ESREF 2024: 35TH EUROPEAN SYMPOSIUM ON RELIABILITY OF ELECTRON DEVICES, FAILURE PHYSICS AND ANALYSIS

A
Abbate, Carmine	The behavior of 350V GaN HEMTs during heavy ion irradiations
Abdelkader, Mohamed Taha Elsayed	Long-Term Positive and Negative Gate Bias Stress Tests on Parallel Connected SiC MOSFETs at -40°C and 175°C
Adlmaier, Thomas	Improved 2D charge carrier quantification workflow for scanning spreading resistance microscopy
Ahn, Kijoon	Risk of CuxO phase penetration between the Ag plating layer and Cu during high-temperature reliability testing of interfaces bonded to cold sintered Ag nano-porous sheets on direct Ag-plated Cu substrates
Alaluss, Mohamed	Threshold Voltage Hysteresis Investigation of SiC MOSFETs with Different Structures under Various Measurement Conditions
Alam, Maroun	Dependence between the drain current saturation and short-circuit robustness of p-GaN HEMTs Gate lifetime investigation at low temperature for p-GaN HEMT
Alamarguy, David	Aging impact of the SiC Mosfet gate dielectric
Alatise, Olayiwola	Long-Term Positive and Negative Gate Bias Stress Tests on Parallel Connected SiC MOSFETs at -40°C and 175°C
Albahrani, Sayed	Reliability and Failure Analysis of AlGaN/GaN HEMT with NiPtAu and PtAu Gate
Aldea, Emanuel	Physics informed Markov chains for remaining useful life prediction of wire bonds in power electronic modules
Altmann, Frank	Numerical study of critical filler particle to chip interaction on an automotive Hall sensor Localization enhancement in quantitative thermal lock-in analysis using spatial phase evaluation
Anaya, Julian	About the influence of temperature operation and packaging stress on the threshold for catastrophic optical damage in laser diodes
Andreani, Alessandro	Issues of electronic devices in hostile environment
Andrieu, François	Reading reliability in 1S1R OTS+PCM devices based on Double Patterned Self Aligned structure
Andronico, Pietro	Electronics authentication using electrical measurements and machine learning
Anoldo, Laura	HTRB effects on threshold instability of 4H-SiC PowerMOSFET with carrots defects
Antonelli, Renzo	Reading reliability in 1S1R OTS+PCM devices based on Double Patterned Self Aligned structure
Ao, Xin Yu	Reliability Design of GaN Based High-frequency Inverter Optimization
Araki, Noritoshi	Understanding improved pitting corrosion resistance under high temperature application leading to a newly developed palladium coated copper wire
Asadi, Navid	(Invited) Physical Assurance for Advanced Packaging
Aschero, Marco	Evaluation with FEM Analysis of peak case non-rupture current for power devices working at very high current
Atance-Loustaunau, Orianne	PBO Delamination and RDL Corrosion detection on WLCSP Package Products
Avenas, Yvan	Evaluation and thermal ageing of power semiconductor die attachment based on porous film electrodeposition
Avraham, Tsuriel	Empirical reliability model of GaN HEMT devices Correlating time and voltage laws in BTI
Avramenko, Marina	Interface-related VTH Shift of SiC MOSFETs during Constant Current Stress extracted from Charge Pumping measurements
Azimi, Sarah	Selective Hardening of RISCV Soft-Processors for Space Applications
B
Baffreau, Stéphane	Wire bonding failure characterization of an IGBT based power module through impedance analysis
Ballier, Aurelien	The Use of Filtered High-Energy X-rays and 60Co for TID Testing of a 32-Bit 28nm FDSOI DSP
Banc, Christophe	Gate lifetime investigation at low temperature for p-GaN HEMT
Bang, Heewon	Degradation Modeling of InGaAs/InP Avalanche Photodiodes using Calibrated Technology Computer-aided Design
Bang, Junghwan	Heat-resistant durability of AMB substrates for SiC power devices: AlN and Si3N4, which one is thermally strong?
Basler, Thomas	Advanced Power Cycling Test Strategies on Discrete SiC MOSFETs in Different Operating Modes and the Impact on Life-time Reliability of Discrete SiC MOSFETs under Temperature-Shock and Power Cycling Tests The impact of mold compound on power cycling capability of SiC MOSFETs in double sided cooled modules Threshold Voltage Hysteresis Investigation of SiC MOSFETs with Different Structures under Various Measurement Conditions Impact of IGBT emitter pad design and front-side ageing on switching stability
Belguith, Mohamed	Development challenges of a one-sided GaN-based high-current density buck converter through multiphysics optimization for electric vehicle applications
Ben Hadj Slama, Jaleleddine	Development challenges of a one-sided GaN-based high-current density buck converter through multiphysics optimization for electric vehicle applications Conducted EMI Assessment of Aging Power Si-MOSFET in 3 phase inverter
Bender, Emmanuel	Correlating time and voltage laws in BTI
Benito, Francisco M	Localization enhancement in quantitative thermal lock-in analysis using spatial phase evaluation
Bensoussan, Alain	Correlating time and voltage laws in BTI
Bergamin, Francesco	OFF-state Breakdown and Threshold Voltage Stability of Vertical GaN-on-Si Trench MOSFETs
Bergmann, Ole	Thermal Impedance and Local Thermal Runaway during Surge Events in Power Rectifiers
Bernard, Mathieu	Reading reliability in 1S1R OTS+PCM devices based on Double Patterned Self Aligned structure
Bernardoni, Mirko	(Invited) Virtual prototyping in power electronics: the role of simulation in developing reliable products SMART Protection Design of Automotive Power Distribution Systems with Temperature-Based Electronic Fuses: Mathematical Background, Design Guidelines and Drawbacks of Energy-Based Methods
Bernstein, Joseph	Empirical reliability model of GaN HEMT devices Correlating time and voltage laws in BTI
Berthold, Joerg	Methodology to estimate the impact of Single Event Transients in Logic
Bevilacqua, Santina	HTRB effects on threshold instability of 4H-SiC PowerMOSFET with carrots defects
Bianchi, Valentina	Aging modelling of Li-Ion Battery Systems based on accelerated tests
Bidaj, Klodjan	PBO Delamination and RDL Corrosion detection on WLCSP Package Products
Binder, Boris	Improved 2D charge carrier quantification workflow for scanning spreading resistance microscopy
Blagojevic, Alexander	Fast Reverse Engineering of Chips using Lasers, Focused Ion Beams, and Confocal and Scanning Electron Microscopy
Blamberger, Lukas	High AC load current testing method for power capacitors
Boccarossa, Marco	A Geometry-Scalable Electrothermal Compact Circuit Model of SiC MPS Diodes Accounting for the Snapback Mechanism: Application to Current Surge Events
Boch, Jerome	The Use of Filtered High-Energy X-rays and 60Co for TID Testing of a 32-Bit 28nm FDSOI DSP
Bocquet, Marc	New statistical analysis methodology to forecast the memory cell behavior before reliability test
Boito, Mirco	Evidence for double degradation regime in off-state stressed 100 V GaN transistors: from dielectric failure to subthreshold current increase
Boldyrjew-Mast, Roman	Threshold Voltage Hysteresis Investigation of SiC MOSFETs with Different Structures under Various Measurement Conditions
Bonkoungou, Benewende Diane Raïnatou	Optimized Semi-Physical EKV Model for Simulation of SiC MOSFETs
Borghese, Alessandro	A Geometry-Scalable Electrothermal Compact Circuit Model of SiC MPS Diodes Accounting for the Snapback Mechanism: Application to Current Surge Events
Boselli, Gianluca	Optimization of the drain-side configuration in ESD-protection SCR-LDMOS for high holding-voltage applications (Keynote) System-Level ESD Design in HV Automotive Applications: Process, IP and System Co-Design Challenges
Bouarroudj, Mounira	Physics informed Markov chains for remaining useful life prediction of wire bonds in power electronic modules
Bouchu, David	Sorption getter characterization under wafer-level packaging (WLP) conditions
Bourgeois, Guillaume	Reading reliability in 1S1R OTS+PCM devices based on Double Patterned Self Aligned structure
Bouvard, Didier	Evaluation and thermal ageing of power semiconductor die attachment based on porous film electrodeposition
Brand, Sebastian	Localization enhancement in quantitative thermal lock-in analysis using spatial phase evaluation
Braud, Francois	PBO Delamination and RDL Corrosion detection on WLCSP Package Products
Briat, Olivier	Performance characterization of lithium-ion battery and ageing under constant stress conditions at low temperature
Bronzoni, Matteo	Evidence for Optically-Induced Degradation in CIGS Solar Cells
Brunko, Alexander	Solder Stop as a Reliable Insulation Layer on Printed Circuit Boards – Different Layouts and Materials under Humidity and High Voltage
Brückner, Peter	Reliability and Failure Analysis of AlGaN/GaN HEMT with NiPtAu and PtAu Gate
Buffolo, Matteo	Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures Hail damage investigation in heterojunction silicon photovoltaic modules: a real word case study Changes in the extraction and collection efficiency of GaN-based MQW solar cells under optical step-stress Evidence for Optically-Induced Degradation in CIGS Solar Cells Reliability analysis of high power LEDs for automotive: impact of current and temperature
Busatto, Giovanni	The behavior of 350V GaN HEMTs during heavy ion irradiations
Butej, Boris	Analyzing the role of hole injection on the short circuit performance of p-GaN gate power HEMTs
Byun, Dongjin	Heat-resistant durability of AMB substrates for SiC power devices: AlN and Si3N4, which one is thermally strong?
