ESREF 2024: 35TH EUROPEAN SYMPOSIUM ON RELIABILITY OF ELECTRON DEVICES, FAILURE PHYSICS AND ANALYSIS

This page contains an index consisting of author-provided keywords.

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- Cryogenic temperature	Issues of electronic devices in hostile environment
- Hostile Environment	Issues of electronic devices in hostile environment
- Reliability	Issues of electronic devices in hostile environment
1
1S1R	Reading reliability in 1S1R OTS+PCM devices based on Double Patterned Self Aligned structure
2
2-DEG	Effect of Drain Field Plate design and 2DEG density on Dynamic-RON of 650V AlGaN/GaN HEMTs
2D dopant characterization	Improved 2D charge carrier quantification workflow for scanning spreading resistance microscopy
2DEG pinch-off	Low-Voltage Schottky p-GaN HEMT Properties under Extreme Repetitive Short-Circuit Operation Conditions : 2DEG Pinch-off, Stability, Aging, Robustness and Failure-Modes Analysis
3
3D integration	Localization enhancement in quantitative thermal lock-in analysis using spatial phase evaluation
3D reconstruction	Semi-supervised parameter estimation for Synthetic Aperture Focusing in Scanning Acoustic Microscopy for a 3D reconstruction of plastic molded electronic devices Fast Reverse Engineering of Chips using Lasers, Focused Ion Beams, and Confocal and Scanning Electron Microscopy System in package: Advanced FA Techniques to Minimize Analysis Time and Cost
3D X-ray	System in package: Advanced FA Techniques to Minimize Analysis Time and Cost
3D-MIM capacitors	Electrical and reliability characterization with optimized extrapolation models of two- and three-dimensional Metal-Insulator-Metal decoupling capacitors with ZrAlxOy high-κ dielectric under BEoL-friendly conditions
4
4H-SiC MOSFETs	Single Event Irradiation Damage Effect of SiC MOSFETs Based on Degradation of Forward Conduction Characteristic
6
60Co gamma rays source	The Use of Filtered High-Energy X-rays and 60Co for TID Testing of a 32-Bit 28nm FDSOI DSP
A
a stability analysis method based on time domain	A Floquet Theory-Based Stability Analysis Method for PV-Storage Independent DC Microgrid
AC Stress	Enhancing AC Degradation Modeling by Considering the Degradation Profile in SiON pMOSFETs
AC-DC flyback converter	Toward understanding the impacts of dynamic Ron on the efficiency in GaN-based AC-DC flyback converter
Accelerated Aging	Performance characterization of lithium-ion battery and ageing under constant stress conditions at low temperature PBO Delamination and RDL Corrosion detection on WLCSP Package Products
Accelerated aging tests	Aging modelling of Li-Ion Battery Systems based on accelerated tests
Accelerated degradation test	Degradation model for insulation characteristics of tantalum capacitors related to manufacturing parameters and stress
Accelerated Life Tests	Design-of-Experiments and ALT plan for reliability qualification of chip resistors based on mission profile of AIMDs
Accelerated mechanical fatigue interconnection test	Crack propagation in ultrasonic-bonded copper wires investigated by power cycling and accelerated mechanical fatigue interconnection test methods
Accelerated step-stress test	Efficient Long-term Reliability Assessment of Planar InGaAs/InP Avalanche Photodiodes using Accelerated Step-Stress Test
accelerated testing	Lifetime model for wire bond degradation in power semiconductors based on accelerated mechanical testing and power cycling
Active Balancing	Impact of Constant and Pulsed Active Balancing Current Patterns on the Aging of Lithium-ion Batteries
Active Gate Driver	Active Gate Driver for Current Overshoot Suppression of SiC+Si Hybrid Switches with Dynamic gate Current Regulation
Active Implantable Medical Devices	Design-of-Experiments and ALT plan for reliability qualification of chip resistors based on mission profile of AIMDs
Active Power Cycling	Degradation mode analysis of Cu bond wires on Cu plated SiC power semiconductors stressed by active power cycling
Additive manufacturing	FEM-based development of novel 3D-printable plastic direct coolers for power semiconductor modules
Advanced Methodology	(Invited) Advanced Methodology and Understanding of GaN Device Reliability
advanced packaging	Fast high-resolution X-ray nano tomography for failure analysis in advanced packaging (Invited) Physical Assurance for Advanced Packaging
advanced test strategys	Advanced Power Cycling Test Strategies on Discrete SiC MOSFETs in Different Operating Modes and the Impact on Life-time
Aero-electrical	Reliability detection and analysis of elliptical holes corresponding to defects in electrothermal environment
AFM resiscope	Aging impact of the SiC Mosfet gate dielectric
Ag porous sheet bonding	Risk of CuxO phase penetration between the Ag plating layer and Cu during high-temperature reliability testing of interfaces bonded to cold sintered Ag nano-porous sheets on direct Ag-plated Cu substrates
Ageing indicator	New Temperature-Independent Aging Indicator for power semiconductor devices – application to IGBTs
Aging	Conducted EMI Assessment of Aging Power Si-MOSFET in 3 phase inverter Impact of Constant and Pulsed Active Balancing Current Patterns on the Aging of Lithium-ion Batteries Low-Voltage Schottky p-GaN HEMT Properties under Extreme Repetitive Short-Circuit Operation Conditions : 2DEG Pinch-off, Stability, Aging, Robustness and Failure-Modes Analysis
Aging test	DC and RF aging test of AlGaN/GaN HEMT technology on SiC substrate
Al2O3	Charging effects in alumina layers deposited with different precursors for microelectronic applications
AlGaN	Study of Trapping Mechanisms Affecting AlGaN/GaN HEMTs adopting AlGaN Back-Barriers with Different Aluminum Concentrations
AlN-AMB	Heat-resistant durability of AMB substrates for SiC power devices: AlN and Si3N4, which one is thermally strong?
AlN/GaN	Nonlinear modelling of AlN/GaN HEMT accounting for Self-biasing effect during RF step stress: analysis and Hard-SOA
Aluminium melting	Preliminary SiC MOSFET Gate-Cracking Modeling under Short-Circuit Based on Rankine's Damage Energetic Approach Using a Wide Temperature-Range Elastoplastic 2D Simulation
Artificial intelligence	AI-assisted reliability testing, modeling, and condition monitoring for power electronics applications
Assembly and Interconnection Technology	Degradation mode analysis of Cu bond wires on Cu plated SiC power semiconductors stressed by active power cycling
Assembly reliability	Assembly reliability of ceramic small outline packaged devices
Atomic layer deposition	Charging effects in alumina layers deposited with different precursors for microelectronic applications
Automotive	(Keynote) System-Level ESD Design in HV Automotive Applications: Process, IP and System Co-Design Challenges (Keynote) Battery Diagnostics and Virtual Sensors in Ferrari (Keynote) An approach to Electronic Platform Complexity: the System Integration in Lamborghini Reliability analysis of high power LEDs for automotive: impact of current and temperature
Automotive power electronics	SMART Protection Design of Automotive Power Distribution Systems with Temperature-Based Electronic Fuses: Mathematical Background, Design Guidelines and Drawbacks of Energy-Based Methods
Avalanche photodiodes	Degradation Modeling of InGaAs/InP Avalanche Photodiodes using Calibrated Technology Computer-aided Design Efficient Long-term Reliability Assessment of Planar InGaAs/InP Avalanche Photodiodes using Accelerated Step-Stress Test
B
back-barrier	Study of Trapping Mechanisms Affecting AlGaN/GaN HEMTs adopting AlGaN Back-Barriers with Different Aluminum Concentrations
Back-Gate Bias	Synergistic Effect of Total Ionizing Dose and Electromagnetic Interference in SRAM using 22nm FDSOI technology
Batteries	(Keynote) Battery Diagnostics and Virtual Sensors in Ferrari
Battery aging	Aging modelling of Li-Ion Battery Systems based on accelerated tests
Battery cycling	Performance characterization of lithium-ion battery and ageing under constant stress conditions at low temperature
Battery modelling	Aging modelling of Li-Ion Battery Systems based on accelerated tests
BEoL	Vertically Scaled Cu/low-k Interconnect Development for BEOL Reliability Improvement of 12nm DRAM Electrical and reliability characterization with optimized extrapolation models of two- and three-dimensional Metal-Insulator-Metal decoupling capacitors with ZrAlxOy high-κ dielectric under BEoL-friendly conditions
Bias Temperature Instability	Threshold Voltage Hysteresis Investigation of SiC MOSFETs with Different Structures under Various Measurement Conditions Long-Term Positive and Negative Gate Bias Stress Tests on Parallel Connected SiC MOSFETs at -40°C and 175°C (IPFA 2024 Best Paper) Reliability of Reconfigurable Field Effect Transistors: Early Analysis of Bias Temperature Instability
bipolar transistor	Optimization of the drain-side configuration in ESD-protection SCR-LDMOS for high holding-voltage applications
Bit flips	C-SMART: A preprocessor for neural network performance and reliability under radiation
Blue laser radiation	Evidence for Optically-Induced Degradation in CIGS Solar Cells
Body Bias	Evaluation of the Impact of Body Bias on the Threshold Voltage Drift of SiO2 Transistors
Bond Wire Degradation Mode	Degradation mode analysis of Cu bond wires on Cu plated SiC power semiconductors stressed by active power cycling
Breakdown Voltage	A Screening Test of GaN-HEMTs for Improvement of Breakdown Voltage Uniformity
BTI	Evaluation of the Impact of Body Bias on the Threshold Voltage Drift of SiO2 Transistors Correlating time and voltage laws in BTI
C
Calibration methods	Improved 2D charge carrier quantification workflow for scanning spreading resistance microscopy
capacitance-voltage	Charging effects in alumina layers deposited with different precursors for microelectronic applications
capacitor	High AC load current testing method for power capacitors
capacitor banks	Analysis and experimental verification of current sharing among parallel-connected dc-link capacitors in a fast-switching converter
Capacitor Parameter Monitoring	A Submodule Capacitor Degradation Balancing Control with Capacitor Parameter Monitoring of a Modular Multilevel Converter for a Battery Energy Storage System
Capacitor Stress Balancing Control	A Submodule Capacitor Degradation Balancing Control with Capacitor Parameter Monitoring of a Modular Multilevel Converter for a Battery Energy Storage System
Carrots defect	HTRB effects on threshold instability of 4H-SiC PowerMOSFET with carrots defects
