Reliability issues in power SiC and GaN (abstract)

Dielectric reliability in microelectronics: a tight relationship between degradation and technology (abstract)

Reliability of packages for power devices (abstract)

Moisture Modeling in Complex Systems (abstract)

Introduction to the modern Reliability based on physics and statistics (abstract)

How to successfully overcome inflection points, or long live Moore's law (abstract)

Vestas’ practice in reliability engineering for power electronics (abstract)

Understanding spatial resolution of laser voltage imaging (abstract)

Exploitation of Laser Voltage techniques for identification and complete characterization of a scan chain transition fail issue using the second harmonic approach (abstract)

Photon emission as a characterization tool for bipolar parasitics in FinFET technology (abstract)

Lifetime Prediction of Aluminum Electrolytic Capacitors in LED Drivers Considering Parameter shifts (abstract)

Capacitor loss analysis method for power electronics converters (abstract)

ESR and capacitance monitoring of a dc-link capacitor used in a three-phase PWM inverter with a front-end diode rectifier (abstract)

Importance of Electric Resistance Monitoring in Shear Test (abstract)

Effect of Joule heating on the reliability of solder joints under power cycling conditions (abstract)

Quantification of lead-free solder fatigue by EBSD analysis (abstract)

Performance increase of tandem amorphous / microcrystalline Si PV devices under variable illumination and temperature conditions (abstract)

Hotspots and performance evaluation of crystalline-silicon and thin-film photovoltaic modules (abstract)

An acoustic emission sensor system for thin layer crack detection (abstract)

Device Characterization of 16/14nm FinFETs for Reliability Assessment with Infrared Emission Spectra (abstract)

Lock-in Thermography for defect localization and thermal characterization for space application (abstract)

Physics-of-Failure (PoF) methodology for qualification and lifetime assessment of supercapacitors for industrial applications (abstract)

Smart SiC MOSFET accelerated lifetime testing (abstract)

Analysis of the degradation mechanisms occurring in the topside interconnections of IGBT power devices during power cycling (abstract)

Experimental characterization of critical high-electric field spots in power semiconductors by planar and scanning collimated alpha sources (abstract)

A power cycling degradation inspector of power semiconductor devices (abstract)

The influence of humidity on the high voltage blocking reliability of power IGBT modules and means of protection (abstract)

ZURICH INSTRUMENTS: Digital Signal Processing for FA (abstract)

MASER: Next generation Accelerated Life test systems for individual sub-40nm node IC’s (abstract)

PARK SYSTEMS: Automatizing Atomic Force Microscopy – Newest technological solutions in advanced applications for failure analysis (abstract)

INSIDIX: TDM COMPACT3: Multi-physical platform for advanced warpage and strain measurement measurements (abstract)

Uncertainty analysis of capacitor reliability prediction due to uneven thermal loading in photovoltaic applications (abstract)

Impact of meteorological variations on the lifetime of grid-connected PV inverters (abstract)

System-level Reliability Enhancement of dc/dc Stage of a Single-Phase PV Inverter (abstract)

Mission profile resolution impacts on the thermal stress and reliability of power devices in PV inverters (abstract)

Converter monitoring in a wind turbine application (abstract)

The end of gate oxide scaling (for real this time) (abstract)

IC security and quality improvement by protection of chip backside against hardware attacks (abstract)

Reliability concerns from the gray market (abstract)

A novel crowdsourcing platform for microelectronics counterfeit defect detection (abstract)

Self-heating induced variability and reliability in nanosheet-FETs based SRAM (abstract)

Simple and Effective Open Switch Fault Diagnosis of Single-Phase PWM Rectifier (abstract)

Lifetime extension through Tj equalisation by use of intelligent gate driver with multi-chip power module (abstract)

humidity robustness for high voltage power modules: limiting mechanisms and improvement of lifetime (abstract)

Investigation of Degradation Mechanisms in Low-Voltage p-Channel Power MOSFETs Under High Temperature Gate Bias Stress (abstract)

SELA: Advanced Solutions for Cross-section of visible and buried defects (abstract)

MSSCORPS: Inside of 10 nm technology node (abstract)

MITSUBISHI: Recent SiC module progress and related applications (abstract)

Statistical Nature of Hard Breakdown Recovery in High-κ Dielectric Stacks Studied using Ramp Voltage Stress (abstract)

