress test system for discrete high power semiconductors
Glavanovics, Michael	Monitoring of Parameter Stability of SiC MOSFETs in Real Application Tests Modular dynamic pulse stress test system for discrete high power semiconductors
Goetz, Thomas	Effect of short-circuit degradation on the remaining useful lifetime of SiC MOSFETs and its failure analysis
Goller, Maximilian	Investigation of the Current Collapse behaviour in GaN Power HEMTs with highly adjustable pulse and measurement concept
Goncalves, Marcio	Improving GPU register file reliability with a comprehensive ISA extension
Gong, Jian	Multi-modal Fault-tolerant Control for Single-phase Cascade Off-gird PV-storage System with PV Failure Using Hybrid Modulation
Gong, Mengtong	A power transfer model-based method for lithium-ion battery discharge time prediction of electric rotatory-wing UAV
Gonzalez, Mireia	Analysis of the successive breakdown statistics of multilayer Al2O3/HfO2 gate stacks using the time-dependent clustering model
González, Tomás	Analysis of trap states in AlGaN/GaN self-switching diodes via impedance measurements
Gourdon, Cyril	0.5µm GaN RF power bar technology space evaluation
Grasser, Tibor	A Single-Trap Study of PBTI in SiON nMOS Transistors
Groezinger, Tobias	Coupled simulations for lifetime prediction of board level packages encapsulated by thermoset injection moulding based on the Coffin-Manson relation
Grunwald, Marco	0.5µm GaN RF power bar technology space evaluation
Gu, Jingda	Faults and Reliability Analysis of Negative Resistance Converter Traction Power System
Gu, Wei	Reliability analysis of excitation control modes of a synchronous condenser during grid-integration at the speed-falling stage
Guan, Chongjie	A comparison study on electromagnetic susceptibility of current reference circuits with scaling-down technologies and schemes
Guibaud, Gerald	Gate-damage accumulation and off-line recovery in SiC power MOSFETs with soft short-circuit failure mode
Guillon, David	Reliability test for Subsea Power Semiconductors
Gunaydin, Yasin	Analysis of cyclic spontaneous switchings in GaN & SiC cascodes by snappy turn-off currents
Guo, Jiaying	Comparisons of SnO2 Gas Sensor Degradation under Elevated Storage and Working Conditions
Guo, Weisheng	Online Junction Temperature Estimation Using Integrated NTC Thermistor in IGBT Modules for PMSM Drives
Guédon-Gracia, Alexandrine	Impact of Crystalline Orientation of Lead-Free Solder Joints on Thermomechanical Response and Reliability of Ball Grid Array Components Effect of Thermal and Vibrational Combined Ageing on QFN Terminal Pads Solder Reliability
H
Hamizi, Nor Aliya	Effect of integrated anneal optimizations of electroplated Cu thin films Interconnects
Han, Wei-Kuo	Packaging Reliability Estimation of High-Power Device Modules by Utilizing Silver Sintering Technology
Han, Zhengsheng	Single event upset for monolithic 3-D integrated 6T SRAM based on a 22 nm FD-SOI technology: Effects of channel size and temperature
Hasegawa, Kazunori	Shoot-through protection for an inverter consisting of the next-generation IGBTs with gate impedance reduction
Hayashi, Shin-Ichiro	Accelerated aging test for gate oxide degradation in SiC MOSFETs for condition monitoring
Hazeldine, Tim	Improved Workflows in Topside and Backside Mechanical Sample Preparation
He, Ze	Heavy Ion and Proton Induced Single Event Upsets in 3D SRAM An Investigation of FinFET Single-Event Latch-up Characteristic and Mitigation Method
Heinemann, Marc	Presentation of the new SMARPROBE LX nanoprober system
Heredia, Richard	Non-destructive Automatic Die-Level Defect Detection of Counterfeit Microelectronics using Machine Vision
Hertl, Michael	On the replacement of water as coupling medium in scanning acoustic microscopy analysis of sensitive electronics components
Hirota, Jun	Profiling of carriers in a 3D flash memory cell with nanometer-level resolution using scanning nonlinear dielectric microscopy
Hoffmann, Felix	Impact of Sensing Current Density on PN-Junction Based Temperature Estimation Methods for Si and SiC Power Devices
Hollmer, Marc	0.5µm GaN RF power bar technology space evaluation
Hsu, Shu-Han	Extraction of Wearout Model Parameters using On-Line Test of an SRAM Optimal Sampling for Accelerated Testing in 14nm FinFET Ring Oscillators
Hu, Xianghong	A reliability evaluation method for multi-performance degradation products based on the Wiener process and Copula function
Hu, Xianghong	A novel accelerated life-test method under thermal cyclic loadings for electronic devices considering multiple failure mechanisms
Huang, Runhong	Mode Identification for Reliability Improvement of MMC
Huang, Shoudao	Electro-thermal Evaluation and Comparison of Quasi-Z Source Inverter Using Different Modulation Methods in Wind Power System
Huang, Shoumou	An error detecting scheme with input offset regulation for Enhancing Reliability of ultralow-voltage SRAM
Huang, Xuanqi	GaN-based high-periodicity multiple quantum well solar cells: degradation under optical and electrical stress
Huang, Yang	Single event upset for monolithic 3-D integrated 6T SRAM based on a 22 nm FD-SOI technology: Effects of channel size and temperature
Huang, Yang	An error detecting scheme with input offset regulation for Enhancing Reliability of ultralow-voltage SRAM
Huang, Ying-Yuan	Extraction of Wearout Model Parameters using On-Line Test of an SRAM Optimal Sampling for Accelerated Testing in 14nm FinFET Ring Oscillators
Huang, Zhiying	Three-level inverters improve reliability based on equivalent input disturbance and repetitive control combinations
Hubert, Guillaume	Circuit Design using Schmitt Trigger to Reliability Improvement
Hwang, Heon	PV system performance and failure evaluation of 10 year field-aged 1-MW PV power plant
I
Iannuzzo, Francesco	Study of Moisture Transport in Silicone Gel for IGBT Modules A non-invasive SiC MOSFET Junction Temperature Estimation Method based on the Transient Light Emission from the Intrinsic Body Diode FEM-Aided Damage Model Calibration Method For Experimental Results Parameters sensitivity analysis of Silicon Carbide buck converters to extract features for condition monitoring Effect of short-circuit degradation on the remaining useful lifetime of SiC MOSFETs and its failure analysis
Ibrahim, Ali	Analysis of the aging mechanism occurring at the bond-wire contact of IGBT power devices during power cycling Using of Bond-Wire Resistance as Ageing Indicator of Semiconductor Power Modules Remaining Useful Lifetime estimation for Electronic Power modules using an analytical degradation model
Ingrosso, Damien	Analysis of the aging mechanism occurring at the bond-wire contact of IGBT power devices during power cycling Using of Bond-Wire Resistance as Ageing Indicator of Semiconductor Power Modules
Irace, Andrea	Gate leakage current sensing for in situ temperature monitoring of p-GaN gate HEMTs Gate-damage accumulation and off-line recovery in SiC power MOSFETs with soft short-circuit failure mode
Isobe, Takanori	Investigation of Multiple Short-Circuits Characteristics and Reliability in SiC Power Devices used for a Start-up Method of Power Converters Gate Threshold Voltage Instability and On-resistance Degradation under Reverse Current Conduction Stress on E-mode GaN-HEMTs Impact of stray-inductance imbalance on short-circuit capability of multi-chip SiC power modules
Iyer, Dorai	Microstructure Evolutions upon Ni(Pt) Silicidation and the Different Responses to the Metal Etch
Iñiguez-de-la-Torre, Ignacio	Analysis of trap states in AlGaN/GaN self-switching diodes via impedance measurements
J
Jacobs, Kristof J.P.	Magnetic field imaging and light induced capacitance alteration for failure analysis of Cu-TSV interconnects
Jacquier, Blaise	Experimental results on gated diodes and BIMOS ESD devices in 28nm FD-SOI under TLP & TID radiation
Jahdi, Saeed	UIS performance and ruggedness of stand-alone and cascode SiC JFETs Analysis of cyclic spontaneous switchings in GaN & SiC cascodes by snappy turn-off currents
Jalel, Ben Hadj Slama	Conducted EMI mitigation in transformerless PV inverters based on intrinsic MOSFET parameters
Janioud, Pierre	Effects of gamma radiation on suspended silicon nanogauges bridge used for MEMS transduction
Jeon, Sang Hoon	FBGA solder ball defect effect on DDR4 data signal rise time and ISI measured by loading the data line with a capacitor
Jeong, Jae-Seong	Barrier properties analysis of Cu/TiW/ITO electrode for Si heterojunction solar cell under thermal aging
Jiang, Maogong	Damage based PoF model of solder joints under temperature cycling and electric coupling condition
Jiang, Xiaheng	A time-domain stability analysis method for LLC resonant converter based on Floquet theory A Time-domain Stability Analysis Method for Paralleled LLC Resonant Converter System Based on Floquet Theory
Jiang, Yu	Effects of anisotropy on the reliability of TSV microstructure
Jo, Jang-Hun	Ultrasonic monitoring performance degradation of lithium ion battery
Johan, Mohd Rafie	Effect of integrated anneal optimizations of electroplated Cu thin films Interconnects
Jourdan, Guillaume	Effects of gamma radiation on suspended silicon nanogauges bridge used for MEMS transduction
Joët, Loïc	Robustness of a M&NEMS Pressure Sensor up to 522°C
Jung, Taehee	Failure-analysis method of soldering interfaces in light-emitting diode packages based on time-domain transient thermal response
K
Kabus, Heidrun	Gold Wire Bond Study for Automotive Application
Kachi, Tetsu	Vertical GaN devices and reliability
Kaczer, Ben	A Single-Trap Study of PBTI in SiON nMOS Transistors
Kaminski, Nando	Impact of Sensing Current Density on PN-Junction Based Temperature Estimation Methods for Si and SiC Power Devices
Kamoji, Rupa	Smart Manufacturing through Predictive FA
Kashiura, Yukiko	Study of temperature dependence of breakdown voltage and AC TDDB reliability for thick insulator film deposited by plasma process
Kastensmidt, Fernanda	Circuit Design using Schmitt Trigger to Reliability Improvement