cascode GaN devices	Power Cycling Results of Cascode GaN Devices – Separate Analysis of Performance Degradation for Si/GaN parts and Lifetime Model Separate Investigation of Performance Degradation for the Si and GaN parts in Cascode GaN devices under Repetitive Short Circuits
Cascode GaN HEMT	Investigation of the long-term dynamic Rds(ON) variation and dynamic high temperature operating life test robustness of Schottky gate and ohmic gate GaN HEMT with comparable stress conditions
Catastrophic damage	About the influence of temperature operation and packaging stress on the threshold for catastrophic optical damage in laser diodes
Cavity temperature	About the influence of temperature operation and packaging stress on the threshold for catastrophic optical damage in laser diodes
Charge Pumping	Interface-related VTH Shift of SiC MOSFETs during Constant Current Stress extracted from Charge Pumping measurements
Chip	Fast Reverse Engineering of Chips using Lasers, Focused Ion Beams, and Confocal and Scanning Electron Microscopy
Chip resistors	Design-of-Experiments and ALT plan for reliability qualification of chip resistors based on mission profile of AIMDs
CIGS Solar Cells	Evidence for Optically-Induced Degradation in CIGS Solar Cells
Classification algorithm	Machine learning classification for failure analysis of smart spark plugs
Clustering methods	New statistical analysis methodology to forecast the memory cell behavior before reliability test
Co-design	(Keynote) System-Level ESD Design in HV Automotive Applications: Process, IP and System Co-Design Challenges
cold sinter joining	Risk of CuxO phase penetration between the Ag plating layer and Cu during high-temperature reliability testing of interfaces bonded to cold sintered Ag nano-porous sheets on direct Ag-plated Cu substrates
Collaboration	Failure investigation on an embedded Schottky Barrier Diode due to an inhomogeneous silicide formation
Collection Efficiency	Changes in the extraction and collection efficiency of GaN-based MQW solar cells under optical step-stress
Color-coded	Changes in the extraction and collection efficiency of GaN-based MQW solar cells under optical step-stress
Compact modeling	A study of UIS ruggedness of mismatched paralleled SiC MOSFETs
compression force	Failure Analysis of Gold-plated Fuzz Button Contacts in Elevated Temperature
computed tomography	Fast high-resolution X-ray nano tomography for failure analysis in advanced packaging
Condition Monitoring	AI-assisted reliability testing, modeling, and condition monitoring for power electronics applications Condition Monitoring of a DC-Link Capacitor in an Inverter with a front-end diode rectifier under Imbalanced Three-phase Supply Voltage Condition Monitoring for Detection of Humidity-Induced Failures in Control Electronics of Power Converters Aging Effects on Short-Circuit Peak Current Through Gate-oxide Degradation in SiC MOSFET
Conducted emission	A New Methodology of Modeling Conducted Emission Behavioural in System-in-Packages (SiP)
Constant Current Discharge	Impact of Constant and Pulsed Active Balancing Current Patterns on the Aging of Lithium-ion Batteries
Constant Voltage Stress	Recovery and Unrecovered Damage During Interrupted CVS in MFIS FE devices
contact characteristics	Research on The Degradation of Contact Resistance of Wire-Spring Contacts in Different Wear Condition
Copper Bond Wire	Degradation mode analysis of Cu bond wires on Cu plated SiC power semiconductors stressed by active power cycling
copper film sintering	Improving Large-Area Sintering Reliability of Power Module Systems Using Copper Paste/Film
copper wire	Thermal ageing monitoring in Cu-Al intermetallic joints through electrical resistance drift: comparative study of lifetime potential in pure and alloyed copper wires Understanding improved pitting corrosion resistance under high temperature application leading to a newly developed palladium coated copper wire
Copper-plated Silicone Carbide	Degradation mode analysis of Cu bond wires on Cu plated SiC power semiconductors stressed by active power cycling
counterfeit electronics	Electronics authentication using electrical measurements and machine learning
Crack propagation	Effect of load sequence interaction for low ∆Tj's on the reliability of bonded aluminium wires in IGBTs
creep tester	Creep tester for quality assessment of solder joints using normal and thermal stress
Crossbar array	Reading reliability in 1S1R OTS+PCM devices based on Double Patterned Self Aligned structure
Crystal plastic finite element method (CPFEM)	Evolution analysis of mechanical behavior of through‑silicon via under thermal cycling load
CSOP	Assembly reliability of ceramic small outline packaged devices
Cu bonding	On the influence of the porosity and homogeneity of sintered die-attach layers on the power cycling performance
Cu oxidation	Failure mode competition and long-term reliability in the isothermal aging of sintered Cu joints
Cu particle sintering	Failure mode competition and long-term reliability in the isothermal aging of sintered Cu joints
Current Overshoot Suppression	Active Gate Driver for Current Overshoot Suppression of SiC+Si Hybrid Switches with Dynamic gate Current Regulation
current sharing	Analysis and experimental verification of current sharing among parallel-connected dc-link capacitors in a fast-switching converter
Current Stress	Interface-related VTH Shift of SiC MOSFETs during Constant Current Stress extracted from Charge Pumping measurements
Current-crowding	Numerical simulation of current uniformity in Ga2O3 planar diodes and its effect on temperature field and device reliability
current-voltage	Charging effects in alumina layers deposited with different precursors for microelectronic applications
current-voltage characteristics	Single Event Irradiation Damage Effect of SiC MOSFETs Based on Degradation of Forward Conduction Characteristic
CuxO risk	Risk of CuxO phase penetration between the Ag plating layer and Cu during high-temperature reliability testing of interfaces bonded to cold sintered Ag nano-porous sheets on direct Ag-plated Cu substrates
D
Damage modeling	Preliminary SiC MOSFET Gate-Cracking Modeling under Short-Circuit Based on Rankine's Damage Energetic Approach Using a Wide Temperature-Range Elastoplastic 2D Simulation
Data fusion	Multi-sensor Data Fusion for Prediction of Remaining Useful Life of IGBT Power Modules
DC contactor	Remaining Useful Life Prediction of DC Contactor Based on LSTM
DC stress	Reliability and Failure Analysis of AlGaN/GaN HEMT with NiPtAu and PtAu Gate
DC system	Remaining Useful Life Prediction of DC Contactor Based on LSTM
DC-link capacitor	Condition Monitoring of a DC-Link Capacitor in an Inverter with a front-end diode rectifier under Imbalanced Three-phase Supply Voltage
DC-link capacitors	Analysis and experimental verification of current sharing among parallel-connected dc-link capacitors in a fast-switching converter
Decoupling capacitors	Electrical and reliability characterization with optimized extrapolation models of two- and three-dimensional Metal-Insulator-Metal decoupling capacitors with ZrAlxOy high-κ dielectric under BEoL-friendly conditions
deep convolutional neural networks	Series AC Arc Fault Diagnosis Method Based on Spectrogram and Deep Residual Network
deep-levels	Study of Trapping Mechanisms Affecting AlGaN/GaN HEMTs adopting AlGaN Back-Barriers with Different Aluminum Concentrations
Defect Depth Localization	Localization enhancement in quantitative thermal lock-in analysis using spatial phase evaluation
Defect ellipse holes	Reliability detection and analysis of elliptical holes corresponding to defects in electrothermal environment
Defect Generation	Recovery and Unrecovered Damage During Interrupted CVS in MFIS FE devices
defects	Charging effects in alumina layers deposited with different precursors for microelectronic applications
Degradation	Changes in the extraction and collection efficiency of GaN-based MQW solar cells under optical step-stress Degradation of SiC-MOSFETs Utilized in Bidirectional Switch for Grid Applications Under Over Current Stress
Degradation analysis	Thermal layout optimization of electrolytic capacitors considering degradation self-acceleration effect for reliability improvement
Degradation and failure	Degradation model for insulation characteristics of tantalum capacitors related to manufacturing parameters and stress
Degradation profile	Enhancing AC Degradation Modeling by Considering the Degradation Profile in SiON pMOSFETs
Degradation-sensitive parameter	Aging Effects on Short-Circuit Peak Current Through Gate-oxide Degradation in SiC MOSFET
Delay control	Peak detection for current balancing of parallel-connected SiC power devices using PCB sensors
Design Methodology	Methodology to estimate the impact of Single Event Transients in Logic
Design of Experiments	Design-of-Experiments and ALT plan for reliability qualification of chip resistors based on mission profile of AIMDs Reliability Assurance in Foldable Displays: Design of Experiment-Based Testing Strategy for Market-Ready Products
Detection	Reliability detection and analysis of elliptical holes corresponding to defects in electrothermal environment
Device Degradation Modeling	Degradation Modeling of InGaAs/InP Avalanche Photodiodes using Calibrated Technology Computer-aided Design
Device Encapsulation	Impact of Device Encapsulation on the Time-Dependent Dielectric Breakdown in Polymeric Dielectrics for Galvanic Isolation
Device numerical simulation	Numerical simulation of current uniformity in Ga2O3 planar diodes and its effect on temperature field and device reliability
Device Reliability	Impact of Device Encapsulation on the Time-Dependent Dielectric Breakdown in Polymeric Dielectrics for Galvanic Isolation
DHTOL	Investigation of the long-term dynamic Rds(ON) variation and dynamic high temperature operating life test robustness of Schottky gate and ohmic gate GaN HEMT with comparable stress conditions
Diagnosis	New Temperature-Independent Aging Indicator for power semiconductor devices – application to IGBTs
Diagnostic circuit	Machine learning classification for failure analysis of smart spark plugs
die attach	Evaluation and thermal ageing of power semiconductor die attachment based on porous film electrodeposition
Dielectric film	Evidence of resistive switching in SiNx thin films for MEMS capacitors: the role of metal contacts
dielectric films	On the electrical properties of ALD HfO2 dielectric films for MEMS capacitive switches.
