Talk Keyword Index

TALK KEYWORD INDEX

This page contains an index consisting of author-provided keywords.

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(TLP)	Frequency Model Investigation for ESD failure prediction
1
1-Dimensional Convolutional Neural Network	Bidirectional 1D-CNN Model Based Failure Current Classification with open-set recognition
16 nm FinFET	Comparison of semi empirical modelling of FinFET FPGA ageing based on high stress short time with 20000 hours low stress measures
2
2D FEM	In-Depth 2D FEM Analysis of Gate Cracking in SiC MOSFETs Under Repetitive Short-Circuit Conditions: Application of the Rankine Model for Crack Length Prediction
3
3D stacked devices	Evaluating Pulsed X-ray-Induced Single-Event Effects in Deeply Buried Layers of 3D NAND Flash Memories
4
4H-SiC	Optimal bonding of 4H-SiC parallel diodes in a single TO-247 package for improved surge current robustness: experimental investigation
5
55nm HBT SiGe	BP1 Non-destructive characterization of Breakdown Voltage measurement and Application on a 55nm SiGe HBT featuring fT/fMAX of 400GHz/500GHz
A
Abnormal Leakage	CP2 Case Analysis and Research on the Failure of Chip Passivation Layer Defects under the Comprehensive External Environmental Stresses
Accelerated Life Tests	Reliability Assessment of SMD Tantalum Capacitors for Active Implantable Medical Devices: A Methodology Based on ALT and DoE
accelerated mechanical fatigue testing	EP7 Lifetime evaluation of wire bonds in LED systems by modelling and accelerated testing
Acoustic emission	Real-time detection of fracture mode at the direct bonded Chevron-notch Si chip via acoustic emission
Activation energy	F2P1 Study of temperature-dependent breakdown in AlGaN/GaN normally-off HEMT under drain step-stress
Active Implantable Medical Devices	Reliability Assessment of SMD Tantalum Capacitors for Active Implantable Medical Devices: A Methodology Based on ALT and DoE
adaptive compensation	F3-2 Dynamic and Static Degradation Characteristic Analysis and Control Optimization of Three-Phase Inverters Considering Physics of Failure
Adhesion forces modelling	Surface wearing in MEMS accelerometer after mechanical reliability stress tests: physical and electrical characterization
AFM	Surface wearing in MEMS accelerometer after mechanical reliability stress tests: physical and electrical characterization CP5 Top and cross-sectional Failure Analysis investigations by AFM, FIB and SEM: elucidation of an unwanted layer growth in integrated microelectronic chip
Ag porous sheet bonding	EP3 Thermo-mechanical reliability of transfer molded TO-247-3L packages with Ag nanoporous sheet bonding
agglomeration of Ag particles	CP4 Mechanism analysis and possible improvements for leak electricity failure caused by conductive silver paste bonding
Aging	F2P8 Aging of p-GaN gate HEMTs under hard-switching conditions
Anti-adhesion coating	Surface wearing in MEMS accelerometer after mechanical reliability stress tests: physical and electrical characterization
ARM	Analyzing Cache Utilization for Improved System Reliability
Artificial intelligence	From AI-powered Image Classification to GenAI: Possibilities for Modern Image-based Failure Analysis
Autoencoder	AP3 Autoencoder-Driven State-of-Health Estimation for Lithium-Ion Batteries via Dynamic Relaxation Time Distribution Features from Electrochemical Impedance Spectroscopy
Automotive	F3P2 Influence of high frequency power cycles on SiC power module lifetime under automotive mission profile
avalanche ruggedness	Effect of the Load Inductor on the Avalanche Ruggedness of 1200-Volt Silicon Diodes during Unclamped Inductive Switching
B
Bandgap Circuit	Long-Term Drift of a Bandgap Voltage Reference by Molding Compound Oxidation during Extended Thermal Aging
bandgap reference circuit	Analysis for an DA converter power up failure induced by process fluctuation
Barrier Traps	F2P7 Impact of OFF-State Stress on RON and VTH of 100-V GaN HEMTs Mimicking Monolithically-Integrated Half-Bridge Circuits
Base current degradation	Study of Electrical and X-ray induced degradation in BiCMOS 55-nm SiGe:C Heterojunction Bipolar Transistors
Battery degradation	Assessment of Thermal Management Strategies for Prismatic LiFePO4 Batteries: a Test Bench Development
Bi-LSTM	AP1 A Bi-LSTM-Based Digital Twin Model for Photovoltaic Strings Under Current Mismatch Condition
Bipolar Junction Transistors	I2P1 Space Flight Demonstration of Enhanced Low Dose Rate Sensitivity Effect on devices
Bond line thickness	EP3 Thermo-mechanical reliability of transfer molded TO-247-3L packages with Ag nanoporous sheet bonding
Bond wire	EP6 A Comprehensive 3-D FEM Based Numerical Lifetime Investigation on the Effect of Bond Wire Loop Ratio on Molded Power Electronics Assemblies
bond wires	Optimal bonding of 4H-SiC parallel diodes in a single TO-247 package for improved surge current robustness: experimental investigation
Bond-wire degradation	Data-driven Metamodels for Failure Analysis of Power Electronic Modules
Bonding strength	Real-time detection of fracture mode at the direct bonded Chevron-notch Si chip via acoustic emission
breakdown field	Impedance spectroscopy of field-emission and resistive switching in MEMS capacitive switches
Breakdown Voltage	BP1 Non-destructive characterization of Breakdown Voltage measurement and Application on a 55nm SiGe HBT featuring fT/fMAX of 400GHz/500GHz F2P1 Study of temperature-dependent breakdown in AlGaN/GaN normally-off HEMT under drain step-stress
Breakdown Voltage ageing	BP1 Non-destructive characterization of Breakdown Voltage measurement and Application on a 55nm SiGe HBT featuring fT/fMAX of 400GHz/500GHz
BTI	Comparison of semi empirical modelling of FinFET FPGA ageing based on high stress short time with 20000 hours low stress measures
BVCBO	BP1 Non-destructive characterization of Breakdown Voltage measurement and Application on a 55nm SiGe HBT featuring fT/fMAX of 400GHz/500GHz
BVCEO	BP1 Non-destructive characterization of Breakdown Voltage measurement and Application on a 55nm SiGe HBT featuring fT/fMAX of 400GHz/500GHz
C
cache	Analyzing Cache Utilization for Improved System Reliability
CAD	Soft Error Reliability Prediction of SRAM-based FPGA Designs
capaciatnce	CP1 Process-related challenges in the formation of SiO2 layers by chemical vapour deposition for MEMS applications
capacitance	BP3 Sodium in amorphous and crystalline Ta2O5
CFD simulation	EP5 Thermal stability of direct cooling structures for power electronics using instantaneous laser soldering: CFD cooling performance verification with and without void
Characterization of Intermetallic Compounds	Long Term Transformation Of Cu / Sn Intermetallic Compounds in Large Solder Joints
Charge carrier trapping	Characterization Methods for Evaluating Charge Carrier Trapping Mechanisms of SiC Power MOSFETs
chip packaging；	CP4 Mechanism analysis and possible improvements for leak electricity failure caused by conductive silver paste bonding
Chip-Package-Interaction	Long-Term Drift of a Bandgap Voltage Reference by Molding Compound Oxidation during Extended Thermal Aging
Classification algorithm	A3 Failure Prediction Through Testing Data Using Machine Learning Classification: A Smart Plug Top Case Study
CMOS	CMOS Gate Driver with Fully Integrated Fast and Robust Gate Monitoring Solution for a Full Short-Circuit Protection of SiC Power Module
