Talk Author Index

TALK AUTHOR INDEX

Shortcuts: A B C D F G H I J K L M N O P Q R S T U V W Y Z

A
Abdelzaher, Salma	Bandit Learning-Driven Power Gating with State Retention for High Performance Computing
Adzlan, Farihin	Enhanced Thermal Conductivity of Electrodeposited Graphene-Cu Thin Films for BEOL Integration
Ahmed, Mohammed Farhan	Direct Die Attached on PCB-like large packages for High Bandwidth AI-Memory Systems
Akash, Akash	An Improved Adaptive Frequency Sampling Approach using Query by Committee
Amin, Fin	A Conditional Diffusion Framework for Sample-Efficient Thermal Modeling in 3DICs
An, Hyunjun	Quad Tower High Bandwidth Memory (QT-HBM) with Glass Substrate and Local Silicon Bridge Signal Integrity Analysis of Chiplet Channel With Interposer Trace and Hybrid Bonding Pad Mamba-based Reinforcement Learning Method for HBM Power Distribution Network (PDN) Optimization with Probing Port-Agnostic Policy Stochastic S-Parameter Generation Using Denoising Regression for High-Speed Link Design Power Integrity Design and Analysis of High Bandwidth Memory-centric Memory Pooling Computing Architecture
Aygün, Kemal	Package Technology Exploration for 448 Gbps Electrical Signaling Machine-Learning-Based Optical I/O Design and Analysis Automation for Co-Packaged Optics
B
Babb, Tracy	Efficient Hierarchical Skeleton-Based Low Rank Decomposition Technique for Integral Equations
Bae, Jaegeun	Quad Tower High Bandwidth Memory (QT-HBM) with Glass Substrate and Local Silicon Bridge Signal Integrity Analysis of Chiplet Channel With Interposer Trace and Hybrid Bonding Pad Mamba-based Reinforcement Learning Method for HBM Power Distribution Network (PDN) Optimization with Probing Port-Agnostic Policy Stochastic S-Parameter Generation Using Denoising Regression for High-Speed Link Design High-Bandwidth Memory (HBM) Network Switch Architecture Design with Low Latency and Efficient Energy Consumption for HBM Centric Computing Design and Analysis of Scalable On-Package Memory Expansion Architectures for GPU-HBM System Considering Signal Integrity Design and Analysis of Power/Ground TSVs considering Static IR Drop for Next-generation HBM Power Integrity Design and Analysis of High Bandwidth Memory-centric Memory Pooling Computing Architecture
Bakir, Muhannad	Temperature-Dependent SPICE Models for UCIe Interconnects
Bao, Tina	SI Performance Optimization on High-Speed Plated-Through-Hole Vias for AI and MCP-Driven Designs
Baten, Md. Zunaid	Can a broken wire transmit signals?: Spoof Plasmonic Wires made of Metallic Islands
Beyne, Eric	Broadband Impedance Response Extraction of On-Chip Interdigital Capacitors using a 3-D DSA Operator for Piecewise Homogeneous Structures
Bianconi, Giacomo	Efficient Hierarchical Skeleton-Based Low Rank Decomposition Technique for Integral Equations
Bohra, Mahesh	Via-to-Trace Crosstalk Mitigation in the BGA Pin Field With the Broadside-Coupled Breakout Signal Integrity Analysis of Parasitic Coupling between Through Silicon Vias and Metal Wires in High-Speed Server Systems
Boyko, Aleksey	Tensor Train Accelerated Solution of Volume Integral Equation for 2D Magneto-Quasi-Static Characterization of Multiconductor Transmission Lines with Logarithmic Complexity
Buhrow, Benjamin	Through-Plane Forward Crosstalk in Superconducting Stripline Transmission Lines
Bui, Thu Huong	Optimization of Co-Packaged Optics (CPO) Layout with Integrated DFB Laser and EIC
C
Cao, Honghao	SI Performance Optimization on High-Speed Plated-Through-Hole Vias for AI and MCP-Driven Designs
Carlucci, Antonio	Towards Estimation of Worst-case Voltage Droop in Nonlinear Power Delivery Networks
Chakraborty, Swagato	Efficient Hierarchical Skeleton-Based Low Rank Decomposition Technique for Integral Equations
Chang, Gordon	Machine Learning Framework for System-Level Prediction of Co-Packaged Optics
