TALK KEYWORD INDEX
This page contains an index consisting of author-provided keywords.
| 1 | |
| 1/f | |
| 1/f noise | |
| 1T1R | |
| 2 | |
| 2D Heterostuctures | |
| 2D materials | |
| 2D semiconductors | |
| 2D-exfoliated materials | |
| 4 | |
| 4H-SiC MOS | |
| A | |
| Ab initio simulations | |
| Access resistance | |
| Activation | |
| Activation Functions | |
| Adaptive electronics | |
| AlGaN | |
| AlGaN/GaN HEMT | |
| Aluminum nitride | |
| amorphous semiconductor | |
| analog circuit | |
| Analog Circuit Design | |
| Analog resistive switching | |
| analytical model | |
| Annealing | |
| Annealing-driven self-assembly | |
| Architecture | |
| artificial synapses | |
| B | |
| Back end of line (BEOL) | |
| Back-Enhanced SOI | |
| Back-gate biasing | |
| BEOL | |
| BEOL integration | |
| Better drive current | |
| Beyond Moore Electronics | |
| Beyond-CMOS | |
| Beyond-CMOS electronics | |
| Biasing | |
| biaxial strain | |
| bilayer PtTe2 | |
| biomolecule detection | |
| biosensor | |
| biosensors | |
| Box Creep | |
| C | |
| Capacitance | |
| Capacitors | |
| Carrier mobility | |
| Carrier Transport Mechanisms | |
| CFET | |
| Channel-last integration | |
| circuit failure | |
| Circuit implementation | |
| CMOS | |
| CMOS inverter | |
| CMOS technology | |
| CNF/CMF model | |
| Coefficient of Variation (CV) | |
| Compact model | |
| Compensation | |
| Complementary FET | |
| Complementary FET (CFET) | |
| Contact | |
| contact resistance | |
| Core-Shell Junctionless FET | |
| Corner Rounding | |
| Coupling | |
| Cryo-electronics | |
| CryoCMOS | |
| Cryogenic | |
| Cryogenic CMOS | |
| cryogenic electronics | |
| Cryogenic memristors | |
| Cryogenic Temperature | |
| cryogenic temperatures | |
| Cryogenics | |
| Current Mirror | |
| current sensitivity | |
| Current Transfer Ratio | |
| current-voltage characteristics | |
| Cycle to Cycle | |
| D | |
| DC Characterization | |
| DDRFET | |
| Deep Neural Network | |
| defect physics | |
| Defects | |
| defects and stability | |
| density functional theory | |
| Density functional theory (DFT) | |
| depolarization effect | |
| device dimensions | |
| Device modelling | |
| Device Performance | |
| Diamond MOSFET | |
| Diamond MOSFET (DM) | |
| diamond-like carbon | |
| Dielectric | |
| Dielectric BD | |
| Dielectric Mismatch | |
| DIG-RFET | |
| Dirac-source FETs (DSFETs) | |
| Direct bonding | |
| Dopant-free transistors | |
| Doping | |
| Drain Voltage | |
| Drain-extension | |
| E | |
| Edge-Field Engineering | |
| effective potential | |
| electric field | |
| Electric field modulation | |
| electrical characterization | |
| Electromechanical Simulation | |
| Electron density | |
| Electronic structure | |
| Electronic transport parameters | |
| Electrostatic Integrity | |
| Electrostrictive FETs | |
| Enhanced flexibility | |
| F | |
| FD-SOI | |
| FD-SOI MOSFETs | |
| FD-SOI transistors | |
| FDSOI | |
| FDSOI MOSFET | |
| FDSOI n-MOSFET | |
| Ferroelectric | |
| Ferroelectric field-effect transistor (FeFET) | |
| Ferroelectric semiconductor | |
| ferroelectric switching | |
| Ferroelectrics | |
| Field Effect Transistor | |
| Field-effect depletion regions (FEDRs) | |
| Field-effect Transitor | |
| Filament | |
| Filament geometry | |