diffusion	Development of Life Prediction Model based on Physics-of-Failure for Negative Temperature Coefficient Thermistor
Digital twin	Spacecraft Sensor Reliability Improvement Based On Temporal Digital Twin Model
diode rectifier	Condition Monitoring of a DC-Link Capacitor in an Inverter with a front-end diode rectifier under Imbalanced Three-phase Supply Voltage
Direct liquid cooling	FEM-based development of novel 3D-printable plastic direct coolers for power semiconductor modules
discrete device	Advanced Power Cycling Test Strategies on Discrete SiC MOSFETs in Different Operating Modes and the Impact on Life-time
Discrete Devices	Reliability of Discrete SiC MOSFETs under Temperature-Shock and Power Cycling Tests
Dose
double sided cooled modules	The impact of mold compound on power cycling capability of SiC MOSFETs in double sided cooled modules
DPI	Synergistic Effect of Total Ionizing Dose and Electromagnetic Interference in SRAM using 22nm FDSOI technology
Dynamic Rdson	Investigation of the long-term dynamic Rds(ON) variation and dynamic high temperature operating life test robustness of Schottky gate and ohmic gate GaN HEMT with comparable stress conditions
Dynamic Reverse Bias	Reliability Assessment of SiC Power MOSFETs in Dynamic Reverse Bias Test
Dynamic Ron	Toward understanding the impacts of dynamic Ron on the efficiency in GaN-based AC-DC flyback converter Impact of drain-source leakage on the dynamic Ron of power HEMTs with p-GaN gate
dynamic-RON	Effect of Drain Field Plate design and 2DEG density on Dynamic-RON of 650V AlGaN/GaN HEMTs
E
EBAC	GaN defect detection and analysis using electrical probing, EBAC, EBIC and EBIRCH
EBIC	GaN defect detection and analysis using electrical probing, EBAC, EBIC and EBIRCH
EBIRCH	GaN defect detection and analysis using electrical probing, EBAC, EBIC and EBIRCH
EBSD	Effect of load sequence interaction for low ∆Tj's on the reliability of bonded aluminium wires in IGBTs
Elasto-plasticity modeling	Preliminary SiC MOSFET Gate-Cracking Modeling under Short-Circuit Based on Rankine's Damage Energetic Approach Using a Wide Temperature-Range Elastoplastic 2D Simulation
electrical characterization	Improved 2D charge carrier quantification workflow for scanning spreading resistance microscopy On the electrical properties of ALD HfO2 dielectric films for MEMS capacitive switches. Electronics authentication using electrical measurements and machine learning Evidence of resistive switching in SiNx thin films for MEMS capacitors: the role of metal contacts
electrical connectors	Research on The Degradation of Contact Resistance of Wire-Spring Contacts in Different Wear Condition
Electrical Degradation	Evidence for Optically-Induced Degradation in CIGS Solar Cells
Electro-thermal modeling	Preliminary SiC MOSFET Gate-Cracking Modeling under Short-Circuit Based on Rankine's Damage Energetic Approach Using a Wide Temperature-Range Elastoplastic 2D Simulation
Electrochemical Migration	Condition Monitoring for Detection of Humidity-Induced Failures in Control Electronics of Power Converters
electrodeposition	Evaluation and thermal ageing of power semiconductor die attachment based on porous film electrodeposition
Electroluminescence	Hail damage investigation in heterojunction silicon photovoltaic modules: a real word case study
Electrolytic capacitor	Thermal layout optimization of electrolytic capacitors considering degradation self-acceleration effect for reliability improvement
Electromigration	Development of Life Prediction Model based on Physics-of-Failure for Negative Temperature Coefficient Thermistor
Electronic fuses	SMART Protection Design of Automotive Power Distribution Systems with Temperature-Based Electronic Fuses: Mathematical Background, Design Guidelines and Drawbacks of Energy-Based Methods
Electronic system	Reliability prediction of multi-level power supply system based on failure precursor parameters
electronics inspection	Fast high-resolution X-ray nano tomography for failure analysis in advanced packaging
Electrothermal effects	(Invited) Out-of-SOA Electrothermal Limitations of Power Semiconductor Devices: Characterization and Modeling
Electrothermal simulation	A Geometry-Scalable Electrothermal Compact Circuit Model of SiC MPS Diodes Accounting for the Snapback Mechanism: Application to Current Surge Events A study of UIS ruggedness of mismatched paralleled SiC MOSFETs
elevated temperature	Failure Analysis of Gold-plated Fuzz Button Contacts in Elevated Temperature
EMI	Conducted EMI Assessment of Aging Power Si-MOSFET in 3 phase inverter A New Methodology of Modeling Conducted Emission Behavioural in System-in-Packages (SiP)
Energy
Epitaxial layer damage	Single Event Irradiation Damage Effect of SiC MOSFETs Based on Degradation of Forward Conduction Characteristic
Epitaxy	Improved 2D charge carrier quantification workflow for scanning spreading resistance microscopy
Equipment	Reliability detection and analysis of elliptical holes corresponding to defects in electrothermal environment
ESD	(Keynote) System-Level ESD Design in HV Automotive Applications: Process, IP and System Co-Design Challenges Optimization of the drain-side configuration in ESD-protection SCR-LDMOS for high holding-voltage applications ESD Human Body Model step stress distributions of GaN HEMTs and the correlation with one level test results
ESREF	Opening ceremony
Extraction Efficiency	Changes in the extraction and collection efficiency of GaN-based MQW solar cells under optical step-stress
F
Fabrication technology	GaN reliability: from technological considerations to failure processes
failure	Analyzing the role of hole injection on the short circuit performance of p-GaN gate power HEMTs
Failure Analysis	Test Methodology for Short-Circuit Assessment Applied to Power SiC MOSFETs Reliability and Failure Analysis of AlGaN/GaN HEMT with NiPtAu and PtAu Gate Fast high-resolution X-ray nano tomography for failure analysis in advanced packaging Failure Analysis of Gold-plated Fuzz Button Contacts in Elevated Temperature Solid failure analysis flow for the detection of the leakage current in MEMS gyroscope resonant system System in package: Advanced FA Techniques to Minimize Analysis Time and Cost PBO Delamination and RDL Corrosion detection on WLCSP Package Products
Failure diagnostic	Wire bonding failure characterization of an IGBT based power module through impedance analysis
Failure indicator	Wire bonding failure characterization of an IGBT based power module through impedance analysis
Failure investigation	Machine learning classification for failure analysis of smart spark plugs
Failure Isolation	Power devices Failure Analysis Use Cases Using High voltage OBIRCh and EMMI workflows
failure mechanism	Aging impact of the SiC Mosfet gate dielectric
Failure mechanisms	GaN reliability: from technological considerations to failure processes
Failure mode	Reliability Assurance in Foldable Displays: Design of Experiment-Based Testing Strategy for Market-Ready Products Thermal Impedance and Local Thermal Runaway during Surge Events in Power Rectifiers
Failure mode competition	Failure mode competition and long-term reliability in the isothermal aging of sintered Cu joints
failure model	Research on The Degradation of Contact Resistance of Wire-Spring Contacts in Different Wear Condition
Failure Physics	(Keynote) The Reliability Perspective of the Advanced CMOS Roadmap
Failure probability	Machine learning classification for failure analysis of smart spark plugs
Failure-mode	Low-Voltage Schottky p-GaN HEMT Properties under Extreme Repetitive Short-Circuit Operation Conditions : 2DEG Pinch-off, Stability, Aging, Robustness and Failure-Modes Analysis
fake electronics	Electronics authentication using electrical measurements and machine learning
fast switching	Analysis and experimental verification of current sharing among parallel-connected dc-link capacitors in a fast-switching converter
Fatigue	Microstructure-based fatigue analysis of SiC power module with sintered silver die attach
fatigue life	Lifetime model for wire bond degradation in power semiconductors based on accelerated mechanical testing and power cycling
fault detection	Series AC Arc Fault Diagnosis Method Based on Spectrogram and Deep Residual Network
Fault localization	Comprehensive LED Reliability Assessment through Integrated Real-Time Visualization, Electrical, and Optical Analysis
Fault simulation and injection	Laser voltage probing and simulation of a flip-flop with undesired quasi-static switching
FDSOI	Synergistic Effect of Total Ionizing Dose and Electromagnetic Interference in SRAM using 22nm FDSOI technology The Use of Filtered High-Energy X-rays and 60Co for TID Testing of a 32-Bit 28nm FDSOI DSP
FE simulation	On the Validity of Rainflow Counting-Based Lifetime Assessment for Power Electronics Assembly
FEA	Machine learning-based surrogate models for finned heatsink optimization
FEM simulations	FEM-based development of novel 3D-printable plastic direct coolers for power semiconductor modules
Ferroelectric	Recovery and Unrecovered Damage During Interrupted CVS in MFIS FE devices
FIB	PBO Delamination and RDL Corrosion detection on WLCSP Package Products
Field-Plate	Effect of Drain Field Plate design and 2DEG density on Dynamic-RON of 650V AlGaN/GaN HEMTs
Filler Particle	Numerical study of critical filler particle to chip interaction on an automotive Hall sensor
FinFET	Correlating time and voltage laws in BTI
FinFET Technology	Characterization and Analysis of Single-Event Effects in 16 nm FinFET FPGAs Based on On-Orbit Data
Finite Element Analysis	Numerical study of critical filler particle to chip interaction on an automotive Hall sensor
finite element simulation	Lifetime model for wire bond degradation in power semiconductors based on accelerated mechanical testing and power cycling
Fitting algorithm	Optimized Semi-Physical EKV Model for Simulation of SiC MOSFETs
Flip-flop retention	Laser voltage probing and simulation of a flip-flop with undesired quasi-static switching
Floquet theory	A Floquet Theory-Based Stability Analysis Method for PV-Storage Independent DC Microgrid
Focused Ion Beam	Fast Reverse Engineering of Chips using Lasers, Focused Ion Beams, and Confocal and Scanning Electron Microscopy
foldable displays	Reliability Assurance in Foldable Displays: Design of Experiment-Based Testing Strategy for Market-Ready Products
Front-side ageing	Impact of IGBT emitter pad design and front-side ageing on switching stability
fuzz button contacts	Failure Analysis of Gold-plated Fuzz Button Contacts in Elevated Temperature
G
Ga2O3	Numerical simulation of current uniformity in Ga2O3 planar diodes and its effect on temperature field and device reliability
Gallium Nitride	GaN reliability: from technological considerations to failure processes Ultra-Fast recovery transients in GaN MIS-HEMT submitted to OFF State stress