Chaw, Derek	Ground Resonance On-Wafer Measurement up to 67 GHz and Modeling with Physical Equivalent Circuit
Chen,	Machine Learning Framework for System-Level Prediction of Co-Packaged Optics
Chen, Chu-Jung	Heat Dissipation Characteristics of Massive Airflow Cooling Heat Sinks: A High-Pressure Air-Surrounded Approach
Chen, Dekang	Machine-Learning-Based Optical I/O Design and Analysis Automation for Co-Packaged Optics
Chen, Xu	Temperature-Dependent SPICE Models for UCIe Interconnects
Cheng, Chris	High-Speed Channel Identification Using Contrastive Learning
Chiu,	Machine Learning Framework for System-Level Prediction of Co-Packaged Optics
Cho, Chulhee	Separate-Cavity Optimization Method for PCIe Gen6.0 PCB-Connector Pad Design Using Particle Swarm Optimization (PSO) Algorithm
Choi, Inyoung	Signal Integrity Analysis of Chiplet Channel With Interposer Trace and Hybrid Bonding Pad
Choi, Inyoung	Quad Tower High Bandwidth Memory (QT-HBM) with Glass Substrate and Local Silicon Bridge Mamba-based Reinforcement Learning Method for HBM Power Distribution Network (PDN) Optimization with Probing Port-Agnostic Policy Signal Integrity Design and Analysis of Inter-Stack Crosslink for 3D-Heterogeneous Integrated High Bandwidth Memory (3D-HI-HBM) Module Stochastic S-Parameter Generation Using Denoising Regression for High-Speed Link Design High-Bandwidth Memory (HBM) Network Switch Architecture Design with Low Latency and Efficient Energy Consumption for HBM Centric Computing Design and Analysis of Scalable On-Package Memory Expansion Architectures for GPU-HBM System Considering Signal Integrity Design and Analysis of Power/Ground TSVs considering Static IR Drop for Next-generation HBM Power Integrity Design and Analysis of High Bandwidth Memory-centric Memory Pooling Computing Architecture
Choi, Seonguk	Stochastic S-Parameter Generation Using Denoising Regression for High-Speed Link Design
Choi, Yongjin	High-Speed Channel Identification Using Contrastive Learning
Chowdhury, Nasirul	8.4GTS LPDDR5x and 6.4GTS DDR5 Combo PHY
Chun, Sunghoon	Separate-Cavity Optimization Method for PCIe Gen6.0 PCB-Connector Pad Design Using Particle Swarm Optimization (PSO) Algorithm
Chun, Sungjun	Via-to-Trace Crosstalk Mitigation in the BGA Pin Field With the Broadside-Coupled Breakout Signal Integrity Analysis of Parasitic Coupling between Through Silicon Vias and Metal Wires in High-Speed Server Systems
Chung, Ook	Suppressing Differential-to-Common-Mode Conversion on Bent Differential Transmission Lines using Backdrills
Cocchini, Matteo	Corner Modeling and Sensitivity Analysis of a Rough-Foil Microstrip using Machine Learning
Corsello, Joshua	Optimized GPU Accelerated Computing Using FP32 for 3D Laguerre-FDTD Method
Corsello, Joshua	Trainable Activation Functions with Applications in the Design of 3D Electromagnetic Structures
D
Das, Sayantan	An Improved Adaptive Frequency Sampling Approach using Query by Committee
Datta, Srijan	Via-to-Trace Crosstalk Mitigation in the BGA Pin Field With the Broadside-Coupled Breakout Signal Integrity Analysis of Parasitic Coupling between Through Silicon Vias and Metal Wires in High-Speed Server Systems
De Zutter, Daniël	Broadband Impedance Response Extraction of On-Chip Interdigital Capacitors using a 3-D DSA Operator for Piecewise Homogeneous Structures
Degerstrom, Michael	Impulse-Response De-Embedding Correction For Non-Identical Fixturing
Dencker, Folke	Technology Demonstrator for a Glass-Based Quantum System
Dreps, Daniel	Via-to-Trace Crosstalk Mitigation in the BGA Pin Field With the Broadside-Coupled Breakout Signal Integrity Analysis of Parasitic Coupling between Through Silicon Vias and Metal Wires in High-Speed Server Systems
Dutta, Sounak	A Conditional Diffusion Framework for Sample-Efficient Thermal Modeling in 3DICs
F
