III-Nitrides Substrates and Defect Characterization in Nitride Materials for Power Devices (abstract)

Vertical GaN devices and reliability (abstract)

Reliability in the era of electrification in aviation: a systems approach (abstract)

Title –High-resolution non-destructive three-dimensional imaging of integrated circuits (abstract)

Reliability Limitations from Crystal Defects in Thick GaN Epitaxial Layers for Power Electronics (abstract)

Impact of electrical stress on total ionizing dose effects on graphene nano-disc non-volatile memory devices (abstract)

CSME: A Novel Cycle-Sensing Margin Enhancement Scheme for High Yield STT-MRAM (abstract)

A Novel BIST for Monitoring Aging / Temperature by Self-Triggered Scheme to Improve the Reliability of STT-MRAM (abstract)

Monitoring of Parameter Stability of SiC MOSFETs in Real Application Tests (abstract)

Extraction of Wearout Model Parameters using On-Line Test of an SRAM (abstract)

Analysis of the aging mechanism occurring at the bond-wire contact of IGBT power devices during power cycling (abstract)

Single-pulse observation of photoemission during avalanche breakdown in insulated gate bipolar transistor (abstract)

Thermal Behaviour Evolution of an IGBT Chip After Aging Measured by Thermoreflectance (abstract)

Shoot-through protection for an inverter consisting of the next-generation IGBTs with gate impedance reduction (abstract)

Modular dynamic pulse stress test system for discrete high power semiconductors (abstract)

On the use of soft gamma radiation to characterize the pre-breakdown carrier multiplication in SiC power MOSFETs and its correlation to the TCR failure rate as measured by neutron irradiation (abstract)

Surge Current Capability of Ultra-Wide-Bandgap Ga2O3 Schottky Diodes (abstract)

A non-invasive SiC MOSFET Junction Temperature Estimation Method based on the Transient Light Emission from the Intrinsic Body Diode (abstract)

Gate-damage accumulation and off-line recovery in SiC power MOSFETs with soft short-circuit failure mode (abstract)

Fail-to-open short-circuit failure mode in SiC power MOSFETs, device characterization and system level exploitaton (abstract)

CFD Modelling of Additive Manufacturing Liquid Cold Plates for More Reliable Power Press-Pack Assemblies (abstract)

Combined Experimental-FEM Investigation of Electrical Ruggedness in Double-Sided Cooled Power Modules (abstract)

Vibration-induced dynamic characteristics modeling of electrical contact resistance for connectors (abstract)

Investigation of the mechanical properties of corroded sintered silver layers by using Nanoindentation (abstract)

New power module concept in PCB-Embedded technology with silver sintering die attach (abstract)

3D and compact thermal modeling in power electronics: an overview (abstract)

Radiation-enhanced glide of 30o Shockley partial dislocations in gallium nitride heterostructures (abstract)

Profiling of carriers in a 3D flash memory cell with nanometer-level resolution using scanning nonlinear dielectric microscopy (abstract)

Reliable Endpoint Technique on Si trenching for Backside Circuit Edit (abstract)

Magnetic field imaging and light induced capacitance alteration for failure analysis of Cu-TSV interconnects (abstract)

Analog and Mixed-Signal Circuits simulation for product level EMMI analysis (abstract)

On the replacement of water as coupling medium in scanning acoustic microscopy analysis of sensitive electronics components (abstract)

A Single-Trap Study of PBTI in SiON nMOS Transistors (abstract)

Reliability Analysis in GeTe and GeSbTe based Phase-Change Memory 4kb Arrays targeting Storage Class Memory Applications (abstract)

Hot-Carrier Degradation in P- and N- Channel EDMOS for Smart Power Application (abstract)

Single event upset for monolithic 3-D integrated 6T SRAM based on a 22 nm FD-SOI technology: Effects of channel size and temperature (abstract)

Methodology to Evaluate the Critical Blocks in an Integrated Circuit based on the Temperature (abstract)