Color Rendering Index	Degradation causes of medium-power, high Color Rendering Index LEDs for indoor illumination
Comparison between model extrapolation and measurement	Comparison of semi empirical modelling of FinFET FPGA ageing based on high stress short time with 20000 hours low stress measures
Composite solder joint	EP2 Microstructural and Reliability Analysis of SAC305/Sn-57Bi-1Ag Composite Solder Joints with Different Printing Aspect Ratios
Condition Monitoring	Junction-temperature measurement of an IGBT module in a sinusoidal PWM inverter with VCE(sat) including built-in voltage
cooling conditions	F3P3 Influence of cooling conditions on estimated power cycling lifetime for the large-area substrate solder joint in power modules
Cooling system status	Online Loss Assessment for Photovoltaic Inverter in High-Power Range: A Coupled Linear Temperature-Rise Model
Copper film	In-situ TEM investigation of thermomechanical fatigue of thick copper metallizations
Cracks	Hotspot analysis on a flexible PV mini-modules based on IBC solar cells
cryo-CMOS	Hot-carrier stress in n-type logic CMOS devices at temperatures down to the deep-cryogenic regime
cryogenic temperatures	Hot-carrier stress in n-type logic CMOS devices at temperatures down to the deep-cryogenic regime
Cu sintering	EP4 High temperature environment reliability of in-air Cu sintered and transfer molded TO-247-3L packages for automotive applications
current	CP1 Process-related challenges in the formation of SiO2 layers by chemical vapour deposition for MEMS applications BP3 Sodium in amorphous and crystalline Ta2O5
current classification	Bidirectional 1D-CNN Model Based Failure Current Classification with open-set recognition
current mismatch	AP1 A Bi-LSTM-Based Digital Twin Model for Photovoltaic Strings Under Current Mismatch Condition
current prediction	AP1 A Bi-LSTM-Based Digital Twin Model for Photovoltaic Strings Under Current Mismatch Condition
Current Sensing	CMOS Gate Driver with Fully Integrated Fast and Robust Gate Monitoring Solution for a Full Short-Circuit Protection of SiC Power Module
Cycling	In-Depth 2D FEM Analysis of Gate Cracking in SiC MOSFETs Under Repetitive Short-Circuit Conditions: Application of the Rankine Model for Crack Length Prediction
D
DA converter	Analysis for an DA converter power up failure induced by process fluctuation
Damage Prediction	In-Depth 2D FEM Analysis of Gate Cracking in SiC MOSFETs Under Repetitive Short-Circuit Conditions: Application of the Rankine Model for Crack Length Prediction
DC Forward stress	BP1 Non-destructive characterization of Breakdown Voltage measurement and Application on a 55nm SiGe HBT featuring fT/fMAX of 400GHz/500GHz
DC Stress	BP2 Thermal and Ageing Characterizations of 55nm SiGe HBT
Decapsulation	Long-Term Drift of a Bandgap Voltage Reference by Molding Compound Oxidation during Extended Thermal Aging
Defects	BP3 Sodium in amorphous and crystalline Ta2O5 Localization of Subtle Front-End FinFET Defects Using EBIC
Degradation	Degradation causes of medium-power, high Color Rendering Index LEDs for indoor illumination
Degradation modeling	AP2 Degradation modeling considering multiple performance parameters degradation based on mixed effects models
degradations	Analysis of robustness of 650 V GaN HEMT under repetitive short-circuits
Design of Experiments	Reliability Assessment of SMD Tantalum Capacitors for Active Implantable Medical Devices: A Methodology Based on ALT and DoE
Detection and Characterization of Solder Defects	Long Term Transformation Of Cu / Sn Intermetallic Compounds in Large Solder Joints
Detection System	CMOS Gate Driver with Fully Integrated Fast and Robust Gate Monitoring Solution for a Full Short-Circuit Protection of SiC Power Module
Diagnostic circuit	A3 Failure Prediction Through Testing Data Using Machine Learning Classification: A Smart Plug Top Case Study
diffusion length	CP1 Process-related challenges in the formation of SiO2 layers by chemical vapour deposition for MEMS applications
digital twin	AP1 A Bi-LSTM-Based Digital Twin Model for Photovoltaic Strings Under Current Mismatch Condition F2P4 A Novel Digital Twin Collaborative Power Cycling Test Method for SiC MOSFETs
Digital-analog co-simulation	F3-2 Dynamic and Static Degradation Characteristic Analysis and Control Optimization of Three-Phase Inverters Considering Physics of Failure
Direct cooling	EP5 Thermal stability of direct cooling structures for power electronics using instantaneous laser soldering: CFD cooling performance verification with and without void
Distribution of Relaxation Times	AP3 Autoencoder-Driven State-of-Health Estimation for Lithium-Ion Batteries via Dynamic Relaxation Time Distribution Features from Electrochemical Impedance Spectroscopy
DPT	F2P8 Aging of p-GaN gate HEMTs under hard-switching conditions
DualBeam	CP3 Large STEM lamella optimisation in a dual beam on HEMT GaN technologies for reliability assessment
Duty Cycle	F2P6 Dynamic Gate Stress: Impact of Duty Cycle and Gate Resistance on Automotive Grade Planar-Gate 1200 V SiC MOSFET
dynamic	Dynamic humidity testing of SiC power semiconductors
dynamic calibration	F2P2 Transient junction temperature measurement error of SiC MOSFETs in power cycling – Influence of gate voltage
Dynamic Gate Stress	F2P6 Dynamic Gate Stress: Impact of Duty Cycle and Gate Resistance on Automotive Grade Planar-Gate 1200 V SiC MOSFET
dynamic high-temperature operating life	Variation of Dynamic ON-Resistance in SiC and p-GaN HEMTs During DHTOL Operation
Dynamic RON	F2P7 Impact of OFF-State Stress on RON and VTH of 100-V GaN HEMTs Mimicking Monolithically-Integrated Half-Bridge Circuits
Dynamic VSD Behaviour	Influencing Factors on the Dynamic VSD Behaviour of different SiC-MOSFET Technologies used for Temperature Read-Out via VSD(T)-Method during the Power Cycling Test
E
Early-life	Early-life drift mechanism investigation of 150nm GaN-on-SiC HEMT RF under accelerated DC test
EBIC	Localization of Subtle Front-End FinFET Defects Using EBIC
ELDRS	I2P1 Space Flight Demonstration of Enhanced Low Dose Rate Sensitivity Effect on devices
Electric field	Field driven failure mechanism on 100V p-GaN HEMT with gate metal retraction
Electrical Characterization	Electrical Properties of Y2O3 for MEMS Applications
Electrical drift	Long-Term Drift of a Bandgap Voltage Reference by Molding Compound Oxidation during Extended Thermal Aging
electrical measurements	CP1 Process-related challenges in the formation of SiO2 layers by chemical vapour deposition for MEMS applications
Electrical stress	Study of Electrical and X-ray induced degradation in BiCMOS 55-nm SiGe:C Heterojunction Bipolar Transistors
Electrochemical impedance spectroscopy	AP3 Autoencoder-Driven State-of-Health Estimation for Lithium-Ion Batteries via Dynamic Relaxation Time Distribution Features from Electrochemical Impedance Spectroscopy
Electroluminescence (EL)	Hotspot analysis on a flexible PV mini-modules based on IBC solar cells
Electron	JEOL (EUROPE) SAS
electron inversion channel	Investigation of Hole Traps Causing Negative Bias Instability in GaN Metal-Oxide-Semiconductor Field-Effect Transistors
Electrothermal model	Modeling and measurement of high frequency temperature variation of GaN transistors for inverter and rectifier applications
EMC and PMC process	EP3 Thermo-mechanical reliability of transfer molded TO-247-3L packages with Ag nanoporous sheet bonding