A new method for estimating the conductive filament temperature in OxRAM devices based on escape rate theory (abstract)

Reliability and reliability investigation of WBG power devices (abstract)

NBTI and irradiation related degradation mechanisms in power VDMOS transistors (abstract)

Performance-reliability trade-offs in short range RF power amplifier design (abstract)

Surge Protection Design with Surge-to-Digital Converter for Microelectronic Circuits and Systems (abstract)

Influence of temperature of Storage, Write and Read operations on Multiple Level Cells NAND Flash memories (abstract)

A Lightweight Write-Assist Scheme for Reduced RRAM Variability and Power (abstract)

Experimental studies of: laminate composition, drill bit wear out, and chloride ion concentration as factors affecting CAF formation rate (abstract)

Towards Understanding Recovery of Hot-Carrier Induced Degradation (abstract)

Quantitative correlation between Flash and equivalent transistor for endurance electrical parameters extraction (abstract)

Variation-resilient quantifiable plasma process induced damage monitoring (abstract)

VTH subthreshold hysteresis technology and temperature dependence in commercial 4H-SiC MOSFETs (abstract)

Impact of the substrate and buffer design on the performance of GaN on Si power HEMTs (abstract)

Degradation of GaN-on-GaN vertical diodes submitted to high current stress (abstract)

Experimentally validated methodology for real-time temperature cycle tracking in SiC power modules (abstract)

Effect of short-circuit stress on the degradation of the SiO2 dielectric in SiC power MOSFETs (abstract)

LATTICEGEAR: Scribing and cleaving solutions in Nanofab and Research – technologies, workflows and uses cases (abstract)

ULTRATEC: ‘In Situ’ Preparation System (abstract)

A novel insight of pBTI degradation in GaN-on-Si E-mode MOSc-HEMT (abstract)

Voltage oscillations during surge pulses induced by self-extinguishing non-destructive second breakdown in pn-junction diodes (abstract)

An Efficient EDAC Approach for Handling Multiple Bit Upsets in Memory Array (abstract)

Ensure an original and safe “Fail-to-Open” mode in planar and trench power SiC MOSFET devices in extreme short-circuit operation (abstract)

Operating-waveform analysis based reliability evaluation of power MOSFETs used for a leg short-circuit initial charge method (abstract)

Bias temperature instability and condition monitoring in SiC power MOSFETs (abstract)

On the impact of substrate electron injection on dynamic Ron in GaN-on-Si HEMTs (abstract)

Degradation mechanisms of heterogeneous III-V/Silicon loop-mirror laser diodes for photonic integrated circuits (abstract)

Current induced degradation study on state of the art DUV LEDs (abstract)

Further improvements of an extended Hakki-Paoli method (abstract)

Impact of dislocations on DLTS spectra and degradation of InGaN-based laser diodes (abstract)

Gaussian Process Regression Approach for Robust Design and Yield Enhancement of Self-Assembled Nanostructures (abstract)

Application of Multi-Output Gaussian Process Regression for Remaining Useful Life Prediction of Light Emitting Diodes (abstract)

A body built-in cell for detecting transient faults and dynamically biasing subcircuits of integrated systems (abstract)

Evaluation of Variability using Schmitt Trigger on Full Adders Layout (abstract)

Impact of Different Transistor Arrangements on Gate Variability (abstract)

Investigation of artificial neural network algorithm based IGBT online condition monitoring (abstract)

In-situ transistor reliability measurements through nanoprobing (abstract)

Statistical analysis of characteristic of ageing precursor of IGBT based on synthetic effect of multi-physical fields (abstract)

Design and Implementation of Reliable Flash ADC for Microwave Applications (abstract)

Manufacturing process-based storage degradation modelling and reliability assessment (abstract)

Assessing Body Built-In Current Sensors for Detection of Multiple Transient Faults (abstract)

Corrosion reliability of lead-free solder systems used in electronics (abstract)

Effect of DC/AC stress on the reliability of cell capacitor in DRAM (abstract)

Method to extract parameters of power law for nano-scale SiON pMOSFETs under Negative Bias Temperature Instability (abstract)

A New Multitime Programmable Non-volatile Memory Cell Using High Voltage NMOS (abstract)