Analysis of the successive breakdown statistics of multilayer Al2O3/HfO2 gate stacks using the time-dependent clustering model (abstract)

Research on 3D NAND flash reliability from the perspective of threshold voltage distribution (abstract)

Modeling and analysis of the catastrophic failure and degradation data (abstract)

A reliability evaluation method for multi-performance degradation products based on the Wiener process and Copula function (abstract)

Optimal Sampling for Accelerated Testing in 14nm FinFET Ring Oscillators (abstract)

Life-cycle Reliability Design Optimization of High-power DC Electromagnet-ic Devices Based on Time-dependent Non-probabilistic Convex Model Pro-cess (abstract)

A high-efficiency threshold voltage distribution test method based on the reliability of 3D NAND flash memory (abstract)

A novel accelerated life-test method under thermal cyclic loadings for electronic devices considering multiple failure mechanisms (abstract)

An error detecting scheme with input offset regulation for Enhancing Reliability of ultralow-voltage SRAM (abstract)

FPGA-based reliability testing and analysis for 3D NAND flash memory (abstract)

FBGA solder ball defect effect on DDR4 data signal rise time and ISI measured by loading the data line with a capacitor (abstract)

Comparisons of SnO2 Gas Sensor Degradation under Elevated Storage and Working Conditions (abstract)

Effect of integrated anneal optimizations of electroplated Cu thin films Interconnects (abstract)

Analysis of counterfeit electronics (abstract)

Smart Manufacturing through Predictive FA (abstract)

Assessing Multi-Output Gaussian Process Regression for Modeling of Non-Monotonic Degradation Trends of Light Emitting Diodes in Storage (abstract)

Electro-thermal Evaluation and Comparison of Quasi-Z Source Inverter Using Different Modulation Methods in Wind Power System (abstract)

Mitigating single event upset of FPGA for the onboard bus control of satellite (abstract)

Reliability-driven pin assingment optimization to improve in-orbit soft-error rate (abstract)

Single-event induced failure mode of PWM in DC/DC converter (abstract)

Design Exploration of Majority Voter Architectures based on the Signal Probability for TMR Strategy Optimization in Space Applications (abstract)

On the Analysis of radiation-induced Failures in the AXI Interconnect Module (abstract)

Evaluating the Soft Error Sensitivity of a GPU-based SoC for Matrix Multiplication (abstract)

An Investigation of FinFET Single-Event Latch-up Characteristic and Mitigation Method (abstract)

Comparing Analytical and Monte-Carlo-based Simulation Methods for Logic Gates SET Sensitivity Evaluation (abstract)

Analysis Of Drain Current Transient Stability Of AlGaN/GaN HEMT stressed under HTOL & HTRB, By Random Telegraph Noise And Low Frequency Noise Characterizations (abstract)

0.5µm GaN RF power bar technology space evaluation (abstract)

Analysis of trap states in AlGaN/GaN self-switching diodes via impedance measurements (abstract)

Hot-carrier-injection resilient RF power amplifier using adaptive bias (abstract)

Degradation mechanism of 0.15 um AlGaN/GaN HETMs: the effects of hot electrons (abstract)

Thermal Optimized Discontinuous Modulation Strategy for Three Phase Impedance Source Inverter (abstract)

System-level Reliability Assessment for a Direct-drive PMSG Based Wind Turbine with Multiple Converters (abstract)

A fault tolerant switched reluctance motor drive for electric vehicles under multi-switches open-fault conditions (abstract)

Mission profile-oriented configuration of PV panels for lifetime and cost-efficiency of PV inverters (abstract)

PV system performance and failure evaluation of 10 year field-aged 1-MW PV power plant (abstract)

Damage based PoF model of solder joints under temperature cycling and electric coupling condition (abstract)

Fretting wear reliability assessment methodology of gold-plated electrical connectors considering manufacture parameters distribution (abstract)

FEM-Aided Damage Model Calibration Method For Experimental Results (abstract)