emerging devices	Reliability aspects of novel device architectures
EMMI	CP3 Large STEM lamella optimisation in a dual beam on HEMT GaN technologies for reliability assessment
Epoxy potting resin	Characterization of the bulk moisture diffusion in epoxy-based potting compounds for IGBT semiconductor power modules
ESD protection	Power-Rail ESD Clamp Circuit With Modified Inverter Structure for Monolithic GaN-Based Integrated Circuits
ESD protection modeling	Frequency Model Investigation for ESD failure prediction
Eurofins	Eurofins MASER
Europe	Seiwa Optical Europe GmbH
Excillum	Excillum
Extreme Value Distribution	Bidirectional 1D-CNN Model Based Failure Current Classification with open-set recognition
F
FA	Sector Technologies Eurofins MASER
Failure	Data-driven Metamodels for Failure Analysis of Power Electronic Modules
Failure analysis	Data-driven Metamodels for Failure Analysis of Power Electronic Modules Optimal bonding of 4H-SiC parallel diodes in a single TO-247 package for improved surge current robustness: experimental investigation F2P1 Study of temperature-dependent breakdown in AlGaN/GaN normally-off HEMT under drain step-stress CP2 Case Analysis and Research on the Failure of Chip Passivation Layer Defects under the Comprehensive External Environmental Stresses
Failure analysis	From AI-powered Image Classification to GenAI: Possibilities for Modern Image-based Failure Analysis
failure analysis；	CP4 Mechanism analysis and possible improvements for leak electricity failure caused by conductive silver paste bonding
Failure investigation	A3 Failure Prediction Through Testing Data Using Machine Learning Classification: A Smart Plug Top Case Study
Failure mechanisms	F2P3 Failure Mechanisms of GaN HEMTs in Single Event Destructive Short-Circuit at Different VDS Voltage Levels
failure physics	F3-2 Dynamic and Static Degradation Characteristic Analysis and Control Optimization of Three-Phase Inverters Considering Physics of Failure
Failure probability	A3 Failure Prediction Through Testing Data Using Machine Learning Classification: A Smart Plug Top Case Study
Fault tolerance	Analyzing Cache Utilization for Improved System Reliability
Fault Under Load	CMOS Gate Driver with Fully Integrated Fast and Robust Gate Monitoring Solution for a Full Short-Circuit Protection of SiC Power Module
Faults Locating	Analysis for an DA converter power up failure induced by process fluctuation
FEM simulation	Thermally cycling-stable and highly heat-dissipative BGA packages manufactured by fluxless laser soldering: Experimental and numerical investigations
FEM simulations	Assessment of Thermal Management Strategies for Prismatic LiFePO4 Batteries: a Test Bench Development
Ferroelectric	Investigation of TiO2 Seed Layer for Enhancing the Uniformity of Remanent Polarization and Time-Dependent Dielectric Breakdown in La-doped Ferroelectric HZO MFM Devices
Ferroelectric FET	Toward Stable FeFET Multi-Level Cell Operations Using Novel Weight Freezing Methodology with Recovery Cycling Scheme for Neuromorphic Applications
FIB	CP5 Top and cross-sectional Failure Analysis investigations by AFM, FIB and SEM: elucidation of an unwanted layer growth in integrated microelectronic chip CP3 Large STEM lamella optimisation in a dual beam on HEMT GaN technologies for reliability assessment
fiber Bragg grating sensor	In-Situ Monitoring of Package Strain During HTRB Test based on Fiber Optic Sensors
field emission	Impedance spectroscopy of field-emission and resistive switching in MEMS capacitive switches
FinFET	Localization of Subtle Front-End FinFET Defects Using EBIC
Finite element simulations	Data-driven Metamodels for Failure Analysis of Power Electronic Modules
Flexible c-Si PV Modules	Hotspot analysis on a flexible PV mini-modules based on IBC solar cells
Fluxless packaging	Thermally cycling-stable and highly heat-dissipative BGA packages manufactured by fluxless laser soldering: Experimental and numerical investigations
FMMEA	Reliability Assessment of SMD Tantalum Capacitors for Active Implantable Medical Devices: A Methodology Based on ALT and DoE
foldable displays	EP1 Standardized Test Method for Pure Bending Evaluation of Foldable Display Materials Under Natural-Arc Folding
foldable materials	EP1 Standardized Test Method for Pure Bending Evaluation of Foldable Display Materials Under Natural-Arc Folding
folding path	EP1 Standardized Test Method for Pure Bending Evaluation of Foldable Display Materials Under Natural-Arc Folding
Foot lift-off	EP6 A Comprehensive 3-D FEM Based Numerical Lifetime Investigation on the Effect of Bond Wire Loop Ratio on Molded Power Electronics Assemblies
FPGA ageing	Comparison of semi empirical modelling of FinFET FPGA ageing based on high stress short time with 20000 hours low stress measures
Fracture toughness	Real-time detection of fracture mode at the direct bonded Chevron-notch Si chip via acoustic emission
Fracutre mode	Real-time detection of fracture mode at the direct bonded Chevron-notch Si chip via acoustic emission
G
GAA MOSFET	Reliability aspects of novel device architectures
Gallium Nitride	Variation of Dynamic ON-Resistance in SiC and p-GaN HEMTs During DHTOL Operation
GaN	Power-Rail ESD Clamp Circuit With Modified Inverter Structure for Monolithic GaN-Based Integrated Circuits 10 kW Inverter with Vertical-GaN Trench MOSFETs and Its Operation Instability Related to MOS Interface Investigation of Hole Traps Causing Negative Bias Instability in GaN Metal-Oxide-Semiconductor Field-Effect Transistors F2P8 Aging of p-GaN gate HEMTs under hard-switching conditions CP3 Large STEM lamella optimisation in a dual beam on HEMT GaN technologies for reliability assessment
GaN HEMT	Analysis of robustness of 650 V GaN HEMT under repetitive short-circuits Modeling and measurement of high frequency temperature variation of GaN transistors for inverter and rectifier applications F2P1 Study of temperature-dependent breakdown in AlGaN/GaN normally-off HEMT under drain step-stress F2P3 Failure Mechanisms of GaN HEMTs in Single Event Destructive Short-Circuit at Different VDS Voltage Levels
GaN HEMTs	Early-life drift mechanism investigation of 150nm GaN-on-SiC HEMT RF under accelerated DC test Permanent degradation of p-GaN HEMTs due to repetitive overvoltage stress during hard turn-off switching
GaN MMIC	Robustness of GaN LNAs under Ku-band jamming signal: understanding the weak point to design future robust LNAs
GaN-on-Si HEMTs	Investigation of RF Stress on the Characteristics of GaN-on-Si HEMTs
Gate Driver	CMOS Gate Driver with Fully Integrated Fast and Robust Gate Monitoring Solution for a Full Short-Circuit Protection of SiC Power Module
Gate Oxide TDDB	Gate Oxide TDDB Lifetime Evaluation of SiC MOSFETs by HTGB Test Using Square Wave Voltage
Gate Resistance	F2P6 Dynamic Gate Stress: Impact of Duty Cycle and Gate Resistance on Automotive Grade Planar-Gate 1200 V SiC MOSFET
Gate-Crack Modeling	In-Depth 2D FEM Analysis of Gate Cracking in SiC MOSFETs Under Repetitive Short-Circuit Conditions: Application of the Rankine Model for Crack Length Prediction
Graphene coating	Microstructural analysis of the Ag/graphene-coated-Cu composite sinter paste in high-temperature reliability
H
Half-Bridge	F2P7 Impact of OFF-State Stress on RON and VTH of 100-V GaN HEMTs Mimicking Monolithically-Integrated Half-Bridge Circuits