Kawahara, Chihiro	Effects of Solder Degradation on the Die Temperature Measurement via Internal Gate Resistance
Khatibi, Golta	A lifetime assessment and prediction method for large area solder joints Interface characterization of Cu-Cu ball bonds by a fast shear fatigue method
Khatir, Zoubir	Analysis of the aging mechanism occurring at the bond-wire contact of IGBT power devices during power cycling Thermal Behaviour Evolution of an IGBT Chip After Aging Measured by Thermoreflectance
Khatir, Zoubir	Using of Bond-Wire Resistance as Ageing Indicator of Semiconductor Power Modules Remaining Useful Lifetime estimation for Electronic Power modules using an analytical degradation model
Kilchytska, Valeria	Experimental results on gated diodes and BIMOS ESD devices in 28nm FD-SOI under TLP & TID radiation
Kim, Daesung	PV system performance and failure evaluation of 10 year field-aged 1-MW PV power plant
Kim, Donghwan	PV system performance and failure evaluation of 10 year field-aged 1-MW PV power plant
Kim, Jae-Yeon	Health monitoring of mechanically fatigued flexible lithium ion battery by electrochemical impedance spectroscopy
Kim, Jae-Yeon	Ultrasonic monitoring performance degradation of lithium ion battery
Kim, Jaehyun	Novel Failure Traces beyond the Barrier on the Floating Device
Kim, Jin-Yeong	Health monitoring of mechanically fatigued flexible lithium ion battery by electrochemical impedance spectroscopy
Kim, Mu-Kyeong	Health monitoring of mechanically fatigued flexible lithium ion battery by electrochemical impedance spectroscopy
Kim, Seung Hyun	Modeling and analysis of the catastrophic failure and degradation data
Kim, So-Yeon	PV system performance and failure evaluation of 10 year field-aged 1-MW PV power plant
Kim, Wonse	Novel Failure Traces beyond the Barrier on the Floating Device
Klengel, Robert	Reliability improvement for palladium coated copper wire using additive element
Klengel, Sandy	Reliability improvement for palladium coated copper wire using additive element
Kolbinger, Elisabeth	Investigation of the mechanical properties of corroded sintered silver layers by using Nanoindentation
Komninou, Philomela	Radiation-enhanced glide of 30o Shockley partial dislocations in gallium nitride heterostructures
Kong, Jianshou	Multi-modal Fault-tolerant Control for Single-phase Cascade Off-gird PV-storage System with PV Failure Using Hybrid Modulation
Konstantinidis, George	A study of hopping transport during discharging in SiNx films for MEMS capacitive switches Field emission induced-damage in the actuation paths of MEMS capacitive structures
Koo, Bonyoung	Novel Failure Traces beyond the Barrier on the Floating Device
Kortabarria, Iñigo	A Method to Extract Lumped Thermal Networks of Capacitors for Reliability Oriented Design
Koumela, Alexandra	Effects of gamma radiation on suspended silicon nanogauges bridge used for MEMS transduction Robustness of a M&NEMS Pressure Sensor up to 522°C
Koutsoureli, Matroni	A study of hopping transport during discharging in SiNx films for MEMS capacitive switches A study of material stoichiometry on charging properties of SiNx films for potential application in RF MEMS capacitive switches Field emission induced-damage in the actuation paths of MEMS capacitive structures
Kowalsky, Jens	Investigation of the Current Collapse behaviour in GaN Power HEMTs with highly adjustable pulse and measurement concept
Krafft, Simon	Coupled simulations for lifetime prediction of board level packages encapsulated by thermoset injection moulding based on the Coffin-Manson relation
Krinke, Joerg	Gold Wire Bond Study for Automotive Application
Krstic, Milos	Prediction of Solar Particle Events with SRAM-Based Soft Error Rate Monitor and Supervised Machine Learning
Kuang, Fen	A rapid life-prediction approach for solder joints based on modified Engelmaier fatigue model
Kuball, Martin	Gallium Nitride on Diamond
Kuechenmeister, Frank	Gold Wire Bond Study for Automotive Application
Kulkarni, Romit	Coupled simulations for lifetime prediction of board level packages encapsulated by thermoset injection moulding based on the Coffin-Manson relation
Kuo, Kuo-Shu	Packaging Reliability Estimation of High-Power Device Modules by Utilizing Silver Sintering Technology
Kussener, Edith	Hot-Carrier Degradation in P- and N- Channel EDMOS for Smart Power Application
Kuttler, Simon	Investigation of the mechanical properties of corroded sintered silver layers by using Nanoindentation
Kwon, Jaedoo	Gold Wire Bond Study for Automotive Application
Kwon, Junhyeong	FBGA solder ball defect effect on DDR4 data signal rise time and ISI measured by loading the data line with a capacitor
L
Labrousse, Denis	New definition of critical energy for SiC MOSFET robustness under short circuit operations: the repetitive critical energy
Lackmann Zimpeck, Alexandra	Circuit Design using Schmitt Trigger to Reliability Improvement
Lallemand, Richard	Using of Bond-Wire Resistance as Ageing Indicator of Semiconductor Power Modules
Lama, Giusy	Reliability Analysis in GeTe and GeSbTe based Phase-Change Memory 4kb Arrays targeting Storage Class Memory Applications
Lambert, Benoit	Analysis Of Drain Current Transient Stability Of AlGaN/GaN HEMT stressed under HTOL & HTRB, By Random Telegraph Noise And Low Frequency Noise Characterizations 0.5µm GaN RF power bar technology space evaluation
Lange, Thomas	Prediction of Solar Particle Events with SRAM-Based Soft Error Rate Monitor and Supervised Machine Learning
Lasserre, Philippe	Combined Experimental-FEM Investigation of Electrical Ruggedness in Double-Sided Cooled Power Modules
Lazar, Oana	Analysis Of Drain Current Transient Stability Of AlGaN/GaN HEMT stressed under HTOL & HTRB, By Random Telegraph Noise And Low Frequency Noise Characterizations
Lederer, Martin	A lifetime assessment and prediction method for large area solder joints
Lee, Chang-Chun	Packaging Reliability Estimation of High-Power Device Modules by Utilizing Silver Sintering Technology
Lee, Gwang Wook	Novel Failure Traces beyond the Barrier on the Floating Device
Lee, Haeseok	PV system performance and failure evaluation of 10 year field-aged 1-MW PV power plant
Lee, Kiseok	FBGA solder ball defect effect on DDR4 data signal rise time and ISI measured by loading the data line with a capacitor
Lee, Kisoo	Novel Failure Traces beyond the Barrier on the Floating Device
Lee, Kwanhun	Failure-analysis method of soldering interfaces in light-emitting diode packages based on time-domain transient thermal response
Lefebvre, Stephane	Robustness Evaluation Of PCB-Embedded Power Dies Using Solderless Pressed Metal Foam New definition of critical energy for SiC MOSFET robustness under short circuit operations: the repetitive critical energy
Lei, Wanjun	An Improved Lifetime Prediction Method for Metallized Film Capacitor Considering Harmonics and Degradation Process
Leon, German	Evaluating the Soft Error Sensitivity of a GPU-based SoC for Matrix Multiplication
Leroux, Paul	Design Exploration of Majority Voter Architectures based on the Signal Probability for TMR Strategy Optimization in Space Applications Reliability-driven pin assingment optimization to improve in-orbit soft-error rate
Letz, Sebastian	Combined Experimental and Numerical Approach for Investigating the Mechanical Degradation of the Interface between Thin Film Metallization and Si-Substrate after Temperature Cycling Test Effect of short-circuit degradation on the remaining useful lifetime of SiC MOSFETs and its failure analysis
Li, Binhong	A comparison study on electromagnetic susceptibility of current reference circuits with scaling-down technologies and schemes Single event upset for monolithic 3-D integrated 6T SRAM based on a 22 nm FD-SOI technology: Effects of channel size and temperature Single-event induced failure mode of PWM in DC/DC converter
Li, Bo	A comparison study on electromagnetic susceptibility of current reference circuits with scaling-down technologies and schemes Single event upset for monolithic 3-D integrated 6T SRAM based on a 22 nm FD-SOI technology: Effects of channel size and temperature Single-event induced failure mode of PWM in DC/DC converter
Li, Cai	Single-event induced failure mode of PWM in DC/DC converter
Li, Donghui	Fretting wear reliability assessment methodology of gold-plated electrical connectors considering manufacture parameters distribution Vibration-induced dynamic characteristics modeling of electrical contact resistance for connectors
Li, Dongqing	Heavy ion track straggling effect in single event effect numerical simulation of 3D stacked devices
Li, Dongqing	An Investigation of FinFET Single-Event Latch-up Characteristic and Mitigation Method
Li, Fei	Fault diagnosis of cracks in crystalline silicon photovoltaic modules through I-V curve
Li, Hong	A time-domain stability analysis method for LLC resonant converter based on Floquet theory A Time-domain Stability Analysis Method for Paralleled LLC Resonant Converter System Based on Floquet Theory
Li, Jianying	A 3-D thermal network model for the temperature monitoring of thermal grease as interface material
Li, Jing	Single-event induced failure mode of PWM in DC/DC converter
Li, Licheng	Mode Identification for Reliability Improvement of MMC
Li, Qian	A novel accelerated life-test method under thermal cyclic loadings for electronic devices considering multiple failure mechanisms
Li, Shuang	Hot-Carrier Degradation in P- and N- Channel EDMOS for Smart Power Application
Li, Wanping	IGBT Aging Monitoring and Remaining Lifetime Prediction Based on Long Short-Term Memory (LSTM) Networks Multiple Failure Modes Identification of SiC planar MOSFETs in Short-circuit Operation
Li, Wenwen	Solving Time-dependent Reliability-based Design Optimization by Adaptive Differential Evolution Algorithm and Time-dependent Polynomial Chaos Expansions(ADE-T-PCE) Life-cycle Reliability Design Optimization of High-power DC Electromagnet-ic Devices Based on Time-dependent Non-probabilistic Convex Model Pro-cess