Solving Time-dependent Reliability-based Design Optimization by Adaptive Differential Evolution Algorithm and Time-dependent Polynomial Chaos Expansions(ADE-T-PCE) (abstract)

Circuit Design using Schmitt Trigger to Reliability Improvement (abstract)

Effect of Thermal and Vibrational Combined Ageing on QFN Terminal Pads Solder Reliability (abstract)

Thermo-Mechanical Assessment of Silver Sintering for Attaching Power Components in Embedded PCB (abstract)

A lifetime assessment and prediction method for large area solder joints (abstract)

Gold Wire Bond Study for Automotive Application (abstract)

A rapid life-prediction approach for solder joints based on modified Engelmaier fatigue model (abstract)

Influence of copper and CdTe thickness in the reliability of CdS/CdTe solar cells (abstract)

Degradation mechanisms in high power InGaN semiconductor lasers investigated by electrical, optical, spectral and C-DLTS measurements (abstract)

GaN-based high-periodicity multiple quantum well solar cells: degradation under optical and electrical stress (abstract)

Smart Soiling Sensor for PV Modules (abstract)

Fault diagnosis of cracks in crystalline silicon photovoltaic modules through I-V curve (abstract)

Electrical nanoprobing and EBIC/EBAC technique integrated in your EFA workflow (abstract)

Effect of the cell size reduction on the threshold voltage of UMOSFETs (abstract)

Ageing of glass passivated TRIAC devices under thermal and electrical stress (abstract)

IGBT Aging Monitoring and Remaining Lifetime Prediction Based on Long Short-Term Memory (LSTM) Networks (abstract)

Spatial scale dependent impact of non-uniform interface defect distribution on field effect mobility in SiC MOSFETs (abstract)

Multiple Failure Modes Identification of SiC planar MOSFETs in Short-circuit Operation (abstract)

New definition of critical energy for SiC MOSFET robustness under short circuit operations: the repetitive critical energy (abstract)

Analysis of cyclic spontaneous switchings in GaN & SiC cascodes by snappy turn-off currents (abstract)

UIS performance and ruggedness of stand-alone and cascode SiC JFETs (abstract)

Impact of stray-inductance imbalance on short-circuit capability of multi-chip SiC power modules (abstract)

Effect of short-circuit degradation on the remaining useful lifetime of SiC MOSFETs and its failure analysis (abstract)

Reliability of H-terminated diamond MESFETs in high power dissipation operating condition (abstract)

Gate Threshold Voltage Instability and On-resistance Degradation under Reverse Current Conduction Stress on E-mode GaN-HEMTs (abstract)

Design of E-Mode GaN HEMTs by the Polarization Super Junction (PSJ) Technology (abstract)

Online Junction Temperature Estimation Using Integrated NTC Thermistor in IGBT Modules for PMSM Drives (abstract)

An active thermal management strategy for switched reluctance drive system with minimizing current sampling delay (abstract)

Three-level inverters improve reliability based on equivalent input disturbance and repetitive control combinations (abstract)

Simplified Hybrid Reliability Simulation Approach of a VSC DC Grid with Integration of an Improved DC Current Flow Controller (abstract)

Short-circuit and open-circuit faults monitoring of IGBTs in SST using collector-emitter voltage (abstract)

Gate drive circuit for current balancing of parallel-connected SiC-JFETs under avalanche mode (abstract)

Faults and Reliability Analysis of Negative Resistance Converter Traction Power System (abstract)

Mode Identification for Reliability Improvement of MMC (abstract)

Accelerated aging test for gate oxide degradation in SiC MOSFETs for condition monitoring (abstract)

A Time-domain Stability Analysis Method for Paralleled LLC Resonant Converter System Based on Floquet Theory (abstract)

Investigation of Multiple Short-Circuits Characteristics and Reliability in SiC Power Devices used for a Start-up Method of Power Converters (abstract)

Parameters sensitivity analysis of Silicon Carbide buck converters to extract features for condition monitoring (abstract)