Hard Switch Fault	CMOS Gate Driver with Fully Integrated Fast and Robust Gate Monitoring Solution for a Full Short-Circuit Protection of SiC Power Module
hard-switching	Permanent degradation of p-GaN HEMTs due to repetitive overvoltage stress during hard turn-off switching F2P8 Aging of p-GaN gate HEMTs under hard-switching conditions
HCS	Hot-carrier stress in n-type logic CMOS devices at temperatures down to the deep-cryogenic regime
Heat dissipation	Thermally cycling-stable and highly heat-dissipative BGA packages manufactured by fluxless laser soldering: Experimental and numerical investigations EP5 Thermal stability of direct cooling structures for power electronics using instantaneous laser soldering: CFD cooling performance verification with and without void
Heel crack	EP6 A Comprehensive 3-D FEM Based Numerical Lifetime Investigation on the Effect of Bond Wire Loop Ratio on Molded Power Electronics Assemblies
HEMT	CP3 Large STEM lamella optimisation in a dual beam on HEMT GaN technologies for reliability assessment
HiCuM	BP2 Thermal and Ageing Characterizations of 55nm SiGe HBT
High Frequency Power Cycling	Modeling and measurement of high frequency temperature variation of GaN transistors for inverter and rectifier applications
High Power	On the self-actuation reliability issue in high-power RF MEMS
High temperature	Robustness of nano-electromechanical switches against the mechanical shock and vibration loads
High temperature reliability	Microstructural analysis of the Ag/graphene-coated-Cu composite sinter paste in high-temperature reliability
high temperature reverse bias	In-Situ Monitoring of Package Strain During HTRB Test based on Fiber Optic Sensors
High-power operation	Online Loss Assessment for Photovoltaic Inverter in High-Power Range: A Coupled Linear Temperature-Rise Model
High-Temperature	In-Depth 2D FEM Analysis of Gate Cracking in SiC MOSFETs Under Repetitive Short-Circuit Conditions: Application of the Rankine Model for Crack Length Prediction
High-Temperature Gate Bias	Gate Oxide TDDB Lifetime Evaluation of SiC MOSFETs by HTGB Test Using Square Wave Voltage
Hole Redistribution Model	F2P7 Impact of OFF-State Stress on RON and VTH of 100-V GaN HEMTs Mimicking Monolithically-Integrated Half-Bridge Circuits
hole trap	Investigation of Hole Traps Causing Negative Bias Instability in GaN Metal-Oxide-Semiconductor Field-Effect Transistors
Hot-Carrier	Hot-carrier stress in n-type logic CMOS devices at temperatures down to the deep-cryogenic regime Direct Dynamic Measurement of Junction Temperature in Power Transistors
hot-carrier degradation	Hot-carrier stress in n-type logic CMOS devices at temperatures down to the deep-cryogenic regime
Hotspots	Hotspot analysis on a flexible PV mini-modules based on IBC solar cells
HS	F2P8 Aging of p-GaN gate HEMTs under hard-switching conditions
HTOL	Early-life drift mechanism investigation of 150nm GaN-on-SiC HEMT RF under accelerated DC test Long-Term Drift of a Bandgap Voltage Reference by Molding Compound Oxidation during Extended Thermal Aging
Human body model (HBM)	Power-Rail ESD Clamp Circuit With Modified Inverter Structure for Monolithic GaN-Based Integrated Circuits
humidity	Dynamic humidity testing of SiC power semiconductors
I
IGBTs	Junction-temperature measurement of an IGBT module in a sinusoidal PWM inverter with VCE(sat) including built-in voltage
Impact-Ionization	BP1 Non-destructive characterization of Breakdown Voltage measurement and Application on a 55nm SiGe HBT featuring fT/fMAX of 400GHz/500GHz
impedance analysis	Impedance spectroscopy of field-emission and resistive switching in MEMS capacitive switches
In situ TEM	In-situ TEM investigation of thermomechanical fatigue of thick copper metallizations
Instability	F2P5 Optimal Preconditional Voltages for SIC MOSFET Vth Measurement in the Aim of Temperature Measurement
Integrated features	CMOS Gate Driver with Fully Integrated Fast and Robust Gate Monitoring Solution for a Full Short-Circuit Protection of SiC Power Module
interface state	Investigation of Hole Traps Causing Negative Bias Instability in GaN Metal-Oxide-Semiconductor Field-Effect Transistors
Intermetallic Compounds in Solder Joints	Long Term Transformation Of Cu / Sn Intermetallic Compounds in Large Solder Joints
IR (infrared) thermography	Hotspot analysis on a flexible PV mini-modules based on IBC solar cells
J
jamming signal	Robustness of GaN LNAs under Ku-band jamming signal: understanding the weak point to design future robust LNAs
JEOL	JEOL (EUROPE) SAS
Junction Barrier Schottky diode	Optimal bonding of 4H-SiC parallel diodes in a single TO-247 package for improved surge current robustness: experimental investigation
Junction Temperature	Junction-temperature measurement of an IGBT module in a sinusoidal PWM inverter with VCE(sat) including built-in voltage F2P3 Failure Mechanisms of GaN HEMTs in Single Event Destructive Short-Circuit at Different VDS Voltage Levels
Junction temperature swing	A4 Reliability Optimization of Three Phase Inverter Based on Model Predictive Control
Junction-Temperature	Direct Dynamic Measurement of Junction Temperature in Power Transistors
K
Kelvin-Probe	Electrical Properties of Y2O3 for MEMS Applications
Kleindiek	Kleindiek Nanotechnik
L
La-doped	Investigation of TiO2 Seed Layer for Enhancing the Uniformity of Remanent Polarization and Time-Dependent Dielectric Breakdown in La-doped Ferroelectric HZO MFM Devices
Laser soldering	Thermally cycling-stable and highly heat-dissipative BGA packages manufactured by fluxless laser soldering: Experimental and numerical investigations
LDMOS	Direct Dynamic Measurement of Junction Temperature in Power Transistors
Leakage current	F2P1 Study of temperature-dependent breakdown in AlGaN/GaN normally-off HEMT under drain step-stress
leakage current；	CP4 Mechanism analysis and possible improvements for leak electricity failure caused by conductive silver paste bonding
LEDs	EP7 Lifetime evaluation of wire bonds in LED systems by modelling and accelerated testing
LiFePO batteries	Assessment of Thermal Management Strategies for Prismatic LiFePO4 Batteries: a Test Bench Development
Lifespan	Long-Term Drift of a Bandgap Voltage Reference by Molding Compound Oxidation during Extended Thermal Aging
lifetime modelling	F3P3 Influence of cooling conditions on estimated power cycling lifetime for the large-area substrate solder joint in power modules
Lifetime Prediction	In-Depth 2D FEM Analysis of Gate Cracking in SiC MOSFETs Under Repetitive Short-Circuit Conditions: Application of the Rankine Model for Crack Length Prediction
Light Emitting Diodes	Degradation causes of medium-power, high Color Rendering Index LEDs for indoor illumination
Lithium-ion batteries	AP3 Autoencoder-Driven State-of-Health Estimation for Lithium-Ion Batteries via Dynamic Relaxation Time Distribution Features from Electrochemical Impedance Spectroscopy
Long ageing time	Comparison of semi empirical modelling of FinFET FPGA ageing based on high stress short time with 20000 hours low stress measures
Long-term reliability	Gate Oxide TDDB Lifetime Evaluation of SiC MOSFETs by HTGB Test Using Square Wave Voltage
Loop aspect ratio	EP6 A Comprehensive 3-D FEM Based Numerical Lifetime Investigation on the Effect of Bond Wire Loop Ratio on Molded Power Electronics Assemblies
Low stress	Comparison of semi empirical modelling of FinFET FPGA ageing based on high stress short time with 20000 hours low stress measures