| filament-free | |
| FinFET | |
| finFETs | |
| Finite element simulation | |
| first principles calculations | |
| First-principles study | |
| flat-band voltage | |
| Forksheet | |
| Forksheet FET | |
| G | |
| GaN | |
| GaN HEMTs | |
| Gate | |
| Gate resistance thermometry | |
| Gate-all-around architecture | |
| Gate-All-Around FET (GAAFET) | |
| Geriatric diagnostics | |
| GeSn | |
| gm/ID Methodology | |
| graphene | |
| graphene field-effect transistor (GFET) | |
| graphene-metal junction | |
| Ground Plane | |
| H | |
| hafnium oxide | |
| Half-Diamond layout style | |
| Halide perovskite | |
| Haptic sensor | |
| Hardware Security | |
| HEMT | |
| HEMTs | |
| Hf1-xZrxO2 Ferroelectric Films | |
| HfO2 | |
| High Temperature | |
| High-resistivity silicon (HR-Si) | |
| High-Temperature Analog Performance of MOSFETs | |
| Hole mobility | |
| hot‑carrier degradation | |
| hybrid circuit | |
| Hydrogen states | |
| I | |
| III-V materials | |
| Implantation- and bonding-free fabrication | |
| In-Memory Computing | |
| In-situ thermal annealing | |
| Incomplete Ionization | |
| InGaAs MOSFETs | |
| InGaAs NSFETs | |
| InGaZn oxide | |
| Inner gate | |
| Input Impedance | |
| interconnect | |
| interface dipole engineering | |
| interface engineering | |
| Interface passivation | |
| Interface State Density | |
| Interface States | |
| Internal thermal oxidation | |
| Inversion regime | |
| inverters | |
| Ionization | |
| ISCAS Benchmark Circuits | |
| ITF | |
| ITO | |
| J | |
| junction optimisation | |
| Junctionless | |
| Junctionless FET | |
| Junctionless Nanowire transistor | |
| K | |
| Key | |
| Kolmogorv Arnold Networks | |
| L | |
| LDO Circuit | |
| Leakage Current | |
| LF noise | |
| LIF neuron | |
| lifetime | |
| liquid probe | |
| Liquid–solid interface | |
| Logic Locking | |
| Lorentzian model | |
| low frequency 1/f noise | |
| Low Frequency Noise | |
| Low-Dropout Regulator | |
| Low-frequency noise | |
| Low-power Electronics | |
| M | |
| Machine learning | |
| Magnetron sputtering | |
| Mandrel | |
| materials science | |
| Membrane–cavity architecture | |
| memories | |
| memory | |
| Memristive devices | |
| Memristive Soft Threshold Neuron | |
| memristive switching | |
| Memristor | |
| Metal extension | |
| metal-to-semiconductor transition | |
| Metallic layers | |
| Middle-of-line | |
| Mixed finite element method | |
| Modeling | |
| molybdenum disulfide (MoS2) | |
| Monolithic vs. Sequential Integration | |
| Monte Carlo simulations | |
| MoS2 | |
| MOSCAPs | |
| MOSFET | |
| Multi Layer Perceptron | |
| Multi-valued logic | |
| Multilayer SOI | |
| N | |
| n/p doping | |
| nano-fabrication | |
| Nanomaterial engineering | |
| Nanoscle memristor | |
| Nanosheet | |
| Nanosheet FET | |
| Nanosheet transistor | |
| Negative differential transconductance | |
| NEGF | |
| Neural Network | |
| Neuromorphic computing | |
| Neuron | |
| New Channel Materials | |
| New FET architecture | |
| New Gate Layout Style for MOSFETs | |
| Nitrogen | |
| Noise | |
| Noise measurement | |
| Non Quasi Static | |
| Non-Volatile | |
| Novel devices | |
| NSFETs | |
| O | |
| On-wafer measurements | |
| open-gap graphene | |
| Operational Transconductance Amplifier | |
| Optimization | |