Analysis of 6T SRAM cell in sub-45nm CMOS and FinFET technologies (abstract)

Method to estimate profile of threshold voltage degradation in MOSFETs due to electrical stress (abstract)

Life Prediction Methodology of System-in-Package Based on Physics of Failure (abstract)

Effect of OFF-State stress on Reliability of nMOSFET in SWD circuits of DRAM (abstract)

An easy-implemented confidence filter for signal processing in the complex electromagnetic environment (abstract)

Unified view on energy and electrical failure of the short-circuit operation of IGBTs (abstract)

Investigations on immunity of interfaces between intelligent media processor and DDR3 SDRAM memory (abstract)

Conducted EMI Evolution of power SiC MOSFET in a Back Converter after Short-Circuit Aging Tests (abstract)

Failure mechanism of Ag nanowire-coated conductive transparent electrode for wearable devices under folding and torsional fatigue condition (abstract)

Automated Detection of Counterfeit ICs using Machine Learning (abstract)

A Defect-Oriented Test Approach Using On-Chip Current Sensors for Resistive Defects in FinFET SRAMs (abstract)

A Prognostic Methodology for Power MOSFETs Under Thermal Stress Using Echo State Network and Particle Filter (abstract)

Simulation-based evaluation of probing attacks to arbiter PUFs using a time-resolved emission microscope (abstract)

Detection of Failure Mechanisms in 24-40nm FinFETs with (Spectral) Photon Emission Techniques using InGaAs Camera (abstract)

Failure Analysis on 14nm FinFET Devices with ESD CDM Failure (abstract)

Cross-sectional Nanoprobing Sample Preparation on Sub-micron Device with Fast Laser Grooving Technique (abstract)

Void detection in solder bumps with deep learning (abstract)

Fault Location of a Switched Mode Power Supply based on Extended Integer-coded Dictionary Method (abstract)

Non-destructive imaging of defects in Ag-sinter die attach layers – a comparative study including X-Ray, Scanning Acoustic Microscopy and thermography (abstract)

Effect of HTRB lifetest on AlGaN/GaN HEMTs under different voltages and temperatures stress (abstract)

A new electro-optical transmission line measurement method revealing a possible contribution of source and drain contact resistances to GaN HEMT dynamic on-resistance (abstract)

Stability and robustness of InAlGaN/GaN HEMT in short-term DC tests for different passivation schemes (abstract)

Measure of High Frequency Input Impedance to Study the Instability of Power Devices in Short Circuit (abstract)

Investigation of Acoustic Emission as a Non-invasive Method for Detection of Power Semiconductor Aging (abstract)

Analysis of indentation measured mechanical properties on Multilayer Ceramic Capacitors (MLCCs) (abstract)

An Analytical Circuit based Nonlinear Thermal Model for Capacitor Banks (abstract)

Reliability evaluation of IGCT from accelerated testing, quality monitoring and field return analysis (abstract)

Comparison of temperature sensitive electrical parameter based methods for junction temperature determination during accelerated ageing of power electronics (abstract)

Degradation estimation using feature increment stepwise linear regression for PWM Inverter of Electro-Mechanical Actuator (abstract)

A Multi-Port Thermal Coupling Model for Multi-Chip Power Modules Suitable for Circuit Simulators (abstract)

Online Condition Monitoring of IGBT Modules Using Voltage Change Rate Identification (abstract)

Bias voltage criteria of gate shielding effect for protecting IGBTs from shoot-through phenomena (abstract)

A fully digital feedback control of gate driver for current balancing of parallel connected power devices (abstract)

Envelop Tracking Based Embedded Current Measurement for Monitoring of IGBT and Power Converter System (abstract)

Mutual and self-aging effects of power semiconductors on the thermal behaviour of DC-DC boost power converter (abstract)

Avalanche ruggedness of parallel SiC power MOSFETs (abstract)

Failure Analysis of 650V Enhancement Mode GaN HEMT after Short Circuit Tests (abstract)

Effect of power cycling tests on traps under the gate of Al2O3/AlGaN/GaN normally-ON devices (abstract)

Investigation on the degradation indicators of short-circuit tests in 1.2 kV SiC MOSFET power modules (abstract)

Effect of short circuit aging on safe operating area of SiC MOSFET (abstract)