Low-power	Robustness of nano-electromechanical switches against the mechanical shock and vibration loads
LP-TEOS	CP1 Process-related challenges in the formation of SiO2 layers by chemical vapour deposition for MEMS applications
M
Machine learning	Data-driven Metamodels for Failure Analysis of Power Electronic Modules A3 Failure Prediction Through Testing Data Using Machine Learning Classification: A Smart Plug Top Case Study
MASER	Eurofins MASER
Mechanical shock	Robustness of nano-electromechanical switches against the mechanical shock and vibration loads
Mechanical vibration	Robustness of nano-electromechanical switches against the mechanical shock and vibration loads
MEMS	Impedance spectroscopy of field-emission and resistive switching in MEMS capacitive switches Electrical Properties of Y2O3 for MEMS Applications
MEMS accelerometer reliability	Surface wearing in MEMS accelerometer after mechanical reliability stress tests: physical and electrical characterization
MEMS sensors	Stability Enhancement of MEMS Sensors Based on Time-Frequency Interleaving Analysis
MEMS surface wearing	Surface wearing in MEMS accelerometer after mechanical reliability stress tests: physical and electrical characterization
Metamodels	Data-driven Metamodels for Failure Analysis of Power Electronic Modules
Metrology	SmarAct Metrology
Mg Doping	Field driven failure mechanism on 100V p-GaN HEMT with gate metal retraction
Microscopy	JEOL (EUROPE) SAS
MIM	Impedance spectroscopy of field-emission and resistive switching in MEMS capacitive switches Electrical Properties of Y2O3 for MEMS Applications
Mission Profile	F3P2 Influence of high frequency power cycles on SiC power module lifetime under automotive mission profile
Mixed effects models	AP2 Degradation modeling considering multiple performance parameters degradation based on mixed effects models
Model predictive control(MPC)	A4 Reliability Optimization of Three Phase Inverter Based on Model Predictive Control
Moisture dependant coefficients	Characterization of the bulk moisture diffusion in epoxy-based potting compounds for IGBT semiconductor power modules
Moisture diffusion	Characterization of the bulk moisture diffusion in epoxy-based potting compounds for IGBT semiconductor power modules
Mold Compound	Long-Term Drift of a Bandgap Voltage Reference by Molding Compound Oxidation during Extended Thermal Aging
Molded assembly	EP6 A Comprehensive 3-D FEM Based Numerical Lifetime Investigation on the Effect of Bond Wire Loop Ratio on Molded Power Electronics Assemblies
MOSFET	10 kW Inverter with Vertical-GaN Trench MOSFETs and Its Operation Instability Related to MOS Interface Investigation of Hole Traps Causing Negative Bias Instability in GaN Metal-Oxide-Semiconductor Field-Effect Transistors F2P6 Dynamic Gate Stress: Impact of Duty Cycle and Gate Resistance on Automotive Grade Planar-Gate 1200 V SiC MOSFET
multi-level cell	Toward Stable FeFET Multi-Level Cell Operations Using Novel Weight Freezing Methodology with Recovery Cycling Scheme for Neuromorphic Applications
Multiple performance parameters degradation	AP2 Degradation modeling considering multiple performance parameters degradation based on mixed effects models
N
Nanoelectromechanical relay	Robustness of nano-electromechanical switches against the mechanical shock and vibration loads
Nanotechnik	Kleindiek Nanotechnik
near-interface trap	Investigation of Hole Traps Causing Negative Bias Instability in GaN Metal-Oxide-Semiconductor Field-Effect Transistors
negative bias instability	Investigation of Hole Traps Causing Negative Bias Instability in GaN Metal-Oxide-Semiconductor Field-Effect Transistors
Neuromorphic	Toward Stable FeFET Multi-Level Cell Operations Using Novel Weight Freezing Methodology with Recovery Cycling Scheme for Neuromorphic Applications
neutron irradiation	Analyzing Cache Utilization for Improved System Reliability
NF50	Robustness of GaN LNAs under Ku-band jamming signal: understanding the weak point to design future robust LNAs
Noise Figure	Robustness of GaN LNAs under Ku-band jamming signal: understanding the weak point to design future robust LNAs
Non-volatile memory	Robustness of nano-electromechanical switches against the mechanical shock and vibration loads
Normally-OFF	F2P1 Study of temperature-dependent breakdown in AlGaN/GaN normally-off HEMT under drain step-stress F2P3 Failure Mechanisms of GaN HEMTs in Single Event Destructive Short-Circuit at Different VDS Voltage Levels
O
Off-state degradation	F2P1 Study of temperature-dependent breakdown in AlGaN/GaN normally-off HEMT under drain step-stress
ON resistance	Variation of Dynamic ON-Resistance in SiC and p-GaN HEMTs During DHTOL Operation
Online loss evaluation	Online Loss Assessment for Photovoltaic Inverter in High-Power Range: A Coupled Linear Temperature-Rise Model
open-set recognition	Bidirectional 1D-CNN Model Based Failure Current Classification with open-set recognition
Optical	Opsens Solutions Seiwa Optical Europe GmbH
Oxidation	Long-Term Drift of a Bandgap Voltage Reference by Molding Compound Oxidation during Extended Thermal Aging
Oxidation resistance	Microstructural analysis of the Ag/graphene-coated-Cu composite sinter paste in high-temperature reliability
P
p-GaN	F2P1 Study of temperature-dependent breakdown in AlGaN/GaN normally-off HEMT under drain step-stress F2P8 Aging of p-GaN gate HEMTs under hard-switching conditions
p-GaN HEMT	Field driven failure mechanism on 100V p-GaN HEMT with gate metal retraction
p-GaN HEMTs	F2P7 Impact of OFF-State Stress on RON and VTH of 100-V GaN HEMTs Mimicking Monolithically-Integrated Half-Bridge Circuits
package strain	In-Situ Monitoring of Package Strain During HTRB Test based on Fiber Optic Sensors
Packaging	Reliability tests of an atom chip for quantum gravimetry
parameters drift	Analysis of robustness of 650 V GaN HEMT under repetitive short-circuits
Parasitics identification	Inductance and capacitance parasitic prediction thanks to data analysis applied to SiC MOSFET wide frequency band characterization
Passivation	CP5 Top and cross-sectional Failure Analysis investigations by AFM, FIB and SEM: elucidation of an unwanted layer growth in integrated microelectronic chip
Passivation Layer Defect	CP2 Case Analysis and Research on the Failure of Chip Passivation Layer Defects under the Comprehensive External Environmental Stresses
PE-TEOS	CP1 Process-related challenges in the formation of SiO2 layers by chemical vapour deposition for MEMS applications
performance characteristics	Reliability Assessment of Systems with Multiple Performance Characteristic by Fusing Random Effects Wiener Processes with R-vine Copula
performance degradation	F3-2 Dynamic and Static Degradation Characteristic Analysis and Control Optimization of Three-Phase Inverters Considering Physics of Failure
permanent degradation	Permanent degradation of p-GaN HEMTs due to repetitive overvoltage stress during hard turn-off switching
Photovoltaic inverter	Online Loss Assessment for Photovoltaic Inverter in High-Power Range: A Coupled Linear Temperature-Rise Model
PiN diode	Effect of the Load Inductor on the Avalanche Ruggedness of 1200-Volt Silicon Diodes during Unclamped Inductive Switching
plateau voltage	A New Online Monitoring Method to Detect Thermal Resistance via Turbo Sampling of Plateau Voltage
PMOS dosimeter	I2P1 Space Flight Demonstration of Enhanced Low Dose Rate Sensitivity Effect on devices
