ESREF 2018: 29TH EUROPEAN SYMPOSIUM ON RELIABILITY OF ELECTRON DEVICES, FAILURE PHYSICS AND ANALYSIS
Musiksalen

Room B

Sessions

  • Session T1 (Oct 01 09:00-10:30) Tutorial
  • Session T3 (Oct 01 10:50-12:20) Tutorial
  • Session T5 (Oct 01 13:10-14:40) Tutorial
  • Session F-1 (Oct 01 17:00-18:00) PCB Solder Joints
  • Session A-1 (Oct 02 08:40-10:20) Quality and Reliability Assessment Techniques and Methods for Devices and Systems
  • Session A-2 (Oct 02 11:20-12:20) Quality and Reliability Assessment Techniques and Methods for Devices and Systems
  • Session INV3 (Oct 02 13:40-14:20) Invited
  • Session A-3 (Oct 02 14:20-16:00) Quality and Reliability Assessment Techniques and Methods for Devices and Systems
  • Session H (Oct 02 16:20-17:40) Photonics Reliability
  • Session L-1 (Oct 03 08:40-10:00) Modeling Challenges for Devices Reliability
  • Session INV5 (Oct 03 10:20-11:00) Invited
  • Session L-2 (Oct 03 11:00-12:20) Numerical Modeling of Back-End Processes and Assembly
  • Session INV7 (Oct 03 13:20-14:00) Invited
  • Session L-3 (Oct 03 14:00-15:20) Simulation of System and Module Reliability
  • Session BP3 (Oct 03 15:20-15:40) Best Paper ISTFA 2017
  • Session I-1 (Oct 04 08:40-10:20) Radiation Effects in Advanced Devices
  • Session I-2 (Oct 04 10:40-12:20) Analysis and Mitigation of Radiation Effects in Complex Chips