EPEPS 2024: 33RD IEEE CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS
W280

This is the main conference room in the 2nd floor.

Sessions

  • Session 1 (Oct 06 09:00-09:10) Welcoming Remarks
  • Session 2 (Oct 06 09:10-11:10) Tutorials 1
  • Session 3 (Oct 06 11:30-13:30) Tutorials 2
  • Session 4 (Oct 06 14:30-16:30) Tutorials 3
  • Session 5 (Oct 07 09:00-09:10) Opening Ceremony
  • Session 6 (Oct 07 09:10-10:10) Keynote
  • Session 7 (Oct 07 10:10-11:10) Heterogeneous Integration I
  • Session 8 (Oct 07 11:30-12:30) Heterogeneous Integration II
  • Session 10 (Oct 07 14:00-15:20) Machine Learning I
  • Session 11 (Oct 07 15:20-15:30) Sponsor Demo: Amphenol
  • Session 12 (Oct 07 15:50-17:10) Device Modeling
  • Session 14 (Oct 08 09:00-10:00) Keynote
  • Session 15 (Oct 08 10:00-11:00) Macromodeling I (in honor of Prof. Michel Nakhla)
  • Session 16 (Oct 08 11:20-12:40) Macromodeling II (in honor of Prof. Michel Nakhla)
  • Session 17 (Oct 08 14:00-15:00) Computational Electromagnetics
  • Session 18 (Oct 08 15:00-15:10) EPEPS 2025 Announcement
  • Session 19A (Oct 08 15:30-17:10) Signal and Power Integrity I
  • Session 22 (Oct 09 09:00-10:00) Invited Talk
  • Session 23 (Oct 09 10:00-11:00) Machine Learning II
  • Session 24 (Oct 09 11:00-11:10) Sponsor Demo: Keysight
  • Session 25A (Oct 09 11:30-12:10) Optics
  • Session 26 (Oct 09 12:10-12:50) Computer Aided Design
  • Session 27 (Oct 09 14:20-15:00) Signal and Power Integrity II
  • Session 28 (Oct 09 15:00-15:20) Closing Ceremony