Bäumler, Christian	Impact of IGBT emitter pad design and front-side ageing on switching stability
Bäumler, Martina	Reliability and Failure Analysis of AlGaN/GaN HEMT with NiPtAu and PtAu Gate
Böttcher, Tim	Thermal Impedance and Local Thermal Runaway during Surge Events in Power Rectifiers
C
Cai, Li	Effect of gate oxide thickness on gate latent damage induced by heavy ion in SiC power MOSFETs
Cai, William	Failure mode competition and long-term reliability in the isothermal aging of sintered Cu joints
Cai, William	Improving Large-Area Sintering Reliability of Power Module Systems Using Copper Paste/Film
Calabretta, Michele	Reliability Assessment of SiC Power MOSFETs in Dynamic Reverse Bias Test
Canale Parola, Giovanni	The behavior of 350V GaN HEMTs during heavy ion irradiations
Canato, Eleonora	Evidence for double degradation regime in off-state stressed 100 V GaN transistors: from dielectric failure to subthreshold current increase
Cantù, Lorenzo	Impact of Device Encapsulation on the Time-Dependent Dielectric Breakdown in Polymeric Dielectrics for Galvanic Isolation
Cao, Qi	Active Gate Driver for Current Overshoot Suppression of SiC+Si Hybrid Switches with Dynamic gate Current Regulation
Capitaine, Armande	Performance characterization of lithium-ion battery and ageing under constant stress conditions at low temperature
Cappellini, Giacomo	Effect of Drain Field Plate design and 2DEG density on Dynamic-RON of 650V AlGaN/GaN HEMTs
Caria, Alessandro	Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures Hail damage investigation in heterojunction silicon photovoltaic modules: a real word case study Changes in the extraction and collection efficiency of GaN-based MQW solar cells under optical step-stress Evidence for Optically-Induced Degradation in CIGS Solar Cells Reliability analysis of high power LEDs for automotive: impact of current and temperature
Carlotto, Andrea	Study of Trapping Mechanisms Affecting AlGaN/GaN HEMTs adopting AlGaN Back-Barriers with Different Aluminum Concentrations
Carluccio, Roberta	Thermal ageing monitoring in Cu-Al intermetallic joints through electrical resistance drift: comparative study of lifetime potential in pure and alloyed copper wires
Carta, Simone	Electronics authentication using electrical measurements and machine learning
Castagna, Maria Eloisa	Effect of Drain Field Plate design and 2DEG density on Dynamic-RON of 650V AlGaN/GaN HEMTs Evidence for double degradation regime in off-state stressed 100 V GaN transistors: from dielectric failure to subthreshold current increase
Castellani, Niccolò	Reading reliability in 1S1R OTS+PCM devices based on Double Patterned Self Aligned structure
Castellaro, Thomas	Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures
Castellazzi, Alberto	A study of UIS ruggedness of mismatched paralleled SiC MOSFETs
Casu, Claudia	Evidence for Optically-Induced Degradation in CIGS Solar Cells
Catalano, Antonio Pio	A study of UIS ruggedness of mismatched paralleled SiC MOSFETs
Cavaliere, Alberto	Ultra-Fast recovery transients in GaN MIS-HEMT submitted to OFF State stress
Ceccarelli, Romain	Gate lifetime investigation at low temperature for p-GaN HEMT
Chachay, Lucas	Evaluation and thermal ageing of power semiconductor die attachment based on porous film electrodeposition
Chakraborty, Sajib	Aging Effects on Short-Circuit Peak Current Through Gate-oxide Degradation in SiC MOSFET
Chamoin, Ludovic	Physics informed Markov chains for remaining useful life prediction of wire bonds in power electronic modules
Chang, Chih-Yao	Toward understanding the impacts of dynamic Ron on the efficiency in GaN-based AC-DC flyback converter
Chang, Christophe	DC and RF aging test of AlGaN/GaN HEMT technology on SiC substrate
Chang, Jason	PBO Delamination and RDL Corrosion detection on WLCSP Package Products
Chen, Bang-Ren	Investigation of Trade-off between Switching Loss and Gate Overshoot in SiC MOSFETs by Driving Waveform Modification
Chen, Cen	Reliability prediction of multi-level power supply system based on failure precursor parameters
Chen, Han-Wei	Toward understanding the impacts of dynamic Ron on the efficiency in GaN-based AC-DC flyback converter
Chen, Hao	Reliability Prediction of Electronic Components based on Physical of Failure with Manufacturing Parameters Fluctuations
Chen, Qiyu	Effect of gate oxide thickness on gate latent damage induced by heavy ion in SiC power MOSFETs
Chen, Xueyong	Failure Analysis of Gold-plated Fuzz Button Contacts in Elevated Temperature
Chen, Xun	Evolution analysis of mechanical behavior of through‑silicon via under thermal cycling load
Chen, Yong	PBO Delamination and RDL Corrosion detection on WLCSP Package Products
Chini, Alessandro	Effect of Drain Field Plate design and 2DEG density on Dynamic-RON of 650V AlGaN/GaN HEMTs
Choi, Hongbin	Fast Reverse Engineering of Chips using Lasers, Focused Ion Beams, and Confocal and Scanning Electron Microscopy
Choi, Hyoungseuk	Development of Life Prediction Model based on Physics-of-Failure for Negative Temperature Coefficient Thermistor
Chrétien, Pascal	Aging impact of the SiC Mosfet gate dielectric
Chuang, Ming-Nan	Toward understanding the impacts of dynamic Ron on the efficiency in GaN-based AC-DC flyback converter
Cioni, Marcello	Effect of Drain Field Plate design and 2DEG density on Dynamic-RON of 650V AlGaN/GaN HEMTs
Coccetti, Fabio	Test Methodology for Short-Circuit Assessment Applied to Power SiC MOSFETs Dependence between the drain current saturation and short-circuit robustness of p-GaN HEMTs Gate lifetime investigation at low temperature for p-GaN HEMT
Codecasa, Lorenzo	A study of UIS ruggedness of mismatched paralleled SiC MOSFETs
Constant, Aurore	Effect of Drain Field Plate design and 2DEG density on Dynamic-RON of 650V AlGaN/GaN HEMTs
Cora, Giorgio	Selective Hardening of RISCV Soft-Processors for Space Applications
Cova, Paolo	Machine learning classification for failure analysis of smart spark plugs Evaluation with FEM Analysis of peak case non-rupture current for power devices working at very high current FEM-based development of novel 3D-printable plastic direct coolers for power semiconductor modules Aging modelling of Li-Ion Battery Systems based on accelerated tests Opening ceremony
Cui, Jiwen	Reliability detection and analysis of elliptical holes corresponding to defects in electrothermal environment
Curatola, Gilberto	Investigation of the long-term dynamic Rds(ON) variation and dynamic high temperature operating life test robustness of Schottky gate and ohmic gate GaN HEMT with comparable stress conditions
Czernohorsky, Malte	Electrical and reliability characterization with optimized extrapolation models of two- and three-dimensional Metal-Insulator-Metal decoupling capacitors with ZrAlxOy high-κ dielectric under BEoL-friendly conditions
Czerny, Bernhard	Lifetime model for wire bond degradation in power semiconductors based on accelerated mechanical testing and power cycling
Czurratis, Peter	Semi-supervised parameter estimation for Synthetic Aperture Focusing in Scanning Acoustic Microscopy for a 3D reconstruction of plastic molded electronic devices
D
D'Alessandro, Vincenzo	A Geometry-Scalable Electrothermal Compact Circuit Model of SiC MPS Diodes Accounting for the Snapback Mechanism: Application to Current Surge Events A study of UIS ruggedness of mismatched paralleled SiC MOSFETs
Dai, Wenxin	Series AC Arc Fault Diagnosis Method Based on Spectrogram and Deep Residual Network
Dal Re, Massimo	Machine learning classification for failure analysis of smart spark plugs
Dalla Ricca, Paolo	Power devices Failure Analysis Use Cases Using High voltage OBIRCh and EMMI workflows
Dammann, Michael	Reliability and Failure Analysis of AlGaN/GaN HEMT with NiPtAu and PtAu Gate
Daniele, Simone	Machine learning classification for failure analysis of smart spark plugs
Danković, Danijel	The effects of NBT stressing on later operation of power VDMOS transistors under normal conditions
Daudin, Remi	Evaluation and thermal ageing of power semiconductor die attachment based on porous film electrodeposition
Davidović, Vojkan	The effects of NBT stressing on later operation of power VDMOS transistors under normal conditions
De Matos, Magali	DC and RF aging test of AlGaN/GaN HEMT technology on SiC substrate
De Pieri, Francesco	Study of Trapping Mechanisms Affecting AlGaN/GaN HEMTs adopting AlGaN Back-Barriers with Different Aluminum Concentrations
De Rosa, Domenico	Solid failure analysis flow for the detection of the leakage current in MEMS gyroscope resonant system
De Santi, Carlo	Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures Hail damage investigation in heterojunction silicon photovoltaic modules: a real word case study Changes in the extraction and collection efficiency of GaN-based MQW solar cells under optical step-stress Evidence for Optically-Induced Degradation in CIGS Solar Cells Reliability analysis of high power LEDs for automotive: impact of current and temperature OFF-state Breakdown and Threshold Voltage Stability of Vertical GaN-on-Si Trench MOSFETs Evidence for double degradation regime in off-state stressed 100 V GaN transistors: from dielectric failure to subthreshold current increase Interface-related VTH Shift of SiC MOSFETs during Constant Current Stress extracted from Charge Pumping measurements Ultra-Fast recovery transients in GaN MIS-HEMT submitted to OFF State stress Study of Trapping Mechanisms Affecting AlGaN/GaN HEMTs adopting AlGaN Back-Barriers with Different Aluminum Concentrations
De Santi, Carlo	Impact of drain-source leakage on the dynamic Ron of power HEMTs with p-GaN gate
De Sio, Corrado	Selective Hardening of RISCV Soft-Processors for Space Applications
Deb, Arkadeep	Long-Term Positive and Negative Gate Bias Stress Tests on Parallel Connected SiC MOSFETs at -40°C and 175°C
Debbadi, Karthik	Multi-sensor Data Fusion for Prediction of Remaining Useful Life of IGBT Power Modules
Dedew, Mohamed Lemine	Dependence between the drain current saturation and short-circuit robustness of p-GaN HEMTs
Degrenne, Nicolas	Effect of load sequence interaction for low ∆Tj's on the reliability of bonded aluminium wires in IGBTs
Della Marca, Vincenzo	New statistical analysis methodology to forecast the memory cell behavior before reliability test
Dellasega, David	Thermal ageing monitoring in Cu-Al intermetallic joints through electrical resistance drift: comparative study of lifetime potential in pure and alloyed copper wires
Delmonte, Nicola	Machine learning classification for failure analysis of smart spark plugs Evaluation with FEM Analysis of peak case non-rupture current for power devices working at very high current FEM-based development of novel 3D-printable plastic direct coolers for power semiconductor modules Aging modelling of Li-Ion Battery Systems based on accelerated tests
Demunari, Ilaria	Aging modelling of Li-Ion Battery Systems based on accelerated tests
Devarajulu, Hemachandar Tanukonda	Localization enhancement in quantitative thermal lock-in analysis using spatial phase evaluation
Dissegna, Mariano	Optimization of the drain-side configuration in ESD-protection SCR-LDMOS for high holding-voltage applications
Djelassi-Tscheck, Christian	SMART Protection Design of Automotive Power Distribution Systems with Temperature-Based Electronic Fuses: Mathematical Background, Design Guidelines and Drawbacks of Energy-Based Methods
Doering, Stefan	Improved 2D charge carrier quantification workflow for scanning spreading resistance microscopy
Dong, Yi-Jun	Investigation of Trade-off between Switching Loss and Gate Overshoot in SiC MOSFETs by Driving Waveform Modification
Dreier, Till	Fast high-resolution X-ray nano tomography for failure analysis in advanced packaging
Dresel, Fabian	Gate voltage modulation for power cycling tests of SiC MOSFETs and its influence on temperature distribution High AC load current testing method for power capacitors
Driad, Rachid	Reliability and Failure Analysis of AlGaN/GaN HEMT with NiPtAu and PtAu Gate
Du, He	Lifetime model for wire bond degradation in power semiconductors based on accelerated mechanical testing and power cycling
Dubois, Tristan	DC and RF aging test of AlGaN/GaN HEMT technology on SiC substrate
Duchemin, Hélène	Sorption getter characterization under wafer-level packaging (WLP) conditions
E
Eckardt, Bernd	Gate voltage modulation for power cycling tests of SiC MOSFETs and its influence on temperature distribution On the Validity of Rainflow Counting-Based Lifetime Assessment for Power Electronics Assembly
Eckardt, Bernd	High AC load current testing method for power capacitors
Eckel, Hans-Günter	Lifetime prediction for power modules in wind-energy converters based on temperature variations in a large area substrate solder connection
Elangovan, Surya	Investigation of Trade-off between Switching Loss and Gate Overshoot in SiC MOSFETs by Driving Waveform Modification
Eloued, Sonia	Development challenges of a one-sided GaN-based high-current density buck converter through multiphysics optimization for electric vehicle applications
Eng, Lukas M.	Improved 2D charge carrier quantification workflow for scanning spreading resistance microscopy
Enichlmair, Hubert	Evaluation of the Impact of Body Bias on the Threshold Voltage Drift of SiO2 Transistors
Ermisch, Karsten	Methodology to estimate the impact of Single Event Transients in Logic
Eto, Motoki	Understanding improved pitting corrosion resistance under high temperature application leading to a newly developed palladium coated copper wire
Eustache, Etienne	On the electrical properties of ALD HfO2 dielectric films for MEMS capacitive switches.