Li, Xiang	A power transfer model-based method for lithium-ion battery discharge time prediction of electric rotatory-wing UAV
Li, Xiaobing	A reliability evaluation method for multi-performance degradation products based on the Wiener process and Copula function
Li, Yaqiu	A novel accelerated life-test method under thermal cyclic loadings for electronic devices considering multiple failure mechanisms A reliability evaluation method for multi-performance degradation products based on the Wiener process and Copula function
Li, Yongliang	Accumulative total ionizing dose (TID) and transient dose rate (TDR) effects on planar and vertical ferroelectric tunneling-field-effect-transistors (TFET)
Liang, Hu	Exploration of Gate Trench Module for Vertical GaN devices
Lim, Sze Li Harry	Assessing Multi-Output Gaussian Process Regression for Modeling of Non-Monotonic Degradation Trends of Light Emitting Diodes in Storage
Lin, Li-Hsiang	Extraction of Wearout Model Parameters using On-Line Test of an SRAM Optimal Sampling for Accelerated Testing in 14nm FinFET Ring Oscillators
Lindoso, Almudena	Evaluating the Soft Error Sensitivity of a GPU-based SoC for Matrix Multiplication
Ling, Sanqiang	Fretting wear reliability assessment methodology of gold-plated electrical connectors considering manufacture parameters distribution Vibration-induced dynamic characteristics modeling of electrical contact resistance for connectors
Liu, Bo	CSME: A Novel Cycle-Sensing Margin Enhancement Scheme for High Yield STT-MRAM
Liu, Bo	Comparisons of SnO2 Gas Sensor Degradation under Elevated Storage and Working Conditions
Liu, Chen	A time-domain stability analysis method for LLC resonant converter based on Floquet theory
Liu, Chen	A Time-domain Stability Analysis Method for Paralleled LLC Resonant Converter System Based on Floquet Theory
Liu, Datong	Lithium-ion Battery Performance Degradation Evaluation in Dynamic Operating Conditions based on a Digital Twin Model
Liu, Fanyu	Single event upset for monolithic 3-D integrated 6T SRAM based on a 22 nm FD-SOI technology: Effects of channel size and temperature
Liu, Hainan	A comparison study on electromagnetic susceptibility of current reference circuits with scaling-down technologies and schemes
Liu, Heng	Fault diagnosis of cracks in crystalline silicon photovoltaic modules through I-V curve
Liu, Jie	Heavy Ion and Proton Induced Single Event Upsets in 3D SRAM Heavy ion track straggling effect in single event effect numerical simulation of 3D stacked devices An Investigation of FinFET Single-Event Latch-up Characteristic and Mitigation Method Single-event induced failure mode of PWM in DC/DC converter
Liu, Jingcun	IGBT Aging Monitoring and Remaining Lifetime Prediction Based on Long Short-Term Memory (LSTM) Networks Multiple Failure Modes Identification of SiC planar MOSFETs in Short-circuit Operation
Liu, Jinjun	An Improved Lifetime Prediction Method for Metallized Film Capacitor Considering Harmonics and Degradation Process
Liu, Liansheng	Mitigating single event upset of FPGA for the onboard bus control of satellite
Liu, Mingyue	CSME: A Novel Cycle-Sensing Margin Enhancement Scheme for High Yield STT-MRAM
Liu, Ping	Thermal Optimized Discontinuous Modulation Strategy for Three Phase Impedance Source Inverter
Liu, Tianqi	Heavy Ion and Proton Induced Single Event Upsets in 3D SRAM
Liu, Tianqi	Heavy ion track straggling effect in single event effect numerical simulation of 3D stacked devices An Investigation of FinFET Single-Event Latch-up Characteristic and Mitigation Method
Liu, Yao	Effects of anisotropy on the reliability of TSV microstructure
Liu, Zhao	Multi-modal Fault-tolerant Control for Single-phase Cascade Off-gird PV-storage System with PV Failure Using Hybrid Modulation Reliability analysis of excitation control modes of a synchronous condenser during grid-integration at the speed-falling stage
Locati, Jordan	AC stress reliability study on a novel vertical MOS transistor for non-volatile memory technology
Loghmani Moghaddam Toussi, Afshin	Parameters sensitivity analysis of Silicon Carbide buck converters to extract features for condition monitoring
Longobardi, Giorgia	Gate leakage current sensing for in situ temperature monitoring of p-GaN gate HEMTs
Lu, Yiyan	Multi-modal Fault-tolerant Control for Single-phase Cascade Off-gird PV-storage System with PV Failure Using Hybrid Modulation
Luo, Derong	Electro-thermal Evaluation and Comparison of Quasi-Z Source Inverter Using Different Modulation Methods in Wind Power System
Luo, Jiajun	A comparison study on electromagnetic susceptibility of current reference circuits with scaling-down technologies and schemes Single event upset for monolithic 3-D integrated 6T SRAM based on a 22 nm FD-SOI technology: Effects of channel size and temperature
Luo, Qin	A reliability evaluation method for multi-performance degradation products based on the Wiener process and Copula function
Lutz, Josef	Investigation of the Current Collapse behaviour in GaN Power HEMTs with highly adjustable pulse and measurement concept
Lv, Chunlin	An Improved Lifetime Prediction Method for Metallized Film Capacitor Considering Harmonics and Degradation Process
M
Ma, Byongjin	Failure-analysis method of soldering interfaces in light-emitting diode packages based on time-domain transient thermal response
Ma, Mingyao	A fault tolerant switched reluctance motor drive for electric vehicles under multi-switches open-fault conditions Fault diagnosis of cracks in crystalline silicon photovoltaic modules through I-V curve An active thermal management strategy for switched reluctance drive system with minimizing current sampling delay Online Junction Temperature Estimation Using Integrated NTC Thermistor in IGBT Modules for PMSM Drives
Mahmoud, Hamouda	Conducted EMI mitigation in transformerless PV inverters based on intrinsic MOSFET parameters
Mannen, Tomoyuki	Investigation of Multiple Short-Circuits Characteristics and Reliability in SiC Power Devices used for a Start-up Method of Power Converters Gate Threshold Voltage Instability and On-resistance Degradation under Reverse Current Conduction Stress on E-mode GaN-HEMTs Impact of stray-inductance imbalance on short-circuit capability of multi-chip SiC power modules
Marchand, Laurent	Can automotive MEMS be reliably used in space applications? An assessment method under sequential bi-parameter testing
Marciano, Daniele	Physical Mechanisms for Gate Damages Induced by Heavy Ions in SiC power MOSFET
Marcon, Daniele	Degradation mechanism of 0.15 um AlGaN/GaN HETMs: the effects of hot electrons
Maresca, Luca	Gate leakage current sensing for in situ temperature monitoring of p-GaN gate HEMTs
Marozau, Ivan	Can automotive MEMS be reliably used in space applications? An assessment method under sequential bi-parameter testing
Martineau, Donatien	Thermo-Mechanical Assessment of Silver Sintering for Attaching Power Components in Embedded PCB
Martines, Giovanni	Analysis of counterfeit electronics
Masin, Fabrizio	OFF-state Trapping Phenomena in GaN HEMTs: Interplay Between Gate Trapping, Acceptor Ionization and Positive Charge Redistribution
Maskell, Douglas	Asynchronous early output majority voter and a relative-timed asynchronous TMR implementation
Mastorakis, Nikos	Asynchronous early output majority voter and a relative-timed asynchronous TMR implementation
Mateos, Javier	Analysis of trap states in AlGaN/GaN self-switching diodes via impedance measurements
Matsumoto, Toru	Single-pulse observation of photoemission during avalanche breakdown in insulated gate bipolar transistor
Maures, Matthieu	Lithium-ion battery SoH estimation based on incremental capacity peak tracking at several current levels for online application
May, Nicholas	Correlative microscopy workflow for precise targeted failure analysis of multi-layer ceramic capacitors
Meinhardt, Cristina	Circuit Design using Schmitt Trigger to Reliability Improvement
Meissner, Elke	III-Nitrides Substrates and Defect Characterization in Nitride Materials for Power Devices
Mejecaze, Guillaume	Investigation of critical parameters in power supplies components failure due to electric pulse
Melis, Tommaso	Analog and Mixed-Signal Circuits simulation for product level EMMI analysis
Mellor, Phil	Analysis of cyclic spontaneous switchings in GaN & SiC cascodes by snappy turn-off currents
Meneghesso,	Non Thermally-Activated Transients and Buffer Traps in GaN Transistors With p-Type Gate: a New Method for Extracting the Activation Energy GaN-based high-periodicity multiple quantum well solar cells: degradation under optical and electrical stress Reliability of H-terminated diamond MESFETs in high power dissipation operating condition
Meneghesso, Gaudenzio	Influence of copper and CdTe thickness in the reliability of CdS/CdTe solar cells Degradation mechanisms in high power InGaN semiconductor lasers investigated by electrical, optical, spectral and C-DLTS measurements Exploration of Gate Trench Module for Vertical GaN devices
Meneghesso, Gaudenzio	OFF-state Trapping Phenomena in GaN HEMTs: Interplay Between Gate Trapping, Acceptor Ionization and Positive Charge Redistribution Degradation mechanism of 0.15 um AlGaN/GaN HETMs: the effects of hot electrons A Novel On-Wafer Approach to Test the Stability of GaN-based Devices in Hard Switching Conditions: Study of Hot-Electron Effects
Meneghini,	Non Thermally-Activated Transients and Buffer Traps in GaN Transistors With p-Type Gate: a New Method for Extracting the Activation Energy Degradation mechanism of 0.15 um AlGaN/GaN HETMs: the effects of hot electrons Influence of copper and CdTe thickness in the reliability of CdS/CdTe solar cells Degradation mechanisms in high power InGaN semiconductor lasers investigated by electrical, optical, spectral and C-DLTS measurements Exploration of Gate Trench Module for Vertical GaN devices GaN-based high-periodicity multiple quantum well solar cells: degradation under optical and electrical stress A Novel On-Wafer Approach to Test the Stability of GaN-based Devices in Hard Switching Conditions: Study of Hot-Electron Effects
