PROGRAM
Days: Monday, December 15th Tuesday, December 16th Wednesday, December 17th
Monday, December 15th
View this program: with abstractssession overviewtalk overview
11:30-12:30Lunch
12:50-13:00Break
13:00-13:45 Session 2: Keynote Speech 1
【Keynote Speech 1】Beyond Moore's Law: The Chiplet Revolution in Semiconductor Packaging
Dr. Yasumitsu Orii (Rapidus)
Chair:
Location: Small Auditorium, 1st floor
13:45-14:00Break
14:00-15:00 Session 3: Tutorial 1
【Tutorial 1】Fundamentals of Electrical Design for Advance Packaging and Heterogeneous Integration
Prof. Rohit Sharma (Indian Institute of Technology Ropar)
Chair:
Location: Small Auditorium, 1st floor
15:00-15:15Break
15:15-16:15 Session 4: Tutorial 2
【Tutorial 2】The Evolution of mmWaveAntenna in Package Toward a Connected Intelligent Future
Dr. Atom O. Watanabe (IBM T.J. Watson Research Center)
Chair:
Location: Small Auditorium, 1st floor
16:15-16:30Break
16:30-17:30 Session 5: Tutorial 3
【Tutorial 3】TBD
Tom Dhaene and Thijs Ullrick (Ghent University - imec)
Chair:
Location: Small Auditorium, 1st floor
17:30-18:00Break
Tuesday, December 16th
View this program: with abstractssession overviewtalk overview
09:45-10:30 Session 7: Keynote Speech 2
【Keynote Speech 2】Heterogeneous Integration - A Means to continue Moore's Law
Prof. Madhavan Swaminathan (Penn State University)
Chair:
Location: Small Auditorium, 1st floor
10:30-10:40Break
10:40-12:00 Session 8: Oral Session
Oral Session1: Next Generation Memory Devices and their Interconnection
Chair:
Location: Small Auditorium, 1st floor
| 10:40 | Design of Chiplet Interconnects Considering Crosstalk Induced from Meshed Ground Plane (abstract) PRESENTER: Jiwoon Moon |
| 11:00 | Signal Integrity Analysis of High-Speed Chiplet Interconnection Considering Surface Roughness Based on Huray Model (abstract) PRESENTER: Jonghyeon Lee |
| 11:20 | Mem-Village: A Hybrid HBF-HBM Architecture on Glass for Ultra-Scale AI Inference Systems (abstract) PRESENTER: Hyuni Lee |
| 11:40 | Compact and robust holographic memory for optically reconfigurable gate arrays (abstract) PRESENTER: Minoru Watanabe |
12:00-13:00Lunch Break
13:30-14:50 Session 10: Oral Session
Oral Session 2: Single and Power Integrity
Chair:
Location: Small Auditorium, 1st floor
| 13:30 | Electrical Performance of Interconnects in an Organic Interposer Targeted for Chiplet Applications (abstract) PRESENTER: Ying Ying Lim |
| 13:50 | Uncertainty Quantification Using Riemannian Tensor Train Completion for Polynomial Chaos (abstract) PRESENTER: Ziyuan Wang |
| 14:10 | Verification of channel crosstalk suppression effects due to differences in cable length using mode-division multiplexed transmission method (abstract) PRESENTER: Hayato Yatabe |
| 14:30 | Estimation of Power Bus Resonance Suppression by Lossy Resonator Filter in the Wi-Fi Band Using Equivalent Circuit Model (abstract) PRESENTER: Sho Kanao |
14:50-15:00Break
15:00-16:20 Session 11: Oral Session
Oral Session3: Advanced Packaging
Chair:
Location: Small Auditorium, 1st floor
| 15:00 | A Novel Study on the Effect of Temperature Cycle Testing on the Transmission Performance of Sub-2 micron Fine-Wiring for Glass Substrates (abstract) PRESENTER: Masaya Tanaka |
| 15:20 | Compact 3D-SiP Power IC Packaging with Thermal Performance Improvement (abstract) PRESENTER: Harrison Chang |
| 15:40 | Vector Fitting Method in Transient Thermal Analysis for Heterogeneous Multilayered Packaging (abstract) PRESENTER: Fong-Rong Bai |
| 16:00 | Asymmetric Organic Cores to Reduce Semiconductor Substrate Warpage (abstract) PRESENTER: Ryota Yambe |
16:20-16:40Break
16:40-17:50 Session 12: Poster Session
Poster Session
A Novel Structure of Pre-Emphasis Passive Amplifier by Employing Broadside Self Coupling (abstract) |
20-H Rule of Power Ground Plane of Printed Circuit Board and Clustering of Electric Near-Field Distribution (abstract) |
Statistical Eye-Diagram Estimation Method for PAM-4 Based High-speed Channel Considering Crosstalk (abstract) PRESENTER: Yuchul Jung |