| Oxide semiconductors | |
| oxides | |
| P | |
| p-bit | |
| Paired-pulse facilitation | |
| parameter extraction | |
| Parasitic Capacitance | |
| Parasitic surface conduction | |
| Patterning | |
| Performance evaluation | |
| Perovskite memristor | |
| Phosphorus | |
| Physical modelling | |
| Physics-based | |
| Physics-Based Simulation | |
| Piezoelectric 2D Materials | |
| Polymorphic Logic Gates | |
| Potentiation and Depression | |
| pseudo-MOS | |
| Pulsed-DC Magnetron Sputtering | |
| Punch-through | |
| Q | |
| Quantum Confinement | |
| Quantum confinent | |
| Quantum dots | |
| Quantum transport | |
| qubits | |
| R | |
| Radiation-Hardness-By-Design (RHBD) | |
| Radio Frequency Energy Harvestin | |
| Raman spectroscopy | |
| Random dopant fluctuation | |
| Random dopant fluctuations | |
| Random Telegraph Noise | |
| Real Time Calibration | |
| Reconfigurable Field-Effect Transistor (RFET) | |
| Reconfigurable Logic | |
| Reconfigurable Transistors | |
| Reduced SCE | |
| ReRAM | |
| reservoir computing | |
| Resistive Random Access Memory | |
| Resistivity | |
| RF characterisation | |
| RF devices | |
| RF extraction | |
| RF performance | |
| RF-SOI | |
| RFET | |
| ring oscillators | |
| Roughness | |
| RRAM | |
| RRR | |
| Ru Gate Electrode | |
| S | |
| SADP | |
| scaling | |
| Schottky barrier field-effect transistor | |
| Schottky Contact | |
| Schottky FET | |
| Self-Heating | |
| Semiconductor | |
| Short-channel effects | |
| short-term memory | |
| SiGe Stressor Optimization | |
| Silicon | |
| Silicon modulation doping | |
| Silicon nanowires | |
| Silicon nitride | |
| Silicon On Insulator | |
| Silicon thickness | |
| Silicon-on-Insulator | |
| Simulation | |
| single trap | |
| SiO2 | |
| Small Signal Modeling | |
| Smart Cut technology | |
| Soft threshold | |
| Spacer Engineering | |
| Spike annealing | |
| spin qubits | |
| Spintronic Logic | |
| SRAM | |
| stability | |
| Stack Nanosheet FET | |
| Stacked MoS₂ channel FETs | |
| Stanford model | |
| Stanford RRAM | |
| Statistical Robustness | |
| Strain | |
| Strain-to-Stress Transduction | |
| Strained Si | |
| Stress Engineering | |
| Substrate | |
| Switching-cycle | |
| Synaptic devices | |
| T | |
| TCAD | |
| TCAD simulation | |
| TCAD simulations | |
| Temperature | |
| Temperature variation | |
| TFET | |
| Thermal Coupling | |
| thin films | |
| threshold switching | |
| Threshold Voltage | |
| Threshold Voltage Engineering | |
| TIG-RFET | |
| TiOx | |
| TMDs | |
| Total Ionizing Dose (TID) | |
| Transconductance | |
| transistor | |
| Transition Metal Dichalcogenides | |
| transparent electronics | |
| Trap recovery | |
| Traps | |
| Triboelectricity | |
| Two-dimensional Electronic Devices | |
| Two-dimensional Materials | |
| U | |
| Ultra Low Power | |
| ultra-low power system | |
| Ultra-thin Ge on SOI | |
| Unconventional Computing | |
| V | |
| Vacancies | |
| van der Waals (vdW) heterostructures | |
| van der Waals interaction | |
| variability | |
| Variability analysis | |
| Verilog-A | |
| Verilog-A Modeling | |
| Vertical GAA | |
| Vertical Mechanical Coupling | |
| Vertical Nanowire | |
| W | |
| WFV | |
| wiring scalability | |
| workfunction variation | |
| WSe2 | |
| Y | |
| Y-function method | |