Meneghini, Matteo	OFF-state Trapping Phenomena in GaN HEMTs: Interplay Between Gate Trapping, Acceptor Ionization and Positive Charge Redistribution Reliability of H-terminated diamond MESFETs in high power dissipation operating condition
Mengotti, Elena	Study of Moisture Transport in Silicone Gel for IGBT Modules
Menozzi, Roberto	Smart Soiling Sensor for PV Modules
Mi, Menglai	Short-circuit and open-circuit faults monitoring of IGBTs in SST using collector-emitter voltage
Mialhe, Florie	On the replacement of water as coupling medium in scanning acoustic microscopy analysis of sensitive electronics components
Milor, Linda	Extraction of Wearout Model Parameters using On-Line Test of an SRAM Optimal Sampling for Accelerated Testing in 14nm FinFET Ring Oscillators
Miranda, Enrique	Analysis of the successive breakdown statistics of multilayer Al2O3/HfO2 gate stacks using the time-dependent clustering model
Mo, Lihua	Heavy Ion and Proton Induced Single Event Upsets in 3D SRAM
Modolo, Nicola	A Novel On-Wafer Approach to Test the Stability of GaN-based Devices in Hard Switching Conditions: Study of Hot-Electron Effects
Moens, Peter	OFF-state Trapping Phenomena in GaN HEMTs: Interplay Between Gate Trapping, Acceptor Ionization and Positive Charge Redistribution
Mollov, Stefan	Analysis of the aging mechanism occurring at the bond-wire contact of IGBT power devices during power cycling Using of Bond-Wire Resistance as Ageing Indicator of Semiconductor Power Modules Effects of Solder Degradation on the Die Temperature Measurement via Internal Gate Resistance
Moneta, Joanna	Radiation-enhanced glide of 30o Shockley partial dislocations in gallium nitride heterostructures
Morabito, Consolato	Gold Wire Bond Study for Automotive Application
Morel, Hervé	New definition of critical energy for SiC MOSFET robustness under short circuit operations: the repetitive critical energy
Morfouli, Panagiota	Effects of gamma radiation on suspended silicon nanogauges bridge used for MEMS transduction
Morgan, Jim	Microstructure Evolutions upon Ni(Pt) Silicidation and the Different Responses to the Metal Etch
Morillon, Benjamin	Ageing of glass passivated TRIAC devices under thermal and electrical stress
Mou, Qingwen	Reliability analysis of excitation control modes of a synchronous condenser during grid-integration at the speed-falling stage
Muetze, Annette	Modular dynamic pulse stress test system for discrete high power semiconductors
Mura, Giovanna	Analysis of counterfeit electronics
Mura, Giovanna	Peculiar Failure Mechanisms in GaN Power Transistors
Murru, Roberto	Analysis of counterfeit electronics
Muñoz Gorriz, Jordi	Analysis of the successive breakdown statistics of multilayer Al2O3/HfO2 gate stacks using the time-dependent clustering model
März, Martin	Combined Experimental and Numerical Approach for Investigating the Mechanical Degradation of the Interface between Thin Film Metallization and Si-Substrate after Temperature Cycling Test
N
Nakajima, Akira	Gate Threshold Voltage Instability and On-resistance Degradation under Reverse Current Conduction Stress on E-mode GaN-HEMTs
Nakamae, Koji	Single-pulse observation of photoemission during avalanche breakdown in insulated gate bipolar transistor
Nakamura, Tomonori	Single-pulse observation of photoemission during avalanche breakdown in insulated gate bipolar transistor
Nakayama, Taichi	Gate Threshold Voltage Instability and On-resistance Degradation under Reverse Current Conduction Stress on E-mode GaN-HEMTs
Nardo, Arianna	Reliability of H-terminated diamond MESFETs in high power dissipation operating condition
Nardo, Arianna	Non Thermally-Activated Transients and Buffer Traps in GaN Transistors With p-Type Gate: a New Method for Extracting the Activation Energy A Novel On-Wafer Approach to Test the Stability of GaN-based Devices in Hard Switching Conditions: Study of Hot-Electron Effects
Navarro, Gabriele	Reliability Analysis in GeTe and GeSbTe based Phase-Change Memory 4kb Arrays targeting Storage Class Memory Applications
Naviner, Lirida	CSME: A Novel Cycle-Sensing Margin Enhancement Scheme for High Yield STT-MRAM A Novel BIST for Monitoring Aging / Temperature by Self-Triggered Scheme to Improve the Reliability of STT-MRAM
Nazar, Mohamad	Remaining Useful Lifetime estimation for Electronic Power modules using an analytical degradation model
Neviani, Andrea	Exploration of Gate Trench Module for Vertical GaN devices
Neviani, Andrea	GaN-based high-periodicity multiple quantum well solar cells: degradation under optical and electrical stress
Ney, David	Hot-Carrier Degradation in P- and N- Channel EDMOS for Smart Power Application
Nguyen, Tien Anh	New definition of critical energy for SiC MOSFET robustness under short circuit operations: the repetitive critical energy
Niel, Stephan	AC stress reliability study on a novel vertical MOS transistor for non-volatile memory technology
Ninomiya, Tamotsu	Shoot-through protection for an inverter consisting of the next-generation IGBTs with gate impedance reduction
Nishizawa, Shin-ichi	Gate drive circuit for current balancing of parallel-connected SiC-JFETs under avalanche mode
Niu, Hao	Reliability-Oriented Optimization of Aluminum Electrolytic Capacitor Considering Uncertain Mission Profile
Nolot, Emmanuel	Reliability Analysis in GeTe and GeSbTe based Phase-Change Memory 4kb Arrays targeting Storage Class Memory Applications
Nowak, Etienne	Reliability Analysis in GeTe and GeSbTe based Phase-Change Memory 4kb Arrays targeting Storage Class Memory Applications
Nowodzinski, Antoine	Capacitive micromachined ultrasonic transducers leak detection by dye penetrant test
Nunes, Rafael	Methodology to Evaluate the Critical Blocks in an Integrated Circuit based on the Temperature
O
Oberai, Ankush	Smart Manufacturing through Predictive FA
Oh, Wonwook	PV system performance and failure evaluation of 10 year field-aged 1-MW PV power plant
Ohguro, Tatsuya	Study of temperature dependence of breakdown voltage and AC TDDB reliability for thick insulator film deposited by plasma process
Omura, Ichiro	Shoot-through protection for an inverter consisting of the next-generation IGBTs with gate impedance reduction Effect of the cell size reduction on the threshold voltage of UMOSFETs
Orio, Roberto	Methodology to Evaluate the Critical Blocks in an Integrated Circuit based on the Temperature
Orozco, Antonio	Magnetic field imaging and light induced capacitance alteration for failure analysis of Cu-TSV interconnects
Ortiz Gonzalez, Jose	UIS performance and ruggedness of stand-alone and cascode SiC JFETs Analysis of cyclic spontaneous switchings in GaN & SiC cascodes by snappy turn-off currents
Ousten, Jean-Pierre	Using of Bond-Wire Resistance as Ageing Indicator of Semiconductor Power Modules
P
P. Dimitrakopulos, George	Radiation-enhanced glide of 30o Shockley partial dislocations in gallium nitride heterostructures
Palazzo, Simone	Physical Mechanisms for Gate Damages Induced by Heavy Ions in SiC power MOSFET
Palumbo, Félix	Hot-carrier-injection resilient RF power amplifier using adaptive bias
Pan, Guangze	A novel accelerated life-test method under thermal cyclic loadings for electronic devices considering multiple failure mechanisms A reliability evaluation method for multi-performance degradation products based on the Wiener process and Copula function
Pan, Yuxiong	A rapid life-prediction approach for solder joints based on modified Engelmaier fatigue model
Papadopoulos, Charalampos	Gold Wire Bond Study for Automotive Application
Papaioannou, George	A study of hopping transport during discharging in SiNx films for MEMS capacitive switches A study of material stoichiometry on charging properties of SiNx films for potential application in RF MEMS capacitive switches Field emission induced-damage in the actuation paths of MEMS capacitive structures
Park, Hyunseok	Assessing Multi-Output Gaussian Process Regression for Modeling of Non-Monotonic Degradation Trends of Light Emitting Diodes in Storage
Patmanidis, Konstantinos	Modular dynamic pulse stress test system for discrete high power semiconductors
Pavanello, Luca	Reliability of H-terminated diamond MESFETs in high power dissipation operating condition
Pazos, Sebastián Matías	Hot-carrier-injection resilient RF power amplifier using adaptive bias
Peng, Xiyuan	A high-efficiency threshold voltage distribution test method based on the reliability of 3D NAND flash memory
Peng, Xiyuan	Research on 3D NAND flash reliability from the perspective of threshold voltage distribution FPGA-based reliability testing and analysis for 3D NAND flash memory
Peng, Yu	Lithium-ion Battery Performance Degradation Evaluation in Dynamic Operating Conditions based on a Digital Twin Model
Petit, Mickael	Robustness Evaluation Of PCB-Embedded Power Dies Using Solderless Pressed Metal Foam
Piao, Zhelong	FPGA-based reliability testing and analysis for 3D NAND flash memory
Pichon, Pierre-Yves	Effects of Solder Degradation on the Die Temperature Measurement via Internal Gate Resistance
Pin, Samuel	Impact of Crystalline Orientation of Lead-Free Solder Joints on Thermomechanical Response and Reliability of Ball Grid Array Components
Piva, Francesco	Degradation mechanisms in high power InGaN semiconductor lasers investigated by electrical, optical, spectral and C-DLTS measurements
Plano, Bernard	Investigation of critical parameters in power supplies components failure due to electric pulse
Pocaterra, Marco	On the use of soft gamma radiation to characterize the pre-breakdown carrier multiplication in SiC power MOSFETs and its correlation to the TCR failure rate as measured by neutron irradiation Experimental setup to monitor non-destructive single ionization events caused in power devices by terrestrial cosmic radiation.
