ESREF 2018: 29TH EUROPEAN SYMPOSIUM ON RELIABILITY OF ELECTRON DEVICES, FAILURE PHYSICS AND ANALYSIS
TALK KEYWORD INDEX

This page contains an index consisting of author-provided keywords.

1
100 nm GaN HEMT
14nm FinFET
2
28nm
28nm FDSOI CMOS technology
3
3D
3D image processing
3D Integration
4
4H-SiC MOSFET
6
600V GaN GIT
A
AA
Accelerated ageing
accelerated aging
accelerated degradation data
accelerated mechanical fatigue test (BAMFIT)
Accelerated Testing
Accessibility
acoustic
acoustic emission
acoustic microscopy
Acoustic Simulation
acoustic wave
Active Thermal Control
Adaptive body biasing
additive manufacturing
AFM
Ag nanowire transparent electrode
Ag paste
Ag stress migration bonding
Ageing
Ageing modes
Aging
aging indicator
AlGaN/GaN
Alpha Source Scanning
Amorphous Si
amorphous-Si (a-Si) thin-film (TF)
Analytics
Annealing
Approximate Circuits
Approximate Library
arbiter PUF
ARM
Arrhenius plot
artificial neural network
ATMR
atomic force microscopy
authentication
Automated
automotive
automotive applications
Automotive Environment
avalanche ruggedness
B
B10 lifetime
back bias voltage
Back gate bias
backside emmi
backside protection
barrier height
Battery
Battery energy storage system
BB
BDC
Bias Temperature Instability
Bias temperature stress
Bias voltage
BiCMOS
Biomass mission
bipolar parasitics
BMS
body bias effect
body built-in current sensors
Bond Wire
bond wire degradation measurement
Bondwire fatigue
boundary determination
Breackdown Voltage of IGZO/AL2O3 TFTs
Breakdown voltage
BTI
buck converter
Buck-Boost Converter
Built-in current sensors
bulk FinFET
C
C-V
CAF
Calendar ageing
Capacitor
Capacitor bank
Capacitor loss analysis
Capacity
carbon
cascade multilevel converter
Cascaded system
CC
Cell capacitor
ceramic capacitor
Chain transition fault
characteristic of ageing precursor
characterization
Charge pumping
Charge Sharing
Charge Transport Mechanisms
Chip backside
Circut level simulation of transistor aging
CMOS
CMOS-MEMS microphone
Cold plate
Combined Test
Common and differential modes
Complex Systems
composition ratio
condition monitoring
conducted EMI
Conductive Anodic Filament
confidence
Contactless testing
Continuum Mechanics
Control strategy
Converters
Cooling
Copper wire
Correlative Microscopy
corrosion
Cosmic ray ruggedness
Counterfeit detection
counterfeit electronic
Coupling factor
crack
Creep
Creep fatigue
creep law
Critical Application
Cross-sectional nanoprobing
Cross-sectional SEM
Crowd Sourcing
crystalline silicon (c-Si)
current balancing
current destruction
current filaments
current overload
Current pulse test
current sensing
current surge
CVS
Cycle ageing
cyclic four-point bending
D
Damped Sinusoidal pulse
data retention
DBC
DC circuit breaker
DC-DC converter
dc-link capacitors
DDR3 SDRAM
deep learning
Defect clustering model
Defect detection
Defect localization
degradation
Degradation indicators
Degradation of battery
Deprocessing
Design
Design for reliability
Design of experiment
Design optimization
device parameters
DFT
di/dt
Diamond-like carbon (DLC)
DICE
Die defect detection
dielectric
Dielectric Charging
Digital circuits
Digital feedback control(DFC)
Digital image correlation
Diode
Diodes
direct power control
Direct Power Injection
discharge voltage
dislocation
displacement damage
dissipated energy
double pulsed testing
drain and source contact resistances
DRAM
Drill Bit Wear Out
drive cycle
Drop test
DTSCR
Dummy cell
DUV LED
Dychotomy
Dynamic Comparator
Dynamic current
dynamic on-resistance
Dynamic Response
E
EBSD
EBSP
EELS
Efficiency degradation
Efficiency improvement
Electric vehicle
electric vehicle motor driver
Electrical characterization
Electrical Injection
electrical overstress
Electrical overstress (EOS)
electrical resistivity
Electrical stress
Electrical Vehicles
Electro-mechanical Actuator
Electro-Optical TLM
Electro-thermal Interactions
electrochemical measurements
electroluminescence
electrolytic capacitor
electromagnetic interference
electronic reliability
Electronics
Electrostatic Discharge
Electrostatic Discharge (ESD)