Post mold cure(PMC) process	EP4 High temperature environment reliability of in-air Cu sintered and transfer molded TO-247-3L packages for automotive applications
Power application	Characterization of the bulk moisture diffusion in epoxy-based potting compounds for IGBT semiconductor power modules
Power Cycling	Application-representative high-frequency power cycling of SiC power modules used in inverters and rectifiers A New Online Monitoring Method to Detect Thermal Resistance via Turbo Sampling of Plateau Voltage Modeling and measurement of high frequency temperature variation of GaN transistors for inverter and rectifier applications F3P3 Influence of cooling conditions on estimated power cycling lifetime for the large-area substrate solder joint in power modules F3P2 Influence of high frequency power cycles on SiC power module lifetime under automotive mission profile F2P4 A Novel Digital Twin Collaborative Power Cycling Test Method for SiC MOSFETs F2P2 Transient junction temperature measurement error of SiC MOSFETs in power cycling – Influence of gate voltage
Power Cycling Test	Experimental Demonstration of Power Cycling Sensors Integrated into a Power Device Chip Influencing Factors on the Dynamic VSD Behaviour of different SiC-MOSFET Technologies used for Temperature Read-Out via VSD(T)-Method during the Power Cycling Test
Power device	10 kW Inverter with Vertical-GaN Trench MOSFETs and Its Operation Instability Related to MOS Interface
Power electronic modules	Data-driven Metamodels for Failure Analysis of Power Electronic Modules
power electronics	Permanent degradation of p-GaN HEMTs due to repetitive overvoltage stress during hard turn-off switching
Power inverters	EP5 Thermal stability of direct cooling structures for power electronics using instantaneous laser soldering: CFD cooling performance verification with and without void
Power loss distribution	Online Loss Assessment for Photovoltaic Inverter in High-Power Range: A Coupled Linear Temperature-Rise Model
Power module	EP3 Thermo-mechanical reliability of transfer molded TO-247-3L packages with Ag nanoporous sheet bonding
Power Modules in High Temperature Storage Test	Long Term Transformation Of Cu / Sn Intermetallic Compounds in Large Solder Joints
Power MOSFET	Characterization Methods for Evaluating Charge Carrier Trapping Mechanisms of SiC Power MOSFETs
power semiconductor	In-Situ Monitoring of Package Strain During HTRB Test based on Fiber Optic Sensors Optimal bonding of 4H-SiC parallel diodes in a single TO-247 package for improved surge current robustness: experimental investigation
power-on speed	Analysis for an DA converter power up failure induced by process fluctuation
Power-rail ESD clamp circuit	Power-Rail ESD Clamp Circuit With Modified Inverter Structure for Monolithic GaN-Based Integrated Circuits
Preconditionning	F2P5 Optimal Preconditional Voltages for SIC MOSFET Vth Measurement in the Aim of Temperature Measurement
Pulsed Stress	BP2 Thermal and Ageing Characterizations of 55nm SiGe HBT
pulsed X-rays	Evaluating Pulsed X-ray-Induced Single-Event Effects in Deeply Buried Layers of 3D NAND Flash Memories
PV string	AP1 A Bi-LSTM-Based Digital Twin Model for Photovoltaic Strings Under Current Mismatch Condition
PWM Inverters	Junction-temperature measurement of an IGBT module in a sinusoidal PWM inverter with VCE(sat) including built-in voltage
Q
Quantum gravimetry	Reliability tests of an atom chip for quantum gravimetry
R
Radiation hard	Robustness of nano-electromechanical switches against the mechanical shock and vibration loads
Radiation test	Soft Error Reliability Prediction of SRAM-based FPGA Designs
Rainflow Counting	F3P2 Influence of high frequency power cycles on SiC power module lifetime under automotive mission profile
RDSON	F2P5 Optimal Preconditional Voltages for SIC MOSFET Vth Measurement in the Aim of Temperature Measurement
Recovery	Long-Term Drift of a Bandgap Voltage Reference by Molding Compound Oxidation during Extended Thermal Aging
reduced order models	F3P3 Influence of cooling conditions on estimated power cycling lifetime for the large-area substrate solder joint in power modules
Reliability	Soft Error Reliability Prediction of SRAM-based FPGA Designs Data-driven Metamodels for Failure Analysis of Power Electronic Modules Toward Stable FeFET Multi-Level Cell Operations Using Novel Weight Freezing Methodology with Recovery Cycling Scheme for Neuromorphic Applications Application-representative high-frequency power cycling of SiC power modules used in inverters and rectifiers Early-life drift mechanism investigation of 150nm GaN-on-SiC HEMT RF under accelerated DC test On the self-actuation reliability issue in high-power RF MEMS Robustness of nano-electromechanical switches against the mechanical shock and vibration loads Degradation causes of medium-power, high Color Rendering Index LEDs for indoor illumination Permanent degradation of p-GaN HEMTs due to repetitive overvoltage stress during hard turn-off switching Dynamic humidity testing of SiC power semiconductors Wire bonding technology : thermomechanical stresses characterisation and modelling F2P6 Dynamic Gate Stress: Impact of Duty Cycle and Gate Resistance on Automotive Grade Planar-Gate 1200 V SiC MOSFET EP7 Lifetime evaluation of wire bonds in LED systems by modelling and accelerated testing EP1 Standardized Test Method for Pure Bending Evaluation of Foldable Display Materials Under Natural-Arc Folding Investigation of RF Stress on the Characteristics of GaN-on-Si HEMTs
Reliability	SAFETY in cars Reliability aspects of novel device architectures Reliability tests of an atom chip for quantum gravimetry
Reliability Assessment	Reliability Assessment of Systems with Multiple Performance Characteristic by Fusing Random Effects Wiener Processes with R-vine Copula
Reliability optimization	A4 Reliability Optimization of Three Phase Inverter Based on Model Predictive Control
resistive switch	Impedance spectroscopy of field-emission and resistive switching in MEMS capacitive switches
RF MEMS	On the self-actuation reliability issue in high-power RF MEMS
RF step-stress	Robustness of GaN LNAs under Ku-band jamming signal: understanding the weak point to design future robust LNAs
RF Stress	Investigation of RF Stress on the Characteristics of GaN-on-Si HEMTs
Ring Oscillator	Comparison of semi empirical modelling of FinFET FPGA ageing based on high stress short time with 20000 hours low stress measures
robust LNA	Robustness of GaN LNAs under Ku-band jamming signal: understanding the weak point to design future robust LNAs
Robustness	CMOS Gate Driver with Fully Integrated Fast and Robust Gate Monitoring Solution for a Full Short-Circuit Protection of SiC Power Module Analysis of robustness of 650 V GaN HEMT under repetitive short-circuits F2P3 Failure Mechanisms of GaN HEMTs in Single Event Destructive Short-Circuit at Different VDS Voltage Levels
S
S-parameters	Robustness of GaN LNAs under Ku-band jamming signal: understanding the weak point to design future robust LNAs Inductance and capacitance parasitic prediction thanks to data analysis applied to SiC MOSFET wide frequency band characterization
SAC305	EP2 Microstructural and Reliability Analysis of SAC305/Sn-57Bi-1Ag Composite Solder Joints with Different Printing Aspect Ratios
Safety	SAFETY in cars