Feng, Milton	Systematic Diagnosis on Mixed-Mode Resonances up to 60 GHz for 212.5 Gbps OSFP Connector Ground Resonance On-Wafer Measurement up to 67 GHz and Modeling with Physical Equivalent Circuit Multimode Phase-Matching Technique for 128 GT/s PAM4 PCIe Connector Resonance Reduction
Franzon, Paul	A Conditional Diffusion Framework for Sample-Efficient Thermal Modeling in 3DICs
G
Geyik, Cemil	Package Technology Exploration for 448 Gbps Electrical Signaling
Gharib, Mohamed	Bandit Learning-Driven Power Gating with State Retention for High Performance Computing
Go, Dong-Jae	Compact Signal Integrity Recovery Module in Coplanar Stripline with Signal Balancing
Gope, Dipanjan	An Improved Adaptive Frequency Sampling Approach using Query by Committee
Grivet-Talocia, Stefano	Towards Estimation of Worst-case Voltage Droop in Nonlinear Power Delivery Networks
Gu, Yalong	Machine-Learning-Based Optical I/O Design and Analysis Automation for Co-Packaged Optics
Guerber, Jon	8.4GTS LPDDR5x and 6.4GTS DDR5 Combo PHY
Guo, Yiliang	Optimized GPU Accelerated Computing Using FP32 for 3D Laguerre-FDTD Method Trainable Activation Functions with Applications in the Design of 3D Electromagnetic Structures
H
Haider, Clifton	Through-Plane Forward Crosstalk in Superconducting Stripline Transmission Lines Temperature Effects on Cryogenic Test Fixture Interconnects Impulse-Response De-Embedding Correction For Non-Identical Fixturing
Han, Jaeduk	Compact Signal Integrity Recovery Module in Coplanar Stripline with Signal Balancing Ultra-wideband Common-mode Rejection Filter Structure with L- and T-shaped Patterns for Ultra-High-Speed Data Transmission
Hatton, Jasper	A Multiresolution Preconditioner for the Electromagnetic Analysis of Large Interconnects
He, Yulin	Systematic Diagnosis on Mixed-Mode Resonances up to 60 GHz for 212.5 Gbps OSFP Connector Ground Resonance On-Wafer Measurement up to 67 GHz and Modeling with Physical Equivalent Circuit Multimode Phase-Matching Technique for 128 GT/s PAM4 PCIe Connector Resonance Reduction
Heine, Hendrik	Technology Demonstrator for a Glass-Based Quantum System
Hong, Seokwoo	PCIe Gen 7.0 System-level Design Considerations for Conventional Cu-based Interconnect
Horng, Auger	Heat Dissipation Characteristics of Massive Airflow Cooling Heat Sinks: A High-Pressure Air-Surrounded Approach
Hossain, Masum	Digital equalization for Multilevel signaling in high-speed SerDes
Hung,	Machine Learning Framework for System-Level Prediction of Co-Packaged Optics
Huynen, Martijn	Broadband Impedance Response Extraction of On-Chip Interdigital Capacitors using a 3-D DSA Operator for Piecewise Homogeneous Structures
Hwang, Jisoo	Reinforcement Learning-Based Co-Optimization of Power and Thermal Integrity in Backside Power Delivery Network-Enabled Advanced Packages
Hwang, Yin-Huan	8.4GTS LPDDR5x and 6.4GTS DDR5 Combo PHY
I
Islam, Md. Jawad Ul	Can a broken wire transmit signals?: Spoof Plasmonic Wires made of Metallic Islands
Ismail, Iman	Enhanced Thermal Conductivity of Electrodeposited Graphene-Cu Thin Films for BEOL Integration
J
Jahan, Ishrat	`Spectral Harvesting': a Fault tolerant design technique for chip-scale interconnects
Jang, Chrom	PCIe Gen 7.0 System-level Design Considerations for Conventional Cu-based Interconnect
Jang, Yooseong	Compact Signal Integrity Recovery Module in Coplanar Stripline with Signal Balancing Ultra-wideband Common-mode Rejection Filter Structure with L- and T-shaped Patterns for Ultra-High-Speed Data Transmission
Jin, Sungwoo	PCIe Gen 7.0 System-level Design Considerations for Conventional Cu-based Interconnect
Joy, Soumitra	Can a broken wire transmit signals?: Spoof Plasmonic Wires made of Metallic Islands Electrical and Thermal Integrity in Interconnect Design: challenges and new opportunities `Spectral Harvesting': a Fault tolerant design technique for chip-scale interconnects
Jung, Ki Wook	Reinforcement Learning-Based Co-Optimization of Power and Thermal Integrity in Backside Power Delivery Network-Enabled Advanced Packages