Study of forward AC stress degradation of GaN-on-Si Schottky diodes (abstract)

Evolution of C-V and I-V characteristics for a commercial 600V GaN GIT power device unde repetitive short-circui tests (abstract)

Investigating SiC MOSFET body diode’s light emission as Temperature-Sensitive Electrical Parameter (abstract)

Measurement and Analysis SiC-MOSFET threshold voltage shift (abstract)

The synergetic effects of high temperature gate bias and total ionization dose on 1.2kV SiC devices (abstract)

Threshold voltage instability in SiC MOSFETs as a consequence of current conduction in their body diode (abstract)

Comparison of Experimental, Analytical and Simulation Methods to Estimate Substrate Material Properties for Warpage Reliability Analysis (abstract)

Power cycling test of transfer molded IGBT modules by advanced power cycler under different junction temperature swings (abstract)

An empirical model for thermal interface materials based on experimental characterizations under realistic conditions (abstract)

GaN transistors efficient cooling by graphene foam (abstract)

Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure (abstract)

Water cold plates for high power converters: a software tool for easy optimized design (abstract)

Reliability investigation of large area solder joints in power electronics modules and its simulative representation (abstract)

Shear properties of In-Bi alloy joints with Cu substrates during thermal aging (abstract)

Sequential Combined thermal Cycling and Vibration Test and Simulation of Printed Circuit Board (abstract)

Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects – a novel approach for hybrid metal baseplates (abstract)

Study on power cycling test with different control strategies (abstract)

Effects of the compositional ratios of sputtering target on the device performance and instability in amorphous InGaZnO thin film transistors (abstract)

Analysis of the effects of voltage pulses on P3HT:PCBM polymeric solar cells by means of TLP technique (abstract)

Effects of stair-case Gate bias stress in IGZO/Al2O3 flexible TFTs (abstract)

Failure limits and electro-optical characteristics of GaN-based LEDs under electrical overstress (abstract)

Analysis of Semiconductor Fault using DS (Damped Sinusoidal) HPEM Injection (abstract)

Experimental and simulation study of the correlation between displacement damage and incident proton energy for GaAs devices (abstract)

Radiation robustness of normally-off GaN/HEMT power transistors (COTS) (abstract)

The total ionizing dose response of Leading-edge FDSOI NMOSFET (abstract)

Charge and energy deposition in thick silicon depletion layers by environmental ionizing radiation and terrestrial cosmic rays (abstract)

Constant voltage stress characterization of nFinFET transistor during total ionizing dose experiment (abstract)

Process variation dependence of total ionizing dose effects in bulk nFinFETs (abstract)

Impact of elevated temperature applied during low dose rate irradiation on the degradation of BiCMOS operational amplifiers (abstract)

TCAD simulation of radiation-induced leakage current in 1T1C SDRAM (abstract)

Single-Event Transient Effects on Dynamic Comparator in 28nm FDSOI CMOS Technology (abstract)

Non-destructive estimation method on cosmic ray ruggedness of power semiconductors using repetitive monitoring technique (abstract)

Photovoltaic plant maintainability optimization and degradation detection: modelling and characterization (abstract)

The effect of solar cell internal resistance change on the bus voltage ripple in spacecraft power system (abstract)

Lifetime Evaluation of a Multifunctional PV Single-Phase Inverter during Harmonic Current Compensation (abstract)

Lifetime estimation of modular cascaded H-bridge MLPVI for grid-connected PV systems considering mission profile (abstract)

Life consumption of a MMC-STATCOM Supporting Wind Power Plants: Impact of the Modulation Strategies (abstract)

Direct power control of three-level NPC grid-connected system combined with fault-tolerant technology (abstract)

Reliability Assessment of Power Conditioner Considering Maintenance in a PEM Fuel Cell System (abstract)

A Novel Method of Reliability-Centered Process Optimization for Additive Manufacturing (abstract)

Influence of the pulse length and temperature swing on the relative lifetime estimation for sintered/soldered chip-on-substrate samples via FE-simulation of power cycles (abstract)

Effect of solder material thickness on Power MOSFET reliability by Electro-Thermo-Mechanical Simulations (abstract)

Lifetime prediction of a modified Y-source inverter in photo-voltaic application (abstract)

Creep measurement and choice of creep laws for BGA assemblies' reliability simulation (abstract)