elevated temperature
Embedded components
embedded processors
EMC
EMP(Electromagnetics Pulse)
Empirical model
encryption
energy destruction
Energy dissipation
EOS
Epoxy resin
Error Detection and Correction (EDAC)
ESA
Experimental mechanics
F
FA
Fail-to-open
failure
Failure analysis
Failure analysis (FA)
Failure Analysis on FINFET
Failure mechanism
Failure mode analysis
failure prediction
failure rate estimation method
fast hole trapping
fast measurement
fatigue
Fatigue failure
Fault current
Fault diagnosis
Fault Isolation
fault location
Fault tolerance
fault tolerance technology
Fault-tolerant
fault-Tolerant control
FDSOI
FE-Simulation
FEM
FEM Reliability Simulation
Field Programmable Gate Array
field reliability
filter
FinFET
FinFET technology
FinFET-based SRAM
FinFETs
Finite Element Analysis
Finite element method
Finite Element Method (FEM)
finite element modeling
Flash reliability
Flexible electric devices
Flexible Thin Film Transistors
Floating gate (FG)
Flying Capacitor
Focused-Ion Beam
Foldable electronic device
Folding fatigue
Fowler-Nordheim
FPGA
full adder
Functionality
Fundamental Frequency
Fuses
fuzzy control
fWLR
G
GaAs
gallium nitride
GaN
GaN HEMT
GaN HEMTs
GaN power HEMT
GaN transistor
GaN-buffer design
GaN-on-si
Gate current
Gate oxide reliability
gate reliability
Gate shielding effect
gate unit reliability
Gaussian process regression
Genetic Algorithm
Golden Sample
Graphene foam
Graphics Processing Units
Grid-connected PV systems
ground bouncing noise
H
H3TRB
Hard breakdown recovery
Hardware attacks
Hardware-based Approach
Harmonic Compensation
harsh environment
HCI
Health Indicators
health prognostics
heating
Heatsink
Heavy ion
Heavy ion irradiation
Heavy Ions
HEMT
HESS;
High density PCBA
High electron mobility transistor
High K
High power IGBT modules
High Temperature Gate Bias (HTGB)
High temperature reverse bias
High temperature storage
high-electron-mobility transistor
High-K
HKMG
Hot carrier
Hot carrier degradation
hot carriers
Hot-carrier injection
hotspots
HPEM
HPEM(High Power Electromagnetics)
HTGB
HTRB
Humidity
hybrid baseplates
hydrogen diffusion
I
I-V
IC Aging Modeling
IC design retrofit
IC design weak point
IC quality
IC security
IDDQ
IEMI
IGBT
IGBT module
IGBT modules
IGBT protection
IGBT reliability
IGCT
imaging
IMC
Immunity
impact of bonding parameters
In-Bi solder
InAlGaN/GaN
indenter
Inflection points
influence factor
InGaAs
InGaN
InGaZnO thin film transistor
Input/Output circuit (I/O)
inspection
Instabilities
Instability
Insulated gate bipolar transistor
Insulated Gate Bipolar Transistors
integer-coded dictionary
Integrated Circuits
integrated health indicator
interface state
intermetallic compound
Internal Resistance
Interval Analysis
intrinsic Stress measurement
Inverters
IR Thermography
irradiation
ITIQ comparator
J
junction temperature
Junction temperature measurement
L
lach design
large area die-attachment
Large Area Solder Joint
Laser deprocess technique
laser diodes
Laser lock-in thermography
Laser Voltage Imaging
Laser Voltage techniques
laser-diode
lead-free
leakage current
LED
LED driver
Life Consumption
Life Prediction
life time
lifetime
lifetime estimation
Lifetime evaluation
Lifetime Modeling
Lifetime prediction
lift-off failure
Light Emitting Diode
Lithium ion battery
Lithium-Ion
lithium-ion battery
LNA
Location of Critical High Carrier Multiplication Spots
Lock-in thermography
Logistic regression
Long term dc bias stability
loss measurement
low dose rate
low frequency concussion
Low-melting temperature
low-temperature PVD PZT
Lumen degradation
M
Machine Learning
Maintainability
Maintenance
manufacturing process
maritime environment
MDSWC
measurement
measurement method
measurement systems
Mechanical Characterization
mechanical damage
mechanical properties characterization
Memory Reliability
MEMS
metal foam
Metal Gate
Metallization
Meteorological Conditions
micro galvanic corrosion
micro-grid;
Microelectronics
microprocessor
Microstructures
MIM Capacitors
Mission Profile
Mission profiles
MLC
MLCC