K
Kabir, Ehsan	Direct Die Attached on PCB-like large packages for High Bandwidth AI-Memory Systems
Kannan, Dinesh	A Conditional Diffusion Framework for Sample-Efficient Thermal Modeling in 3DICs
Kashyap, Priyank	A Conditional Diffusion Framework for Sample-Efficient Thermal Modeling in 3DICs High-Speed Channel Identification Using Contrastive Learning
Kassner, Alexander	Technology Demonstrator for a Glass-Based Quantum System
Khac Le, Hung	Crosstalk-Aware MMSE Equalizer Design for Chiplet Interfaces
Kiguradze, Zurab	Skew-Induced Insertion Loss Deviation (SILD) and FOM_SILD: Metrics for Quantifying P/N Skew Effects in High-Speed Channels
Kim, Byeongmok	Quad Tower High Bandwidth Memory (QT-HBM) with Glass Substrate and Local Silicon Bridge Signal Integrity Analysis of Chiplet Channel With Interposer Trace and Hybrid Bonding Pad Mamba-based Reinforcement Learning Method for HBM Power Distribution Network (PDN) Optimization with Probing Port-Agnostic Policy Signal Integrity Design and Analysis of Inter-Stack Crosslink for 3D-Heterogeneous Integrated High Bandwidth Memory (3D-HI-HBM) Module Stochastic S-Parameter Generation Using Denoising Regression for High-Speed Link Design High-Bandwidth Memory (HBM) Network Switch Architecture Design with Low Latency and Efficient Energy Consumption for HBM Centric Computing Design and Analysis of Scalable On-Package Memory Expansion Architectures for GPU-HBM System Considering Signal Integrity Design and Analysis of Power/Ground TSVs considering Static IR Drop for Next-generation HBM Power Integrity Design and Analysis of High Bandwidth Memory-centric Memory Pooling Computing Architecture
Kim, Haeyeon	Mamba-based Reinforcement Learning Method for HBM Power Distribution Network (PDN) Optimization with Probing Port-Agnostic Policy Design and Analysis of Power/Ground TSVs considering Static IR Drop for Next-generation HBM
Kim, Hyunwoo	PCIe Gen 7.0 System-level Design Considerations for Conventional Cu-based Interconnect
Kim, Joungho	Quad Tower High Bandwidth Memory (QT-HBM) with Glass Substrate and Local Silicon Bridge Signal Integrity Analysis of Chiplet Channel With Interposer Trace and Hybrid Bonding Pad Mamba-based Reinforcement Learning Method for HBM Power Distribution Network (PDN) Optimization with Probing Port-Agnostic Policy Signal Integrity Design and Analysis of Inter-Stack Crosslink for 3D-Heterogeneous Integrated High Bandwidth Memory (3D-HI-HBM) Module Stochastic S-Parameter Generation Using Denoising Regression for High-Speed Link Design High-Bandwidth Memory (HBM) Network Switch Architecture Design with Low Latency and Efficient Energy Consumption for HBM Centric Computing Design and Analysis of Scalable On-Package Memory Expansion Architectures for GPU-HBM System Considering Signal Integrity Design and Analysis of Power/Ground TSVs considering Static IR Drop for Next-generation HBM Power Integrity Design and Analysis of High Bandwidth Memory-centric Memory Pooling Computing Architecture
Kim, Kang-Wook	Compact Signal Integrity Recovery Module in Coplanar Stripline with Signal Balancing Ultra-wideband Common-mode Rejection Filter Structure with L- and T-shaped Patterns for Ultra-High-Speed Data Transmission
Kim, Kyungsuk	Separate-Cavity Optimization Method for PCIe Gen6.0 PCB-Connector Pad Design Using Particle Swarm Optimization (PSO) Algorithm PCIe Gen 7.0 System-level Design Considerations for Conventional Cu-based Interconnect
Kim, Mun-Ju	Compact Signal Integrity Recovery Module in Coplanar Stripline with Signal Balancing Ultra-wideband Common-mode Rejection Filter Structure with L- and T-shaped Patterns for Ultra-High-Speed Data Transmission
Kim, Nam Sung	Temperature-Dependent SPICE Models for UCIe Interconnects
Kim, Soyoung	Crosstalk-Aware MMSE Equalizer Design for Chiplet Interfaces Reinforcement Learning-Based Co-Optimization of Power and Thermal Integrity in Backside Power Delivery Network-Enabled Advanced Packages