Reliability model of bond wire fatigue for IGBT in MMC with system redundancy consideration (abstract)

Transient junction temperature estimation of IGBT using improved thermal model (abstract)

Reliability design of battery management system for power battery (abstract)

RCD snubber design based on reliability consideration: A case study for thermal balancing in power electronic converters (abstract)

An Extensible Stability Analysis Method in Time Domain for Cascaded DC-DC Converters in Electrical Vehicles (abstract)

Reliability of rail transit traction drive system—a review (abstract)

A Novel Fault-tolerant Control for Battery-Energy-Storage System Based on Cascade Multilevel Converter with Battery/BMS Failure (abstract)

Implementation of Direct Chip Junction Temperature Measurement in High Power IGBT Module in Operation - Railway Traction Converter (abstract)

Reliable N Sleep Shuffled Phase Damping Design for Ground Bouncing Noise Mitigation (abstract)

On-line Fault Diagnosis Model for Locomotive Traction Inverter Based on Wavelet transform and Support Vector Machine (abstract)

A PCH Strong Tracking Control Strategy for Power Coordinated Allocation of Li-SC HESS (abstract)

Influence Factors Analysis of Rail Potential in Urban Rail Transit (abstract)

A Reliable Speed Controller for Suppressing Low Frequency Concussion of Electric Vehicle (abstract)

Failure Modes and Mechanism Analysis of SiC MOSFET under Short-Circuit Conditions (abstract)

Impact of sidewall etching on the dynamic performance of GaN-on-Si E-mode transistors (abstract)

On-line solder layer degradation measurement for SiC-MOSFET modules under accelerated power cycling condition (abstract)

Degradation of vertical GaN-on-GaN fin transistors: step-stress and constant voltage experiments (abstract)

TCAD investigation on hot-electron injection in new-generation technologies (abstract)

TCAD Study of DLC Coatings for Large-Area High-Power Diodes (abstract)

Investigation of layout effects in diode-triggered SCRs under very-fast TLP stress through full-size, calibrated 3D TCAD simulation (abstract)

NBTI and HCI models for circuit level aging simulations in different EDA environments (abstract)

Remaining useful life prediction for lithium-ion batteries based on an integrated health indicator (abstract)

Lithium-ion battery state of health estimation with short-term current pulse test and support vector machine (abstract)

A prediction method for discharge voltage of lithium-ion batteries under unknown dynamic loads (abstract)

Efficient state of health estimation of Li-ion battery under several ageing types for aeronautic applications (abstract)

Analytics for physics of failure in automotive applications (abstract)

Cross-Layer Approaches for Resilient VLSI System Design (abstract)

Large area die-attachment by silver stress migration bonding for power device applications (abstract)

Frequency domain scanning acoustic microscopy for power electronics: physics-based feature identification and selectivity (abstract)

Influence of thermal exposure upon mechanical/electrical properties and microstructure of sintered micro-porous silver (abstract)

Corrosion behaviour of sintered silver under maritime environmental conditions (abstract)

Deriving Lifetime Predictions for Wire Bonds at High Temperatures (abstract)

Modeling the rate-dependent inelastic deformation behavior of porous polycrystalline silver films (abstract)

Thermal resistance modelling and design optimization of PCB vias (abstract)

Highlighting two integration technologies based on vias: Through Silicon Vias and embedded components into PCB. Strengths and weaknesses for manufacturing and reliability. (abstract)

Fundamental Frequency Region-based Thermal Control of Power Electronics Modules in High Power Motor Drive (abstract)

Calendar and cycling ageing combination of batteries in electric vehicles (abstract)

Method of Junction Temperature Estimation and Over Temperature Protection Used for Electric Vehicle’s IGBT Power Modules (abstract)

Comparison of Lithium-ion Battery Performance at Beginning-of-Life and End-of-Life (abstract)

Interplay of humidity and electrical functionality imposing reliability problems in electronics (abstract)

TCAD Modelling for Reliability (abstract)

Cyclic robustness of heavy wire bonds: Al, AlMg, Cu and CucorAl (abstract)

Experimental investigation of the reliability of Printed Circuit Board (PCB)-embedded power dies with pressed contact made of metal foam (abstract)

Mechanism of Wire Bond Shear Testing (abstract)