Portesine, Federico	CFD Modelling of Additive Manufacturing Liquid Cold Plates for More Reliable Power Press-Pack Assemblies
Posthuma, Niels	Role of the AlGaN barrier on the long-term gate reliability of power HEMTs with p-GaN gate
Pouget, Vincent	Design Exploration of Majority Voter Architectures based on the Signal Probability for TMR Strategy Optimization in Space Applications Reliability-driven pin assingment optimization to improve in-orbit soft-error rate
Poulain, Christophe	Effects of gamma radiation on suspended silicon nanogauges bridge used for MEMS transduction
Prechtl,	Non Thermally-Activated Transients and Buffer Traps in GaN Transistors With p-Type Gate: a New Method for Extracting the Activation Energy A Novel On-Wafer Approach to Test the Stability of GaN-based Devices in Hard Switching Conditions: Study of Hot-Electron Effects
Prinz, Jan	Gold Wire Bond Study for Automotive Application
Puybaret, Frédéric	Investigation of critical parameters in power supplies components failure due to electric pulse
Pérez-Martín, Elsa	Analysis of trap states in AlGaN/GaN self-switching diodes via impedance measurements
Q
Qi, Jia	Comparisons of SnO2 Gas Sensor Degradation under Elevated Storage and Working Conditions
Qiao, Liyan	Research on 3D NAND flash reliability from the perspective of threshold voltage distribution FPGA-based reliability testing and analysis for 3D NAND flash memory A high-efficiency threshold voltage distribution test method based on the reliability of 3D NAND flash memory
Qin, Wentao	Microstructure Evolutions upon Ni(Pt) Silicidation and the Different Responses to the Metal Etch
Qiu, Dongyuan	Mode Identification for Reliability Improvement of MMC
Qu, Xinpeng	Lithium-ion Battery Performance Degradation Evaluation in Dynamic Operating Conditions based on a Digital Twin Model
Quittard, Olivier	Study of Moisture Transport in Silicone Gel for IGBT Modules
R
Raciti, Angelo	A non-invasive SiC MOSFET Junction Temperature Estimation Method based on the Transient Light Emission from the Intrinsic Body Diode
Raghavan, Nagarajan	Assessing Multi-Output Gaussian Process Regression for Modeling of Non-Monotonic Degradation Trends of Light Emitting Diodes in Storage
Ramirez, José	Methodology to Evaluate the Critical Blocks in an Integrated Circuit based on the Temperature
Rampazzo, Fabiana	Degradation mechanism of 0.15 um AlGaN/GaN HETMs: the effects of hot electrons
Rao, Hong	Mode Identification for Reliability Improvement of MMC
Raoult, Marianne	0.5µm GaN RF power bar technology space evaluation
Raposo, Victor Javier	Analysis of trap states in AlGaN/GaN self-switching diodes via impedance measurements
Regnier, Arnaud	AC stress reliability study on a novel vertical MOS transistor for non-volatile memory technology
Reis, Ricardo	Circuit Design using Schmitt Trigger to Reliability Improvement
Reverdy, Antoine	ThermoFisher Static Optical Fault Isolation Roadmap and Lock- In Thermography for Automotive
Rey, Patrice	Effects of gamma radiation on suspended silicon nanogauges bridge used for MEMS transduction Robustness of a M&NEMS Pressure Sensor up to 522°C
Riccio, Michele	Gate leakage current sensing for in situ temperature monitoring of p-GaN gate HEMTs
Richard, Isaline	On the replacement of water as coupling medium in scanning acoustic microscopy analysis of sensitive electronics components
Richardeau, Frédéric	Gate-damage accumulation and off-line recovery in SiC power MOSFETs with soft short-circuit failure mode
Rivero, Christian	AC stress reliability study on a novel vertical MOS transistor for non-volatile memory technology
Rizzo, Santi Agatino	A non-invasive SiC MOSFET Junction Temperature Estimation Method based on the Transient Light Emission from the Intrinsic Body Diode
Rodriguez, Andy	Gold Wire Bond Study for Automotive Application
Rodriguez Condia, Josie Esteban	Improving GPU register file reliability with a comprehensive ISA extension
Romeo, Alessandro	Influence of copper and CdTe thickness in the reliability of CdS/CdTe solar cells
Rosa Jr, Leomar	Comparing Analytical and Monte-Carlo-based Simulation Methods for Logic Gates SET Sensitivity Evaluation
Roumanille, Pierre	Impact of Crystalline Orientation of Lead-Free Solder Joints on Thermomechanical Response and Reliability of Ball Grid Array Components
Rugen, Sarah	Impact of Sensing Current Density on PN-Junction Based Temperature Estimation Methods for Si and SiC Power Devices
Rumeau, Alexandre	Analysis Of Drain Current Transient Stability Of AlGaN/GaN HEMT stressed under HTOL & HTRB, By Random Telegraph Noise And Low Frequency Noise Characterizations
Ruzzarin, Maria	Exploration of Gate Trench Module for Vertical GaN devices
Rzepa, Gerhard	A Single-Trap Study of PBTI in SiON nMOS Transistors
S
Sagadevan, Suresh	Effect of integrated anneal optimizations of electroplated Cu thin films Interconnects
Sagné, Frédéric	Design Exploration of Majority Voter Architectures based on the Signal Probability for TMR Strategy Optimization in Space Applications Reliability-driven pin assingment optimization to improve in-orbit soft-error rate
Saito, Wataru	Gate drive circuit for current balancing of parallel-connected SiC-JFETs under avalanche mode
Sana, Kraiem	Conducted EMI mitigation in transformerless PV inverters based on intrinsic MOSFET parameters
Sandrini, Jury	Reliability Analysis in GeTe and GeSbTe based Phase-Change Memory 4kb Arrays targeting Storage Class Memory Applications
Sangiorgi, Enrico	Role of the AlGaN barrier on the long-term gate reliability of power HEMTs with p-GaN gate
Sanseverino, Annunziata	Physical Mechanisms for Gate Damages Induced by Heavy Ions in SiC power MOSFET
Santoro, Danilo	CFD Modelling of Additive Manufacturing Liquid Cold Plates for More Reliable Power Press-Pack Assemblies Smart Soiling Sensor for PV Modules A Method to Extract Lumped Thermal Networks of Capacitors for Reliability Oriented Design
Sapienza, Sergio	Smart Soiling Sensor for PV Modules
Sayadi,	Non Thermally-Activated Transients and Buffer Traps in GaN Transistors With p-Type Gate: a New Method for Extracting the Activation Energy
Scherrer, Barbara	Reliability test for Subsea Power Semiconductors
Schletz, Andreas	Combined Experimental and Numerical Approach for Investigating the Mechanical Degradation of the Interface between Thin Film Metallization and Si-Substrate after Temperature Cycling Test Effect of short-circuit degradation on the remaining useful lifetime of SiC MOSFETs and its failure analysis
Schlottig, Gerd	Study of Moisture Transport in Silicone Gel for IGBT Modules
Schneider-Ramelow, Martin	Investigation of the mechanical properties of corroded sintered silver layers by using Nanoindentation Influence of Temperature and Humidity on Power Cycling Capability of Power Modules
Schramm, Dorian	Conducted EMI Susceptibility Analysis of a COTS Processor as Function of Aging
Schvittz, Rafael	Comparing Analytical and Monte-Carlo-based Simulation Methods for Logic Gates SET Sensitivity Evaluation
Sciancalepore, Corrado	Smart Soiling Sensor for PV Modules
Scognamillo, Ciro	Combined Experimental-FEM Investigation of Electrical Ruggedness in Double-Sided Cooled Power Modules
Seo, Kun Won	PV system performance and failure evaluation of 10 year field-aged 1-MW PV power plant
Sereda, Olha	Can automotive MEMS be reliably used in space applications? An assessment method under sequential bi-parameter testing
Shahbazi, Zahra	Non-destructive Automatic Die-Level Defect Detection of Counterfeit Microelectronics using Machine Vision
Shahbazmohamadi, Sina	Non-destructive Automatic Die-Level Defect Detection of Counterfeit Microelectronics using Machine Vision Correlative microscopy workflow for precise targeted failure analysis of multi-layer ceramic capacitors
Sharbati, Samaneh	Design of E-Mode GaN HEMTs by the Polarization Super Junction (PSJ) Technology
Shen, Chen	Heavy ion track straggling effect in single event effect numerical simulation of 3D stacked devices
Shim, Sunnu	Novel Failure Traces beyond the Barrier on the Floating Device
Sicre,	Non Thermally-Activated Transients and Buffer Traps in GaN Transistors With p-Type Gate: a New Method for Extracting the Activation Energy A Novel On-Wafer Approach to Test the Stability of GaN-based Devices in Hard Switching Conditions: Study of Hot-Electron Effects
Sievers, Markus	Monitoring of Parameter Stability of SiC MOSFETs in Real Application Tests
Silber, Dieter	Impact of Sensing Current Density on PN-Junction Based Temperature Estimation Methods for Si and SiC Power Devices
Silveira, Fernando	Hot-carrier-injection resilient RF power amplifier using adaptive bias
Simeu, Emmanuel	Analog and Mixed-Signal Circuits simulation for product level EMMI analysis