Kim, Taesoo	Quad Tower High Bandwidth Memory (QT-HBM) with Glass Substrate and Local Silicon Bridge Signal Integrity Analysis of Chiplet Channel With Interposer Trace and Hybrid Bonding Pad Stochastic S-Parameter Generation Using Denoising Regression for High-Speed Link Design
Koo, Jayoon	Quad Tower High Bandwidth Memory (QT-HBM) with Glass Substrate and Local Silicon Bridge
Koul, Amendra	Skew-Induced Insertion Loss Deviation (SILD) and FOM_SILD: Metrics for Quantifying P/N Skew Effects in High-Speed Channels
Krishna, Ram	Temperature-Dependent SPICE Models for UCIe Interconnects
Kumar, Gokul	Direct Die Attached on PCB-like large packages for High Bandwidth AI-Memory Systems
L
Lee, Hyeongi	Separate-Cavity Optimization Method for PCIe Gen6.0 PCB-Connector Pad Design Using Particle Swarm Optimization (PSO) Algorithm
Lee, Jaehoon	Suppressing Differential-to-Common-Mode Conversion on Bent Differential Transmission Lines using Backdrills
Lee, Junghyun	Mamba-based Reinforcement Learning Method for HBM Power Distribution Network (PDN) Optimization with Probing Port-Agnostic Policy Signal Integrity Design and Analysis of Inter-Stack Crosslink for 3D-Heterogeneous Integrated High Bandwidth Memory (3D-HI-HBM) Module High-Bandwidth Memory (HBM) Network Switch Architecture Design with Low Latency and Efficient Energy Consumption for HBM Centric Computing Design and Analysis of Scalable On-Package Memory Expansion Architectures for GPU-HBM System Considering Signal Integrity Design and Analysis of Power/Ground TSVs considering Static IR Drop for Next-generation HBM Power Integrity Design and Analysis of High Bandwidth Memory-centric Memory Pooling Computing Architecture
Lee, Junghyun	Reinforcement Learning-Based Co-Optimization of Power and Thermal Integrity in Backside Power Delivery Network-Enabled Advanced Packages
Lee, Myunghoon	Reinforcement Learning-Based Co-Optimization of Power and Thermal Integrity in Backside Power Delivery Network-Enabled Advanced Packages
Lee, Youngjae	Separate-Cavity Optimization Method for PCIe Gen6.0 PCB-Connector Pad Design Using Particle Swarm Optimization (PSO) Algorithm
Li, Jingbo	SI Performance Optimization on High-Speed Plated-Through-Hole Vias for AI and MCP-Driven Designs
Li, Weizhe	SI Performance Optimization on High-Speed Plated-Through-Hole Vias for AI and MCP-Driven Designs
Li, Yongzhong	A Multiresolution Preconditioner for the Electromagnetic Analysis of Large Interconnects
Limaye, Aparna	Direct Die Attached on PCB-like large packages for High Bandwidth AI-Memory Systems
Lin, Han-Ting	On-Chip Passive Dispersive Delay Lines for RF Chirp Pulse Shaping On-Chip Tunable Delay Line Using Complementary Bridged T-Coils with Inductor-Capacitor Tuning
Lin, Kung-An	Optimization of Co-Packaged Optics (CPO) Layout with Integrated DFB Laser and EIC
Liu, Dan	SI Performance Optimization on High-Speed Plated-Through-Hole Vias for AI and MCP-Driven Designs
Liu, Zetai	Ground Resonance On-Wafer Measurement up to 67 GHz and Modeling with Physical Equivalent Circuit
Lu, Meiju	Machine Learning Framework for System-Level Prediction of Co-Packaged Optics
M
Manukovsky, Alex	Waveguiding Approach to Via Design with Bandwidth over 120 GHz
Min, Byung-Cheol	Compact Signal Integrity Recovery Module in Coplanar Stripline with Signal Balancing Ultra-wideband Common-mode Rejection Filter Structure with L- and T-shaped Patterns for Ultra-High-Speed Data Transmission
N
Nguyen, Chris	Tensor Train Accelerated Solution of Volume Integral Equation for 2D Magneto-Quasi-Static Characterization of Multiconductor Transmission Lines with Logarithmic Complexity
Nguyen, Megan	Signal Integrity Analysis of Parasitic Coupling between Through Silicon Vias and Metal Wires in High-Speed Server Systems
Noman, Md. Omar Faruk	Can a broken wire transmit signals?: Spoof Plasmonic Wires made of Metallic Islands