F
Falidas, Konstantinos Efstathios	Electrical and reliability characterization with optimized extrapolation models of two- and three-dimensional Metal-Insulator-Metal decoupling capacitors with ZrAlxOy high-κ dielectric under BEoL-friendly conditions
Famaey, Jeroen	C-SMART: A preprocessor for neural network performance and reliability under radiation
Fan, Zhengwei	Evolution analysis of mechanical behavior of through‑silicon via under thermal cycling load
Farnbacher, Lukas R.	Gate voltage modulation for power cycling tests of SiC MOSFETs and its influence on temperature distribution
Favero, Davide	Impact of drain-source leakage on the dynamic Ron of power HEMTs with p-GaN gate
Favero, Davide	OFF-state Breakdown and Threshold Voltage Stability of Vertical GaN-on-Si Trench MOSFETs
Favrichon, Julien	The Use of Filtered High-Energy X-rays and 60Co for TID Testing of a 32-Bit 28nm FDSOI DSP
Fellouh, Leïla	Reading reliability in 1S1R OTS+PCM devices based on Double Patterned Self Aligned structure
Feng, Mingtao	Reliability prediction of multi-level power supply system based on failure precursor parameters
Fiore, Michele	Reliability Assessment of SiC Power MOSFETs in Dynamic Reverse Bias Test
Fornari, Roberto	Numerical simulation of current uniformity in Ga2O3 planar diodes and its effect on temperature field and device reliability
Fraccaroli, Riccardo	Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures Reliability analysis of high power LEDs for automotive: impact of current and temperature Evidence for double degradation regime in off-state stressed 100 V GaN transistors: from dielectric failure to subthreshold current increase
Fregolent, Manuel	OFF-state Breakdown and Threshold Voltage Stability of Vertical GaN-on-Si Trench MOSFETs Study of Trapping Mechanisms Affecting AlGaN/GaN HEMTs adopting AlGaN Back-Barriers with Different Aluminum Concentrations
Fregolent, Manuel	Evidence for double degradation regime in off-state stressed 100 V GaN transistors: from dielectric failure to subthreshold current increase
Frey, Pascal	Test Methodology for Short-Circuit Assessment Applied to Power SiC MOSFETs
G
Galderisi, Giulio	(IPFA 2024 Best Paper) Reliability of Reconfigurable Field Effect Transistors: Early Analysis of Bias Temperature Instability
Gan, Chee Lip	Comprehensive LED Reliability Assessment through Integrated Real-Time Visualization, Electrical, and Optical Analysis
Gao, Chenhe	Synergistic Effect of Total Ionizing Dose and Electromagnetic Interference in SRAM using 22nm FDSOI technology
Gao, Hongyi	Stress comparison of several short-circuit types on SiC MOSFET packaging
Gao, Junpeng	Thermal layout optimization of electrolytic capacitors considering degradation self-acceleration effect for reliability improvement
Gao, Yu	Comprehensive LED Reliability Assessment through Integrated Real-Time Visualization, Electrical, and Optical Analysis
Gao, Yue	Failure mode competition and long-term reliability in the isothermal aging of sintered Cu joints
Gardelis, Spiros	Evidence of resistive switching in SiNx thin films for MEMS capacitors: the role of metal contacts
Georgakos, Georg	Methodology to estimate the impact of Single Event Transients in Logic
Gerardin, Simone	(Invited) Non-volatile Memories for the Space Environment: Ionizing Radiation Effects
Ghizzo, Lucien	Low-Voltage Schottky p-GaN HEMT Properties under Extreme Repetitive Short-Circuit Operation Conditions : 2DEG Pinch-off, Stability, Aging, Robustness and Failure-Modes Analysis
Ghrabli, Mehdi	Physics informed Markov chains for remaining useful life prediction of wire bonds in power electronic modules
Gigandet, Marie-Pierre	Evaluation and thermal ageing of power semiconductor die attachment based on porous film electrodeposition
Giorgino, Giovanni	Effect of Drain Field Plate design and 2DEG density on Dynamic-RON of 650V AlGaN/GaN HEMTs
Gironés, Vincent	The Use of Filtered High-Energy X-rays and 60Co for TID Testing of a 32-Bit 28nm FDSOI DSP
Gnani, Elena	Optimization of the drain-side configuration in ESD-protection SCR-LDMOS for high holding-voltage applications
Gopishetti, Anusha	Wire bonding failure characterization of an IGBT based power module through impedance analysis
Gossner, Harald	(Keynote) The Reliability Perspective of the Advanced CMOS Roadmap
Gout, Sylvain	Reading reliability in 1S1R OTS+PCM devices based on Double Patterned Self Aligned structure
Goyal, Deepak	Localization enhancement in quantitative thermal lock-in analysis using spatial phase evaluation
Graff, Andreas	Reliability and Failure Analysis of AlGaN/GaN HEMT with NiPtAu and PtAu Gate
Grasser, Tibor	Evaluation of the Impact of Body Bias on the Threshold Voltage Drift of SiO2 Transistors
Greatti, Matteo	Impact of Device Encapsulation on the Time-Dependent Dielectric Breakdown in Polymeric Dielectrics for Galvanic Isolation
Grosse, Christian	Localization enhancement in quantitative thermal lock-in analysis using spatial phase evaluation
Guarino, Lucrezia	Thermal ageing monitoring in Cu-Al intermetallic joints through electrical resistance drift: comparative study of lifetime potential in pure and alloyed copper wires
Gullone, Giorgio	(Keynote) Battery Diagnostics and Virtual Sensors in Ferrari
Guo, Jianshe	Failure Analysis of Gold-plated Fuzz Button Contacts in Elevated Temperature
Guo, Zhihao	Microstructure-based fatigue analysis of SiC power module with sintered silver die attach
Guo, Zijian	Reliability Prediction of Electronic Components based on Physical of Failure with Manufacturing Parameters Fluctuations
Gustin, Wolfgang	Methodology to estimate the impact of Single Event Transients in Logic
Gwoziecki, Romain	Optimized Semi-Physical EKV Model for Simulation of SiC MOSFETs
H
Haibara, Teruo	Understanding improved pitting corrosion resistance under high temperature application leading to a newly developed palladium coated copper wire
Halouani, Ayda	Effect of load sequence interaction for low ∆Tj's on the reliability of bonded aluminium wires in IGBTs
Hammouda, Mahmoud	Conducted EMI Assessment of Aging Power Si-MOSFET in 3 phase inverter
Han, Seung Su	Reliability Assurance in Foldable Displays: Design of Experiment-Based Testing Strategy for Market-Ready Products
Han, Yunseok	Efficient Long-term Reliability Assessment of Planar InGaAs/InP Avalanche Photodiodes using Accelerated Step-Stress Test Degradation Modeling of InGaAs/InP Avalanche Photodiodes using Calibrated Technology Computer-aided Design
Hantos, Gusztáv	Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures
Harrouche, Kathia	Nonlinear modelling of AlN/GaN HEMT accounting for Self-biasing effect during RF step stress: analysis and Hard-SOA
Hasegawa, Kazunori	A Submodule Capacitor Degradation Balancing Control with Capacitor Parameter Monitoring of a Modular Multilevel Converter for a Battery Energy Storage System Condition Monitoring of a DC-Link Capacitor in an Inverter with a front-end diode rectifier under Imbalanced Three-phase Supply Voltage Analysis and experimental verification of current sharing among parallel-connected dc-link capacitors in a fast-switching converter
Hegazy, Omar	Aging Effects on Short-Circuit Peak Current Through Gate-oxide Degradation in SiC MOSFET
Hegedüs, János	Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures
Heimler, Patrick	Advanced Power Cycling Test Strategies on Discrete SiC MOSFETs in Different Operating Modes and the Impact on Life-time Reliability of Discrete SiC MOSFETs under Temperature-Shock and Power Cycling Tests Threshold Voltage Hysteresis Investigation of SiC MOSFETs with Different Structures under Various Measurement Conditions
Hein, Lukas	Advanced Power Cycling Test Strategies on Discrete SiC MOSFETs in Different Operating Modes and the Impact on Life-time
Heise, Tobias	Lifetime prediction for power modules in wind-energy converters based on temperature variations in a large area substrate solder connection
Heitmann, Johannes	Electrical and reliability characterization with optimized extrapolation models of two- and three-dimensional Metal-Insulator-Metal decoupling capacitors with ZrAlxOy high-κ dielectric under BEoL-friendly conditions
Heldwein, Marcelo	Investigation of the long-term dynamic Rds(ON) variation and dynamic high temperature operating life test robustness of Schottky gate and ohmic gate GaN HEMT with comparable stress conditions
Henneken, Lothar	Solder Stop as a Reliable Insulation Layer on Printed Circuit Boards – Different Layouts and Materials under Humidity and High Voltage
Hihn, Jean-Yves	Evaluation and thermal ageing of power semiconductor die attachment based on porous film electrodeposition
Ho, Cheng-Tsung	Toward understanding the impacts of dynamic Ron on the efficiency in GaN-based AC-DC flyback converter
Hoang, Minh Long	Machine learning classification for failure analysis of smart spark plugs
Hofer, Anton Marco	Improved CV characterization technique for interface state evaluation in Si3N4/n-GaN MIS Capacitors
Hoffrogge, Peter	Semi-supervised parameter estimation for Synthetic Aperture Focusing in Scanning Acoustic Microscopy for a 3D reconstruction of plastic molded electronic devices
Hosseinabadi, Farzad	Aging Effects on Short-Circuit Peak Current Through Gate-oxide Degradation in SiC MOSFET
Hou, Kaihong	Evolution analysis of mechanical behavior of through‑silicon via under thermal cycling load
Hsiao, Yi-Kai	Investigation of Trade-off between Switching Loss and Gate Overshoot in SiC MOSFETs by Driving Waveform Modification
Hsiao, Yu-Sheng	Investigation of Trade-off between Switching Loss and Gate Overshoot in SiC MOSFETs by Driving Waveform Modification
Hsieh, Hsing-Hua	Toward understanding the impacts of dynamic Ron on the efficiency in GaN-based AC-DC flyback converter
Hsiung, Chih-Wen	Toward understanding the impacts of dynamic Ron on the efficiency in GaN-based AC-DC flyback converter
Hsu, Huang-Pin	Toward understanding the impacts of dynamic Ron on the efficiency in GaN-based AC-DC flyback converter
Hu, Peipei	Effect of gate oxide thickness on gate latent damage induced by heavy ion in SiC power MOSFETs
Hu, Xiaofei	Online Junction Temperature Monitoring of SiC MOSFET Based On The Maximum Drain Current Change Rate During The Process of Opening
Hu, Yifan	Reliability Prediction of Electronic Components based on Physical of Failure with Manufacturing Parameters Fluctuations
Huang, Ambrogio	Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures
Huber, Christian	OFF-state Breakdown and Threshold Voltage Stability of Vertical GaN-on-Si Trench MOSFETs
Huber, Toni	Methodology to estimate the impact of Single Event Transients in Logic
Hussain, Muhammad Aitezaz	Impact of Constant and Pulsed Active Balancing Current Patterns on the Aging of Lithium-ion Batteries
Hållstedt, Julius	Fast high-resolution X-ray nano tomography for failure analysis in advanced packaging
Hübner, Susanne	Reliability and Failure Analysis of AlGaN/GaN HEMT with NiPtAu and PtAu Gate
I
Iannuzzo, Francesco	Power Cycling Results of Cascode GaN Devices – Separate Analysis of Performance Degradation for Si/GaN parts and Lifetime Model Separate Investigation of Performance Degradation for the Si and GaN parts in Cascode GaN devices under Repetitive Short Circuits Stress comparison of several short-circuit types on SiC MOSFET packaging Lifetime model for wire bond degradation in power semiconductors based on accelerated mechanical testing and power cycling
Ibrahim, Ali	New Temperature-Independent Aging Indicator for power semiconductor devices – application to IGBTs Effect of load sequence interaction for low ∆Tj's on the reliability of bonded aluminium wires in IGBTs
Illing, Robert	SMART Protection Design of Automotive Power Distribution Systems with Temperature-Based Electronic Fuses: Mathematical Background, Design Guidelines and Drawbacks of Energy-Based Methods
Indmeskine, Fatima-Ezahra	Design-of-Experiments and ALT plan for reliability qualification of chip resistors based on mission profile of AIMDs
Ingrosso, Damien	Effect of load sequence interaction for low ∆Tj's on the reliability of bonded aluminium wires in IGBTs
Ioannidis, Eleftherios G.	Evaluation of the Impact of Body Bias on the Threshold Voltage Drift of SiO2 Transistors
Irace, Andrea	A Geometry-Scalable Electrothermal Compact Circuit Model of SiC MPS Diodes Accounting for the Snapback Mechanism: Application to Current Surge Events (Invited) Out-of-SOA Electrothermal Limitations of Power Semiconductor Devices: Characterization and Modeling
Itoh, Jun-Ichi	A Submodule Capacitor Degradation Balancing Control with Capacitor Parameter Monitoring of a Modular Multilevel Converter for a Battery Energy Storage System
Iucolano, Ferdinando	Effect of Drain Field Plate design and 2DEG density on Dynamic-RON of 650V AlGaN/GaN HEMTs Evidence for double degradation regime in off-state stressed 100 V GaN transistors: from dielectric failure to subthreshold current increase
J
Jaffré, Alexandre	Aging impact of the SiC Mosfet gate dielectric
Jahdi, Saeed	Long-Term Positive and Negative Gate Bias Stress Tests on Parallel Connected SiC MOSFETs at -40°C and 175°C
Janod, Goulven	Evaluation and thermal ageing of power semiconductor die attachment based on porous film electrodeposition
Jellema, Edwin	ESD Human Body Model step stress distributions of GaN HEMTs and the correlation with one level test results
Jeong, Jae-Seong	Creep tester for quality assessment of solder joints using normal and thermal stress
Jeong, Ui Hyo	Reliability Assurance in Foldable Displays: Design of Experiment-Based Testing Strategy for Market-Ready Products
Ji, Chensong	Degradation model for insulation characteristics of tantalum capacitors related to manufacturing parameters and stress
Jiang, Han	Microstructure-based fatigue analysis of SiC power module with sintered silver die attach
Jiang, Yu	Evolution analysis of mechanical behavior of through‑silicon via under thermal cycling load
Jiao, Yang	Effect of gate oxide thickness on gate latent damage induced by heavy ion in SiC power MOSFETs
Jimenez, Juan	About the influence of temperature operation and packaging stress on the threshold for catastrophic optical damage in laser diodes
Jo, Eunjin	Risk of CuxO phase penetration between the Ag plating layer and Cu during high-temperature reliability testing of interfaces bonded to cold sintered Ag nano-porous sheets on direct Ag-plated Cu substrates
Johnson, Greg	GaN defect detection and analysis using electrical probing, EBAC, EBIC and EBIRCH
Joshi, Saumya	Methodology to estimate the impact of Single Event Transients in Logic
Jovanović, Igor	The effects of NBT stressing on later operation of power VDMOS transistors under normal conditions
Ju, Byeong Kwon	Risk of CuxO phase penetration between the Ag plating layer and Cu during high-temperature reliability testing of interfaces bonded to cold sintered Ag nano-porous sheets on direct Ag-plated Cu substrates
Justus Rajappa, Anuj	C-SMART: A preprocessor for neural network performance and reliability under radiation
K
Kadi, Moncef	Development challenges of a one-sided GaN-based high-current density buck converter through multiphysics optimization for electric vehicle applications Conducted EMI Assessment of Aging Power Si-MOSFET in 3 phase inverter
Kaminski, Nando	Solder Stop as a Reliable Insulation Layer on Printed Circuit Boards – Different Layouts and Materials under Humidity and High Voltage
Karanja, Liz	Crack propagation in ultrasonic-bonded copper wires investigated by power cycling and accelerated mechanical fatigue interconnection test methods
Kempf, Thibault	New statistical analysis methodology to forecast the memory cell behavior before reliability test
Keßler, Ulrich	Degradation mode analysis of Cu bond wires on Cu plated SiC power semiconductors stressed by active power cycling
Khatibi, Golta	Lifetime model for wire bond degradation in power semiconductors based on accelerated mechanical testing and power cycling
Khatir, Zoubir	New Temperature-Independent Aging Indicator for power semiconductor devices – application to IGBTs
Khatir, Zoubir	Optimized Semi-Physical EKV Model for Simulation of SiC MOSFETs Effect of load sequence interaction for low ∆Tj's on the reliability of bonded aluminium wires in IGBTs
Khazaka, Rabih	Evaluation and thermal ageing of power semiconductor die attachment based on porous film electrodeposition
Kilian, Borja	Degradation mode analysis of Cu bond wires on Cu plated SiC power semiconductors stressed by active power cycling
Kim, Dajung	Enhancing Long-Term Thermal Reliability of Sintered Joints through the Use of Silver-Coated Copper Particles
Kim, Dongjin	Heat-resistant durability of AMB substrates for SiC power devices: AlN and Si3N4, which one is thermally strong? Risk of CuxO phase penetration between the Ag plating layer and Cu during high-temperature reliability testing of interfaces bonded to cold sintered Ag nano-porous sheets on direct Ag-plated Cu substrates
Kim, Jaeup	Risk of CuxO phase penetration between the Ag plating layer and Cu during high-temperature reliability testing of interfaces bonded to cold sintered Ag nano-porous sheets on direct Ag-plated Cu substrates
Kim, Jemin	Thermal Performance Comparison of Wide Bandgap Power Modules by Simulation
Kim, Shin-il	Heat-resistant durability of AMB substrates for SiC power devices: AlN and Si3N4, which one is thermally strong?