Coupled simulations for lifetime prediction of board level packages encapsulated by thermoset injection moulding based on the Coffin-Manson relation (abstract)

Impact of Crystalline Orientation of Lead-Free Solder Joints on Thermomechanical Response and Reliability of Ball Grid Array Components (abstract)

Wear-out Failure of an IGBT Module in Motor Drives due to Uneven Thermal Impedance of Power Semiconductor Devices (abstract)

A 3-D thermal network model for the temperature monitoring of thermal grease as interface material (abstract)

Study of temperature dependence of breakdown voltage and AC TDDB reliability for thick insulator film deposited by plasma process (abstract)

Study of Moisture Transport in Silicone Gel for IGBT Modules (abstract)

A time-domain stability analysis method for LLC resonant converter based on Floquet theory (abstract)

Modeling and Fault Diagnosis of Multi-phase Winding Inter-turn Short Circuit for Five-phase PMSM based on Improved Trust Region (abstract)

Impact of Sensing Current Density on PN-Junction Based Temperature Estimation Methods for Si and SiC Power Devices (abstract)

Multi-modal Fault-tolerant Control for Single-phase Cascade Off-gird PV-storage System with PV Failure Using Hybrid Modulation (abstract)

Role of the AlGaN barrier on the long-term gate reliability of power HEMTs with p-GaN gate (abstract)

Gate leakage current sensing for in situ temperature monitoring of p-GaN gate HEMTs (abstract)

Non Thermally-Activated Transients and Buffer Traps in GaN Transistors With p-Type Gate: a New Method for Extracting the Activation Energy (abstract)

OFF-state Trapping Phenomena in GaN HEMTs: Interplay Between Gate Trapping, Acceptor Ionization and Positive Charge Redistribution (abstract)

Challenges to Overcome Breakdown Limitations in lateral β-Ga2O3 MOSFET Devices (abstract)

High Throughput Ultrasonic Inspection Apparatus Using Quasi-static Water Surface Contact (abstract)

Comparative evaluation of mission profile based reliability assessment methods of power modules in motor drive inverter (abstract)

Non-destructive Automatic Die-Level Defect Detection of Counterfeit Microelectronics using Machine Vision (abstract)

Reliability test for Subsea Power Semiconductors (abstract)

Combined Experimental and Numerical Approach for Investigating the Mechanical Degradation of the Interface between Thin Film Metallization and Si-Substrate after Temperature Cycling Test (abstract)

Experimental setup to monitor non-destructive single ionization events caused in power devices by terrestrial cosmic radiation. (abstract)

Asynchronous early output majority voter and a relative-timed asynchronous TMR implementation (abstract)

Physical Mechanisms for Gate Damages Induced by Heavy Ions in SiC power MOSFET (abstract)

Improving GPU register file reliability with a comprehensive ISA extension (abstract)

Can automotive MEMS be reliably used in space applications? An assessment method under sequential bi-parameter testing (abstract)

Robustness of a M&NEMS Pressure Sensor up to 522°C (abstract)

A study of material stoichiometry on charging properties of SiNx films for potential application in RF MEMS capacitive switches (abstract)

Field emission induced-damage in the actuation paths of MEMS capacitive structures (abstract)

ThermoFisher Static Optical Fault Isolation Roadmap and Lock- In Thermography for Automotive (abstract)

Presentation of the new SMARPROBE LX nanoprober system (abstract)

Row hammer avoidance analysis of DDR3 SDRAM (abstract)

Reliability Prediction of FinFET FPGAs by MTOL (abstract)

AC stress reliability study on a novel vertical MOS transistor for non-volatile memory technology (abstract)

Novel Failure Traces beyond the Barrier on the Floating Device (abstract)

Ultrasonic monitoring performance degradation of lithium ion battery (abstract)

Failure-analysis method of soldering interfaces in light-emitting diode packages based on time-domain transient thermal response (abstract)