Nozadze, David	Skew-Induced Insertion Loss Deviation (SILD) and FOM_SILD: Metrics for Quantifying P/N Skew Effects in High-Speed Channels
O
Okhmatovski, Vladimir	Tensor Train Acceleration of Volume Integral Equation Solutions for EM Analysis of Interconnects Tensor Train Accelerated Solution of Volume Integral Equation for 2D Magneto-Quasi-Static Characterization of Multiconductor Transmission Lines with Logarithmic Complexity
Oldenburg, Wesley	Through-Plane Forward Crosstalk in Superconducting Stripline Transmission Lines
Oshita, Takao	8.4GTS LPDDR5x and 6.4GTS DDR5 Combo PHY
Ovard, David	Direct Die Attached on PCB-like large packages for High Bandwidth AI-Memory Systems
P
Page, Andrew	Corner Modeling and Sensitivity Analysis of a Rough-Foil Microstrip using Machine Learning
Palermo, Samuel	Transceiver Architectures for Future System Interconnect Demands
Panda, Sushil	A Conditional Diffusion Framework for Sample-Efficient Thermal Modeling in 3DICs
Park, Junho	Quad Tower High Bandwidth Memory (QT-HBM) with Glass Substrate and Local Silicon Bridge Signal Integrity Analysis of Chiplet Channel With Interposer Trace and Hybrid Bonding Pad Mamba-based Reinforcement Learning Method for HBM Power Distribution Network (PDN) Optimization with Probing Port-Agnostic Policy Signal Integrity Design and Analysis of Inter-Stack Crosslink for 3D-Heterogeneous Integrated High Bandwidth Memory (3D-HI-HBM) Module Stochastic S-Parameter Generation Using Denoising Regression for High-Speed Link Design High-Bandwidth Memory (HBM) Network Switch Architecture Design with Low Latency and Efficient Energy Consumption for HBM Centric Computing Design and Analysis of Scalable On-Package Memory Expansion Architectures for GPU-HBM System Considering Signal Integrity Design and Analysis of Power/Ground TSVs considering Static IR Drop for Next-generation HBM Power Integrity Design and Analysis of High Bandwidth Memory-centric Memory Pooling Computing Architecture
Park, Seonghyun	Crosstalk-Aware MMSE Equalizer Design for Chiplet Interfaces
Partin-Vaisband, Inna	Vertical Power Delivery for High-Density Computing: Challenges and Opportunities Bandit Learning-Driven Power Gating with State Retention for High Performance Computing
Pattyn, Tim	Broadband Impedance Response Extraction of On-Chip Interdigital Capacitors using a 3-D DSA Operator for Piecewise Homogeneous Structures
Penta, Srujan	Temperature-Dependent SPICE Models for UCIe Interconnects
Pöpsel, Frederik	Technology Demonstrator for a Glass-Based Quantum System
Q
Qian, Zhiguo	Package Technology Exploration for 448 Gbps Electrical Signaling
Quillen, Kevin	Direct Die Attached on PCB-like large packages for High Bandwidth AI-Memory Systems
R
Radke, Andrew	ADAPT - Adaptive Droop and Performance Tuner for Droop Mitigation Schemes
Raghuram, Raj	SPICE Based Optimization of Equalization in Channel Simulation
Ranjan Trivedi, Amit	Bandit Learning-Driven Power Gating with State Retention for High Performance Computing
Ren, Jihong	Augmented Reality Applications and Power Electronics Challenges
Rosenbaum, Elyse	Temperature-Dependent SPICE Models for UCIe Interconnects
Rouf, Nirjhor	A Conditional Diffusion Framework for Sample-Efficient Thermal Modeling in 3DICs
Roy, Abinash	ADAPT - Adaptive Droop and Performance Tuner for Droop Mitigation Schemes
S
Saha, Anindya	8.4GTS LPDDR5x and 6.4GTS DDR5 Combo PHY
Salim, Amani	Enhanced Thermal Conductivity of Electrodeposited Graphene-Cu Thin Films for BEOL Integration
Sapozhnikov, Mike	Skew-Induced Insertion Loss Deviation (SILD) and FOM_SILD: Metrics for Quantifying P/N Skew Effects in High-Speed Channels
Schudak, Svenja	Technology Demonstrator for a Glass-Based Quantum System
Schutt-Aine, Jose	Fast Simulation Algorithm for Negative-Capacitance FinFET Based on Latency Insertion Method