Kim, Sunho	Efficient Long-term Reliability Assessment of Planar InGaAs/InP Avalanche Photodiodes using Accelerated Step-Stress Test Degradation Modeling of InGaAs/InP Avalanche Photodiodes using Calibrated Technology Computer-aided Design
Kim, Yehri	Risk of CuxO phase penetration between the Ag plating layer and Cu during high-temperature reliability testing of interfaces bonded to cold sintered Ag nano-porous sheets on direct Ag-plated Cu substrates
Kim, Yong-Mo	Heat-resistant durability of AMB substrates for SiC power devices: AlN and Si3N4, which one is thermally strong?
Kim, Yujin	Enhancing AC Degradation Modeling by Considering the Degradation Profile in SiON pMOSFETs
Kim, Yun-Chan	Heat-resistant durability of AMB substrates for SiC power devices: AlN and Si3N4, which one is thermally strong?
Klengel, Robert	Understanding improved pitting corrosion resistance under high temperature application leading to a newly developed palladium coated copper wire
Klengel, Sandy	Understanding improved pitting corrosion resistance under high temperature application leading to a newly developed palladium coated copper wire
Knobloch, Theresia	Evaluation of the Impact of Body Bias on the Threshold Voltage Drift of SiO2 Transistors
Ko, Seungbum	Vertically Scaled Cu/low-k Interconnect Development for BEOL Reliability Improvement of 12nm DRAM
Kobi, Abdessamad	Design-of-Experiments and ALT plan for reliability qualification of chip resistors based on mission profile of AIMDs
Kolkovsky, Vladimir	Charging effects in alumina layers deposited with different precursors for microelectronic applications
Koller, Christian	Analyzing the role of hole injection on the short circuit performance of p-GaN gate power HEMTs Improved CV characterization technique for interface state evaluation in Si3N4/n-GaN MIS Capacitors
Konstanzer, Helmer	Reliability and Failure Analysis of AlGaN/GaN HEMT with NiPtAu and PtAu Gate
Krause, Sebastian	Reliability and Failure Analysis of AlGaN/GaN HEMT with NiPtAu and PtAu Gate
Krinke, Jörg	Semi-supervised parameter estimation for Synthetic Aperture Focusing in Scanning Acoustic Microscopy for a 3D reconstruction of plastic molded electronic devices
Kuo, Hao-Chung	Investigation of Trade-off between Switching Loss and Gate Overshoot in SiC MOSFETs by Driving Waveform Modification
Kupsch, Christian	Semi-supervised parameter estimation for Synthetic Aperture Focusing in Scanning Acoustic Microscopy for a 3D reconstruction of plastic molded electronic devices
Kögel, Michael	Localization enhancement in quantitative thermal lock-in analysis using spatial phase evaluation
Kühnel, Kati	Electrical and reliability characterization with optimized extrapolation models of two- and three-dimensional Metal-Insulator-Metal decoupling capacitors with ZrAlxOy high-κ dielectric under BEoL-friendly conditions
L
Labat, Nathalie	Nonlinear modelling of AlN/GaN HEMT accounting for Self-biasing effect during RF step stress: analysis and Hard-SOA DC and RF aging test of AlGaN/GaN HEMT technology on SiC substrate
Lallemand, Richard	New Temperature-Independent Aging Indicator for power semiconductor devices – application to IGBTs Effect of load sequence interaction for low ∆Tj's on the reliability of bonded aluminium wires in IGBTs
Lambert, Benoit	DC and RF aging test of AlGaN/GaN HEMT technology on SiC substrate
Lauria, Michele	Impact of Device Encapsulation on the Time-Dependent Dielectric Breakdown in Polymeric Dielectrics for Galvanic Isolation
Lazzaroni, Massimo	Issues of electronic devices in hostile environment
Le, Thanh Long	Dependence between the drain current saturation and short-circuit robustness of p-GaN HEMTs Wire bonding failure characterization of an IGBT based power module through impedance analysis
Lee, Guesuk	Thermal Performance Comparison of Wide Bandgap Power Modules by Simulation
Lee, Jaehyeong	Vertically Scaled Cu/low-k Interconnect Development for BEOL Reliability Improvement of 12nm DRAM
Lee, Kenneth Eng Kian	Comprehensive LED Reliability Assessment through Integrated Real-Time Visualization, Electrical, and Optical Analysis
Lee, Namhyun	Vertically Scaled Cu/low-k Interconnect Development for BEOL Reliability Improvement of 12nm DRAM
Lee, Yoongul	Risk of CuxO phase penetration between the Ag plating layer and Cu during high-temperature reliability testing of interfaces bonded to cold sintered Ag nano-porous sheets on direct Ag-plated Cu substrates
Lee, Young-Yun	Vertically Scaled Cu/low-k Interconnect Development for BEOL Reliability Improvement of 12nm DRAM
Lee, Yumi	Vertically Scaled Cu/low-k Interconnect Development for BEOL Reliability Improvement of 12nm DRAM
Lee, Yunsung	Vertically Scaled Cu/low-k Interconnect Development for BEOL Reliability Improvement of 12nm DRAM
Lefebvre, Stéphane	Dependence between the drain current saturation and short-circuit robustness of p-GaN HEMTs
Legros, Marc	Crack propagation in ultrasonic-bonded copper wires investigated by power cycling and accelerated mechanical fatigue interconnection test methods
Leib, Jürgen	Gate voltage modulation for power cycling tests of SiC MOSFETs and its influence on temperature distribution On the Validity of Rainflow Counting-Based Lifetime Assessment for Power Electronics Assembly High AC load current testing method for power capacitors
Lentzsch, Tobias	Advanced Power Cycling Test Strategies on Discrete SiC MOSFETs in Different Operating Modes and the Impact on Life-time The impact of mold compound on power cycling capability of SiC MOSFETs in double sided cooled modules
Letz, Sebastian	On the Validity of Rainflow Counting-Based Lifetime Assessment for Power Electronics Assembly
Li, Binhong	Synergistic Effect of Total Ionizing Dose and Electromagnetic Interference in SRAM using 22nm FDSOI technology
Li, Donghui	Degradation model for insulation characteristics of tantalum capacitors related to manufacturing parameters and stress
Li, Hong	A Floquet Theory-Based Stability Analysis Method for PV-Storage Independent DC Microgrid Online Junction Temperature Monitoring of SiC MOSFET Based On The Maximum Drain Current Change Rate During The Process of Opening Reliability Design of GaN Based High-frequency Inverter Optimization
Li, Jianzhong	Synergistic Effect of Total Ionizing Dose and Electromagnetic Interference in SRAM using 22nm FDSOI technology
Li, Ke	Improving Large-Area Sintering Reliability of Power Module Systems Using Copper Paste/Film Failure mode competition and long-term reliability in the isothermal aging of sintered Cu joints
Li, Pengwei	Single Event Irradiation Damage Effect of SiC MOSFETs Based on Degradation of Forward Conduction Characteristic
Li, Wuhua	Stress comparison of several short-circuit types on SiC MOSFET packaging
Li, Xingji	The Effect of Trench Depth on Single-Event Burnout Hardening of Split-Gate-Trench MOSFET Single Event Irradiation Damage Effect of SiC MOSFETs Based on Degradation of Forward Conduction Characteristic
Li, Xinyu	Effect of gate oxide thickness on gate latent damage induced by heavy ion in SiC power MOSFETs
Li, Yang	Synergistic Effect of Total Ionizing Dose and Electromagnetic Interference in SRAM using 22nm FDSOI technology
Li, Yang	A New Methodology of Modeling Conducted Emission Behavioural in System-in-Packages (SiP)
Liang, Huimin	Remaining Useful Life Prediction of DC Contactor Based on LSTM
Liang, Shuibao	Microstructure-based fatigue analysis of SiC power module with sintered silver die attach
Lim, Seongyong	Reliability Assurance in Foldable Displays: Design of Experiment-Based Testing Strategy for Market-Ready Products
Lin, Wei-Cheng	Investigation of Trade-off between Switching Loss and Gate Overshoot in SiC MOSFETs by Driving Waveform Modification
Lindner, Achim	Numerical study of critical filler particle to chip interaction on an automotive Hall sensor
Ling, Sanqiang	Failure Analysis of Gold-plated Fuzz Button Contacts in Elevated Temperature
Lipák, Gyula	Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures
Liserre, Marco	Multi-sensor Data Fusion for Prediction of Remaining Useful Life of IGBT Power Modules
Liu, Datong	Spacecraft Sensor Reliability Improvement Based On Temporal Digital Twin Model
Liu, Fengkai	The Effect of Trench Depth on Single-Event Burnout Hardening of Split-Gate-Trench MOSFET
Liu, Jie	Effect of gate oxide thickness on gate latent damage induced by heavy ion in SiC power MOSFETs
Liu, Peiguo	A New Methodology of Modeling Conducted Emission Behavioural in System-in-Packages (SiP)
Liu, Ping	Active Gate Driver for Current Overshoot Suppression of SiC+Si Hybrid Switches with Dynamic gate Current Regulation
Liu, Shuo	The Effect of Trench Depth on Single-Event Burnout Hardening of Split-Gate-Trench MOSFET
Liu, Sushi	Failure mode competition and long-term reliability in the isothermal aging of sintered Cu joints
Liu, Weiming	Reliability prediction of multi-level power supply system based on failure precursor parameters
Liu, Yang	Failure mode competition and long-term reliability in the isothermal aging of sintered Cu joints
Liu, Yang	Improving Large-Area Sintering Reliability of Power Module Systems Using Copper Paste/Film
Liu, Yongjie	Active Gate Driver for Current Overshoot Suppression of SiC+Si Hybrid Switches with Dynamic gate Current Regulation
Liu, Yuzhu	Effect of gate oxide thickness on gate latent damage induced by heavy ion in SiC power MOSFETs
Liu, Zhongli	The Effect of Trench Depth on Single-Event Burnout Hardening of Split-Gate-Trench MOSFET
Longato, Simone	Impact of drain-source leakage on the dynamic Ron of power HEMTs with p-GaN gate
Losacco, Gabriele	Thermal ageing monitoring in Cu-Al intermetallic joints through electrical resistance drift: comparative study of lifetime potential in pure and alloyed copper wires
Lu, Jicun	Improving Large-Area Sintering Reliability of Power Module Systems Using Copper Paste/Film
Lu, Yanfang	A New Methodology of Modeling Conducted Emission Behavioural in System-in-Packages (SiP)
Lu, Zhebie	Power Cycling Results of Cascode GaN Devices – Separate Analysis of Performance Degradation for Si/GaN parts and Lifetime Model Separate Investigation of Performance Degradation for the Si and GaN parts in Cascode GaN devices under Repetitive Short Circuits
Luca, Denise	System in package: Advanced FA Techniques to Minimize Analysis Time and Cost
Luo, Haoze	Stress comparison of several short-circuit types on SiC MOSFET packaging
Luo, Jun	Synergistic Effect of Total Ionizing Dose and Electromagnetic Interference in SRAM using 22nm FDSOI technology
Lupena, Francis Nikolai	Failure investigation on an embedded Schottky Barrier Diode due to an inhomogeneous silicide formation
Lutz, Josef	Advanced Power Cycling Test Strategies on Discrete SiC MOSFETs in Different Operating Modes and the Impact on Life-time Reliability of Discrete SiC MOSFETs under Temperature-Shock and Power Cycling Tests The impact of mold compound on power cycling capability of SiC MOSFETs in double sided cooled modules Threshold Voltage Hysteresis Investigation of SiC MOSFETs with Different Structures under Various Measurement Conditions
Lv, Xiaochun	Improving Large-Area Sintering Reliability of Power Module Systems Using Copper Paste/Film Failure mode competition and long-term reliability in the isothermal aging of sintered Cu joints
M
Ma, Byongjin	Thermal Performance Comparison of Wide Bandgap Power Modules by Simulation
Ma, Hangyu	Remaining Useful Life Prediction of DC Contactor Based on LSTM
Magnien, Julien	Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures
Mahjoub, Aymen	On the electrical properties of ALD HfO2 dielectric films for MEMS capacitive switches.