Achieving 32 Gbps in UCIe-S 2D-Packaging Based on Microstrip Routing on Glass Substrates (abstract) PRESENTER: Yuchi Yang |
Guided by Uncertainty: Adaptive Frequency Sampling Using Gaussian Processes (abstract) PRESENTER: Thijs Ullrick |
Comprehensive Characterization of Inkjet Printer Ag Film on Paper Substrate for Sensor Electrodes (abstract) PRESENTER: Akanksha Arya |
Probed Measurement Techniques for 100 Gbit/s D-band Wireless Link Experiments (abstract) PRESENTER: Reinier Broucke |
Pressure-Bonding of GaN-HEMT Die to Graphite Carbon for heat dissipation (abstract) PRESENTER: Koji Aramaki |
Temperature Dependence of Threshold Voltage for Interconnect IDDQ Testing in 3D Stacked ICs Using an Offset-Cancellation-Type Comparator (abstract) PRESENTER: Haruto Ohmori |
Effect of Wiring Geometry Modification on Signal Integrity in Silicon-Interposer Interconnect (abstract) PRESENTER: Yosei Kawamoto |
Physics-Intuitive Micro-Modeling Circuits (MMC) for Fast Analysis of Finite Dielectric Problems (abstract) PRESENTER: Chengyi Cao |
17:50-18:10Break
Wednesday, December 17th
View this program: with abstractssession overviewtalk overview
09:00-09:45 Session 13: Keynote Speech 3
【Keynote Speech 3】TBD
TBD
Chair:
Location: Small Auditorium, 1st floor
09:45-10:30 Session 14: Keynote Speech 4
【Keynote Speech 4】AI for Signal and Power Integrity: From Physics-Guided Learning to Intelligent Electronics Design
Prof. En-Xiao Liu (A*STAR Institute of High Performance Computing)
Chair:
Location: Small Auditorium, 1st floor
10:30-10:40Break
10:40-12:00 Session 15: Oral Session
Oral Session 4: Machine Learning and EDA
Chair:
Location: Small Auditorium, 1st floor
| 10:40 | Memory-Encoded DeepONet (M-DeepONet) for Transient Circuit Behavioral Modeling (abstract) PRESENTER: Phoo Pyae Pyae Linn |
| 11:00 | Chiplet Placement and Routing Agent for UCIe Interfaces Considering Thermal and Signal Integrity (abstract) PRESENTER: Hyunseo Uhm |
| 11:20 | Switch Transformer-based Reinforcement Learning Method for Power Supply Induced Jitter (PSIJ) Reduction in High Bandwidth Memory (HBM) (abstract) PRESENTER: Jaegeun Bae |
| 11:40 | Hierarchical Reinforcement Learning-based Co-Optimization of Package Substrate Design for Multiple Power Domain 3D-ICs (abstract) PRESENTER: Seunghun Ryu |
12:00-12:50Lunch Break
13:20-13:30 Session 17: TC Session
TC Session: Activities of the IEEE EPS Technical Committee on Electrical Design, Modeling, and Simulation
Prof. Antonio Maffucci (University of Cassino and Southern Lazio, Cassino)
Location: Small Auditorium, 1st floor
13:30-14:50 Session 18: Oral Session
Oral Session 5: RF and Antenna in Package
Location: Small Auditorium, 1st floor
| 13:30 | Robust High-Frequency Wirebonding of a Power Amplifier to a Wideband D-band Antenna Array (abstract) PRESENTER: Samuel Rimbaut |
| 13:50 | Tunable Graphene based Terahertz Bandstop Filter for Semiconductor Packaging Applications (abstract) PRESENTER: G Challa Ram |
| 14:10 | A Velocity-Aware Density Peaks Clustering Method with Curb Filtering for Millimeter-Wave Radar (abstract) PRESENTER: Shixian Su |
| 14:30 | High-Performance Horizontally Polarized Bow-Tie Slot Antenna for Next-Generation Wi-Fi 7 Systems (abstract) PRESENTER: Hao Deng |
14:50-15:00Break
15:00-16:20 Session 19: Oral Session
Oral Session 6: EMI Countermeasures
Location: Small Auditorium, 1st floor
| 15:00 | Suppression of Connector Radiation Coupling to Antenna by Phase Cancellation (abstract) PRESENTER: Chih-Yu Fang |
| 15:20 | Design and Measurement of Ultra-wideband Bidirectional Absorptive Common Mode Filter (abstract) PRESENTER: Akihiro Narushima |
| 15:40 | Design of a Hybrid Common-Mode Filter Based on Electromagnetic Bandgap and Defected Ground Structure for Wideband Noise Suppression (abstract) PRESENTER: Jinwook Lee |
| 16:00 | An Ultra-Lightweight CNT-Aerogel Absorber for Broadband Noise Suppression on High-Speed Packages (abstract) PRESENTER: Sho Muroga |