Selvam, Pretha	Enhanced Thermal Conductivity of Electrodeposited Graphene-Cu Thin Films for BEOL Integration
Seo, Eunji	Quad Tower High Bandwidth Memory (QT-HBM) with Glass Substrate and Local Silicon Bridge Signal Integrity Analysis of Chiplet Channel With Interposer Trace and Hybrid Bonding Pad Mamba-based Reinforcement Learning Method for HBM Power Distribution Network (PDN) Optimization with Probing Port-Agnostic Policy Signal Integrity Design and Analysis of Inter-Stack Crosslink for 3D-Heterogeneous Integrated High Bandwidth Memory (3D-HI-HBM) Module High-Bandwidth Memory (HBM) Network Switch Architecture Design with Low Latency and Efficient Energy Consumption for HBM Centric Computing Design and Analysis of Scalable On-Package Memory Expansion Architectures for GPU-HBM System Considering Signal Integrity Design and Analysis of Power/Ground TSVs considering Static IR Drop for Next-generation HBM Power Integrity Design and Analysis of High Bandwidth Memory-centric Memory Pooling Computing Architecture
Shamsul, Iqbal	Enhanced Thermal Conductivity of Electrodeposited Graphene-Cu Thin Films for BEOL Integration
Sharma, Rohit	High-speed Interconnect Design for next-gen AI Hardware
Shaw, Stephen	Through-Plane Forward Crosstalk in Superconducting Stripline Transmission Lines
Sheikh Sofla, Sohrab	Machine Learning Framework for System-Level Prediction of Co-Packaged Optics
Shin, Taein	Stochastic S-Parameter Generation Using Denoising Regression for High-Speed Link Design
Shlepnev, Yuriy	Waveguiding Approach to Via Design with Bandwidth over 120 GHz
Son, Keeyoung	Design and Analysis of Scalable On-Package Memory Expansion Architectures for GPU-HBM System Considering Signal Integrity Power Integrity Design and Analysis of High Bandwidth Memory-centric Memory Pooling Computing Architecture
Song, Jinwook	Separate-Cavity Optimization Method for PCIe Gen6.0 PCB-Connector Pad Design Using Particle Swarm Optimization (PSO) Algorithm PCIe Gen 7.0 System-level Design Considerations for Conventional Cu-based Interconnect
Song, Kewei	Systematic Diagnosis on Mixed-Mode Resonances up to 60 GHz for 212.5 Gbps OSFP Connector Ground Resonance On-Wafer Measurement up to 67 GHz and Modeling with Physical Equivalent Circuit Multimode Phase-Matching Technique for 128 GT/s PAM4 PCIe Connector Resonance Reduction
Song, Suhyoun	Suppressing Differential-to-Common-Mode Conversion on Bent Differential Transmission Lines using Backdrills
Steffen, Chris	Signal Integrity Analysis of Parasitic Coupling between Through Silicon Vias and Metal Wires in High-Speed Server Systems
Su, Huan-Ping	Heat Dissipation Characteristics of Massive Airflow Cooling Heat Sinks: A High-Pressure Air-Surrounded Approach
Su, Tao	SPICE Based Optimization of Equalization in Channel Simulation
Suh, Haeseok	Quad Tower High Bandwidth Memory (QT-HBM) with Glass Substrate and Local Silicon Bridge Signal Integrity Analysis of Chiplet Channel With Interposer Trace and Hybrid Bonding Pad Mamba-based Reinforcement Learning Method for HBM Power Distribution Network (PDN) Optimization with Probing Port-Agnostic Policy Signal Integrity Design and Analysis of Inter-Stack Crosslink for 3D-Heterogeneous Integrated High Bandwidth Memory (3D-HI-HBM) Module Stochastic S-Parameter Generation Using Denoising Regression for High-Speed Link Design High-Bandwidth Memory (HBM) Network Switch Architecture Design with Low Latency and Efficient Energy Consumption for HBM Centric Computing Design and Analysis of Scalable On-Package Memory Expansion Architectures for GPU-HBM System Considering Signal Integrity Design and Analysis of Power/Ground TSVs considering Static IR Drop for Next-generation HBM Power Integrity Design and Analysis of High Bandwidth Memory-centric Memory Pooling Computing Architecture
Sun, Xiao	Broadband Impedance Response Extraction of On-Chip Interdigital Capacitors using a 3-D DSA Operator for Piecewise Homogeneous Structures