scanning acoustic microscopy	From AI-powered Image Classification to GenAI: Possibilities for Modern Image-based Failure Analysis
scanning electron microscope(SEM)	EP4 High temperature environment reliability of in-air Cu sintered and transfer molded TO-247-3L packages for automotive applications
Sector	Sector Technologies
Seiwa	Seiwa Optical Europe GmbH
Self Actuation	On the self-actuation reliability issue in high-power RF MEMS
Self heating	On the self-actuation reliability issue in high-power RF MEMS
Self-Heating	Direct Dynamic Measurement of Junction Temperature in Power Transistors BP2 Thermal and Ageing Characterizations of 55nm SiGe HBT
SEM	CP5 Top and cross-sectional Failure Analysis investigations by AFM, FIB and SEM: elucidation of an unwanted layer growth in integrated microelectronic chip
semiconductor	Dynamic humidity testing of SiC power semiconductors
semiconductor device reliability	Effect of the Load Inductor on the Avalanche Ruggedness of 1200-Volt Silicon Diodes during Unclamped Inductive Switching
semiconductor device testing	Effect of the Load Inductor on the Avalanche Ruggedness of 1200-Volt Silicon Diodes during Unclamped Inductive Switching
semiconductor reliability	In-Situ Monitoring of Package Strain During HTRB Test based on Fiber Optic Sensors
Sensing	Opsens Solutions
Sensor	Experimental Demonstration of Power Cycling Sensors Integrated into a Power Device Chip
Short Circuit Detection	CMOS Gate Driver with Fully Integrated Fast and Robust Gate Monitoring Solution for a Full Short-Circuit Protection of SiC Power Module
Short-Circuit	Analysis of robustness of 650 V GaN HEMT under repetitive short-circuits F2P3 Failure Mechanisms of GaN HEMTs in Single Event Destructive Short-Circuit at Different VDS Voltage Levels
Short-Circuit (SC)	In-Depth 2D FEM Analysis of Gate Cracking in SiC MOSFETs Under Repetitive Short-Circuit Conditions: Application of the Rankine Model for Crack Length Prediction
Si direct bonding	Real-time detection of fracture mode at the direct bonded Chevron-notch Si chip via acoustic emission
SiC	Dynamic humidity testing of SiC power semiconductors
SiC	Characterization Methods for Evaluating Charge Carrier Trapping Mechanisms of SiC Power MOSFETs
SiC MOSFET	CMOS Gate Driver with Fully Integrated Fast and Robust Gate Monitoring Solution for a Full Short-Circuit Protection of SiC Power Module Inductance and capacitance parasitic prediction thanks to data analysis applied to SiC MOSFET wide frequency band characterization Gate Oxide TDDB Lifetime Evaluation of SiC MOSFETs by HTGB Test Using Square Wave Voltage In-Depth 2D FEM Analysis of Gate Cracking in SiC MOSFETs Under Repetitive Short-Circuit Conditions: Application of the Rankine Model for Crack Length Prediction F3P2 Influence of high frequency power cycles on SiC power module lifetime under automotive mission profile F2P5 Optimal Preconditional Voltages for SIC MOSFET Vth Measurement in the Aim of Temperature Measurement F2P4 A Novel Digital Twin Collaborative Power Cycling Test Method for SiC MOSFETs
SiC power module	F3P2 Influence of high frequency power cycles on SiC power module lifetime under automotive mission profile
SiC Power Modules	Application-representative high-frequency power cycling of SiC power modules used in inverters and rectifiers
SiC-MOSFET Technologies	Influencing Factors on the Dynamic VSD Behaviour of different SiC-MOSFET Technologies used for Temperature Read-Out via VSD(T)-Method during the Power Cycling Test
SiGe HBT	BP2 Thermal and Ageing Characterizations of 55nm SiGe HBT
SiGe HBTs	Study of Electrical and X-ray induced degradation in BiCMOS 55-nm SiGe:C Heterojunction Bipolar Transistors
Silicon Carbide	Variation of Dynamic ON-Resistance in SiC and p-GaN HEMTs During DHTOL Operation F2P2 Transient junction temperature measurement error of SiC MOSFETs in power cycling – Influence of gate voltage F2P6 Dynamic Gate Stress: Impact of Duty Cycle and Gate Resistance on Automotive Grade Planar-Gate 1200 V SiC MOSFET
Silicon Nitride	CP5 Top and cross-sectional Failure Analysis investigations by AFM, FIB and SEM: elucidation of an unwanted layer growth in integrated microelectronic chip
silver paste；	CP4 Mechanism analysis and possible improvements for leak electricity failure caused by conductive silver paste bonding
Single Event Effect	Evaluating Pulsed X-ray-Induced Single-Event Effects in Deeply Buried Layers of 3D NAND Flash Memories
Single Event Upset	Soft Error Reliability Prediction of SRAM-based FPGA Designs
Sintering	Microstructural analysis of the Ag/graphene-coated-Cu composite sinter paste in high-temperature reliability
SmarAct	SmarAct Metrology
Smart spark plugs	A3 Failure Prediction Through Testing Data Using Machine Learning Classification: A Smart Plug Top Case Study
SMD Tantalum Capacitors	Reliability Assessment of SMD Tantalum Capacitors for Active Implantable Medical Devices: A Methodology Based on ALT and DoE
Sn-Bi	EP2 Microstructural and Reliability Analysis of SAC305/Sn-57Bi-1Ag Composite Solder Joints with Different Printing Aspect Ratios
SOA	BP1 Non-destructive characterization of Breakdown Voltage measurement and Application on a 55nm SiGe HBT featuring fT/fMAX of 400GHz/500GHz
sodium	BP3 Sodium in amorphous and crystalline Ta2O5
soft errors	Analyzing Cache Utilization for Improved System Reliability
Software Defined Vehicle	SAFETY in cars
SOI-BiCMOS	Long-Term Drift of a Bandgap Voltage Reference by Molding Compound Oxidation during Extended Thermal Aging
Solder Crack	Experimental Demonstration of Power Cycling Sensors Integrated into a Power Device Chip
Solid State Lighting	Degradation causes of medium-power, high Color Rendering Index LEDs for indoor illumination
Solutions	Opsens Solutions Kleindiek Nanotechnik SmarAct Metrology
sources manufacture	Excillum
Space Applications	Soft Error Reliability Prediction of SRAM-based FPGA Designs
Space Flight Demonstration	I2P1 Space Flight Demonstration of Enhanced Low Dose Rate Sensitivity Effect on devices
Speed	CMOS Gate Driver with Fully Integrated Fast and Robust Gate Monitoring Solution for a Full Short-Circuit Protection of SiC Power Module
SRAM-FPGA	Soft Error Reliability Prediction of SRAM-based FPGA Designs
stability enhancement	Stability Enhancement of MEMS Sensors Based on Time-Frequency Interleaving Analysis
State of Health estimation	AP3 Autoencoder-Driven State-of-Health Estimation for Lithium-Ion Batteries via Dynamic Relaxation Time Distribution Features from Electrochemical Impedance Spectroscopy
STEM	CP3 Large STEM lamella optimisation in a dual beam on HEMT GaN technologies for reliability assessment
Step-stress	F2P1 Study of temperature-dependent breakdown in AlGaN/GaN normally-off HEMT under drain step-stress
Step-stress test	Characterization of the bulk moisture diffusion in epoxy-based potting compounds for IGBT semiconductor power modules
substrate solder lifetime model	F3P3 Influence of cooling conditions on estimated power cycling lifetime for the large-area substrate solder joint in power modules
surge current	Optimal bonding of 4H-SiC parallel diodes in a single TO-247 package for improved surge current robustness: experimental investigation
System level ESD	Frequency Model Investigation for ESD failure prediction
T
Ta2O5	BP3 Sodium in amorphous and crystalline Ta2O5
Technologies	Sector Technologies
TEM	Surface wearing in MEMS accelerometer after mechanical reliability stress tests: physical and electrical characterization