Mahyari, Parisa	Fast Reverse Engineering of Chips using Lasers, Focused Ion Beams, and Confocal and Scanning Electron Microscopy
Malavena, Gerardo	Impact of Device Encapsulation on the Time-Dependent Dielectric Breakdown in Polymeric Dielectrics for Galvanic Isolation
Malbert, Nathalie	Nonlinear modelling of AlN/GaN HEMT accounting for Self-biasing effect during RF step stress: analysis and Hard-SOA DC and RF aging test of AlGaN/GaN HEMT technology on SiC substrate
Mancaleoni, Alberto	Thermal ageing monitoring in Cu-Al intermetallic joints through electrical resistance drift: comparative study of lifetime potential in pure and alloyed copper wires
Maniar, Youssef	Degradation mode analysis of Cu bond wires on Cu plated SiC power semiconductors stressed by active power cycling
Maniscalco, Matthew	Fast Reverse Engineering of Chips using Lasers, Focused Ion Beams, and Confocal and Scanning Electron Microscopy
Mannen, Tomoyuki	Degradation of SiC-MOSFETs Utilized in Bidirectional Switch for Grid Applications Under Over Current Stress
Maraine, Tadec	The Use of Filtered High-Energy X-rays and 60Co for TID Testing of a 32-Bit 28nm FDSOI DSP
Marano, Vincenzo	Impact of Device Encapsulation on the Time-Dependent Dielectric Breakdown in Polymeric Dielectrics for Galvanic Isolation
Marceau, Hélène	Design-of-Experiments and ALT plan for reliability qualification of chip resistors based on mission profile of AIMDs
Marcuzzi, Alberto	Interface-related VTH Shift of SiC MOSFETs during Constant Current Stress extracted from Charge Pumping measurements
Martano, Emanuele	The behavior of 350V GaN HEMTs during heavy ion irradiations
Martin, Simon	Reading reliability in 1S1R OTS+PCM devices based on Double Patterned Self Aligned structure
Martins, Paolo	On the electrical properties of ALD HfO2 dielectric films for MEMS capacitive switches.
Matmat, Mohamed	Gate lifetime investigation at low temperature for p-GaN HEMT
Mauromicale, Giuseppe	Reliability Assessment of SiC Power MOSFETs in Dynamic Reverse Bias Test
Mawby, Phil	Long-Term Positive and Negative Gate Bias Stress Tests on Parallel Connected SiC MOSFETs at -40°C and 175°C
May, Nicholas	Fast Reverse Engineering of Chips using Lasers, Focused Ion Beams, and Confocal and Scanning Electron Microscopy
Mazzer, Massimo	Evidence for Optically-Induced Degradation in CIGS Solar Cells
Mazzola, Jurij Lorenzo	Impact of Device Encapsulation on the Time-Dependent Dielectric Breakdown in Polymeric Dielectrics for Galvanic Isolation
Medda, Matteo	PBO Delamination and RDL Corrosion detection on WLCSP Package Products
Medjdoub, Farid	Nonlinear modelling of AlN/GaN HEMT accounting for Self-biasing effect during RF step stress: analysis and Hard-SOA
Meier, Markus	Solder Stop as a Reliable Insulation Layer on Printed Circuit Boards – Different Layouts and Materials under Humidity and High Voltage
Meli, Valentina	Reading reliability in 1S1R OTS+PCM devices based on Double Patterned Self Aligned structure
Melis, Tommaso	Laser voltage probing and simulation of a flip-flop with undesired quasi-static switching
Menditto, Rosina	Methodology to estimate the impact of Single Event Transients in Logic
Meneghesso, Gaudenzio	Evidence for Optically-Induced Degradation in CIGS Solar Cells GaN reliability: from technological considerations to failure processes OFF-state Breakdown and Threshold Voltage Stability of Vertical GaN-on-Si Trench MOSFETs Interface-related VTH Shift of SiC MOSFETs during Constant Current Stress extracted from Charge Pumping measurements Study of Trapping Mechanisms Affecting AlGaN/GaN HEMTs adopting AlGaN Back-Barriers with Different Aluminum Concentrations
Meneghesso, Gaudenzio	Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures Reliability analysis of high power LEDs for automotive: impact of current and temperature Ultra-Fast recovery transients in GaN MIS-HEMT submitted to OFF State stress
Meneghesso, Gaudenzio	Hail damage investigation in heterojunction silicon photovoltaic modules: a real word case study Changes in the extraction and collection efficiency of GaN-based MQW solar cells under optical step-stress Evidence for double degradation regime in off-state stressed 100 V GaN transistors: from dielectric failure to subthreshold current increase
Meneghesso, Gaudenzio	Impact of drain-source leakage on the dynamic Ron of power HEMTs with p-GaN gate
Meneghini, Matteo	Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures Hail damage investigation in heterojunction silicon photovoltaic modules: a real word case study Changes in the extraction and collection efficiency of GaN-based MQW solar cells under optical step-stress Evidence for Optically-Induced Degradation in CIGS Solar Cells Reliability analysis of high power LEDs for automotive: impact of current and temperature OFF-state Breakdown and Threshold Voltage Stability of Vertical GaN-on-Si Trench MOSFETs Evidence for double degradation regime in off-state stressed 100 V GaN transistors: from dielectric failure to subthreshold current increase Interface-related VTH Shift of SiC MOSFETs during Constant Current Stress extracted from Charge Pumping measurements Ultra-Fast recovery transients in GaN MIS-HEMT submitted to OFF State stress Study of Trapping Mechanisms Affecting AlGaN/GaN HEMTs adopting AlGaN Back-Barriers with Different Aluminum Concentrations
Meneghini, Matteo	Impact of drain-source leakage on the dynamic Ron of power HEMTs with p-GaN gate
Meng, Shengwei	Spacecraft Sensor Reliability Improvement Based On Temporal Digital Twin Model
Menozzi, Roberto	FEM-based development of novel 3D-printable plastic direct coolers for power semiconductor modules
Merassi, Angelo Antonio	Laser voltage probing and simulation of a flip-flop with undesired quasi-static switching
Mercelis, Siegfried	C-SMART: A preprocessor for neural network performance and reliability under radiation
Miccoli, Cristina	Effect of Drain Field Plate design and 2DEG density on Dynamic-RON of 650V AlGaN/GaN HEMTs Evidence for double degradation regime in off-state stressed 100 V GaN transistors: from dielectric failure to subthreshold current increase
Mikolajick, Thomas	Improved 2D charge carrier quantification workflow for scanning spreading resistance microscopy
Mikulla, Michael	Reliability and Failure Analysis of AlGaN/GaN HEMT with NiPtAu and PtAu Gate
Mikutta, Lukas	On the influence of the porosity and homogeneity of sintered die-attach layers on the power cycling performance
Minixhofer, Rainer	Evaluation of the Impact of Body Bias on the Threshold Voltage Drift of SiO2 Transistors
Missiaen, Jean-Michel	Evaluation and thermal ageing of power semiconductor die attachment based on porous film electrodeposition
Mitrović, Nikola	The effects of NBT stressing on later operation of power VDMOS transistors under normal conditions
Modolo, Nicola	Improved CV characterization technique for interface state evaluation in Si3N4/n-GaN MIS Capacitors Ultra-Fast recovery transients in GaN MIS-HEMT submitted to OFF State stress
Moens, Peter	Interface-related VTH Shift of SiC MOSFETs during Constant Current Stress extracted from Charge Pumping measurements
Mohamed El Khawaga, Timo	Failure investigation on an embedded Schottky Barrier Diode due to an inhomogeneous silicide formation
Mohammadi Anaei, Mohammad Taghi	Fast Reverse Engineering of Chips using Lasers, Focused Ion Beams, and Confocal and Scanning Electron Microscopy
Mondal, Gopal	Multi-sensor Data Fusion for Prediction of Remaining Useful Life of IGBT Power Modules
Monniez, Théo	Reading reliability in 1S1R OTS+PCM devices based on Double Patterned Self Aligned structure
Monzio Compagnoni, Christian	Impact of Device Encapsulation on the Time-Dependent Dielectric Breakdown in Polymeric Dielectrics for Galvanic Isolation
Moore, Toni	Fast Reverse Engineering of Chips using Lasers, Focused Ion Beams, and Confocal and Scanning Electron Microscopy
Moragues, Jean-Michel	New statistical analysis methodology to forecast the memory cell behavior before reliability test
Morel, Hervé	Test Methodology for Short-Circuit Assessment Applied to Power SiC MOSFETs
Mouhoubi, Samir	Investigation of the long-term dynamic Rds(ON) variation and dynamic high temperature operating life test robustness of Schottky gate and ohmic gate GaN HEMT with comparable stress conditions
Mura, Giovanna	Electronics authentication using electrical measurements and machine learning
Musa, Michela	Electronics authentication using electrical measurements and machine learning
März, Martin	High AC load current testing method for power capacitors
N
Nardo, Arianna	Impact of drain-source leakage on the dynamic Ron of power HEMTs with p-GaN gate
Nasu, Sakurako	Analysis and experimental verification of current sharing among parallel-connected dc-link capacitors in a fast-switching converter
Naumann, Falk	Numerical study of critical filler particle to chip interaction on an automotive Hall sensor
Navarro, Gabriele	Reading reliability in 1S1R OTS+PCM devices based on Double Patterned Self Aligned structure
Nguyen, Tien Anh	Dependence between the drain current saturation and short-circuit robustness of p-GaN HEMTs
Nicoletto, Marco	Hail damage investigation in heterojunction silicon photovoltaic modules: a real word case study Changes in the extraction and collection efficiency of GaN-based MQW solar cells under optical step-stress
Nielebock, Sebastian	Multi-sensor Data Fusion for Prediction of Remaining Useful Life of IGBT Power Modules
Nilsson, Daniel	Fast high-resolution X-ray nano tomography for failure analysis in advanced packaging
Nishizawa, Shin-Ichi	A Screening Test of GaN-HEMTs for Improvement of Breakdown Voltage Uniformity
Nishizawa, Shin-Ichi	Improvement of Sensitivity for Power Cycle Degradation by A New Device Structure
Noh, Seungjun	Risk of CuxO phase penetration between the Ag plating layer and Cu during high-temperature reliability testing of interfaces bonded to cold sintered Ag nano-porous sheets on direct Ag-plated Cu substrates
O
Oberhoff, Stefan	Semi-supervised parameter estimation for Synthetic Aperture Focusing in Scanning Acoustic Microscopy for a 3D reconstruction of plastic molded electronic devices
Oh, Chulmin	Enhancing Long-Term Thermal Reliability of Sintered Joints through the Use of Silver-Coated Copper Particles
Okame, Koki	Improvement of Sensitivity for Power Cycle Degradation by A New Device Structure
Oliveira, Joao	Test Methodology for Short-Circuit Assessment Applied to Power SiC MOSFETs Dependence between the drain current saturation and short-circuit robustness of p-GaN HEMTs
Omura, Ichiro	Peak detection for current balancing of parallel-connected SiC power devices using PCB sensors
Onushkin, Grigory	(Invited) LED Reliability for Lighting Applications and Beyond
Ortiz Gonzalez, Jose	Long-Term Positive and Negative Gate Bias Stress Tests on Parallel Connected SiC MOSFETs at -40°C and 175°C
Ostermaier, Clemens	Analyzing the role of hole injection on the short circuit performance of p-GaN gate power HEMTs Improved CV characterization technique for interface state evaluation in Si3N4/n-GaN MIS Capacitors
Otto, Frederik	On the influence of the porosity and homogeneity of sintered die-attach layers on the power cycling performance
P
Pacheco, Mario	Localization enhancement in quantitative thermal lock-in analysis using spatial phase evaluation
Paci, Dario	Impact of Device Encapsulation on the Time-Dependent Dielectric Breakdown in Polymeric Dielectrics for Galvanic Isolation
Pae, Sangwoo	Vertically Scaled Cu/low-k Interconnect Development for BEOL Reliability Improvement of 12nm DRAM
Palazzo, Simone	The behavior of 350V GaN HEMTs during heavy ion irradiations
Pallaro, Thomas	DC and RF aging test of AlGaN/GaN HEMT technology on SiC substrate
Pan, Jinchang	A Floquet Theory-Based Stability Analysis Method for PV-Storage Independent DC Microgrid
Panizzon, Davide	Hail damage investigation in heterojunction silicon photovoltaic modules: a real word case study
Papaioannou, George	Evidence of resistive switching in SiNx thin films for MEMS capacitors: the role of metal contacts On the electrical properties of ALD HfO2 dielectric films for MEMS capacitive switches.