Galvanic Isolators	Impact of Device Encapsulation on the Time-Dependent Dielectric Breakdown in Polymeric Dielectrics for Galvanic Isolation
GaN	Development challenges of a one-sided GaN-based high-current density buck converter through multiphysics optimization for electric vehicle applications Changes in the extraction and collection efficiency of GaN-based MQW solar cells under optical step-stress Improved CV characterization technique for interface state evaluation in Si3N4/n-GaN MIS Capacitors Ultra-Fast recovery transients in GaN MIS-HEMT submitted to OFF State stress Study of Trapping Mechanisms Affecting AlGaN/GaN HEMTs adopting AlGaN Back-Barriers with Different Aluminum Concentrations (Invited) Advanced Methodology and Understanding of GaN Device Reliability Empirical reliability model of GaN HEMT devices GaN defect detection and analysis using electrical probing, EBAC, EBIC and EBIRCH Impact of drain-source leakage on the dynamic Ron of power HEMTs with p-GaN gate Reliability Design of GaN Based High-frequency Inverter Optimization Effect of Drain Field Plate design and 2DEG density on Dynamic-RON of 650V AlGaN/GaN HEMTs
GaN HEMT	The behavior of 350V GaN HEMTs during heavy ion irradiations Dependence between the drain current saturation and short-circuit robustness of p-GaN HEMTs Analyzing the role of hole injection on the short circuit performance of p-GaN gate power HEMTs Reliability and Failure Analysis of AlGaN/GaN HEMT with NiPtAu and PtAu Gate ESD Human Body Model step stress distributions of GaN HEMTs and the correlation with one level test results
GaN HEMTs	DC and RF aging test of AlGaN/GaN HEMT technology on SiC substrate
GaN-HEMTs	A Screening Test of GaN-HEMTs for Improvement of Breakdown Voltage Uniformity
Gate lifetime	Gate lifetime investigation at low temperature for p-GaN HEMT
Gate overshoot	Investigation of Trade-off between Switching Loss and Gate Overshoot in SiC MOSFETs by Driving Waveform Modification
Gate oxide degradation	Effect of gate oxide thickness on gate latent damage induced by heavy ion in SiC power MOSFETs
Gate-crack modeling	Preliminary SiC MOSFET Gate-Cracking Modeling under Short-Circuit Based on Rankine's Damage Energetic Approach Using a Wide Temperature-Range Elastoplastic 2D Simulation
gate-leakage	Nonlinear modelling of AlN/GaN HEMT accounting for Self-biasing effect during RF step stress: analysis and Hard-SOA
Gate-oxide degradation	Aging Effects on Short-Circuit Peak Current Through Gate-oxide Degradation in SiC MOSFET
GDSII	Fast Reverse Engineering of Chips using Lasers, Focused Ion Beams, and Confocal and Scanning Electron Microscopy
Geometric parameters	Reliability detection and analysis of elliptical holes corresponding to defects in electrothermal environment
Global Fault Isolation	Solid failure analysis flow for the detection of the leakage current in MEMS gyroscope resonant system
Grain boundary	Evolution analysis of mechanical behavior of through‑silicon via under thermal cycling load
H
Hailstorms Damage	Hail damage investigation in heterojunction silicon photovoltaic modules: a real word case study
Hard switching	Investigation of the long-term dynamic Rds(ON) variation and dynamic high temperature operating life test robustness of Schottky gate and ohmic gate GaN HEMT with comparable stress conditions
Hardened structure	The Effect of Trench Depth on Single-Event Burnout Hardening of Split-Gate-Trench MOSFET
HBM	ESD Human Body Model step stress distributions of GaN HEMTs and the correlation with one level test results
HCD	Correlating time and voltage laws in BTI
HCI
heat	Development challenges of a one-sided GaN-based high-current density buck converter through multiphysics optimization for electric vehicle applications
Heat dissipation	Numerical simulation of current uniformity in Ga2O3 planar diodes and its effect on temperature field and device reliability
Heatsink optimization	Machine learning-based surrogate models for finned heatsink optimization
heavy ion	The behavior of 350V GaN HEMTs during heavy ion irradiations
Heavy ion irradiation	Effect of gate oxide thickness on gate latent damage induced by heavy ion in SiC power MOSFETs
HEMT	Ultra-Fast recovery transients in GaN MIS-HEMT submitted to OFF State stress Nonlinear modelling of AlN/GaN HEMT accounting for Self-biasing effect during RF step stress: analysis and Hard-SOA Impact of drain-source leakage on the dynamic Ron of power HEMTs with p-GaN gate Effect of Drain Field Plate design and 2DEG density on Dynamic-RON of 650V AlGaN/GaN HEMTs
High accuracy sensor	Improvement of Sensitivity for Power Cycle Degradation by A New Device Structure
high bandwidth memory	Fast high-resolution X-ray nano tomography for failure analysis in advanced packaging
High Humidity High Temperature Reverse Bias	Solder Stop as a Reliable Insulation Layer on Printed Circuit Boards – Different Layouts and Materials under Humidity and High Voltage
high power	Reliability analysis of high power LEDs for automotive: impact of current and temperature
high temperature application	Understanding improved pitting corrosion resistance under high temperature application leading to a newly developed palladium coated copper wire
High Temperature Storage	Thermal ageing monitoring in Cu-Al intermetallic joints through electrical resistance drift: comparative study of lifetime potential in pure and alloyed copper wires
High Voltage application	Power devices Failure Analysis Use Cases Using High voltage OBIRCh and EMMI workflows
high-current-density	Development challenges of a one-sided GaN-based high-current density buck converter through multiphysics optimization for electric vehicle applications
High-energy X-rays	The Use of Filtered High-Energy X-rays and 60Co for TID Testing of a 32-Bit 28nm FDSOI DSP
holding voltage	Optimization of the drain-side configuration in ESD-protection SCR-LDMOS for high holding-voltage applications
hole injection	Analyzing the role of hole injection on the short circuit performance of p-GaN gate power HEMTs Thermal Impedance and Local Thermal Runaway during Surge Events in Power Rectifiers
hot electron effect	Investigation of the long-term dynamic Rds(ON) variation and dynamic high temperature operating life test robustness of Schottky gate and ohmic gate GaN HEMT with comparable stress conditions
HTGB	Aging impact of the SiC Mosfet gate dielectric
HTRB stress	HTRB effects on threshold instability of 4H-SiC PowerMOSFET with carrots defects
Humidity Reliability	Solder Stop as a Reliable Insulation Layer on Printed Circuit Boards – Different Layouts and Materials under Humidity and High Voltage
HVRB	Empirical reliability model of GaN HEMT devices
Hybrid Switches	Active Gate Driver for Current Overshoot Suppression of SiC+Si Hybrid Switches with Dynamic gate Current Regulation
Hybrid thermal and electrical stresses	Efficient Long-term Reliability Assessment of Planar InGaAs/InP Avalanche Photodiodes using Accelerated Step-Stress Test
H³TRB	Solder Stop as a Reliable Insulation Layer on Printed Circuit Boards – Different Layouts and Materials under Humidity and High Voltage
I
IGBT	Effect of load sequence interaction for low ∆Tj's on the reliability of bonded aluminium wires in IGBTs Multi-sensor Data Fusion for Prediction of Remaining Useful Life of IGBT Power Modules
IGBT power module	New Temperature-Independent Aging Indicator for power semiconductor devices – application to IGBTs
imbalanced supply voltage	Condition Monitoring of a DC-Link Capacitor in an Inverter with a front-end diode rectifier under Imbalanced Three-phase Supply Voltage
IMD Fracture	Numerical study of critical filler particle to chip interaction on an automotive Hall sensor
impact ionization	Evidence for double degradation regime in off-state stressed 100 V GaN transistors: from dielectric failure to subthreshold current increase
impedance analysis	On the electrical properties of ALD HfO2 dielectric films for MEMS capacitive switches.
In-situ microscopic imaging	Comprehensive LED Reliability Assessment through Integrated Real-Time Visualization, Electrical, and Optical Analysis
Increase	Conducted EMI Assessment of Aging Power Si-MOSFET in 3 phase inverter
Independent PV-Storage DC Microgrid	A Floquet Theory-Based Stability Analysis Method for PV-Storage Independent DC Microgrid
Infrared Radiation	Hail damage investigation in heterojunction silicon photovoltaic modules: a real word case study
InGaN	Changes in the extraction and collection efficiency of GaN-based MQW solar cells under optical step-stress
Integrated analysis methodology	Comprehensive LED Reliability Assessment through Integrated Real-Time Visualization, Electrical, and Optical Analysis
Intelligent power distribution	SMART Protection Design of Automotive Power Distribution Systems with Temperature-Based Electronic Fuses: Mathematical Background, Design Guidelines and Drawbacks of Energy-Based Methods
Interconnect	Vertically Scaled Cu/low-k Interconnect Development for BEOL Reliability Improvement of 12nm DRAM
interface	Improved CV characterization technique for interface state evaluation in Si3N4/n-GaN MIS Capacitors Interface-related VTH Shift of SiC MOSFETs during Constant Current Stress extracted from Charge Pumping measurements
interface degradation	Lifetime model for wire bond degradation in power semiconductors based on accelerated mechanical testing and power cycling
interface Si02-SiC	Aging impact of the SiC Mosfet gate dielectric
intermetallic compounds	Thermal ageing monitoring in Cu-Al intermetallic joints through electrical resistance drift: comparative study of lifetime potential in pure and alloyed copper wires
Internal activity	A New Methodology of Modeling Conducted Emission Behavioural in System-in-Packages (SiP)
inverter	Condition Monitoring of a DC-Link Capacitor in an Inverter with a front-end diode rectifier under Imbalanced Three-phase Supply Voltage Reliability Design of GaN Based High-frequency Inverter Optimization
J
JEDEC	ESD Human Body Model step stress distributions of GaN HEMTs and the correlation with one level test results
Junction temperature monitoring Measurement	Online Junction Temperature Monitoring of SiC MOSFET Based On The Maximum Drain Current Change Rate During The Process of Opening
L
large area connection	Improving Large-Area Sintering Reliability of Power Module Systems Using Copper Paste/Film
Laser	Fast Reverse Engineering of Chips using Lasers, Focused Ion Beams, and Confocal and Scanning Electron Microscopy
Laser diodes	About the influence of temperature operation and packaging stress on the threshold for catastrophic optical damage in laser diodes
Laser voltage probing	Laser voltage probing and simulation of a flip-flop with undesired quasi-static switching
Latent damages	Effect of gate oxide thickness on gate latent damage induced by heavy ion in SiC power MOSFETs
Lateral crack	Heat-resistant durability of AMB substrates for SiC power devices: AlN and Si3N4, which one is thermally strong?