Temperature measurement	F2P2 Transient junction temperature measurement error of SiC MOSFETs in power cycling – Influence of gate voltage
Temperature Read-Out via VSD(T)-Method	Influencing Factors on the Dynamic VSD Behaviour of different SiC-MOSFET Technologies used for Temperature Read-Out via VSD(T)-Method during the Power Cycling Test
Temperature variation	Modeling and measurement of high frequency temperature variation of GaN transistors for inverter and rectifier applications
Temperature-dependent breakdown	F2P1 Study of temperature-dependent breakdown in AlGaN/GaN normally-off HEMT under drain step-stress
Test Bench	F2P8 Aging of p-GaN gate HEMTs under hard-switching conditions
test methods	EP1 Standardized Test Method for Pure Bending Evaluation of Foldable Display Materials Under Natural-Arc Folding
thermal aging	EP4 High temperature environment reliability of in-air Cu sintered and transfer molded TO-247-3L packages for automotive applications
Thermal Characterization	BP2 Thermal and Ageing Characterizations of 55nm SiGe HBT
Thermal Characterization of Solder Defects	Long Term Transformation Of Cu / Sn Intermetallic Compounds in Large Solder Joints
Thermal Impedance	F3P2 Influence of high frequency power cycles on SiC power module lifetime under automotive mission profile
Thermal management	Assessment of Thermal Management Strategies for Prismatic LiFePO4 Batteries: a Test Bench Development
Thermal Model	Modeling and measurement of high frequency temperature variation of GaN transistors for inverter and rectifier applications
Thermal Network	BP2 Thermal and Ageing Characterizations of 55nm SiGe HBT
thermal reliability	Thermally cycling-stable and highly heat-dissipative BGA packages manufactured by fluxless laser soldering: Experimental and numerical investigations
Thermal Reliability of Solder Joints	Long Term Transformation Of Cu / Sn Intermetallic Compounds in Large Solder Joints
thermal resistance	A New Online Monitoring Method to Detect Thermal Resistance via Turbo Sampling of Plateau Voltage
Thermal shock test	EP5 Thermal stability of direct cooling structures for power electronics using instantaneous laser soldering: CFD cooling performance verification with and without void EP2 Microstructural and Reliability Analysis of SAC305/Sn-57Bi-1Ag Composite Solder Joints with Different Printing Aspect Ratios
thermal structure function	A New Online Monitoring Method to Detect Thermal Resistance via Turbo Sampling of Plateau Voltage
Thermally Stimulated Depolarization Current	Electrical Properties of Y2O3 for MEMS Applications
Thermo-mechanical reliability	EP3 Thermo-mechanical reliability of transfer molded TO-247-3L packages with Ag nanoporous sheet bonding
Thermoelectrical model	F3P2 Influence of high frequency power cycles on SiC power module lifetime under automotive mission profile
Thermoelectrical modeling	Application-representative high-frequency power cycling of SiC power modules used in inverters and rectifiers
Thermomechanical fatigue	In-situ TEM investigation of thermomechanical fatigue of thick copper metallizations
thermomechanical stress	Wire bonding technology : thermomechanical stresses characterisation and modelling
Three phase inverter	A4 Reliability Optimization of Three Phase Inverter Based on Model Predictive Control
three-phase inverter	F3-2 Dynamic and Static Degradation Characteristic Analysis and Control Optimization of Three-Phase Inverters Considering Physics of Failure
Threshold voltage	F2P5 Optimal Preconditional Voltages for SIC MOSFET Vth Measurement in the Aim of Temperature Measurement
time-frequency interleaving analysis	Stability Enhancement of MEMS Sensors Based on Time-Frequency Interleaving Analysis
TiO2 Seed Layer	Investigation of TiO2 Seed Layer for Enhancing the Uniformity of Remanent Polarization and Time-Dependent Dielectric Breakdown in La-doped Ferroelectric HZO MFM Devices
TO-247 modeling	Inductance and capacitance parasitic prediction thanks to data analysis applied to SiC MOSFET wide frequency band characterization
TO-247 package	Optimal bonding of 4H-SiC parallel diodes in a single TO-247 package for improved surge current robustness: experimental investigation
Trans-Impedance-Amplifier	Direct Dynamic Measurement of Junction Temperature in Power Transistors
transient simulation	Frequency Model Investigation for ESD failure prediction
Transistor	CP2 Case Analysis and Research on the Failure of Chip Passivation Layer Defects under the Comprehensive External Environmental Stresses
Transmission line pulse system (TLP)	Power-Rail ESD Clamp Circuit With Modified Inverter Structure for Monolithic GaN-Based Integrated Circuits
Transmission-Line Pulse	Frequency Model Investigation for ESD failure prediction
TSEP	F2P5 Optimal Preconditional Voltages for SIC MOSFET Vth Measurement in the Aim of Temperature Measurement
turbo samling	A New Online Monitoring Method to Detect Thermal Resistance via Turbo Sampling of Plateau Voltage
TVS	BP3 Sodium in amorphous and crystalline Ta2O5
U
UIS3	Permanent degradation of p-GaN HEMTs due to repetitive overvoltage stress during hard turn-off switching
unclamped inductive switching	Effect of the Load Inductor on the Avalanche Ruggedness of 1200-Volt Silicon Diodes during Unclamped Inductive Switching
V
vds peak	Permanent degradation of p-GaN HEMTs due to repetitive overvoltage stress during hard turn-off switching
vertical	10 kW Inverter with Vertical-GaN Trench MOSFETs and Its Operation Instability Related to MOS Interface
Vine Copula	Reliability Assessment of Systems with Multiple Performance Characteristic by Fusing Random Effects Wiener Processes with R-vine Copula
voltage	CP1 Process-related challenges in the formation of SiO2 layers by chemical vapour deposition for MEMS applications
Vsd(T) method	F2P2 Transient junction temperature measurement error of SiC MOSFETs in power cycling – Influence of gate voltage
VTH	F2P5 Optimal Preconditional Voltages for SIC MOSFET Vth Measurement in the Aim of Temperature Measurement
VTH Drift	F2P7 Impact of OFF-State Stress on RON and VTH of 100-V GaN HEMTs Mimicking Monolithically-Integrated Half-Bridge Circuits
W
Warpage	Long-Term Drift of a Bandgap Voltage Reference by Molding Compound Oxidation during Extended Thermal Aging
Weibull distribution	F2P1 Study of temperature-dependent breakdown in AlGaN/GaN normally-off HEMT under drain step-stress
Whole-chip ESD protection	Power-Rail ESD Clamp Circuit With Modified Inverter Structure for Monolithic GaN-Based Integrated Circuits
Wide frequency bandwidth behavior	Inductance and capacitance parasitic prediction thanks to data analysis applied to SiC MOSFET wide frequency band characterization
Wiener Processes	Reliability Assessment of Systems with Multiple Performance Characteristic by Fusing Random Effects Wiener Processes with R-vine Copula
Wire bonding	Wire bonding technology : thermomechanical stresses characterisation and modelling
wire bonds	EP7 Lifetime evaluation of wire bonds in LED systems by modelling and accelerated testing
X
X-ray	Excillum
X-ray irradiation	Study of Electrical and X-ray induced degradation in BiCMOS 55-nm SiGe:C Heterojunction Bipolar Transistors
Y
Y2O3	Impedance spectroscopy of field-emission and resistive switching in MEMS capacitive switches
Yttrium Oxide	Electrical Properties of Y2O3 for MEMS Applications