Parisini, Antonella	Numerical simulation of current uniformity in Ga2O3 planar diodes and its effect on temperature field and device reliability
Pascal, Yoann	Multi-sensor Data Fusion for Prediction of Remaining Useful Life of IGBT Power Modules
Paskaleva, Albena	The effects of NBT stressing on later operation of power VDMOS transistors under normal conditions
Patanè, Francesco	HTRB effects on threshold instability of 4H-SiC PowerMOSFET with carrots defects
Patanè, Salvatore	HTRB effects on threshold instability of 4H-SiC PowerMOSFET with carrots defects
Peng, Yu	Spacecraft Sensor Reliability Improvement Based On Temporal Digital Twin Model
Perez, Gaetan	Optimized Semi-Physical EKV Model for Simulation of SiC MOSFETs
Perini, Lorenzo	Numerical simulation of current uniformity in Ga2O3 planar diodes and its effect on temperature field and device reliability
Perrin, Sebastien	New statistical analysis methodology to forecast the memory cell behavior before reliability test
Perrotin, Olivier	Test Methodology for Short-Circuit Assessment Applied to Power SiC MOSFETs Gate lifetime investigation at low temperature for p-GaN HEMT
Pey, Kin Leong	Recovery and Unrecovered Damage During Interrupted CVS in MFIS FE devices
Phoulady, Adrian	Fast Reverse Engineering of Chips using Lasers, Focused Ion Beams, and Confocal and Scanning Electron Microscopy
Phulpin, Tanguy	Aging impact of the SiC Mosfet gate dielectric
Pichon, Pierre-Yves	Crack propagation in ultrasonic-bonded copper wires investigated by power cycling and accelerated mechanical fatigue interconnection test methods
Pieprzyk, Jean-Francois	Gate lifetime investigation at low temperature for p-GaN HEMT
Pierobon, Giulia	Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures
Piton, Michel	Test Methodology for Short-Circuit Assessment Applied to Power SiC MOSFETs
Pizzo, Giansalvo	Evidence for double degradation regime in off-state stressed 100 V GaN transistors: from dielectric failure to subthreshold current increase
Pogany, Dionyz	Analyzing the role of hole injection on the short circuit performance of p-GaN gate power HEMTs Improved CV characterization technique for interface state evaluation in Si3N4/n-GaN MIS Capacitors
Poppe, András	Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures
Portal, Jean-Michel	New statistical analysis methodology to forecast the memory cell behavior before reliability test
Portesine, Federico	Evaluation with FEM Analysis of peak case non-rupture current for power devices working at very high current
Principato, Santo	Effect of Drain Field Plate design and 2DEG density on Dynamic-RON of 650V AlGaN/GaN HEMTs
Pura, José Luis	About the influence of temperature operation and packaging stress on the threshold for catastrophic optical damage in laser diodes
R
Rafik, Ossama	Performance characterization of lithium-ion battery and ageing under constant stress conditions at low temperature
Raghavan, Nagarajan	Recovery and Unrecovered Damage During Interrupted CVS in MFIS FE devices
Rajabi Kalvani, Payam	Numerical simulation of current uniformity in Ga2O3 planar diodes and its effect on temperature field and device reliability
Ramachandran, Saran	Microstructure-based fatigue analysis of SiC power module with sintered silver die attach
Rampazzo, Fabiana	Study of Trapping Mechanisms Affecting AlGaN/GaN HEMTs adopting AlGaN Back-Barriers with Different Aluminum Concentrations
Rampino, Stefano	Evidence for Optically-Induced Degradation in CIGS Solar Cells
Rauf, Fawad	Investigation of the long-term dynamic Rds(ON) variation and dynamic high temperature operating life test robustness of Schottky gate and ohmic gate GaN HEMT with comparable stress conditions
Realmuto, Chiara	Power devices Failure Analysis Use Cases Using High voltage OBIRCh and EMMI workflows
Rech, Paolo	C-SMART: A preprocessor for neural network performance and reliability under radiation
Reck, André	Electrical and reliability characterization with optimized extrapolation models of two- and three-dimensional Metal-Insulator-Metal decoupling capacitors with ZrAlxOy high-κ dielectric under BEoL-friendly conditions
Reggiani, Susanna	Optimization of the drain-side configuration in ESD-protection SCR-LDMOS for high holding-voltage applications
Regnier, Arnaud	New statistical analysis methodology to forecast the memory cell behavior before reliability test
Reiter, Philippe	C-SMART: A preprocessor for neural network performance and reliability under radiation
Reverdy, Antoine	Power devices Failure Analysis Use Cases Using High voltage OBIRCh and EMMI workflows
Reynes, Jean-Michel	Test Methodology for Short-Circuit Assessment Applied to Power SiC MOSFETs
Richardeau, Frédéric	Preliminary SiC MOSFET Gate-Cracking Modeling under Short-Circuit Based on Rankine's Damage Energetic Approach Using a Wide Temperature-Range Elastoplastic 2D Simulation Low-Voltage Schottky p-GaN HEMT Properties under Extreme Repetitive Short-Circuit Operation Conditions : 2DEG Pinch-off, Stability, Aging, Robustness and Failure-Modes Analysis
Richter, Sandro	Reliability of Discrete SiC MOSFETs under Temperature-Shock and Power Cycling Tests
Riminucci, Andrea	Issues of electronic devices in hostile environment
Ristić, Goran	The effects of NBT stressing on later operation of power VDMOS transistors under normal conditions
Rittner, Martin	Degradation mode analysis of Cu bond wires on Cu plated SiC power semiconductors stressed by active power cycling
Robin, Pierre-Alexis	The Use of Filtered High-Energy X-rays and 60Co for TID Testing of a 32-Bit 28nm FDSOI DSP
Roccato, Nicola	Changes in the extraction and collection efficiency of GaN-based MQW solar cells under optical step-stress
Roccato, Nicola	Reliability analysis of high power LEDs for automotive: impact of current and temperature
Rosc, Joerdis	Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures
Rossetto, Isabella	Evidence for double degradation regime in off-state stressed 100 V GaN transistors: from dielectric failure to subthreshold current increase
Rost, Steffen	Methodology to estimate the impact of Single Event Transients in Logic
Rotorato, Simone	Optimization of the drain-side configuration in ESD-protection SCR-LDMOS for high holding-voltage applications
Rudolph, Matthias	Electrical and reliability characterization with optimized extrapolation models of two- and three-dimensional Metal-Insulator-Metal decoupling capacitors with ZrAlxOy high-κ dielectric under BEoL-friendly conditions
Rummel, Andreas	GaN defect detection and analysis using electrical probing, EBAC, EBIC and EBIRCH
Russo, Alfio	HTRB effects on threshold instability of 4H-SiC PowerMOSFET with carrots defects Evidence for double degradation regime in off-state stressed 100 V GaN transistors: from dielectric failure to subthreshold current increase
Rustichelli, Valeria	Dependence between the drain current saturation and short-circuit robustness of p-GaN HEMTs Gate lifetime investigation at low temperature for p-GaN HEMT
S
Saghi, Zineb	Reading reliability in 1S1R OTS+PCM devices based on Double Patterned Self Aligned structure
Said, Nasri	Nonlinear modelling of AlN/GaN HEMT accounting for Self-biasing effect during RF step stress: analysis and Hard-SOA
Saigné, Frederic	The Use of Filtered High-Energy X-rays and 60Co for TID Testing of a 32-Bit 28nm FDSOI DSP
Saintis, Laurent	Design-of-Experiments and ALT plan for reliability qualification of chip resistors based on mission profile of AIMDs
Saito, Wataru	A Screening Test of GaN-HEMTs for Improvement of Breakdown Voltage Uniformity Improvement of Sensitivity for Power Cycle Degradation by A New Device Structure
Salvi, Antoine	Reading reliability in 1S1R OTS+PCM devices based on Double Patterned Self Aligned structure
Sankaralingam, Raj	Optimization of the drain-side configuration in ESD-protection SCR-LDMOS for high holding-voltage applications
Sankari, Rasched	Degradation mode analysis of Cu bond wires on Cu plated SiC power semiconductors stressed by active power cycling
Sanseverino, Annunziata	The behavior of 350V GaN HEMTs during heavy ion irradiations
Santoro, Danilo	Issues of electronic devices in hostile environment Machine learning classification for failure analysis of smart spark plugs
Saro, Marco	Study of Trapping Mechanisms Affecting AlGaN/GaN HEMTs adopting AlGaN Back-Barriers with Different Aluminum Concentrations
Sarraute, Emmanuel	Preliminary SiC MOSFET Gate-Cracking Modeling under Short-Circuit Based on Rankine's Damage Energetic Approach Using a Wide Temperature-Range Elastoplastic 2D Simulation
Sasangka, Wardhana A.	Comprehensive LED Reliability Assessment through Integrated Real-Time Visualization, Electrical, and Optical Analysis
Saugnon, Damien	Nonlinear modelling of AlN/GaN HEMT accounting for Self-biasing effect during RF step stress: analysis and Hard-SOA
Schadewald, Jörg	On the influence of the porosity and homogeneity of sintered die-attach layers on the power cycling performance
Schilling, Oliver	Lifetime prediction for power modules in wind-energy converters based on temperature variations in a large area substrate solder connection
Schindler, Guenther	Methodology to estimate the impact of Single Event Transients in Logic
Schleicher, Michael	Solder Stop as a Reliable Insulation Layer on Printed Circuit Boards – Different Layouts and Materials under Humidity and High Voltage
Schletz, Andreas	Gate voltage modulation for power cycling tests of SiC MOSFETs and its influence on temperature distribution
Schneider-Ramelow, Martin	Degradation mode analysis of Cu bond wires on Cu plated SiC power semiconductors stressed by active power cycling
Schoenleber, Jonathan	Evaluation and thermal ageing of power semiconductor die attachment based on porous film electrodeposition
Schroer, Erwin	HTRB effects on threshold instability of 4H-SiC PowerMOSFET with carrots defects
Schucht, Detlev	Solder Stop as a Reliable Insulation Layer on Printed Circuit Boards – Different Layouts and Materials under Humidity and High Voltage
Schulz, Adelja	Condition Monitoring for Detection of Humidity-Induced Failures in Control Electronics of Power Converters
Schulze, Jörg	Gate voltage modulation for power cycling tests of SiC MOSFETs and its influence on temperature distribution
Schweigart, Helmut	Solder Stop as a Reliable Insulation Layer on Printed Circuit Boards – Different Layouts and Materials under Humidity and High Voltage
Sciancalepore, Corrado	FEM-based development of novel 3D-printable plastic direct coolers for power semiconductor modules
Scognamillo, Ciro	A study of UIS ruggedness of mismatched paralleled SiC MOSFETs
Sehr, Frederic	Condition Monitoring for Detection of Humidity-Induced Failures in Control Electronics of Power Converters
Serafini, Andrea	Thermal ageing monitoring in Cu-Al intermetallic joints through electrical resistance drift: comparative study of lifetime potential in pure and alloyed copper wires
Shahbazmohamadi, Sina	Fast Reverse Engineering of Chips using Lasers, Focused Ion Beams, and Confocal and Scanning Electron Microscopy
Shang, Yinyin	Synergistic Effect of Total Ionizing Dose and Electromagnetic Interference in SRAM using 22nm FDSOI technology
Shi, Xingjian	Stress comparison of several short-circuit types on SiC MOSFET packaging
Shqair, Mustafa	Preliminary SiC MOSFET Gate-Cracking Modeling under Short-Circuit Based on Rankine's Damage Energetic Approach Using a Wide Temperature-Range Elastoplastic 2D Simulation