model predictive control
Modeling
Modeling for reliability
Modelling
Modular cascaded H-bridge MLPVI
Modular Multilevel Converter
Modulation scheme
Modulation Strategies
Moisture
Monitoring
Monte Carlo
Monte-Carlo Simulation
Moore law
MOS interface
MOS interface states
MOS transistor
MOSFET
Motor Drive Reliability
MPG encoder
Multi-chip power modules
multi-physical fields
Multi-physics Modelling and Simulation
Multi-port thermal model
Multichip power module
Multifunctional Inverters
Multiple transient faults
Multiple-Bit Upset (MBU)
multitime programmable (MTP)
mutilayer ceramic capacitor
N
N sleep shuffled phase damping
NAND Flash memory
nano-indentation
nanoprobing
NBTI
near EM field
negative bias temperature instability
Negative Bias Temperature Stress (NBTS)
NIEL
NIR illumination
nMOSFET
Noise
Noisy Environment
Non-Destructive Analysis
Non-destructive testing
non-uniform operation
Non-uniform Temperature
non-volatile memory (NVM)
Numerical modeling
O
object detection
Observer
obsolescence
off shore
OFF-State stress
online condition monitoring
online estimation
online monitoring
Online platform
open defect
Open-circuit fault
Operating-Waveform Analysis
operational amplifiers
optical analysis
optical gain
Optical layer
Organic electronics
Outdoor stress tests
over temperature protection
Oxide breakdown
P
p-GaN gate
p-n junctions
P3HT:PCBM polymeric solar cells
Package reliability
Packages
Parallel
Parallel connected IGBT
Parallel sleep transistor
parameter shifts
parasitic bipolar transistor
Parasitic capacitance
parasitic devices
Parity-per-Byte
partial decapping
partial shadings
particle filter
passivation
Passive Temperature Cycling
passive thermal cycling
PBTI
PCB
PCB embedding
PCB sensor
PCH strong tracking control
Peak minimization
Peltier effect
PEM
PEM Fuel Cell System
Percolation model
Performace
performance
performance index
Permanent magnet synchronous motor
pHEMT
Photo-voltaic
photon emission
photon emission microscopy
Photovoltaic
Photovoltaic modules
Photovoltaic Systems
Physics
physics of failure
PID
piezo resistive
Planar and Collimated Alpha Source
Plasma charging
Poole-Frenkel-like transport
positive bias temperature instability
Positive Gate bias stress
power
Power battery
Power Conditioner
power converter
power coordinated allocation;
Power Cycle
Power Cycling
power cycling test
power device
Power Device Reliability and Robustness
Power devices
power efficiency
Power electronics
Power Electronics Reliability
power integrity(PI)
Power inverter
Power module
power module packaging reliability
Power Modules
Power MOSFET
Power MOSFETs
power pin
Power Semiconductor Devices
Power Semiconductors
Power transistor
Power VDMOSFETs
Power-amplifiers
prediction
pressed contact
Printed circuit board
Printed Circuit Board (PCB)
probing
process optimization
process variability
Process variation
prognostic
Prognostics and health management
Proton
pseudo-failure lifetime
PTM
Pulsed electro-acoustic analysis
PV inverter
PV systems
PWM Inverter
PZT Thin Films
Q
qualification
quality
quantification of margins and uncertainties
quantile regression
quasi-Z-source inverter
Quatro
quiescent current
R
R-Flash ADC
Radiation
Radiation effects
radiation hardened by design
Radiation hardness
Radiation Related Degradation
Radiation-Hardening-by-Design (RHBD) techniques
rail potential
rail transit
Railway traction
Raman spectroscopy
Ramp voltage stress
random failure
RBSOA
Real temperature measurement
Real-time monitoring
Recovery
redundancy
Reliabil
Reliability
Reliability Analysis
Reliability assessment
reliability evaluation
reliability indicators
reliability investigation
reliability model
reliability of capacitor
reliability of SiC MOSFETs
Reliability prediction
Reliabilty Simulation
Reliable Circuits
remaining useful life
renewable energy
Repassivation
Repetitive short-circuit test
Repetitive tests
Resilient
Resistive defects
Resistive RAM
Resistive switching
resistive-random-access memory
Resolution
resonance
RF
RF-MEMS
Robust design
Robustness
Rogowski coil
S