lead forming	Assembly reliability of ceramic small outline packaged devices
Leakage current	Degradation model for insulation characteristics of tantalum capacitors related to manufacturing parameters and stress Solid failure analysis flow for the detection of the leakage current in MEMS gyroscope resonant system
LED	Reliability analysis of high power LEDs for automotive: impact of current and temperature (Invited) LED Reliability for Lighting Applications and Beyond Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures
LED failure mechanisms	Comprehensive LED Reliability Assessment through Integrated Real-Time Visualization, Electrical, and Optical Analysis
LED reliability testing	Comprehensive LED Reliability Assessment through Integrated Real-Time Visualization, Electrical, and Optical Analysis
Life model	Development of Life Prediction Model based on Physics-of-Failure for Negative Temperature Coefficient Thermistor
lifetime	High AC load current testing method for power capacitors Reliability and Failure Analysis of AlGaN/GaN HEMT with NiPtAu and PtAu Gate
lifetime assessment	On the Validity of Rainflow Counting-Based Lifetime Assessment for Power Electronics Assembly
lifetime model	Lifetime model for wire bond degradation in power semiconductors based on accelerated mechanical testing and power cycling Power Cycling Results of Cascode GaN Devices – Separate Analysis of Performance Degradation for Si/GaN parts and Lifetime Model Investigating the thermal degradation trends for thermal interface materials in the power converter
lifetime modelling and estimation	Lifetime prediction for power modules in wind-energy converters based on temperature variations in a large area substrate solder connection
Light-induced defects	Evidence for Optically-Induced Degradation in CIGS Solar Cells
Lighting Applications	(Invited) LED Reliability for Lighting Applications and Beyond
LISN	Conducted EMI Assessment of Aging Power Si-MOSFET in 3 phase inverter
LIT	System in package: Advanced FA Techniques to Minimize Analysis Time and Cost
Lithium plating	Performance characterization of lithium-ion battery and ageing under constant stress conditions at low temperature
Lithium-Ion battery	Performance characterization of lithium-ion battery and ageing under constant stress conditions at low temperature Impact of Constant and Pulsed Active Balancing Current Patterns on the Aging of Lithium-ion Batteries
load current	High AC load current testing method for power capacitors
Load sequence	Effect of load sequence interaction for low ∆Tj's on the reliability of bonded aluminium wires in IGBTs
Load-pull	DC and RF aging test of AlGaN/GaN HEMT technology on SiC substrate
Local thermal runaway	Thermal Impedance and Local Thermal Runaway during Surge Events in Power Rectifiers
Lock-in Thermography	Localization enhancement in quantitative thermal lock-in analysis using spatial phase evaluation System in package: Advanced FA Techniques to Minimize Analysis Time and Cost
Long Short Term Memory	Reliability Prediction of Electronic Components based on Physical of Failure with Manufacturing Parameters Fluctuations
long-term degradation	Investigation of the long-term dynamic Rds(ON) variation and dynamic high temperature operating life test robustness of Schottky gate and ohmic gate GaN HEMT with comparable stress conditions
Long-term reliability	Investigation of the long-term dynamic Rds(ON) variation and dynamic high temperature operating life test robustness of Schottky gate and ohmic gate GaN HEMT with comparable stress conditions Efficient Long-term Reliability Assessment of Planar InGaAs/InP Avalanche Photodiodes using Accelerated Step-Stress Test Failure mode competition and long-term reliability in the isothermal aging of sintered Cu joints
Low-voltage power device	Low-Voltage Schottky p-GaN HEMT Properties under Extreme Repetitive Short-Circuit Operation Conditions : 2DEG Pinch-off, Stability, Aging, Robustness and Failure-Modes Analysis
LSTM	Remaining Useful Life Prediction of DC Contactor Based on LSTM
M
Machine learning	C-SMART: A preprocessor for neural network performance and reliability under radiation Electronics authentication using electrical measurements and machine learning Machine learning classification for failure analysis of smart spark plugs Machine learning-based surrogate models for finned heatsink optimization
Manufacturing Parameters	Reliability Prediction of Electronic Components based on Physical of Failure with Manufacturing Parameters Fluctuations
Markov chain	Physics informed Markov chains for remaining useful life prediction of wire bonds in power electronic modules
Masking Effects	Methodology to estimate the impact of Single Event Transients in Logic
MBU	Selective Hardening of RISCV Soft-Processors for Space Applications
Mechanical stress	Improvement of Sensitivity for Power Cycle Degradation by A New Device Structure
MEMS	Sorption getter characterization under wafer-level packaging (WLP) conditions
MEMS gyroscopes	Solid failure analysis flow for the detection of the leakage current in MEMS gyroscope resonant system
Metal insulator metal (MIM)	Evidence of resistive switching in SiNx thin films for MEMS capacitors: the role of metal contacts
Micro electro mechanical systems (MEMS)	Evidence of resistive switching in SiNx thin films for MEMS capacitors: the role of metal contacts
micro-raman	Aging impact of the SiC Mosfet gate dielectric
Microstructural evolution	Enhancing Long-Term Thermal Reliability of Sintered Joints through the Use of Silver-Coated Copper Particles
Microstructure	Effect of load sequence interaction for low ∆Tj's on the reliability of bonded aluminium wires in IGBTs
MIM electrical properties	On the electrical properties of ALD HfO2 dielectric films for MEMS capacitive switches.
Minority carrier injection	Thermal Impedance and Local Thermal Runaway during Surge Events in Power Rectifiers
MIS capacitor	Improved CV characterization technique for interface state evaluation in Si3N4/n-GaN MIS Capacitors
MIS-HEMT	Ultra-Fast recovery transients in GaN MIS-HEMT submitted to OFF State stress
Mission profile	On the Validity of Rainflow Counting-Based Lifetime Assessment for Power Electronics Assembly Design-of-Experiments and ALT plan for reliability qualification of chip resistors based on mission profile of AIMDs
Model	Degradation model for insulation characteristics of tantalum capacitors related to manufacturing parameters and stress
Modeling	A New Methodology of Modeling Conducted Emission Behavioural in System-in-Packages (SiP) (Invited) Out-of-SOA Electrothermal Limitations of Power Semiconductor Devices: Characterization and Modeling
Modular Multilevel Converter (MMC)	A Submodule Capacitor Degradation Balancing Control with Capacitor Parameter Monitoring of a Modular Multilevel Converter for a Battery Energy Storage System
mold compound	The impact of mold compound on power cycling capability of SiC MOSFETs in double sided cooled modules
Molding	Numerical study of critical filler particle to chip interaction on an automotive Hall sensor
Monte Carlo	Reliability prediction of multi-level power supply system based on failure precursor parameters
MOSFET	Conducted EMI Assessment of Aging Power Si-MOSFET in 3 phase inverter Gate voltage modulation for power cycling tests of SiC MOSFETs and its influence on temperature distribution Reliability Assessment of SiC Power MOSFETs in Dynamic Reverse Bias Test
MOSFET SiC	Aging impact of the SiC Mosfet gate dielectric
N
nanoprobing	GaN defect detection and analysis using electrical probing, EBAC, EBIC and EBIRCH
Nanoscale Devices	Evaluation of the Impact of Body Bias on the Threshold Voltage Drift of SiO2 Transistors
natural length	Failure Analysis of Gold-plated Fuzz Button Contacts in Elevated Temperature
NBT stress	The effects of NBT stressing on later operation of power VDMOS transistors under normal conditions
Near field Synthetic Aperture Focusing Technique (SAFT)	Semi-supervised parameter estimation for Synthetic Aperture Focusing in Scanning Acoustic Microscopy for a 3D reconstruction of plastic molded electronic devices
Negative activation energy	Gate lifetime investigation at low temperature for p-GaN HEMT
Neural Network	C-SMART: A preprocessor for neural network performance and reliability under radiation
non-destructive detection	Electronics authentication using electrical measurements and machine learning
Non-Evaporated Getter (NEG)	Sorption getter characterization under wafer-level packaging (WLP) conditions
Non-linear measurements	DC and RF aging test of AlGaN/GaN HEMT technology on SiC substrate
Non-volatile memories	(Invited) Non-volatile Memories for the Space Environment: Ionizing Radiation Effects
Nonlinear capacitances	Optimized Semi-Physical EKV Model for Simulation of SiC MOSFETs
nonlinear model	Nonlinear modelling of AlN/GaN HEMT accounting for Self-biasing effect during RF step stress: analysis and Hard-SOA
normal stress	Creep tester for quality assessment of solder joints using normal and thermal stress
NTC thermistor	Development of Life Prediction Model based on Physics-of-Failure for Negative Temperature Coefficient Thermistor
O
OBIRCh	Power devices Failure Analysis Use Cases Using High voltage OBIRCh and EMMI workflows
OFF state stress	Ultra-Fast recovery transients in GaN MIS-HEMT submitted to OFF State stress
OFF-state breakdown	Evidence for double degradation regime in off-state stressed 100 V GaN transistors: from dielectric failure to subthreshold current increase
Off-state leakage	Impact of drain-source leakage on the dynamic Ron of power HEMTs with p-GaN gate
Ohmic Gate Device	Investigation of the long-term dynamic Rds(ON) variation and dynamic high temperature operating life test robustness of Schottky gate and ohmic gate GaN HEMT with comparable stress conditions
On resistance degradation	Single Event Irradiation Damage Effect of SiC MOSFETs Based on Degradation of Forward Conduction Characteristic
On-Orbit	Characterization and Analysis of Single-Event Effects in 16 nm FinFET FPGAs Based on On-Orbit Data
One-diode model	Evidence for Optically-Induced Degradation in CIGS Solar Cells
one-sided	Development challenges of a one-sided GaN-based high-current density buck converter through multiphysics optimization for electric vehicle applications
Open Circuit Voltage	Changes in the extraction and collection efficiency of GaN-based MQW solar cells under optical step-stress
Opening	Opening ceremony
outdoor lighting	Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures
Over Current	Degradation of SiC-MOSFETs Utilized in Bidirectional Switch for Grid Applications Under Over Current Stress
overshoots	Development challenges of a one-sided GaN-based high-current density buck converter through multiphysics optimization for electric vehicle applications
Ovonic Threshold Switching	Reading reliability in 1S1R OTS+PCM devices based on Double Patterned Self Aligned structure
oxidation	Reliability and Failure Analysis of AlGaN/GaN HEMT with NiPtAu and PtAu Gate
P
p-GaN gate	Impact of drain-source leakage on the dynamic Ron of power HEMTs with p-GaN gate
p-GaN gate HEMTs	Toward understanding the impacts of dynamic Ron on the efficiency in GaN-based AC-DC flyback converter
p-GaN HEMT	Evidence for double degradation regime in off-state stressed 100 V GaN transistors: from dielectric failure to subthreshold current increase Investigation of the long-term dynamic Rds(ON) variation and dynamic high temperature operating life test robustness of Schottky gate and ohmic gate GaN HEMT with comparable stress conditions Low-Voltage Schottky p-GaN HEMT Properties under Extreme Repetitive Short-Circuit Operation Conditions : 2DEG Pinch-off, Stability, Aging, Robustness and Failure-Modes Analysis
Packaging	(Keynote) The Reliability Perspective of the Advanced CMOS Roadmap Numerical study of critical filler particle to chip interaction on an automotive Hall sensor Impact of Device Encapsulation on the Time-Dependent Dielectric Breakdown in Polymeric Dielectrics for Galvanic Isolation
packaging reliability	Stress comparison of several short-circuit types on SiC MOSFET packaging
Packaging stress	About the influence of temperature operation and packaging stress on the threshold for catastrophic optical damage in laser diodes
parallel connection	Peak detection for current balancing of parallel-connected SiC power devices using PCB sensors
Paralleled devices reliability	A study of UIS ruggedness of mismatched paralleled SiC MOSFETs
Parameter extraction	Optimized Semi-Physical EKV Model for Simulation of SiC MOSFETs
Parasitic NPN transistor	The Effect of Trench Depth on Single-Event Burnout Hardening of Split-Gate-Trench MOSFET