Swaminathan, Madhavan	Optimized GPU Accelerated Computing Using FP32 for 3D Laguerre-FDTD Method Machine Learning Framework for System-Level Prediction of Co-Packaged Optics Trainable Activation Functions with Applications in the Design of 3D Electromagnetic Structures
T
Tang, Junyan	Via-to-Trace Crosstalk Mitigation in the BGA Pin Field With the Broadside-Coupled Breakout Signal Integrity Analysis of Parasitic Coupling between Through Silicon Vias and Metal Wires in High-Speed Server Systems
Triverio, Piero	A Multiresolution Preconditioner for the Electromagnetic Analysis of Large Interconnects
U
Uhm, Hyunseo	Signal Integrity Analysis of Chiplet Channel With Interposer Trace and Hybrid Bonding Pad Mamba-based Reinforcement Learning Method for HBM Power Distribution Network (PDN) Optimization with Probing Port-Agnostic Policy High-Bandwidth Memory (HBM) Network Switch Architecture Design with Low Latency and Efficient Energy Consumption for HBM Centric Computing Design and Analysis of Scalable On-Package Memory Expansion Architectures for GPU-HBM System Considering Signal Integrity Design and Analysis of Power/Ground TSVs considering Static IR Drop for Next-generation HBM Power Integrity Design and Analysis of High Bandwidth Memory-centric Memory Pooling Computing Architecture
V
Vande Ginste, Dries	Broadband Impedance Response Extraction of On-Chip Interdigital Capacitors using a 3-D DSA Operator for Piecewise Homogeneous Structures
Victor, Ashita	Temperature-Dependent SPICE Models for UCIe Interconnects
W
Wang, Joseph	Multimode Phase-Matching Technique for 128 GT/s PAM4 PCIe Connector Resonance Reduction
Wang, Wayne	SI Performance Optimization on High-Speed Plated-Through-Hole Vias for AI and MCP-Driven Designs
Wang, Yifan	Optimized GPU Accelerated Computing Using FP32 for 3D Laguerre-FDTD Method
Wang, Yifan	Trainable Activation Functions with Applications in the Design of 3D Electromagnetic Structures
Wang, Yuechen	Via-to-Trace Crosstalk Mitigation in the BGA Pin Field With the Broadside-Coupled Breakout Signal Integrity Analysis of Parasitic Coupling between Through Silicon Vias and Metal Wires in High-Speed Server Systems
Wassick, Tom	Signal Integrity Analysis of Parasitic Coupling between Through Silicon Vias and Metal Wires in High-Speed Server Systems
Watanabe, Atom	Temperature-Dependent SPICE Models for UCIe Interconnects
Waters, Allen	8.4GTS LPDDR5x and 6.4GTS DDR5 Combo PHY
Weisshaar, Andreas	On-Chip Passive Dispersive Delay Lines for RF Chirp Pulse Shaping On-Chip Tunable Delay Line Using Complementary Bridged T-Coils with Inductor-Capacitor Tuning
Wen, Yuejiang	High-Speed Channel Identification Using Contrastive Learning
Wolf, Henry	Temperature Effects on Cryogenic Test Fixture Interconnects
Wu, Chao-Hsin	Optimization of Co-Packaged Optics (CPO) Layout with Integrated DFB Laser and EIC
Wu, Haonan	Systematic Diagnosis on Mixed-Mode Resonances up to 60 GHz for 212.5 Gbps OSFP Connector Ground Resonance On-Wafer Measurement up to 67 GHz and Modeling with Physical Equivalent Circuit
Wurz, Marc Christopher	Technology Demonstrator for a Glass-Based Quantum System
Y
Yang,	Machine Learning Framework for System-Level Prediction of Co-Packaged Optics
Yang, Lucas	Optimization of Co-Packaged Optics (CPO) Layout with Integrated DFB Laser and EIC
Yang, Xianbo	Via-to-Trace Crosstalk Mitigation in the BGA Pin Field With the Broadside-Coupled Breakout Signal Integrity Analysis of Parasitic Coupling between Through Silicon Vias and Metal Wires in High-Speed Server Systems
Ye, Duye	Package Technology Exploration for 448 Gbps Electrical Signaling Machine-Learning-Based Optical I/O Design and Analysis Automation for Co-Packaged Optics
Yoo, Hogeun	Suppressing Differential-to-Common-Mode Conversion on Bent Differential Transmission Lines using Backdrills
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