Safe failure mode
safety
Salt Spray Test
SAM
Scaling principle
Scanning Acoustic Microscopy
scanning probe microscopy
Schmitt Trigger
SCSOA
SDRAM
SEB
second breakdown
security
SEE
Self assembly
SEM
semiconductor
Sensitivity Analysis
sensor
separated test method
Shaker
Shear test
shear tests
Shock loading
Shoot-through
Short Circuit
short circuit aging
short pulse power
Short-circuit
Short-circuit capability
short-fault
Si IGBT
SiC
SiC MOSFET
SiC MOSFETs
SiC power module
SiC Power MOSFET
signature statistical analysis
SIHFT
Silicon Carbide
Silicon carbide (SiC)
Silicon Carbide MOSFET
Silicon nitride assisted gate
silicon photonics
silver sinter paste
Silver-sintering die attach
Simulation
Single Event Burnout
Single event cell degradation
single event effects
Single Event Transient
Single Event Transients
single event upset
single poly CMOS
Single-phase rectifier
sinter joining
sinter silver
Sintered Silver
SiON dielectrics
sliding mode speed controller
slow measurement
Snubber
SOA
soft-errors
solar array
solar photovoltaic
solder alloy
solder bumps
Solder die fatigue failure
solder fatigue
Solder joint
solder joint reliability
Solder joints
solder layer degradation measurement
soldering induced residual stress
Space Qualification
Spatial distribution of degradation
Spatial resolution
Spectra
Spectral analysis
spectral photon emission
spectrum
sputtering target
SRAM
SRAM-based FPGA
stability
Staggered phase damping
State of health
statistical analysis
Statistics
Step-stress testing
stochastic finite element analysis
storage degradation modelling
storage reliability of batch products
Stress analysis
stress-counting
Substrate reliability
subthreshold
subthreshold hystereisi
supercapacitors
Superconducting fault current limiter
Support Vector Machine
surge protection
Surge pulse
Surge Test
surge-to-digital converter
Survival analysis
SVM
Switched mode power supply
Switching system
synergetic effects
system voltage ripple
System-in-Package
system-level reliability
T
T-gate
Taguchi method
Tandem PV devices
TCAD
TCAD simulation
TCAD simulations
TEM
temperature
Temperature Estimate
Temperature Monitor
Temperature monitoring
tensile strength
termination
Terrestrial cosmic rays
Testability
THB
THBHV-DC
thermal aging
Thermal Analysis
Thermal balancing
Thermal characterization
thermal control
Thermal coupling
Thermal Cycle
Thermal Cycling
Thermal interface materials
Thermal loading
thermal model
Thermal modeling
Thermal resistance
thermal runaway
thermal shock
Thermal simulation
Thermal stress
thermal stresses
Thermo-Mechanical Analysis
Thermo-Mechanical-Analysis
thin films
thin layer
thin metal films
three level NPC
three-phase inverters
threshold method
Threshold voltage
Threshold voltage degradation
threshold voltage drift
Threshold voltage instability
Threshold voltage shift
Through Silicon Via
TID
Time-domain stability anlysis
time-resolved emission microscope
Tj estimation
Topgraphy and Deformation Measurements
Topside Interconnections
torque ripples
Torsion fatigue
Total ionizing dose
Trace
traction
traction drive system
Traction inverter
traction power supply system
transient fault tolerance
transient liquid phase bonding
transistor
Transistor Arrangements
trap center
trapping
Trapping phenomena
trapping process
Traps
TSEP
tuning
U
UIS
Uncertainty
unit-to-unit variability
unknown dynamic load
urban rail transit
UV illumination
V
Variability
vector analysis
Vertical diodes
Vertical leakage
Vertical transistor
Vestas' prectice
vf-TLP
Via
Vibration
virtual flux
Visco-Plasticity
VLSI
void detection
voltage change rate
voltage oscillations
voltage overshoot
Vth Hysteresis
W
W thin film sandwich structure
wafer test
Warpage
Wavelet transform
WBG power devices
Weibull model
Wide band gap semiconductors
wide band-gap semiconductors
Wide Bandgap Devices
Wire bond
wire bond interconnect reliability
Wire bonding
WLR
word-line
Work-Function Fluctuation
write assist
X
X-ray imaging
Xray tomography of electronics
Y
Y-source inveter
Yellow luminescence
Yield optimization
Yttrium Oxide