Shubhakar, Kalya	Recovery and Unrecovered Damage During Interrupted CVS in MFIS FE devices
Silvestrin, Luca	The behavior of 350V GaN HEMTs during heavy ion irradiations
Simon, Daniel K.	Improved 2D charge carrier quantification workflow for scanning spreading resistance microscopy
Simon-Najasek, Michel	Reliability and Failure Analysis of AlGaN/GaN HEMT with NiPtAu and PtAu Gate
Simon-Najasek, Michél	Numerical study of critical filler particle to chip interaction on an automotive Hall sensor
Simonazzi, Marco	Aging modelling of Li-Ion Battery Systems based on accelerated tests
Sitta, Alessandro	Reliability Assessment of SiC Power MOSFETs in Dynamic Reverse Bias Test
Soldati, Alessandro	Impact of Constant and Pulsed Active Balancing Current Patterns on the Aging of Lithium-ion Batteries
Song, Yuchen	Spacecraft Sensor Reliability Improvement Based On Temporal Digital Twin Model
Souifi, Abdelkader	Reading reliability in 1S1R OTS+PCM devices based on Double Patterned Self Aligned structure
Souto, Jorge	About the influence of temperature operation and packaging stress on the threshold for catastrophic optical damage in laser diodes
Sozzi, Giovanna	Numerical simulation of current uniformity in Ga2O3 planar diodes and its effect on temperature field and device reliability Impact of Constant and Pulsed Active Balancing Current Patterns on the Aging of Lithium-ion Batteries
Spaggiari, Davide	Evaluation with FEM Analysis of peak case non-rupture current for power devices working at very high current FEM-based development of novel 3D-printable plastic direct coolers for power semiconductor modules
Spassov, Dencho	The effects of NBT stressing on later operation of power VDMOS transistors under normal conditions
Speroni, Fabrizio	Impact of Device Encapsulation on the Time-Dependent Dielectric Breakdown in Polymeric Dielectrics for Galvanic Isolation
Spinelli, Alessandro	Impact of Device Encapsulation on the Time-Dependent Dielectric Breakdown in Polymeric Dielectrics for Galvanic Isolation
Stabentheiner, Manuel	(Invited) Advanced Methodology and Understanding of GaN Device Reliability Analyzing the role of hole injection on the short circuit performance of p-GaN gate power HEMTs
Stegmann, Heiko	GaN defect detection and analysis using electrical probing, EBAC, EBIC and EBIRCH
Sterna, Leo	Optimized Semi-Physical EKV Model for Simulation of SiC MOSFETs
Sterpone, Luca	Selective Hardening of RISCV Soft-Processors for Space Applications
Stighezza, Mattia	Aging modelling of Li-Ion Battery Systems based on accelerated tests
Stockman, Arno	Impact of drain-source leakage on the dynamic Ron of power HEMTs with p-GaN gate
Stübner, Ronald	Charging effects in alumina layers deposited with different precursors for microelectronic applications
Sun, Qisen	Thermal layout optimization of electrolytic capacitors considering degradation self-acceleration effect for reliability improvement
Sun, Yi	Single Event Irradiation Damage Effect of SiC MOSFETs Based on Degradation of Forward Conduction Characteristic
Sun, Youmei	Effect of gate oxide thickness on gate latent damage induced by heavy ion in SiC power MOSFETs
Sun, Zhigang	Series AC Arc Fault Diagnosis Method Based on Spectrogram and Deep Residual Network
Sung, Cheng	Investigation of Trade-off between Switching Loss and Gate Overshoot in SiC MOSFETs by Driving Waveform Modification
Szász, Katalin	System in package: Advanced FA Techniques to Minimize Analysis Time and Cost
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Tack, Marnix	Impact of drain-source leakage on the dynamic Ron of power HEMTs with p-GaN gate
Tan, Hui Teng	Comprehensive LED Reliability Assessment through Integrated Real-Time Visualization, Electrical, and Optical Analysis
Tan, Tiang Teck	Recovery and Unrecovered Damage During Interrupted CVS in MFIS FE devices
Tartarin, Jean Guy	Nonlinear modelling of AlN/GaN HEMT accounting for Self-biasing effect during RF step stress: analysis and Hard-SOA
Tavousi, Pouya	Fast Reverse Engineering of Chips using Lasers, Focused Ion Beams, and Confocal and Scanning Electron Microscopy
Tayyab, Muhammad Farhan	Investigation of the long-term dynamic Rds(ON) variation and dynamic high temperature operating life test robustness of Schottky gate and ohmic gate GaN HEMT with comparable stress conditions
Terracciano, Vincenzo	A Geometry-Scalable Electrothermal Compact Circuit Model of SiC MPS Diodes Accounting for the Snapback Mechanism: Application to Current Surge Events
Theocharis, John	Evidence of resistive switching in SiNx thin films for MEMS capacitors: the role of metal contacts On the electrical properties of ALD HfO2 dielectric films for MEMS capacitive switches.
Thiele, Sven	Threshold Voltage Hysteresis Investigation of SiC MOSFETs with Different Structures under Various Measurement Conditions
Thompson, Carl V.	Comprehensive LED Reliability Assessment through Integrated Real-Time Visualization, Electrical, and Optical Analysis
Tlig, Mohamed	Conducted EMI Assessment of Aging Power Si-MOSFET in 3 phase inverter
Toscani, Andrea	Aging modelling of Li-Ion Battery Systems based on accelerated tests
Tosto, Giuseppe	HTRB effects on threshold instability of 4H-SiC PowerMOSFET with carrots defects
Trabattoni, Valeria	Issues of electronic devices in hostile environment
Tremouilles, David	Low-Voltage Schottky p-GaN HEMT Properties under Extreme Repetitive Short-Circuit Operation Conditions : 2DEG Pinch-off, Stability, Aging, Robustness and Failure-Modes Analysis Gate lifetime investigation at low temperature for p-GaN HEMT
Trieu, Hoc Khiem	Thermal Impedance and Local Thermal Runaway during Surge Events in Power Rectifiers
Tripathi, Ravi Nath	Peak detection for current balancing of parallel-connected SiC power devices using PCB sensors
Tripolt, Mario	SMART Protection Design of Automotive Power Distribution Systems with Temperature-Based Electronic Fuses: Mathematical Background, Design Guidelines and Drawbacks of Energy-Based Methods
Trivellin, Nicola	Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures Hail damage investigation in heterojunction silicon photovoltaic modules: a real word case study Evidence for Optically-Induced Degradation in CIGS Solar Cells Reliability analysis of high power LEDs for automotive: impact of current and temperature
Tselios, Konstantinos	Evaluation of the Impact of Body Bias on the Threshold Voltage Drift of SiO2 Transistors
Tsou, Ming-Chang	Toward understanding the impacts of dynamic Ron on the efficiency in GaN-based AC-DC flyback converter
Tu, Chang-Ching	Investigation of Trade-off between Switching Loss and Gate Overshoot in SiC MOSFETs by Driving Waveform Modification
Tu, Chunming	Active Gate Driver for Current Overshoot Suppression of SiC+Si Hybrid Switches with Dynamic gate Current Regulation
U
Urena-Acuna, Alejandro	The Use of Filtered High-Energy X-rays and 60Co for TID Testing of a 32-Bit 28nm FDSOI DSP
Urru, Alessandro	Electronics authentication using electrical measurements and machine learning
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van der Berg, Roelof	ESD Human Body Model step stress distributions of GaN HEMTs and the correlation with one level test results
Vanmeerbeek, Piet	Impact of drain-source leakage on the dynamic Ron of power HEMTs with p-GaN gate
Velardi, Francesco	The behavior of 350V GaN HEMTs during heavy ion irradiations
Veljković, Sandra	The effects of NBT stressing on later operation of power VDMOS transistors under normal conditions
Vidal, Paul-Etienne	Wire bonding failure characterization of an IGBT based power module through impedance analysis
Villa, Riccardo	Thermal ageing monitoring in Cu-Al intermetallic joints through electrical resistance drift: comparative study of lifetime potential in pure and alloyed copper wires
Vinassa, Jean-Michel	Performance characterization of lithium-ion battery and ageing under constant stress conditions at low temperature
Vinnac, Sébastien	Low-Voltage Schottky p-GaN HEMT Properties under Extreme Repetitive Short-Circuit Operation Conditions : 2DEG Pinch-off, Stability, Aging, Robustness and Failure-Modes Analysis
Viné, Guillaume	Wire bonding failure characterization of an IGBT based power module through impedance analysis
Vitanza, Elisa	Power devices Failure Analysis Use Cases Using High voltage OBIRCh and EMMI workflows
Vogt, Michael	Solder Stop as a Reliable Insulation Layer on Printed Circuit Boards – Different Layouts and Materials under Humidity and High Voltage
Vorwerk, Alexander	Condition Monitoring for Detection of Humidity-Induced Failures in Control Electronics of Power Converters
Votava, Martin	Multi-sensor Data Fusion for Prediction of Remaining Useful Life of IGBT Power Modules
Vu, Hoan	Thermal Impedance and Local Thermal Runaway during Surge Events in Power Rectifiers
W
Wagner, Stefan	Condition Monitoring for Detection of Humidity-Induced Failures in Control Electronics of Power Converters
Wakrim, Tariq	Effect of Drain Field Plate design and 2DEG density on Dynamic-RON of 650V AlGaN/GaN HEMTs
Waldhoer, Dominic	Evaluation of the Impact of Body Bias on the Threshold Voltage Drift of SiO2 Transistors
Waltl, Michael	Evaluation of the Impact of Body Bias on the Threshold Voltage Drift of SiO2 Transistors
Wang, Haodong	Thermal layout optimization of electrolytic capacitors considering degradation self-acceleration effect for reliability improvement
Wang, Huai	Investigating the thermal degradation trends for thermal interface materials in the power converter Machine learning-based surrogate models for finned heatsink optimization AI-assisted reliability testing, modeling, and condition monitoring for power electronics applications
Wang, Li	Reliability detection and analysis of elliptical holes corresponding to defects in electrothermal environment
Wang, Qianyuan	Single Event Irradiation Damage Effect of SiC MOSFETs Based on Degradation of Forward Conduction Characteristic
Wang, Shujuan	Failure Analysis of Gold-plated Fuzz Button Contacts in Elevated Temperature
Wang, Shujuan	Research on The Degradation of Contact Resistance of Wire-Spring Contacts in Different Wear Condition
Wang, Wenbo	Stress comparison of several short-circuit types on SiC MOSFET packaging
Wang, Wenyan	Assembly reliability of ceramic small outline packaged devices
Wang, Xiu Teng	Reliability Design of GaN Based High-frequency Inverter Optimization
Wang, Xuhui	Single Event Irradiation Damage Effect of SiC MOSFETs Based on Degradation of Forward Conduction Characteristic
Wang, Yashun	Evolution analysis of mechanical behavior of through‑silicon via under thermal cycling load
Wang, Yingqi	Spacecraft Sensor Reliability Improvement Based On Temporal Digital Twin Model
Wang, Yu	Remaining Useful Life Prediction of DC Contactor Based on LSTM
Wang, Ziheng	Investigating the thermal degradation trends for thermal interface materials in the power converter Machine learning-based surrogate models for finned heatsink optimization
Waschneck, Katja	Methodology to estimate the impact of Single Event Transients in Logic
Weber, Benjamin	Reliability and Failure Analysis of AlGaN/GaN HEMT with NiPtAu and PtAu Gate
Wei, Zhi Chao	Characterization and Analysis of Single-Event Effects in 16 nm FinFET FPGAs Based on On-Orbit Data
Welter, Loic	New statistical analysis methodology to forecast the memory cell behavior before reliability test
Wiedenmann, Michael	Semi-supervised parameter estimation for Synthetic Aperture Focusing in Scanning Acoustic Microscopy for a 3D reconstruction of plastic molded electronic devices