Simevski, Aleksandar	Prediction of Solar Particle Events with SRAM-Based Soft Error Rate Monitor and Supervised Machine Learning
Simonazzi, Marco	Smart Soiling Sensor for PV Modules
Singh, Preetpal	Assessing Multi-Output Gaussian Process Regression for Modeling of Non-Monotonic Degradation Trends of Light Emitting Diodes in Storage
Smalc-Koziorowska, Julita	Radiation-enhanced glide of 30o Shockley partial dislocations in gallium nitride heterostructures
Soltani, Mahdi	Coupled simulations for lifetime prediction of board level packages encapsulated by thermoset injection moulding based on the Coffin-Manson relation
Song, Jianhua	Investigation of the Current Collapse behaviour in GaN Power HEMTs with highly adjustable pulse and measurement concept
Song, Yuchen	Lithium-ion Battery Performance Degradation Evaluation in Dynamic Operating Conditions based on a Digital Twin Model
Sonza Reorda, Matteo	Improving GPU register file reliability with a comprehensive ISA extension
Soto, Frederic	Experimental results on gated diodes and BIMOS ESD devices in 28nm FD-SOI under TLP & TID radiation
Sozzi, Giovanna	Smart Soiling Sensor for PV Modules
Spaggiari, Davide	CFD Modelling of Additive Manufacturing Liquid Cold Plates for More Reliable Power Press-Pack Assemblies
Stampfer, Bernhard	A Single-Trap Study of PBTI in SiON nMOS Transistors
Stavrinidis, George	A study of hopping transport during discharging in SiNx films for MEMS capacitive switches
Steiner, Sebastian	Gold Wire Bond Study for Automotive Application
Steinwall, Jim	Microstructure Evolutions upon Ni(Pt) Silicidation and the Different Responses to the Metal Etch
Sterpone, Luca	Improving GPU register file reliability with a comprehensive ISA extension On the Analysis of radiation-induced Failures in the AXI Interconnect Module
Stockman, Arno	OFF-state Trapping Phenomena in GaN HEMTs: Interplay Between Gate Trapping, Acceptor Ionization and Positive Charge Redistribution
Stuhldreier, Hannes	0.5µm GaN RF power bar technology space evaluation
Sugaya, Natsuki	High Throughput Ultrasonic Inspection Apparatus Using Quasi-static Water Surface Contact
Sugiyama, Masaaki	Reliability improvement for palladium coated copper wire using additive element
Sun, Qisen	Life-cycle Reliability Design Optimization of High-power DC Electromagnet-ic Devices Based on Time-dependent Non-probabilistic Convex Model Pro-cess
Sun, Yongquan	Comparisons of SnO2 Gas Sensor Degradation under Elevated Storage and Working Conditions
Sung, Si-Il	Modeling and analysis of the catastrophic failure and degradation data
Susinni, Giovanni	A non-invasive SiC MOSFET Junction Temperature Estimation Method based on the Transient Light Emission from the Intrinsic Body Diode
Suñe, Jordi	Analysis of the successive breakdown statistics of multilayer Al2O3/HfO2 gate stacks using the time-dependent clustering model
Sánchez-Martín, Hector	Analysis of trap states in AlGaN/GaN self-switching diodes via impedance measurements
T
Tablati, Amina	New power module concept in PCB-Embedded technology with silver sintering die attach
Taffarel, Mattia	Degradation mechanisms in high power InGaN semiconductor lasers investigated by electrical, optical, spectral and C-DLTS measurements
Takamori, Taro	Gate drive circuit for current balancing of parallel-connected SiC-JFETs under avalanche mode
Tallarico, Andrea Natale	Role of the AlGaN barrier on the long-term gate reliability of power HEMTs with p-GaN gate
Tan, Cher Ming	Assessing Multi-Output Gaussian Process Regression for Modeling of Non-Monotonic Degradation Trends of Light Emitting Diodes in Storage
Tanaka, Hideo	Reliable Endpoint Technique on Si trenching for Backside Circuit Edit
Tang, Diyin	A power transfer model-based method for lithium-ion battery discharge time prediction of electric rotatory-wing UAV
Tartarin, Jean-Guy	Analysis Of Drain Current Transient Stability Of AlGaN/GaN HEMT stressed under HTOL & HTRB, By Random Telegraph Noise And Low Frequency Noise Characterizations
Tavousi, Pouya	Correlative microscopy workflow for precise targeted failure analysis of multi-layer ceramic capacitors
Tetzner, Kornelius	Challenges to Overcome Breakdown Limitations in lateral β-Ga2O3 MOSFET Devices
Theocharis, John	Field emission induced-damage in the actuation paths of MEMS capacitive structures
Thierry, Kociniewski	Thermal Behaviour Evolution of an IGBT Chip After Aging Measured by Thermoreflectance
Thim, Marc André	Investigation of the Current Collapse behaviour in GaN Power HEMTs with highly adjustable pulse and measurement concept
Thomason, Mike	Microstructure Evolutions upon Ni(Pt) Silicidation and the Different Responses to the Metal Etch
Théolier, Loic	New power module concept in PCB-Embedded technology with silver sintering die attach
Tian, Guoliang	Accumulative total ionizing dose (TID) and transient dose rate (TDR) effects on planar and vertical ferroelectric tunneling-field-effect-transistors (TFET)
Toscani, Andrea	A Method to Extract Lumped Thermal Networks of Capacitors for Reliability Oriented Design
Touboul, Antoine	Design Exploration of Majority Voter Architectures based on the Signal Probability for TMR Strategy Optimization in Space Applications Reliability-driven pin assingment optimization to improve in-orbit soft-error rate
Trivellin, Nicola	Influence of copper and CdTe thickness in the reliability of CdS/CdTe solar cells
Tsao, Chun-Cheng	Reliable Endpoint Technique on Si trenching for Backside Circuit Edit
Tsukuda, Masanori	Shoot-through protection for an inverter consisting of the next-generation IGBTs with gate impedance reduction
Tu, Chunming	Thermal Optimized Discontinuous Modulation Strategy for Three Phase Impedance Source Inverter
U
Urban, Juergen	Gold Wire Bond Study for Automotive Application
V
Vaccaro, Filippo	CFD Modelling of Additive Manufacturing Liquid Cold Plates for More Reliable Power Press-Pack Assemblies
Van de Casteele, Jerome	0.5µm GaN RF power bar technology space evaluation
Van Den Berghe, Sebastien	0.5µm GaN RF power bar technology space evaluation
Vanzi, Massimo	Peculiar Failure Mechanisms in GaN Power Transistors
Vaquero, Daniel	Analysis of trap states in AlGaN/GaN self-switching diodes via impedance measurements
Vargas, Fabian	Conducted EMI Susceptibility Analysis of a COTS Processor as Function of Aging
Velardi, Francesco	Physical Mechanisms for Gate Damages Induced by Heavy Ions in SiC power MOSFET
Vernica, Ionut	Wear-out Failure of an IGBT Module in Motor Drives due to Uneven Thermal Impedance of Power Semiconductor Devices Comparative evaluation of mission profile based reliability assessment methods of power modules in motor drive inverter
Verona, Claudio	Reliability of H-terminated diamond MESFETs in high power dissipation operating condition
Verona Rinati, Gianluca	Reliability of H-terminated diamond MESFETs in high power dissipation operating condition
Versen, Martin	Row hammer avoidance analysis of DDR3 SDRAM
Villiger, Thomas	Gold Wire Bond Study for Automotive Application
Vinassa, Jean-Michel	Investigation of critical parameters in power supplies components failure due to electric pulse Lithium-ion battery SoH estimation based on incremental capacity peak tracking at several current levels for online application
W
Wada, Keiji	Investigation of Multiple Short-Circuits Characteristics and Reliability in SiC Power Devices used for a Start-up Method of Power Converters Accelerated aging test for gate oxide degradation in SiC MOSFETs for condition monitoring Gate drive circuit for current balancing of parallel-connected SiC-JFETs under avalanche mode
Wagner, Stefan	Investigation of the mechanical properties of corroded sintered silver layers by using Nanoindentation
Waltl, Michael	A Single-Trap Study of PBTI in SiON nMOS Transistors
Wan, Bo	Damage based PoF model of solder joints under temperature cycling and electric coupling condition
Wang, Bixuan	IGBT Aging Monitoring and Remaining Lifetime Prediction Based on Long Short-Term Memory (LSTM) Networks Multiple Failure Modes Identification of SiC planar MOSFETs in Short-circuit Operation
Wang, Boyan	Surge Current Capability of Ultra-Wide-Bandgap Ga2O3 Schottky Diodes
Wang, Chi-Wei	Packaging Reliability Estimation of High-Power Device Modules by Utilizing Silver Sintering Technology
Wang, Chunhui	A reliability evaluation method for multi-performance degradation products based on the Wiener process and Copula function
Wang, Chunhui	A novel accelerated life-test method under thermal cyclic loadings for electronic devices considering multiple failure mechanisms
Wang, Chunlin	Single-event induced failure mode of PWM in DC/DC converter
Wang, Dingyi	Mission profile-oriented configuration of PV panels for lifetime and cost-efficiency of PV inverters