Paris' law	Physics informed Markov chains for remaining useful life prediction of wire bonds in power electronic modules
Passivation	Numerical study of critical filler particle to chip interaction on an automotive Hall sensor
Passives	System in package: Advanced FA Techniques to Minimize Analysis Time and Cost
PBO Delamination	PBO Delamination and RDL Corrosion detection on WLCSP Package Products
PCB Rogowski sensor	Peak detection for current balancing of parallel-connected SiC power devices using PCB sensors
PCC wire	Understanding improved pitting corrosion resistance under high temperature application leading to a newly developed palladium coated copper wire
performance degradation	Reliability prediction of multi-level power supply system based on failure precursor parameters Power Cycling Results of Cascode GaN Devices – Separate Analysis of Performance Degradation for Si/GaN parts and Lifetime Model Separate Investigation of Performance Degradation for the Si and GaN parts in Cascode GaN devices under Repetitive Short Circuits
Phase Change Memory	Reading reliability in 1S1R OTS+PCM devices based on Double Patterned Self Aligned structure
Photo Emission	Power devices Failure Analysis Use Cases Using High voltage OBIRCh and EMMI workflows
Photovoltaics	Hail damage investigation in heterojunction silicon photovoltaic modules: a real word case study
Photovoltaics Modules	Hail damage investigation in heterojunction silicon photovoltaic modules: a real word case study
Physic of failure	Reliability prediction of multi-level power supply system based on failure precursor parameters
Physical Assurance	(Invited) Physical Assurance for Advanced Packaging
Physical of Failure	Reliability Prediction of Electronic Components based on Physical of Failure with Manufacturing Parameters Fluctuations
Physics of failure	Design-of-Experiments and ALT plan for reliability qualification of chip resistors based on mission profile of AIMDs
Physics-informed machine learning	Physics informed Markov chains for remaining useful life prediction of wire bonds in power electronic modules
pitting corrosion	Understanding improved pitting corrosion resistance under high temperature application leading to a newly developed palladium coated copper wire
Planar and trench structures	Threshold Voltage Hysteresis Investigation of SiC MOSFETs with Different Structures under Various Measurement Conditions
Planar diode	Numerical simulation of current uniformity in Ga2O3 planar diodes and its effect on temperature field and device reliability
plastic molded electronic devices	Semi-supervised parameter estimation for Synthetic Aperture Focusing in Scanning Acoustic Microscopy for a 3D reconstruction of plastic molded electronic devices
pMOSFET	Enhancing AC Degradation Modeling by Considering the Degradation Profile in SiON pMOSFETs
PNP	Optimization of the drain-side configuration in ESD-protection SCR-LDMOS for high holding-voltage applications
PoF	Correlating time and voltage laws in BTI
Porosity	On the influence of the porosity and homogeneity of sintered die-attach layers on the power cycling performance
power converters	Analysis and experimental verification of current sharing among parallel-connected dc-link capacitors in a fast-switching converter
Power cycle degradation	Improvement of Sensitivity for Power Cycle Degradation by A New Device Structure
Power cycle test	Improvement of Sensitivity for Power Cycle Degradation by A New Device Structure
power cycling	The impact of mold compound on power cycling capability of SiC MOSFETs in double sided cooled modules Advanced Power Cycling Test Strategies on Discrete SiC MOSFETs in Different Operating Modes and the Impact on Life-time Crack propagation in ultrasonic-bonded copper wires investigated by power cycling and accelerated mechanical fatigue interconnection test methods Lifetime prediction for power modules in wind-energy converters based on temperature variations in a large area substrate solder connection On the influence of the porosity and homogeneity of sintered die-attach layers on the power cycling performance
power cycling reliability	Power Cycling Results of Cascode GaN Devices – Separate Analysis of Performance Degradation for Si/GaN parts and Lifetime Model
power cycling test	Gate voltage modulation for power cycling tests of SiC MOSFETs and its influence on temperature distribution Power Cycling Results of Cascode GaN Devices – Separate Analysis of Performance Degradation for Si/GaN parts and Lifetime Model Reliability of Discrete SiC MOSFETs under Temperature-Shock and Power Cycling Tests
Power devices	New Temperature-Independent Aging Indicator for power semiconductor devices – application to IGBTs Failure mode competition and long-term reliability in the isothermal aging of sintered Cu joints
Power diodes	Evaluation with FEM Analysis of peak case non-rupture current for power devices working at very high current
power electronic modules	Physics informed Markov chains for remaining useful life prediction of wire bonds in power electronic modules
Power electronics	(Keynote) An approach to Electronic Platform Complexity: the System Integration in Lamborghini New Temperature-Independent Aging Indicator for power semiconductor devices – application to IGBTs Condition Monitoring for Detection of Humidity-Induced Failures in Control Electronics of Power Converters (Invited) Virtual prototyping in power electronics: the role of simulation in developing reliable products
power eletronics	On the Validity of Rainflow Counting-Based Lifetime Assessment for Power Electronics Assembly
Power Module	Evaluation and thermal ageing of power semiconductor die attachment based on porous film electrodeposition Thermal Performance Comparison of Wide Bandgap Power Modules by Simulation Microstructure-based fatigue analysis of SiC power module with sintered silver die attach
Power module integrated cooler	FEM-based development of novel 3D-printable plastic direct coolers for power semiconductor modules
Power modules	Wire bonding failure characterization of an IGBT based power module through impedance analysis
power modules in wind-energy applications	Lifetime prediction for power modules in wind-energy converters based on temperature variations in a large area substrate solder connection
Power SiC MOSFETs	Test Methodology for Short-Circuit Assessment Applied to Power SiC MOSFETs
Powercycling	High AC load current testing method for power capacitors
PowerMOSFET	HTRB effects on threshold instability of 4H-SiC PowerMOSFET with carrots defects
Preprocessor	C-SMART: A preprocessor for neural network performance and reliability under radiation
Press-pack	Evaluation with FEM Analysis of peak case non-rupture current for power devices working at very high current
Principal component Analysis	New statistical analysis methodology to forecast the memory cell behavior before reliability test
Printed Circuit Boards (PCB)	Solder Stop as a Reliable Insulation Layer on Printed Circuit Boards – Different Layouts and Materials under Humidity and High Voltage
Prognostics	Physics informed Markov chains for remaining useful life prediction of wire bonds in power electronic modules
Pulse Current Discharge	Impact of Constant and Pulsed Active Balancing Current Patterns on the Aging of Lithium-ion Batteries
Q
Qualification	System in package: Advanced FA Techniques to Minimize Analysis Time and Cost
quality assessment	Creep tester for quality assessment of solder joints using normal and thermal stress
Quasi-static undesired switching	Laser voltage probing and simulation of a flip-flop with undesired quasi-static switching
R
Radiation	C-SMART: A preprocessor for neural network performance and reliability under radiation (Invited) Non-volatile Memories for the Space Environment: Ionizing Radiation Effects
radiation failure	The behavior of 350V GaN HEMTs during heavy ion irradiations
Radiation Impact on Logic	Methodology to estimate the impact of Single Event Transients in Logic
rainflow counting	On the Validity of Rainflow Counting-Based Lifetime Assessment for Power Electronics Assembly
RDL Corrosion	PBO Delamination and RDL Corrosion detection on WLCSP Package Products
Rdson	Empirical reliability model of GaN HEMT devices
Reading reliability	Reading reliability in 1S1R OTS+PCM devices based on Double Patterned Self Aligned structure
Reconfigurable FET	(IPFA 2024 Best Paper) Reliability of Reconfigurable Field Effect Transistors: Early Analysis of Bias Temperature Instability
Reliability	(Keynote) The Reliability Perspective of the Advanced CMOS Roadmap Reliability analysis of high power LEDs for automotive: impact of current and temperature C-SMART: A preprocessor for neural network performance and reliability under radiation Advanced Power Cycling Test Strategies on Discrete SiC MOSFETs in Different Operating Modes and the Impact on Life-time Improvement of Sensitivity for Power Cycle Degradation by A New Device Structure New Temperature-Independent Aging Indicator for power semiconductor devices – application to IGBTs Degradation mode analysis of Cu bond wires on Cu plated SiC power semiconductors stressed by active power cycling Thermal ageing monitoring in Cu-Al intermetallic joints through electrical resistance drift: comparative study of lifetime potential in pure and alloyed copper wires Reliability and Failure Analysis of AlGaN/GaN HEMT with NiPtAu and PtAu Gate Vertically Scaled Cu/low-k Interconnect Development for BEOL Reliability Improvement of 12nm DRAM Reliability Assurance in Foldable Displays: Design of Experiment-Based Testing Strategy for Market-Ready Products (Invited) Physical Assurance for Advanced Packaging (Invited) LED Reliability for Lighting Applications and Beyond (Invited) Advanced Methodology and Understanding of GaN Device Reliability (Invited) Virtual prototyping in power electronics: the role of simulation in developing reliable products Improving Large-Area Sintering Reliability of Power Module Systems Using Copper Paste/Film Aging Effects on Short-Circuit Peak Current Through Gate-oxide Degradation in SiC MOSFET Reliability detection and analysis of elliptical holes corresponding to defects in electrothermal environment Reliability Assessment of SiC Power MOSFETs in Dynamic Reverse Bias Test Selective Hardening of RISCV Soft-Processors for Space Applications Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures System in package: Advanced FA Techniques to Minimize Analysis Time and Cost Reliability Design of GaN Based High-frequency Inverter Optimization PBO Delamination and RDL Corrosion detection on WLCSP Package Products HTRB effects on threshold instability of 4H-SiC PowerMOSFET with carrots defects (IPFA 2024 Best Paper) Reliability of Reconfigurable Field Effect Transistors: Early Analysis of Bias Temperature Instability
reliability analysis	Separate Investigation of Performance Degradation for the Si and GaN parts in Cascode GaN devices under Repetitive Short Circuits
reliability engineering	Investigating the thermal degradation trends for thermal interface materials in the power converter
Reliability improvement	Spacecraft Sensor Reliability Improvement Based On Temporal Digital Twin Model
Reliability of memory array	New statistical analysis methodology to forecast the memory cell behavior before reliability test
Reliability Prediction	Reliability prediction of multi-level power supply system based on failure precursor parameters Reliability Prediction of Electronic Components based on Physical of Failure with Manufacturing Parameters Fluctuations
Reliability testing	AI-assisted reliability testing, modeling, and condition monitoring for power electronics applications
Remaining useful life	Physics informed Markov chains for remaining useful life prediction of wire bonds in power electronic modules
Remaining Useful Life Prediction	Remaining Useful Life Prediction of DC Contactor Based on LSTM
Remaining useful lifetime	Multi-sensor Data Fusion for Prediction of Remaining Useful Life of IGBT Power Modules
Repetitive hard-switching	Impact of IGBT emitter pad design and front-side ageing on switching stability
repetitive short circuits	Separate Investigation of Performance Degradation for the Si and GaN parts in Cascode GaN devices under Repetitive Short Circuits
Residual Gas Analysis	Sorption getter characterization under wafer-level packaging (WLP) conditions
Resistive switching	Evidence of resistive switching in SiNx thin films for MEMS capacitors: the role of metal contacts
Reverse engineering	Fast Reverse Engineering of Chips using Lasers, Focused Ion Beams, and Confocal and Scanning Electron Microscopy