Wieland, Dominik	Analyzing the role of hole injection on the short circuit performance of p-GaN gate power HEMTs
Wiesenberger, Bernd	Numerical study of critical filler particle to chip interaction on an automotive Hall sensor
Wittler, Olaf	Degradation mode analysis of Cu bond wires on Cu plated SiC power semiconductors stressed by active power cycling
Wolf, Mario	Semi-supervised parameter estimation for Synthetic Aperture Focusing in Scanning Acoustic Microscopy for a 3D reconstruction of plastic molded electronic devices
Won, Mi So	Enhancing Long-Term Thermal Reliability of Sintered Joints through the Use of Silver-Coated Copper Particles
Woo, Byoungwook	Vertically Scaled Cu/low-k Interconnect Development for BEOL Reliability Improvement of 12nm DRAM
Wu, Jianfei	A New Methodology of Modeling Conducted Emission Behavioural in System-in-Packages (SiP)
Wu, Jianfei	Synergistic Effect of Total Ionizing Dose and Electromagnetic Interference in SRAM using 22nm FDSOI technology
Wu, Lei	The Effect of Trench Depth on Single-Event Burnout Hardening of Split-Gate-Trench MOSFET
Wu, Tian-Li	Investigation of Trade-off between Switching Loss and Gate Overshoot in SiC MOSFETs by Driving Waveform Modification Recovery and Unrecovered Damage During Interrupted CVS in MFIS FE devices Toward understanding the impacts of dynamic Ron on the efficiency in GaN-based AC-DC flyback converter
Wu, Tsung-Hsiu	Toward understanding the impacts of dynamic Ron on the efficiency in GaN-based AC-DC flyback converter
X
Xiao, Biao	Active Gate Driver for Current Overshoot Suppression of SiC+Si Hybrid Switches with Dynamic gate Current Regulation
Xie, Dong	Threshold Voltage Hysteresis Investigation of SiC MOSFETs with Different Structures under Various Measurement Conditions
Xie, Yong	Remaining Useful Life Prediction of DC Contactor Based on LSTM
Xin, Jianbo	Improving Large-Area Sintering Reliability of Power Module Systems Using Copper Paste/Film Failure mode competition and long-term reliability in the isothermal aging of sintered Cu joints
Xu, Le	Degradation model for insulation characteristics of tantalum capacitors related to manufacturing parameters and stress Failure Analysis of Gold-plated Fuzz Button Contacts in Elevated Temperature
Xu, Le	Research on The Degradation of Contact Resistance of Wire-Spring Contacts in Different Wear Condition
Xu, Yaohua	Microstructure-based fatigue analysis of SiC power module with sintered silver die attach
Y
Yamada, Takashi	Understanding improved pitting corrosion resistance under high temperature application leading to a newly developed palladium coated copper wire
Yamakita, Yuki	Improvement of Sensitivity for Power Cycle Degradation by A New Device Structure
Yamasoto, Takuma	Condition Monitoring of a DC-Link Capacitor in an Inverter with a front-end diode rectifier under Imbalanced Three-phase Supply Voltage
Yan, Xiaoyu	Effect of gate oxide thickness on gate latent damage induced by heavy ion in SiC power MOSFETs
Yang, Hyunseung	Enhancing Long-Term Thermal Reliability of Sintered Joints through the Use of Silver-Coated Copper Particles
Yang, Jianqun	Single Event Irradiation Damage Effect of SiC MOSFETs Based on Degradation of Forward Conduction Characteristic
Yang, Jianqun	The Effect of Trench Depth on Single-Event Burnout Hardening of Split-Gate-Trench MOSFET
Yang, Le	Failure mode competition and long-term reliability in the isothermal aging of sintered Cu joints
Yasuda, Takumi	A Submodule Capacitor Degradation Balancing Control with Capacitor Parameter Monitoring of a Modular Multilevel Converter for a Battery Energy Storage System
Ye, Tianchun	Synergistic Effect of Total Ionizing Dose and Electromagnetic Interference in SRAM using 22nm FDSOI technology
Ye, Xuerong	Reliability Prediction of Electronic Components based on Physical of Failure with Manufacturing Parameters Fluctuations Reliability prediction of multi-level power supply system based on failure precursor parameters
Ye, Xuerong	Thermal layout optimization of electrolytic capacitors considering degradation self-acceleration effect for reliability improvement
You, Jun	Improving Large-Area Sintering Reliability of Power Module Systems Using Copper Paste/Film
Yu, Bin	Stress comparison of several short-circuit types on SiC MOSFET packaging
Yu, Dong-Yurl	Heat-resistant durability of AMB substrates for SiC power devices: AlN and Si3N4, which one is thermally strong?
Yu, Qingkui	Single Event Irradiation Damage Effect of SiC MOSFETs Based on Degradation of Forward Conduction Characteristic
Yu, Runze	Spacecraft Sensor Reliability Improvement Based On Temporal Digital Twin Model
Yu, Wei-Chen Yu	Investigation of Trade-off between Switching Loss and Gate Overshoot in SiC MOSFETs by Driving Waveform Modification
Yun, Ilgu	Efficient Long-term Reliability Assessment of Planar InGaAs/InP Avalanche Photodiodes using Accelerated Step-Stress Test Degradation Modeling of InGaAs/InP Avalanche Photodiodes using Calibrated Technology Computer-aided Design
Yun, Yeohyeok	Enhancing AC Degradation Modeling by Considering the Degradation Profile in SiON pMOSFETs
Z
Zacheo, Luca	(Keynote) An approach to Electronic Platform Complexity: the System Integration in Lamborghini
Zagni, Nicolo	Effect of Drain Field Plate design and 2DEG density on Dynamic-RON of 650V AlGaN/GaN HEMTs
Zani, Andrea	Issues of electronic devices in hostile environment
Zanoni, Enrico	Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures Reliability analysis of high power LEDs for automotive: impact of current and temperature
Zanoni, Enrico	Evidence for Optically-Induced Degradation in CIGS Solar Cells OFF-state Breakdown and Threshold Voltage Stability of Vertical GaN-on-Si Trench MOSFETs Interface-related VTH Shift of SiC MOSFETs during Constant Current Stress extracted from Charge Pumping measurements Study of Trapping Mechanisms Affecting AlGaN/GaN HEMTs adopting AlGaN Back-Barriers with Different Aluminum Concentrations
Zanoni, Enrico	Hail damage investigation in heterojunction silicon photovoltaic modules: a real word case study Changes in the extraction and collection efficiency of GaN-based MQW solar cells under optical step-stress Evidence for double degradation regime in off-state stressed 100 V GaN transistors: from dielectric failure to subthreshold current increase Ultra-Fast recovery transients in GaN MIS-HEMT submitted to OFF State stress
Zanoni, Enrico	Impact of drain-source leakage on the dynamic Ron of power HEMTs with p-GaN gate
Zerarka, Moustafa	Gate lifetime investigation at low temperature for p-GaN HEMT
Zhai, Guofu	Degradation model for insulation characteristics of tantalum capacitors related to manufacturing parameters and stress Thermal layout optimization of electrolytic capacitors considering degradation self-acceleration effect for reliability improvement Series AC Arc Fault Diagnosis Method Based on Spectrogram and Deep Residual Network Reliability prediction of multi-level power supply system based on failure precursor parameters
Zhai, Pengfei	Effect of gate oxide thickness on gate latent damage induced by heavy ion in SiC power MOSFETs
Zhang, Guohe	Single Event Irradiation Damage Effect of SiC MOSFETs Based on Degradation of Forward Conduction Characteristic
Zhang, He	Reliability detection and analysis of elliptical holes corresponding to defects in electrothermal environment
Zhang, Hongli	A New Methodology of Modeling Conducted Emission Behavioural in System-in-Packages (SiP)
Zhang, Hongli	Synergistic Effect of Total Ionizing Dose and Electromagnetic Interference in SRAM using 22nm FDSOI technology
Zhang, Hongwei	Single Event Irradiation Damage Effect of SiC MOSFETs Based on Degradation of Forward Conduction Characteristic
Zhang, Jing	Failure mode competition and long-term reliability in the isothermal aging of sintered Cu joints
Zhang, Kuang	A Floquet Theory-Based Stability Analysis Method for PV-Storage Independent DC Microgrid
Zhang, Lei	Failure Analysis of Gold-plated Fuzz Button Contacts in Elevated Temperature
Zhang, Mingxu	Degradation model for insulation characteristics of tantalum capacitors related to manufacturing parameters and stress
Zhang, Qinghao	Online Junction Temperature Monitoring of SiC MOSFET Based On The Maximum Drain Current Change Rate During The Process of Opening
Zhang, Ruyue	Thermal layout optimization of electrolytic capacitors considering degradation self-acceleration effect for reliability improvement
Zhang, Shufeng	Evolution analysis of mechanical behavior of through‑silicon via under thermal cycling load
Zhang, Teng	Effect of gate oxide thickness on gate latent damage induced by heavy ion in SiC power MOSFETs
Zhang, Xiaojuan	Failure Analysis of Gold-plated Fuzz Button Contacts in Elevated Temperature
Zhang, Ya Jing	Reliability Design of GaN Based High-frequency Inverter Optimization
Zhang, Yi	Investigating the thermal degradation trends for thermal interface materials in the power converter Machine learning-based surrogate models for finned heatsink optimization
Zhao, Dawei	On the Validity of Rainflow Counting-Based Lifetime Assessment for Power Electronics Assembly
Zhao, Shiwei	Effect of gate oxide thickness on gate latent damage induced by heavy ion in SiC power MOSFETs
Zhao, Xing	Synergistic Effect of Total Ionizing Dose and Electromagnetic Interference in SRAM using 22nm FDSOI technology
Zhao, Yixiang	Online Junction Temperature Monitoring of SiC MOSFET Based On The Maximum Drain Current Change Rate During The Process of Opening
Zhao, Yuyao	Research on The Degradation of Contact Resistance of Wire-Spring Contacts in Different Wear Condition
Zhen, Liang	Single Event Irradiation Damage Effect of SiC MOSFETs Based on Degradation of Forward Conduction Characteristic
Zheng, Wei	Reliability prediction of multi-level power supply system based on failure precursor parameters
Zheng, Yifei	A New Methodology of Modeling Conducted Emission Behavioural in System-in-Packages (SiP)
Zhong, Zhihong	Microstructure-based fatigue analysis of SiC power module with sintered silver die attach
Zhou, Minghao	Improving Large-Area Sintering Reliability of Power Module Systems Using Copper Paste/Film Failure mode competition and long-term reliability in the isothermal aging of sintered Cu joints
Zhou, Xue	Degradation model for insulation characteristics of tantalum capacitors related to manufacturing parameters and stress Series AC Arc Fault Diagnosis Method Based on Spectrogram and Deep Residual Network
Ziaei, Afshin	On the electrical properties of ALD HfO2 dielectric films for MEMS capacitive switches.
Zitouna, Bessem	Conducted EMI Assessment of Aging Power Si-MOSFET in 3 phase inverter
Zunarelli, Laura	Optimization of the drain-side configuration in ESD-protection SCR-LDMOS for high holding-voltage applications
Zöllner, Nils	Lifetime prediction for power modules in wind-energy converters based on temperature variations in a large area substrate solder connection
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Übelacker, David	Lifetime prediction for power modules in wind-energy converters based on temperature variations in a large area substrate solder connection
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Živanović, Emilija	The effects of NBT stressing on later operation of power VDMOS transistors under normal conditions

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