Wang, Guoqing	Single event upset for monolithic 3-D integrated 6T SRAM based on a 22 nm FD-SOI technology: Effects of channel size and temperature
Wang, Haoran	Mission profile-oriented configuration of PV panels for lifetime and cost-efficiency of PV inverters
Wang, Huai	Wear-out Failure of an IGBT Module in Motor Drives due to Uneven Thermal Impedance of Power Semiconductor Devices
Wang, Jianhua	IGBT Aging Monitoring and Remaining Lifetime Prediction Based on Long Short-Term Memory (LSTM) Networks Multiple Failure Modes Identification of SiC planar MOSFETs in Short-circuit Operation
Wang, Puyu	Reliability analysis of excitation control modes of a synchronous condenser during grid-integration at the speed-falling stage Simplified Hybrid Reliability Simulation Approach of a VSC DC Grid with Integration of an Improved DC Current Flow Controller
Wang, Rongwei	Single event upset for monolithic 3-D integrated 6T SRAM based on a 22 nm FD-SOI technology: Effects of channel size and temperature
Wang, Rui	A fault tolerant switched reluctance motor drive for electric vehicles under multi-switches open-fault conditions
Wang, Shihang	A 3-D thermal network model for the temperature monitoring of thermal grease as interface material
Wang, Shujuan	Reliability-Oriented Optimization of Aluminum Electrolytic Capacitor Considering Uncertain Mission Profile
Wang, Song	Simplified Hybrid Reliability Simulation Approach of a VSC DC Grid with Integration of an Improved DC Current Flow Controller
Wang, Xiaolin	A 3-D thermal network model for the temperature monitoring of thermal grease as interface material
Wang, Xu	A rapid life-prediction approach for solder joints based on modified Engelmaier fatigue model
Wang, Yue	Solving Time-dependent Reliability-based Design Optimization by Adaptive Differential Evolution Algorithm and Time-dependent Polynomial Chaos Expansions(ADE-T-PCE)
Wang, Yujie	An error detecting scheme with input offset regulation for Enhancing Reliability of ultralow-voltage SRAM
Wang, Zhian	A comparison study on electromagnetic susceptibility of current reference circuits with scaling-down technologies and schemes
Waqar, Muhammad	FBGA solder ball defect effect on DDR4 data signal rise time and ISI measured by loading the data line with a capacitor
Watkins, Robert	Microstructure Evolutions upon Ni(Pt) Silicidation and the Different Responses to the Metal Etch
Wei, Debao	Research on 3D NAND flash reliability from the perspective of threshold voltage distribution FPGA-based reliability testing and analysis for 3D NAND flash memory A high-efficiency threshold voltage distribution test method based on the reliability of 3D NAND flash memory
Wittler, Olaf	Influence of Temperature and Humidity on Power Cycling Capability of Power Modules
Woirgard, Eric	New power module concept in PCB-Embedded technology with silver sintering die attach
Won, Seokjun	Novel Failure Traces beyond the Barrier on the Floating Device
Wong, Hiu-Yung	Surge Current Capability of Ultra-Wide-Bandgap Ga2O3 Schottky Diodes
Wrobel, Frédéric	Comparing Analytical and Monte-Carlo-based Simulation Methods for Logic Gates SET Sensitivity Evaluation Design Exploration of Majority Voter Architectures based on the Signal Probability for TMR Strategy Optimization in Space Applications Reliability-driven pin assingment optimization to improve in-orbit soft-error rate
Wu, Jianfei	A comparison study on electromagnetic susceptibility of current reference circuits with scaling-down technologies and schemes
Wu, Kangning	A 3-D thermal network model for the temperature monitoring of thermal grease as interface material
Wu, Qinzhi	Single-event induced failure mode of PWM in DC/DC converter
Wu, Ruizhu	UIS performance and ruggedness of stand-alone and cascode SiC JFETs
Wu, Yi-da	Extraction of Wearout Model Parameters using On-Line Test of an SRAM Optimal Sampling for Accelerated Testing in 14nm FinFET Ring Oscillators
Wu, Zhenyu	An Investigation of FinFET Single-Event Latch-up Characteristic and Mitigation Method
Wuest, Felix	Influence of Temperature and Humidity on Power Cycling Capability of Power Modules
X
Xi, Kai	Impact of electrical stress on total ionizing dose effects on graphene nano-disc non-volatile memory devices
Xiang, Zhengrong	Reliability analysis of excitation control modes of a synchronous condenser during grid-integration at the speed-falling stage Simplified Hybrid Reliability Simulation Approach of a VSC DC Grid with Integration of an Improved DC Current Flow Controller
Xiao, Ming	Surge Current Capability of Ultra-Wide-Bandgap Ga2O3 Schottky Diodes
Xin, Lei	A 3-D thermal network model for the temperature monitoring of thermal grease as interface material
Xu, Gaobo	Accumulative total ionizing dose (TID) and transient dose rate (TDR) effects on planar and vertical ferroelectric tunneling-field-effect-transistors (TFET)
Xu, Jie	Thermal Optimized Discontinuous Modulation Strategy for Three Phase Impedance Source Inverter
Xu, Le	Fretting wear reliability assessment methodology of gold-plated electrical connectors considering manufacture parameters distribution Vibration-induced dynamic characteristics modeling of electrical contact resistance for connectors
Xu, Qiuxia	Accumulative total ionizing dose (TID) and transient dose rate (TDR) effects on planar and vertical ferroelectric tunneling-field-effect-transistors (TFET)
Xu, Shukai	Mode Identification for Reliability Improvement of MMC
Y
Yagi, Yuki	Study of temperature dependence of breakdown voltage and AC TDDB reliability for thick insulator film deposited by plasma process
Yamada, Takashi	Reliability improvement for palladium coated copper wire using additive element
Yamasue, Kohei	Profiling of carriers in a 3D flash memory cell with nanometer-level resolution using scanning nonlinear dielectric microscopy Spatial scale dependent impact of non-uniform interface defect distribution on field effect mobility in SiC MOSFETs
Yan, Gangping	Accumulative total ionizing dose (TID) and transient dose rate (TDR) effects on planar and vertical ferroelectric tunneling-field-effect-transistors (TFET)
Yan, Xuesong	Online Junction Temperature Estimation Using Integrated NTC Thermistor in IGBT Modules for PMSM Drives
Yang, Can	Single event upset for monolithic 3-D integrated 6T SRAM based on a 22 nm FD-SOI technology: Effects of channel size and temperature
Yang, Guangwen	Heavy ion track straggling effect in single event effect numerical simulation of 3D stacked devices
Yang, Guoliang	Three-level inverters improve reliability based on equivalent input disturbance and repetitive control combinations
Yang, Jianwei	Modeling and Fault Diagnosis of Multi-phase Winding Inter-turn Short Circuit for Five-phase PMSM based on Improved Trust Region
Yang, Jianxiong	Short-circuit and open-circuit faults monitoring of IGBTs in SST using collector-emitter voltage
Yang, Jun	A Novel BIST for Monitoring Aging / Temperature by Self-Triggered Scheme to Improve the Reliability of STT-MRAM
Yang, Kexin	Extraction of Wearout Model Parameters using On-Line Test of an SRAM Optimal Sampling for Accelerated Testing in 14nm FinFET Ring Oscillators
Yang, Pan	An error detecting scheme with input offset regulation for Enhancing Reliability of ultralow-voltage SRAM
Yang, Qingqing	A fault tolerant switched reluctance motor drive for electric vehicles under multi-switches open-fault conditions An active thermal management strategy for switched reluctance drive system with minimizing current sampling delay
Yang, Shuying	A fault tolerant switched reluctance motor drive for electric vehicles under multi-switches open-fault conditions An active thermal management strategy for switched reluctance drive system with minimizing current sampling delay Online Junction Temperature Estimation Using Integrated NTC Thermistor in IGBT Modules for PMSM Drives
Yang, Xiaofeng	Faults and Reliability Analysis of Negative Resistance Converter Traction Power System
Ye, Bing	Heavy Ion and Proton Induced Single Event Upsets in 3D SRAM
Ye, Shuaichen	System-level Reliability Assessment for a Direct-drive PMSG Based Wind Turbine with Multiple Converters
Ye, Tianchun	A comparison study on electromagnetic susceptibility of current reference circuits with scaling-down technologies and schemes Single-event induced failure mode of PWM in DC/DC converter
Ye, Xiaocan	An error detecting scheme with input offset regulation for Enhancing Reliability of ultralow-voltage SRAM
Ye, Xuerong	Reliability-Oriented Optimization of Aluminum Electrolytic Capacitor Considering Uncertain Mission Profile Solving Time-dependent Reliability-based Design Optimization by Adaptive Differential Evolution Algorithm and Time-dependent Polynomial Chaos Expansions(ADE-T-PCE) Life-cycle Reliability Design Optimization of High-power DC Electromagnet-ic Devices Based on Time-dependent Non-probabilistic Convex Model Pro-cess