RF characterization	Wire bonding failure characterization of an IGBT based power module through impedance analysis
RF-Robustness	Nonlinear modelling of AlN/GaN HEMT accounting for Self-biasing effect during RF step stress: analysis and Hard-SOA
ringings	Development challenges of a one-sided GaN-based high-current density buck converter through multiphysics optimization for electric vehicle applications
RISC-V	Selective Hardening of RISCV Soft-Processors for Space Applications
Robustness	Reliability analysis of high power LEDs for automotive: impact of current and temperature Dependence between the drain current saturation and short-circuit robustness of p-GaN HEMTs Low-Voltage Schottky p-GaN HEMT Properties under Extreme Repetitive Short-Circuit Operation Conditions : 2DEG Pinch-off, Stability, Aging, Robustness and Failure-Modes Analysis
S
S/D Implant Tilt Angle
Safe Operating Area	(Invited) Out-of-SOA Electrothermal Limitations of Power Semiconductor Devices: Characterization and Modeling
Sample preparation	Improved 2D charge carrier quantification workflow for scanning spreading resistance microscopy
SB-MISFET	Improvement of Sensitivity for Power Cycle Degradation by A New Device Structure
Scanning Acoustic Microscopy (SAM)	Semi-supervised parameter estimation for Synthetic Aperture Focusing in Scanning Acoustic Microscopy for a 3D reconstruction of plastic molded electronic devices
Scanning probe microscopy	Improved 2D charge carrier quantification workflow for scanning spreading resistance microscopy
Scanning resistance profiling	Improved 2D charge carrier quantification workflow for scanning spreading resistance microscopy
Scanning spreading resistance microscopy	Improved 2D charge carrier quantification workflow for scanning spreading resistance microscopy
Schottky	Failure investigation on an embedded Schottky Barrier Diode due to an inhomogeneous silicide formation
Schottky gate device	Investigation of the long-term dynamic Rds(ON) variation and dynamic high temperature operating life test robustness of Schottky gate and ohmic gate GaN HEMT with comparable stress conditions
Schottky-type p-GaN	Gate lifetime investigation at low temperature for p-GaN HEMT
SCR-LDMOS	Optimization of the drain-side configuration in ESD-protection SCR-LDMOS for high holding-voltage applications
Screening	A Screening Test of GaN-HEMTs for Improvement of Breakdown Voltage Uniformity
Self-acceleration effect	Thermal layout optimization of electrolytic capacitors considering degradation self-acceleration effect for reliability improvement
self-biasing	Nonlinear modelling of AlN/GaN HEMT accounting for Self-biasing effect during RF step stress: analysis and Hard-SOA
Self-heating	The effects of NBT stressing on later operation of power VDMOS transistors under normal conditions
semi-supervised parameter estimation	Semi-supervised parameter estimation for Synthetic Aperture Focusing in Scanning Acoustic Microscopy for a 3D reconstruction of plastic molded electronic devices
Sensors	(Keynote) Battery Diagnostics and Virtual Sensors in Ferrari
series ac arc fault	Series AC Arc Fault Diagnosis Method Based on Spectrogram and Deep Residual Network
SEU	Selective Hardening of RISCV Soft-Processors for Space Applications
Short circuit	Analyzing the role of hole injection on the short circuit performance of p-GaN gate power HEMTs Evaluation with FEM Analysis of peak case non-rupture current for power devices working at very high current Stress comparison of several short-circuit types on SiC MOSFET packaging Long-Term Positive and Negative Gate Bias Stress Tests on Parallel Connected SiC MOSFETs at -40°C and 175°C
Short Circuit Current	Changes in the extraction and collection efficiency of GaN-based MQW solar cells under optical step-stress
Short-circuit	Dependence between the drain current saturation and short-circuit robustness of p-GaN HEMTs Test Methodology for Short-Circuit Assessment Applied to Power SiC MOSFETs Preliminary SiC MOSFET Gate-Cracking Modeling under Short-Circuit Based on Rankine's Damage Energetic Approach Using a Wide Temperature-Range Elastoplastic 2D Simulation Low-Voltage Schottky p-GaN HEMT Properties under Extreme Repetitive Short-Circuit Operation Conditions : 2DEG Pinch-off, Stability, Aging, Robustness and Failure-Modes Analysis
short-circuit test	Separate Investigation of Performance Degradation for the Si and GaN parts in Cascode GaN devices under Repetitive Short Circuits
Si3N4-AMB	Heat-resistant durability of AMB substrates for SiC power devices: AlN and Si3N4, which one is thermally strong?
SiC devices	Power devices Failure Analysis Use Cases Using High voltage OBIRCh and EMMI workflows
SiC MOSFET	The impact of mold compound on power cycling capability of SiC MOSFETs in double sided cooled modules Aging Effects on Short-Circuit Peak Current Through Gate-oxide Degradation in SiC MOSFET Online Junction Temperature Monitoring of SiC MOSFET Based On The Maximum Drain Current Change Rate During The Process of Opening Preliminary SiC MOSFET Gate-Cracking Modeling under Short-Circuit Based on Rankine's Damage Energetic Approach Using a Wide Temperature-Range Elastoplastic 2D Simulation Stress comparison of several short-circuit types on SiC MOSFET packaging Long-Term Positive and Negative Gate Bias Stress Tests on Parallel Connected SiC MOSFETs at -40°C and 175°C
SiC MOSFET modeling	Optimized Semi-Physical EKV Model for Simulation of SiC MOSFETs
SiC MOSFETs	Interface-related VTH Shift of SiC MOSFETs during Constant Current Stress extracted from Charge Pumping measurements Advanced Power Cycling Test Strategies on Discrete SiC MOSFETs in Different Operating Modes and the Impact on Life-time Threshold Voltage Hysteresis Investigation of SiC MOSFETs with Different Structures under Various Measurement Conditions A study of UIS ruggedness of mismatched paralleled SiC MOSFETs Reliability of Discrete SiC MOSFETs under Temperature-Shock and Power Cycling Tests
SiC MPS diode	A Geometry-Scalable Electrothermal Compact Circuit Model of SiC MPS Diodes Accounting for the Snapback Mechanism: Application to Current Surge Events
SiC power device	Risk of CuxO phase penetration between the Ag plating layer and Cu during high-temperature reliability testing of interfaces bonded to cold sintered Ag nano-porous sheets on direct Ag-plated Cu substrates
SiC power devices	Peak detection for current balancing of parallel-connected SiC power devices using PCB sensors Heat-resistant durability of AMB substrates for SiC power devices: AlN and Si3N4, which one is thermally strong?
SiC power MOSFETs	Investigation of Trade-off between Switching Loss and Gate Overshoot in SiC MOSFETs by Driving Waveform Modification Effect of gate oxide thickness on gate latent damage induced by heavy ion in SiC power MOSFETs
SiC-MOSFET	Degradation of SiC-MOSFETs Utilized in Bidirectional Switch for Grid Applications Under Over Current Stress
Silicon	Hail damage investigation in heterojunction silicon photovoltaic modules: a real word case study
Silicon Carbide	Gate voltage modulation for power cycling tests of SiC MOSFETs and its influence on temperature distribution Reliability Assessment of SiC Power MOSFETs in Dynamic Reverse Bias Test HTRB effects on threshold instability of 4H-SiC PowerMOSFET with carrots defects
Silicon carbide metal oxide semiconductor field effect transistor (MOSFET)	Optimized Semi-Physical EKV Model for Simulation of SiC MOSFETs
silicone degradation	Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures
silver coated copper particles	Enhancing Long-Term Thermal Reliability of Sintered Joints through the Use of Silver-Coated Copper Particles
Silver sintering	On the influence of the porosity and homogeneity of sintered die-attach layers on the power cycling performance
Simulation	Vertically Scaled Cu/low-k Interconnect Development for BEOL Reliability Improvement of 12nm DRAM (Invited) Virtual prototyping in power electronics: the role of simulation in developing reliable products Thermal Performance Comparison of Wide Bandgap Power Modules by Simulation Optimized Semi-Physical EKV Model for Simulation of SiC MOSFETs
single event burnout	The behavior of 350V GaN HEMTs during heavy ion irradiations
Single Event Transients	Methodology to estimate the impact of Single Event Transients in Logic
Single Event Upsets	Methodology to estimate the impact of Single Event Transients in Logic
Single-event burnout (SEB)	The Effect of Trench Depth on Single-Event Burnout Hardening of Split-Gate-Trench MOSFET
single-event effect	Single Event Irradiation Damage Effect of SiC MOSFETs Based on Degradation of Forward Conduction Characteristic
Single-Event Upset (SEU)	Characterization and Analysis of Single-Event Effects in 16 nm FinFET FPGAs Based on On-Orbit Data
Sintered silver	Microstructure-based fatigue analysis of SiC power module with sintered silver die attach
sintering paste	Enhancing Long-Term Thermal Reliability of Sintered Joints through the Use of Silver-Coated Copper Particles
SiON	Enhancing AC Degradation Modeling by Considering the Degradation Profile in SiON pMOSFETs
SIP	System in package: Advanced FA Techniques to Minimize Analysis Time and Cost
Slew Rate	Investigation of the long-term dynamic Rds(ON) variation and dynamic high temperature operating life test robustness of Schottky gate and ohmic gate GaN HEMT with comparable stress conditions Reliability Assessment of SiC Power MOSFETs in Dynamic Reverse Bias Test
Smart spark plugs	Machine learning classification for failure analysis of smart spark plugs
Snapback	A Geometry-Scalable Electrothermal Compact Circuit Model of SiC MPS Diodes Accounting for the Snapback Mechanism: Application to Current Surge Events
Soft switching	Investigation of the long-term dynamic Rds(ON) variation and dynamic high temperature operating life test robustness of Schottky gate and ohmic gate GaN HEMT with comparable stress conditions
Soft-switching	Reliability Design of GaN Based High-frequency Inverter Optimization
Solar Cells	Changes in the extraction and collection efficiency of GaN-based MQW solar cells under optical step-stress
solder joint	Creep tester for quality assessment of solder joints using normal and thermal stress
Solder Stop Reliability	Solder Stop as a Reliable Insulation Layer on Printed Circuit Boards – Different Layouts and Materials under Humidity and High Voltage
solid state lighting	Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures
solid-state power controller	Stress comparison of several short-circuit types on SiC MOSFET packaging
Sorption Characterization	Sorption getter characterization under wafer-level packaging (WLP) conditions
Space	(Invited) Non-volatile Memories for the Space Environment: Ionizing Radiation Effects
Space Applications	Selective Hardening of RISCV Soft-Processors for Space Applications
Spacecraft sensor	Spacecraft Sensor Reliability Improvement Based On Temporal Digital Twin Model
spectrogram	Series AC Arc Fault Diagnosis Method Based on Spectrogram and Deep Residual Network
Spectrunm	Conducted EMI Assessment of Aging Power Si-MOSFET in 3 phase inverter
SPICE compact modeling	A Geometry-Scalable Electrothermal Compact Circuit Model of SiC MPS Diodes Accounting for the Snapback Mechanism: Application to Current Surge Events
Split gate	The Effect of Trench Depth on Single-Event Burnout Hardening of Split-Gate-Trench MOSFET
SRAM	Synergistic Effect of Total Ionizing Dose and Electromagnetic Interference in SRAM using 22nm FDSOI technology
stability	Study of Trapping Mechanisms Affecting AlGaN/GaN HEMTs adopting AlGaN Back-Barriers with Different Aluminum Concentrations
Stacked Devices	Localization enhancement in quantitative thermal lock-in analysis using spatial phase evaluation
State of health	Multi-sensor Data Fusion for Prediction of Remaining Useful Life of IGBT Power Modules
step stress	ESD Human Body Model step stress distributions of GaN HEMTs and the correlation with one level test results
sub-micron resolution	Fast high-resolution X-ray nano tomography for failure analysis in advanced packaging
substrate solder degradation	Lifetime prediction for power modules in wind-energy converters based on temperature variations in a large area substrate solder connection
sulfur induced corrosion	Understanding improved pitting corrosion resistance under high temperature application leading to a newly developed palladium coated copper wire
Surface Insulation Resistance	Condition Monitoring for Detection of Humidity-Induced Failures in Control Electronics of Power Converters
Surface potential decay	On the electrical properties of ALD HfO2 dielectric films for MEMS capacitive switches.