Electrical characterization of epoxy-based molding compounds for next generation HV ICs in presence of moisture (abstract)

Characterization of cyclic delamination behavior of thin film multilayers (abstract)

Two-thermal-states model predictive control for IGBT in three-phase inverter (abstract)

Simulation and Modelling of Long Term Reliability of Digital Circuits implemented in FPGA (abstract)

Thermal Modeling of Wire-bonded Power Modules Considering Non-Uniform Temperature and Electric Current Interactions (abstract)

A new processing method for accelerated degradation data based on quantile regression and pseudo-failure lifetime (abstract)

Reliability Assessment for Traction Power Supply System Based on Quantification of Margins and Uncertainties (abstract)

A Fault-Tolerant Control Strategy for Switched Reluctance Motor Drive for Electric Vehicles Under Short-Fault Condition (abstract)

Thermal stress reduction of quasi-Z source inverter drive by model predictive control (abstract)

Detection and Identification of Power Switch Failures for Fault-Tolerant Operation of Flying Capacitor Buck-Boost Converters (abstract)

A novel current-limiting circuit based on resistive-type SFCL for fault in DC power system (abstract)

Steps toward automated deprocessing of integrated circuits (abstract)

High resolution observation of defects at SiO2/4H-SiC interfaces by time-resolved scanning nonlinear dielectric microscopy (abstract)

Use of Golden Samples for the Assessment of the Quality and Reproducibility of Scanning Acoustic Microscopy Images of Electronics Samples (abstract)

New defect detection approach using near electromagnetic field probing for high density PCBAs (abstract)

Complex Automotive ICs defect localization driven by Quiescent Power Supply Current: three cases study (abstract)

Metallization Defect Detection in 3D Integrated Components using Scanning Acoustic Microscopy and Acoustic Simulations (abstract)

Reliability assessment and failure mode analysis of MEMS accelerometers for space applications (abstract)

Reliability Testing of Integrated Low-Temperature PVD PZT Films (abstract)

Stress Analysis of CMOS-MEMS Microphone under Shock Loading by Taguchi Method (abstract)

Design and development of MEMS-based structures for in-situ characterization of thermo-mechanical behaviour of thin metal films (abstract)

Charging mechanisms in Y2O3 dielectric films for MEMS capacitive switches (abstract)

Analysis of the charge sharing effect in the SET sensitivity of bulk 45nm standard cell layouts under heavy ions (abstract)

Progressive Drain Damage in SiC Power MOSFETs Exposed to Ionizing Radiation (abstract)

Total Ionizing Dose and Single Event Effects of 1Mb HfO2-based Resistive-Random-Access Memory (abstract)

Effects of HPEM Stress on GaAs Low-Noise Amplifier from Circuit to Component Scale (abstract)

A single event upset tolerant latch design (abstract)

Influence of Sample Preparation on Intrinsic Stresses inside a Model Chip - First Results of Partial Decapsulation (abstract)

Failure Mechanism Analysis of Fuses Subjected to Manufacturing and Operational Thermal stresses (abstract)

Solving 28nm I/O Circuit Reliability Issue due to Design Weakness (abstract)

Failure Signature Analysis of Power-Opens in DDR3 SDRAMs (abstract)

Impact of carbon impurities on the initial leakage current of AlGaN/GaN high electron mobility transistors (abstract)

Comparison of Reliability of 100 nm AlGaN/GaN HEMTs with T-Gate and SAG-Gate Technology (abstract)

On-wafer RF stress and trapping kinetics of Fe-doped AlGaN/GaN HEMTs (abstract)

Combined experimental and numerical approach to study electro-mechanical resonant phenomena in GaN-on-Si heterostructures (abstract)

Qualification of GaN microwave transistors for the European Space Agency Biomass mission (abstract)

Evaluating the reliability of a GPU pipeline to SEU and the impacts of software-based and hardware-based fault tolerance techniques (abstract)

Design of Approximate-TMR using Approximate Library and Heuristic Approaches (abstract)

PTM-based hybrid error-detection architecture for ARM microprocessors (abstract)

On the Analysis of Radiation-induced Single Event Transients on SRAM-based FPGAs (abstract)

SHARC: Efficient Metric for Selective Protection of Software against Soft Errors (abstract)