EPEPS 2026: 35TH IEEE CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS
Synergy 1

Sessions

  • Session 1 (Oct 18 09:00-09:10) Welcome Remarks
  • Session 2 (Oct 18 09:10-10:10) IEEE EPS Distinguished Lecture
  • Session 3 (Oct 18 10:10-11:10) Tutorial 2
  • Session 4 (Oct 18 11:30-12:30) Tutorial 3
  • Session 5 (Oct 18 14:00-15:00) Tutorial 4
  • Session 6 (Oct 18 15:00-16:00) Tutorial 5
  • Session 7 (Oct 18 16:00-17:00) Tutorial 6
  • Session 8 (Oct 19 09:00-09:10) Welcome Remarks
  • Session 9 (Oct 19 09:10-10:10) Keynote 1
  • Session 10 (Oct 19 10:10-11:10) Modeling and Simulation
  • Session 11 (Oct 19 11:30-12:30) APAC Special Panel Session
  • Session 13 (Oct 19 14:00-15:20) Packaging Research from APAC Region
  • Session 14 (Oct 19 15:00-15:10) Keysight Demonstration Presentation
  • Session 15 (Oct 19 15:40-17:00) Machine Learning for Interconnect Modeling
  • Session 17 (Oct 20 09:00-10:00) Keynote 2
  • Session 18A (Oct 20 10:00-11:00) AI for Electronic Design Automation
  • Session 19 (Oct 20 11:20-12:20) Heterogeneous Integration and HBM
  • Session 20 (Oct 20 12:20-12:30) Amphenol Sponsor Demonstration
  • Session 21 (Oct 20 13:30-13:40) IEEE TC on EDMS
  • Session 22 (Oct 20 13:40-13:50) EPEPS 2027 Announcement
  • Session 23 (Oct 20 13:50-15:10) Signal Integrity 1
  • Session 25 (Oct 20 15:30-16:50) Signal Integrity 2
  • Session 26 (Oct 20 16:50-18:10) Power Integrity
  • Session 27 (Oct 21 08:30-09:30) Electromagnetics
  • Session 28 (Oct 21 10:00-11:00) Thermal-Mechanical Analysis
  • Session 29 (Oct 21 11:00-12:30) RF and Quantum Interconnects