Surge current	Evaluation with FEM Analysis of peak case non-rupture current for power devices working at very high current
Surge current (IFSM)	Thermal Impedance and Local Thermal Runaway during Surge Events in Power Rectifiers
Surge current imbalance	A Geometry-Scalable Electrothermal Compact Circuit Model of SiC MPS Diodes Accounting for the Snapback Mechanism: Application to Current Surge Events
Surrogate model	Machine learning-based surrogate models for finned heatsink optimization
Switching locus	Investigation of the long-term dynamic Rds(ON) variation and dynamic high temperature operating life test robustness of Schottky gate and ohmic gate GaN HEMT with comparable stress conditions
Switching loss	Investigation of Trade-off between Switching Loss and Gate Overshoot in SiC MOSFETs by Driving Waveform Modification
System in Package	System in package: Advanced FA Techniques to Minimize Analysis Time and Cost
System integration	(Keynote) An approach to Electronic Platform Complexity: the System Integration in Lamborghini
System-in-Package	A New Methodology of Modeling Conducted Emission Behavioural in System-in-Packages (SiP)
T
Tantalum capacitor	Degradation model for insulation characteristics of tantalum capacitors related to manufacturing parameters and stress
TCAD	Optimization of the drain-side configuration in ESD-protection SCR-LDMOS for high holding-voltage applications
TCAD simulation	Effect of gate oxide thickness on gate latent damage induced by heavy ion in SiC power MOSFETs
TDDB	Evidence for double degradation regime in off-state stressed 100 V GaN transistors: from dielectric failure to subthreshold current increase Electrical and reliability characterization with optimized extrapolation models of two- and three-dimensional Metal-Insulator-Metal decoupling capacitors with ZrAlxOy high-κ dielectric under BEoL-friendly conditions
Technology Computer-aided Design	Degradation Modeling of InGaAs/InP Avalanche Photodiodes using Calibrated Technology Computer-aided Design
Temperature	Thermal Performance Comparison of Wide Bandgap Power Modules by Simulation
Temperature distribution	Gate voltage modulation for power cycling tests of SiC MOSFETs and its influence on temperature distribution Impact of IGBT emitter pad design and front-side ageing on switching stability
Temperature-sensitive electrical parameters	Online Junction Temperature Monitoring of SiC MOSFET Based On The Maximum Drain Current Change Rate During The Process of Opening
Temporal depedency model	Spacecraft Sensor Reliability Improvement Based On Temporal Digital Twin Model
Test Vehicle	Investigation of the long-term dynamic Rds(ON) variation and dynamic high temperature operating life test robustness of Schottky gate and ohmic gate GaN HEMT with comparable stress conditions
testing method	High AC load current testing method for power capacitors
The maximum value of the rate of change of the drain current during the process of opening	Online Junction Temperature Monitoring of SiC MOSFET Based On The Maximum Drain Current Change Rate During The Process of Opening
thermal ageing	Evaluation and thermal ageing of power semiconductor die attachment based on porous film electrodeposition
Thermal cyclic loading	Evolution analysis of mechanical behavior of through‑silicon via under thermal cycling load
Thermal design optimization	Thermal layout optimization of electrolytic capacitors considering degradation self-acceleration effect for reliability improvement
thermal interface materials	Investigating the thermal degradation trends for thermal interface materials in the power converter
Thermal management	FEM-based development of novel 3D-printable plastic direct coolers for power semiconductor modules
Thermal model	Evaluation with FEM Analysis of peak case non-rupture current for power devices working at very high current
thermal modelling	SMART Protection Design of Automotive Power Distribution Systems with Temperature-Based Electronic Fuses: Mathematical Background, Design Guidelines and Drawbacks of Energy-Based Methods Lifetime prediction for power modules in wind-energy converters based on temperature variations in a large area substrate solder connection
Thermal performance	Machine learning-based surrogate models for finned heatsink optimization
thermal reliability	Enhancing Long-Term Thermal Reliability of Sintered Joints through the Use of Silver-Coated Copper Particles
Thermal Resistance (junction - case - heat sink)	Reliability of Discrete SiC MOSFETs under Temperature-Shock and Power Cycling Tests
Thermal shock reliability	Heat-resistant durability of AMB substrates for SiC power devices: AlN and Si3N4, which one is thermally strong?
Thermal Shock Test	Reliability of Discrete SiC MOSFETs under Temperature-Shock and Power Cycling Tests
thermal stress	Creep tester for quality assessment of solder joints using normal and thermal stress
Thermally Stimulated Depolarisation Current	On the electrical properties of ALD HfO2 dielectric films for MEMS capacitive switches.
Thermally stimulated depolarization current	Evidence of resistive switching in SiNx thin films for MEMS capacitors: the role of metal contacts
Thermomecanical modeling	About the influence of temperature operation and packaging stress on the threshold for catastrophic optical damage in laser diodes
Threshold instability	HTRB effects on threshold instability of 4H-SiC PowerMOSFET with carrots defects
Threshold Voltage	Interface-related VTH Shift of SiC MOSFETs during Constant Current Stress extracted from Charge Pumping measurements Long-Term Positive and Negative Gate Bias Stress Tests on Parallel Connected SiC MOSFETs at -40°C and 175°C
Threshold Voltage Degradation	Enhancing AC Degradation Modeling by Considering the Degradation Profile in SiON pMOSFETs
Threshold voltage hysteresis	Threshold Voltage Hysteresis Investigation of SiC MOSFETs with Different Structures under Various Measurement Conditions
threshold voltage shift	Investigation of the long-term dynamic Rds(ON) variation and dynamic high temperature operating life test robustness of Schottky gate and ohmic gate GaN HEMT with comparable stress conditions
Through‑silicon via (TSV)	Evolution analysis of mechanical behavior of through‑silicon via under thermal cycling load
TID	Synergistic Effect of Total Ionizing Dose and Electromagnetic Interference in SRAM using 22nm FDSOI technology
TID testing	The Use of Filtered High-Energy X-rays and 60Co for TID Testing of a 32-Bit 28nm FDSOI DSP
Time domain characterization	DC and RF aging test of AlGaN/GaN HEMT technology on SiC substrate
Time-Dependent Dielectric Breakdown	Impact of Device Encapsulation on the Time-Dependent Dielectric Breakdown in Polymeric Dielectrics for Galvanic Isolation
Time-dependent gate degradation	Gate lifetime investigation at low temperature for p-GaN HEMT
Total Ionizing Dose	The Use of Filtered High-Energy X-rays and 60Co for TID Testing of a 32-Bit 28nm FDSOI DSP
Trap-Assisted Tunneling	Recovery and Unrecovered Damage During Interrupted CVS in MFIS FE devices
trapping	Improved CV characterization technique for interface state evaluation in Si3N4/n-GaN MIS Capacitors OFF-state Breakdown and Threshold Voltage Stability of Vertical GaN-on-Si Trench MOSFETs Study of Trapping Mechanisms Affecting AlGaN/GaN HEMTs adopting AlGaN Back-Barriers with Different Aluminum Concentrations
Trench MOSFETs	OFF-state Breakdown and Threshold Voltage Stability of Vertical GaN-on-Si Trench MOSFETs
TSEP	Impact of IGBT emitter pad design and front-side ageing on switching stability
TTF	Empirical reliability model of GaN HEMT devices
U
UIS tests	A study of UIS ruggedness of mismatched paralleled SiC MOSFETs
Ultra-Fast recovery transients	Ultra-Fast recovery transients in GaN MIS-HEMT submitted to OFF State stress
Ultrasonic thick copper wires	Crack propagation in ultrasonic-bonded copper wires investigated by power cycling and accelerated mechanical fatigue interconnection test methods
V
Variability	Evaluation of the Impact of Body Bias on the Threshold Voltage Drift of SiO2 Transistors
VDMOS power transistors	The effects of NBT stressing on later operation of power VDMOS transistors under normal conditions
Vertical GaN	OFF-state Breakdown and Threshold Voltage Stability of Vertical GaN-on-Si Trench MOSFETs
void coalescence	Risk of CuxO phase penetration between the Ag plating layer and Cu during high-temperature reliability testing of interfaces bonded to cold sintered Ag nano-porous sheets on direct Ag-plated Cu substrates
VTH stability	OFF-state Breakdown and Threshold Voltage Stability of Vertical GaN-on-Si Trench MOSFETs
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Wafer Lavel Packaging (WLP)	Sorption getter characterization under wafer-level packaging (WLP) conditions
wear	Research on The Degradation of Contact Resistance of Wire-Spring Contacts in Different Wear Condition
Welcome	Opening ceremony
Wide Band Gap (WBG)	Thermal Performance Comparison of Wide Bandgap Power Modules by Simulation
Wide Band Gap devices	Power devices Failure Analysis Use Cases Using High voltage OBIRCh and EMMI workflows
Wide frequency band	Wire bonding failure characterization of an IGBT based power module through impedance analysis
wire bond lift-off	Lifetime model for wire bond degradation in power semiconductors based on accelerated mechanical testing and power cycling
wire bonding	Thermal ageing monitoring in Cu-Al intermetallic joints through electrical resistance drift: comparative study of lifetime potential in pure and alloyed copper wires
wire bonds	Physics informed Markov chains for remaining useful life prediction of wire bonds in power electronic modules
WLCSP	PBO Delamination and RDL Corrosion detection on WLCSP Package Products
X
x-ray imaging	Fast high-resolution X-ray nano tomography for failure analysis in advanced packaging
XPS	Aging impact of the SiC Mosfet gate dielectric
Y
Yield	Failure investigation on an embedded Schottky Barrier Diode due to an inhomogeneous silicide formation
Z
ZrAlxOy	Electrical and reliability characterization with optimized extrapolation models of two- and three-dimensional Metal-Insulator-Metal decoupling capacitors with ZrAlxOy high-κ dielectric under BEoL-friendly conditions
Zth-Measurement	Reliability of Discrete SiC MOSFETs under Temperature-Shock and Power Cycling Tests

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