Ye, Xuerong	Solving Time-dependent Reliability-based Design Optimization by Adaptive Differential Evolution Algorithm and Time-dependent Polynomial Chaos Expansions(ADE-T-PCE) Life-cycle Reliability Design Optimization of High-power DC Electromagnet-ic Devices Based on Time-dependent Non-probabilistic Convex Model Pro-cess
Yin, Huaxiang	Accumulative total ionizing dose (TID) and transient dose rate (TDR) effects on planar and vertical ferroelectric tunneling-field-effect-transistors (TFET)
Yin, Jinze	Three-level inverters improve reliability based on equivalent input disturbance and repetitive control combinations
You, Shuzhen	Exploration of Gate Trench Module for Vertical GaN devices
Youssef, Metayrek	Thermal Behaviour Evolution of an IGBT Chip After Aging Measured by Thermoreflectance
Youssef, Toni	Thermo-Mechanical Assessment of Silver Sintering for Attaching Power Components in Embedded PCB New power module concept in PCB-Embedded technology with silver sintering die attach
Yu, Jinsong	A power transfer model-based method for lithium-ion battery discharge time prediction of electric rotatory-wing UAV
Yu, Tianhua	Comparisons of SnO2 Gas Sensor Degradation under Elevated Storage and Working Conditions
Yu, Xiaoling	A 3-D thermal network model for the temperature monitoring of thermal grease as interface material
Yu, Zechun	Combined Experimental and Numerical Approach for Investigating the Mechanical Degradation of the Interface between Thin Film Metallization and Si-Substrate after Temperature Cycling Test
Yuan, Jiaxin	Damage based PoF model of solder joints under temperature cycling and electric coupling condition
Yuan, Ruiming	Solving Time-dependent Reliability-based Design Optimization by Adaptive Differential Evolution Algorithm and Time-dependent Polynomial Chaos Expansions(ADE-T-PCE) Life-cycle Reliability Design Optimization of High-power DC Electromagnet-ic Devices Based on Time-dependent Non-probabilistic Convex Model Pro-cess
Yuan, Tao	Reliability analysis of excitation control modes of a synchronous condenser during grid-integration at the speed-falling stage
Yuan, Xibo	Analysis of cyclic spontaneous switchings in GaN & SiC cascodes by snappy turn-off currents
Yun, Ping	Fault diagnosis of cracks in crystalline silicon photovoltaic modules through I-V curve
Z
Zamperetti, Filippo	GaN-based high-periodicity multiple quantum well solar cells: degradation under optical and electrical stress
Zanoni,	Non Thermally-Activated Transients and Buffer Traps in GaN Transistors With p-Type Gate: a New Method for Extracting the Activation Energy OFF-state Trapping Phenomena in GaN HEMTs: Interplay Between Gate Trapping, Acceptor Ionization and Positive Charge Redistribution GaN-based high-periodicity multiple quantum well solar cells: degradation under optical and electrical stress Reliability of H-terminated diamond MESFETs in high power dissipation operating condition
Zanoni, Enrico	Degradation mechanisms in high power InGaN semiconductor lasers investigated by electrical, optical, spectral and C-DLTS measurements Exploration of Gate Trench Module for Vertical GaN devices
Zanoni, Enrico	Degradation mechanism of 0.15 um AlGaN/GaN HETMs: the effects of hot electrons Influence of copper and CdTe thickness in the reliability of CdS/CdTe solar cells A Novel On-Wafer Approach to Test the Stability of GaN-based Devices in Hard Switching Conditions: Study of Hot-Electron Effects
Zeng, Chuanbin	Single-event induced failure mode of PWM in DC/DC converter
Zhai, Guofu	Fretting wear reliability assessment methodology of gold-plated electrical connectors considering manufacture parameters distribution Vibration-induced dynamic characteristics modeling of electrical contact resistance for connectors Solving Time-dependent Reliability-based Design Optimization by Adaptive Differential Evolution Algorithm and Time-dependent Polynomial Chaos Expansions(ADE-T-PCE) Life-cycle Reliability Design Optimization of High-power DC Electromagnet-ic Devices Based on Time-dependent Non-probabilistic Convex Model Pro-cess
Zhang, Bo	Mode Identification for Reliability Improvement of MMC
Zhang, Gang	Single-event induced failure mode of PWM in DC/DC converter
Zhang, Guogang	IGBT Aging Monitoring and Remaining Lifetime Prediction Based on Long Short-Term Memory (LSTM) Networks Multiple Failure Modes Identification of SiC planar MOSFETs in Short-circuit Operation
Zhang, Junjun	Single event upset for monolithic 3-D integrated 6T SRAM based on a 22 nm FD-SOI technology: Effects of channel size and temperature
Zhang, Kaichen	Study of Moisture Transport in Silicone Gel for IGBT Modules
Zhang, Mengdi	A Novel BIST for Monitoring Aging / Temperature by Self-Triggered Scheme to Improve the Reliability of STT-MRAM
Zhang, Sujuan	Damage based PoF model of solder joints under temperature cycling and electric coupling condition
Zhang, Wei	An error detecting scheme with input offset regulation for Enhancing Reliability of ultralow-voltage SRAM
Zhang, Xiao-Ping	Simplified Hybrid Reliability Simulation Approach of a VSC DC Grid with Integration of an Improved DC Current Flow Controller
Zhang, Xiaotong	A 3-D thermal network model for the temperature monitoring of thermal grease as interface material
Zhang, Xing	A fault tolerant switched reluctance motor drive for electric vehicles under multi-switches open-fault conditions Mission profile-oriented configuration of PV panels for lifetime and cost-efficiency of PV inverters Fault diagnosis of cracks in crystalline silicon photovoltaic modules through I-V curve An active thermal management strategy for switched reluctance drive system with minimizing current sampling delay
Zhang, Yan	An Improved Lifetime Prediction Method for Metallized Film Capacitor Considering Harmonics and Degradation Process
Zhang, Yuhao	Surge Current Capability of Ultra-Wide-Bandgap Ga2O3 Schottky Diodes
Zhang, Yuna	Three-level inverters improve reliability based on equivalent input disturbance and repetitive control combinations
Zhang, Yunan	Effects of anisotropy on the reliability of TSV microstructure
Zhang, Zhen	Modeling and Fault Diagnosis of Multi-phase Winding Inter-turn Short Circuit for Five-phase PMSM based on Improved Trust Region
Zhang, Zhixiang	Fault diagnosis of cracks in crystalline silicon photovoltaic modules through I-V curve
Zhao, Dawei	Combined Experimental and Numerical Approach for Investigating the Mechanical Degradation of the Interface between Thin Film Metallization and Si-Substrate after Temperature Cycling Test
Zhao, Fazhan	Single-event induced failure mode of PWM in DC/DC converter
Zhao, Peixiong	Heavy ion track straggling effect in single event effect numerical simulation of 3D stacked devices An Investigation of FinFET Single-Event Latch-up Characteristic and Mitigation Method
Zhao, Wenxin	A comparison study on electromagnetic susceptibility of current reference circuits with scaling-down technologies and schemes
Zhao, Xin	Simplified Hybrid Reliability Simulation Approach of a VSC DC Grid with Integration of an Improved DC Current Flow Controller
Zhao, Yongxin	An error detecting scheme with input offset regulation for Enhancing Reliability of ultralow-voltage SRAM
Zhao, Yuji	GaN-based high-periodicity multiple quantum well solar cells: degradation under optical and electrical stress
Zhao, Zhijun	Faults and Reliability Analysis of Negative Resistance Converter Traction Power System
Zheng, Trillion Q.	Faults and Reliability Analysis of Negative Resistance Converter Traction Power System
Zhou, Dao	System-level Reliability Assessment for a Direct-drive PMSG Based Wind Turbine with Multiple Converters Comparative evaluation of mission profile based reliability assessment methods of power modules in motor drive inverter
Zhou, Guifa	A rapid life-prediction approach for solder joints based on modified Engelmaier fatigue model
Zhou, Yongliang	CSME: A Novel Cycle-Sensing Margin Enhancement Scheme for High Yield STT-MRAM A Novel BIST for Monitoring Aging / Temperature by Self-Triggered Scheme to Improve the Reliability of STT-MRAM
Zimmermann, André	Coupled simulations for lifetime prediction of board level packages encapsulated by thermoset injection moulding based on the Coffin-Manson relation
Zou, Ying	A time-domain stability analysis method for LLC resonant converter based on Floquet theory A Time-domain Stability Analysis Method for Paralleled LLC Resonant Converter System Based on Floquet Theory

Disclaimer | Powered by EasyChair Smart Program