Correlative microscopy workflow for precise targeted failure analysis of multi-layer ceramic capacitors (abstract)

Effects of anisotropy on the reliability of TSV microstructure (abstract)

Reliability improvement for palladium coated copper wire using additive element (abstract)

Robustness Evaluation Of PCB-Embedded Power Dies Using Solderless Pressed Metal Foam (abstract)

Remaining Useful Lifetime estimation for Electronic Power modules using an analytical degradation model (abstract)

Effects of Solder Degradation on the Die Temperature Measurement via Internal Gate Resistance (abstract)

Interface characterization of Cu-Cu ball bonds by a fast shear fatigue method (abstract)

Using of Bond-Wire Resistance as Ageing Indicator of Semiconductor Power Modules (abstract)

Packaging Reliability Estimation of High-Power Device Modules by Utilizing Silver Sintering Technology (abstract)

Influence of Temperature and Humidity on Power Cycling Capability of Power Modules (abstract)

Barrier properties analysis of Cu/TiW/ITO electrode for Si heterojunction solar cell under thermal aging (abstract)

Conducted EMI mitigation in transformerless PV inverters based on intrinsic MOSFET parameters (abstract)

Experimental results on gated diodes and BIMOS ESD devices in 28nm FD-SOI under TLP & TID radiation (abstract)

Conducted EMI Susceptibility Analysis of a COTS Processor as Function of Aging (abstract)

A power transfer model-based method for lithium-ion battery discharge time prediction of electric rotatory-wing UAV (abstract)

Reliability analysis of excitation control modes of a synchronous condenser during grid-integration at the speed-falling stage (abstract)

A Method to Extract Lumped Thermal Networks of Capacitors for Reliability Oriented Design (abstract)

Health monitoring of mechanically fatigued flexible lithium ion battery by electrochemical impedance spectroscopy (abstract)

Heavy Ion and Proton Induced Single Event Upsets in 3D SRAM (abstract)

Accumulative total ionizing dose (TID) and transient dose rate (TDR) effects on planar and vertical ferroelectric tunneling-field-effect-transistors (TFET) (abstract)

Heavy ion track straggling effect in single event effect numerical simulation of 3D stacked devices (abstract)

Prediction of Solar Particle Events with SRAM-Based Soft Error Rate Monitor and Supervised Machine Learning (abstract)

Microstructure Evolutions upon Ni(Pt) Silicidation and the Different Responses to the Metal Etch (abstract)

A comparison study on electromagnetic susceptibility of current reference circuits with scaling-down technologies and schemes (abstract)

Investigation of critical parameters in power supplies components failure due to electric pulse (abstract)

Improved Workflows in Topside and Backside Mechanical Sample Preparation (abstract)

Peculiar Failure Mechanisms in GaN Power Transistors (abstract)

Exploration of Gate Trench Module for Vertical GaN devices (abstract)

A Novel On-Wafer Approach to Test the Stability of GaN-based Devices in Hard Switching Conditions: Study of Hot-Electron Effects (abstract)

Investigation of the Current Collapse behaviour in GaN Power HEMTs with highly adjustable pulse and measurement concept (abstract)

Gallium Nitride on Diamond (abstract)

Lithium-ion Battery Performance Degradation Evaluation in Dynamic Operating Conditions based on a Digital Twin Model (abstract)

Lithium-ion battery SoH estimation based on incremental capacity peak tracking at several current levels for online application (abstract)

Reliability-Oriented Optimization of Aluminum Electrolytic Capacitor Considering Uncertain Mission Profile (abstract)

An Improved Lifetime Prediction Method for Metallized Film Capacitor Considering Harmonics and Degradation Process (abstract)

Effects of gamma radiation on suspended silicon nanogauges bridge used for MEMS transduction (abstract)

Capacitive micromachined ultrasonic transducers leak detection by dye penetrant test (abstract)

A study of hopping transport during discharging in SiNx films for MEMS capacitive switches (abstract)