ESREF2025: ESREF 2025 : 36TH EUROPEAN SYMPOSIUM ON RELIABILITY OF ELECTRON DEVICES, FAILURE PHYSICS AND ANALYSIS
Amphitheatre Jean Touton

190 places

Sessions

  • Session opening (Oct 06 13:30-13:50) Opening session
  • Session KN (Oct 06 13:50-14:30) Keynote
  • Session BPA (Oct 06 14:30-15:30) Best papers sister conferences
  • Session T1 (Oct 06 15:50-17:20) Tutorial
  • Session F2-1 (Oct 07 08:30-10:30) F2-1 - Power Devices and Microelectronic System: Reliability and Failure Analysis - F2-1 SiC Reliability
  • Session D (Oct 07 10:50-12:10) D - Reliability of Microwave devices and circuits
  • Session C-IP (Oct 07 13:50-14:30) C - Progress in Failure Analysis: Defect Detection and Analysis
  • Session E2 (Oct 07 14:30-16:10) E2 - Packaging and Assembly : Reliability and Failure Analysis - Long-term Reliability and Harsh Conditions
  • Session A (Oct 08 08:30-10:30) A - Quality and Reliability assessment techniques and methods for Devices and Systems
  • Session F2-2 (Oct 08 10:50-12:10) F2-2 - Power Devices and Microelectronic System: Reliability and Failure Analysis - F2-2 GaN Reliability
  • Session E1 (Oct 08 13:50-15:50) E1 - Packaging and Assembly : Reliability and Failure Analysis - Thermo-mechanical reliability and microstructural analysis
  • Session F2-3 (Oct 08 16:10-17:30) F2-3 - Power Devices and Microelectronic System: Reliability and Failure Analysis - F2-3 SiC and GaN Reliability
  • Session F1 (Oct 09 08:30-10:30) F1 - Power Devices and Microelectronic System: Reliability and Failure Analysis - F1 - Smart-power devices, IGBT, thyristors - Thermal & electrical characterization of power transistors
  • Session F3 (Oct 09 10:50-12:30) F3 - Power Devices and Microelectronic System: Reliability and Failure Analysis - F3 - Power Electronic System
  • Session closing (Oct 09 12:30-13:10) Closing session and Best paper awards