Constraining Poles of Parameterized Macromodels (abstract)

An Efficient NN Architecture for Harmonic Balance-based Analysis for SI Applications (abstract)

Deep Equilibrium Recurrent–Transformer (DERT) Model for Large Coupled Interconnect Systems (abstract)

Thermal-Aware Signal Integrity Analysis of GPU-HBM-HBF Interposer Channels Considering HBF Power Consumption (abstract)

Transformer-Based S-Parameter Prediction for Chiplet Interconnects with Sparse Global Context (abstract)

Physics-Informed Wideband S-Parameter Prediction for UCIe Interconnect using Resonance-Aware Gaussian Process Regression (abstract)

Design Optimization for 224Gbs Channel in High Density Interconnect Printed Circuit Boards (abstract)

Data-Efficient Training of Machine Learning Surrogates with Application to a Memory Interposer (abstract)

Pattern- and Channel-Aware Physics-Assisted Deep Learning for Per-DQ Eye-Metric Estimation in RDL Interposer Channels (abstract)

Machine-Learning-Based Multi-Channel Optical I/O Analysis for Co-Packaged Optics (abstract)

Physics-Derived Machine Learning Surrogate Modeling for Rapid LPDDR Signal Integrity Triage (abstract)

Active-Learning-Based TX FIR Tuning for High-Speed Links Under Dynamic Thermal Ramping (abstract)

Active Immersion Cooling Fixture for High Power Testing of Planar Microwave Transmission Lines (abstract)

AI-Assisted Chiplet Design Space Exploration with Physics-Aware Reduced-Order Modeling (abstract)

Signal and Power Integrity Analysis of 32 Gbps Die-to-Die Interconnects for Chiplet (abstract)

SI/PI Trade-off Analysis of UCIe-A Interfaces Considering Power/Ground-to-Signal Bump Ratios (abstract)

Design and Analysis of HBM-HBF-NMC Architecture for LLM Inference Considering Signal Integrity (abstract)

Package-level thermal optimization for high-power-density AI accelerators (abstract)

Influence of interface roughness between Ag sintered bonding layer and Cu on thermal stress in SiC power chip system with AMB substrate (abstract)

8533 MT/s LPDDR5X Package Design with Memory-on-Board Topology (abstract)

Extension of a 2D CIM-Based Approach for Efficient and Automated Computation of Resistances for DC-Analysis of Multilayer PCBs (abstract)

Physics-Aware Reinforcement Learning for Timing-Margin Optimization of High-Speed DDR5 RDIMM (abstract)

Efficient Agentic Touchstone Analysis via DSL (abstract)

PDGChat: A Fine-Tuning Dataset For LLMs (abstract)

Bayesian Optimization of Crossbar-Based Compute-In-Memory System Design for Efficient DNN Inference (abstract)

Cost-Aware Design Space Exploration of Yield-Compliant UCIe Interconnects (abstract)

Signal Integrity Design and Optimization of High-Bandwidth Memory Test System (abstract)

Dual-Referenced Circuit Ports for Hybrid Modeling and Correlation of HPC Memory Interfaces (abstract)

Mitigating the Impact of Glass Weave on Bidirectional High-Speed Signaling (abstract)

A Low-Power, Low-Cost USB4 Cable Using an Ultra-Wideband Signal Integrity Recovery Structure (abstract)

A Differential Tab Structure Design for Optimizing 200G+ PCB Via Transitions (abstract)

Balanced Line-based Ultra-wideband Channel with Enhanced SNR for 224G/448G SerDes Links (abstract)

Common-Mode Sign-Based P/N Skew Calibration for 212.5-Gbps PAM-4 Wireline Receivers (abstract)

Voltage Supply Noise Analysis of Phase-Locked Loop (PLL) Structure in Custom Base Die of High Bandwidth Memory (HBM) (abstract)

Impact of Ground Bounce on Logic-HIGH in Differential Signalling: Case Study of a Current-Mode Driver (abstract)

Simulation-driven Adaptive Estimation of Worst-case Power Noise (abstract)

Design of Integrated Voltage Regulators using a Generative Waveform Surrogate (abstract)

Equal Source Voltages for Minimum DC Conduction Loss in High-Current Power-Delivery Interconnects (abstract)

Non-Uniform Channel Allocation in Multi-Fin GaN Tri-Gate Transistors for Package-Integrated Power Delivery (abstract)

Model-Driven Design Exploration of Hybrid Voltage Regulators for Vertical Power Delivery (abstract)

Investigation of Nanowire Crosstalk through an Ab-Initio EM/QM Simulation Framework (abstract)

Tensor-Train Accelerated Solution of Three-Dimensional Volume Integral Equations in Modeling of Optical Interconnects (abstract)

Fast Electromagnetic Analysis of Multiscale Structures Using MultiAIM with an Improved Projection Scheme (abstract)

Component-Based Model Order Reduction of Thermal-Mechanical Analysis for Chiplet Design (abstract)

Fast Transient Electrothermal Co-Simulation for Thermal-Integrity Analysis of Power-Gated 2.5D/3D Systems (abstract)

Analysis on creep strain and fatigue resistance of Ag sintered bonding layers in SiC chip systems using Ag sintering chip-attachment (abstract)

Systematic Synthesis of Ultra-Compact On-Chip E-Band 360° Phase Shifter (abstract)

Improved Signal Integrity Modeling for Quantum Flex Circuits via Low-Temperature Dk/Df Extraction (abstract)

Rooftop SSPP Interconnect with Filtering and Crosstalk Suppression at Cryogenic State (77 K) (abstract)

Harvesting Waste Heat for Autonomous Reconfigurability in VO2-Based spSIW Interconnect (abstract)