EDAPS 2025: IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS

A
Ahn, Seungyoung	Hierarchical Reinforcement Learning-based Co-Optimization of Package Substrate Design for Multiple Power Domain 3D-ICs Design of a Hybrid Common-Mode Filter Based on Electromagnetic Bandgap and Defected Ground Structure for Wideband Noise Suppression
Ajia, Saijian	An Ultra-Lightweight CNT-Aerogel Absorber for Broadband Noise Suppression on High-Speed Packages
Ali, Fara Ashikin Binti	Temperature Dependence of Threshold Voltage for Interconnect IDDQ Testing in 3D Stacked ICs Using an Offset-Cancellation-Type Comparator
An, Hyowon	Mem-Village: A Hybrid HBF-HBM Architecture on Glass for Ultra-Scale AI Inference Systems
An, Hyunjun	Chiplet Placement and Routing Agent for UCIe Interfaces Considering Thermal and Signal Integrity
Aoyagi, Masahiro	Electrical Performance of Interconnects in an Organic Interposer Targeted for Chiplet Applications
Aoyagi, Masahiro	Effect of Wiring Geometry Modification on Signal Integrity in Silicon-Interposer Interconnect
Aramaki, Koji	Pressure-Bonding of GaN-HEMT Die to Graphite Carbon for heat dissipation
Arya, Akanksha	Comprehensive Characterization of Inkjet Printer Ag Film on Paper Substrate for Sensor Electrodes
B
Bae, Jaegeun	Chiplet Placement and Routing Agent for UCIe Interfaces Considering Thermal and Signal Integrity Switch Transformer-based Reinforcement Learning Method for Power Supply Induced Jitter (PSIJ) Reduction in High Bandwidth Memory (HBM)
Bai, Fong-Rong	Vector Fitting Method in Transient Thermal Analysis for Heterogeneous Multilayered Packaging
Broucke, Reinier	Probed Measurement Techniques for 100 Gbit/s D-band Wireless Link Experiments Robust High-Frequency Wirebonding of a Power Amplifier to a Wideband D-band Antenna Array
C
Cao, Chengyi	Physics-Intuitive Micro-Modeling Circuits (MMC) for Fast Analysis of Finite Dielectric Problems
Challa Ram, G	Tunable Graphene based Terahertz Bandstop Filter for Semiconductor Packaging Applications
Chang, Harrison	Compact 3D-SiP Power IC Packaging with Thermal Performance Improvement
Chen, Xu	Memory-Encoded DeepONet (M-DeepONet) for Transient Circuit Behavioral Modeling
Choi, Inyoung	Chiplet Placement and Routing Agent for UCIe Interfaces Considering Thermal and Signal Integrity Switch Transformer-based Reinforcement Learning Method for Power Supply Induced Jitter (PSIJ) Reduction in High Bandwidth Memory (HBM) Mem-Village: A Hybrid HBF-HBM Architecture on Glass for Ultra-Scale AI Inference Systems
Choi, Jaeho	A Novel Structure of Pre-Emphasis Passive Amplifier by Employing Broadside Self Coupling
D
Deng, Hao	A Velocity-Aware Density Peaks Clustering Method with Curb Filtering for Millimeter-Wave Radar High-Performance Horizontally Polarized Bow-Tie Slot Antenna for Next-Generation Wi-Fi 7 Systems
Deschrijver, Dirk	Guided by Uncertainty: Adaptive Frequency Sampling Using Gaussian Processes
Dhaene, Tom	Guided by Uncertainty: Adaptive Frequency Sampling Using Gaussian Processes
Dou, Yuhang	Physics-Intuitive Micro-Modeling Circuits (MMC) for Fast Analysis of Finite Dielectric Problems
E
Endo, Yasushi	An Ultra-Lightweight CNT-Aerogel Absorber for Broadband Noise Suppression on High-Speed Packages
F
Fang, Chih-Yu	Suppression of Connector Radiation Coupling to Antenna by Phase Cancellation
Feng, Wei	Electrical Performance of Interconnects in an Organic Interposer Targeted for Chiplet Applications
Fukumoto, Yuki	Verification of channel crosstalk suppression effects due to differences in cable length using mode-division multiplexed transmission method
H
H Werner, Douglas	Tunable Graphene based Terahertz Bandstop Filter for Semiconductor Packaging Applications
Ha, Seungmin	Design of a Hybrid Common-Mode Filter Based on Electromagnetic Bandgap and Defected Ground Structure for Wideband Noise Suppression
Hashizume, Masaki	Temperature Dependence of Threshold Voltage for Interconnect IDDQ Testing in 3D Stacked ICs Using an Offset-Cancellation-Type Comparator
Hidaka, Kishio	An Ultra-Lightweight CNT-Aerogel Absorber for Broadband Noise Suppression on High-Speed Packages
Hou, Yung-Chih	Suppression of Connector Radiation Coupling to Antenna by Phase Cancellation
J
J. Prat Balagna, Virgile	Compact and robust holographic memory for optically reconfigurable gate arrays
Jiang, Yang	Physics-Intuitive Micro-Modeling Circuits (MMC) for Fast Analysis of Finite Dielectric Problems
Johno, Keita	Asymmetric Organic Cores to Reduce Semiconductor Substrate Warpage
Jung, Yuchul	Statistical Eye-Diagram Estimation Method for PAM-4 Based High-speed Channel Considering Crosstalk Design of Chiplet Interconnects Considering Crosstalk Induced from Meshed Ground Plane Signal Integrity Analysis of High-Speed Chiplet Interconnection Considering Surface Roughness Based on Huray Model
K
Kanao, Sho	Estimation of Power Bus Resonance Suppression by Lossy Resonator Filter in the Wi-Fi Band Using Equivalent Circuit Model
Kapusuz, Kamil Yavuz	Probed Measurement Techniques for 100 Gbit/s D-band Wireless Link Experiments Robust High-Frequency Wirebonding of a Power Amplifier to a Wideband D-band Antenna Array
Kawamoto, Yosei	Effect of Wiring Geometry Modification on Signal Integrity in Silicon-Interposer Interconnect
Khazaka, Roni	Uncertainty Quantification Using Riemannian Tensor Train Completion for Polynomial Chaos
Kim, Byeongmok	Chiplet Placement and Routing Agent for UCIe Interfaces Considering Thermal and Signal Integrity Switch Transformer-based Reinforcement Learning Method for Power Supply Induced Jitter (PSIJ) Reduction in High Bandwidth Memory (HBM)
Kim, Dongkyun	Hierarchical Reinforcement Learning-based Co-Optimization of Package Substrate Design for Multiple Power Domain 3D-ICs
Kim, Haeyeon	Chiplet Placement and Routing Agent for UCIe Interfaces Considering Thermal and Signal Integrity Mem-Village: A Hybrid HBF-HBM Architecture on Glass for Ultra-Scale AI Inference Systems
Kim, Hyunwoo	Hierarchical Reinforcement Learning-based Co-Optimization of Package Substrate Design for Multiple Power Domain 3D-ICs Design of a Hybrid Common-Mode Filter Based on Electromagnetic Bandgap and Defected Ground Structure for Wideband Noise Suppression
Kim, Jiseong	Hierarchical Reinforcement Learning-based Co-Optimization of Package Substrate Design for Multiple Power Domain 3D-ICs Design of a Hybrid Common-Mode Filter Based on Electromagnetic Bandgap and Defected Ground Structure for Wideband Noise Suppression
Kim, Joungho	Chiplet Placement and Routing Agent for UCIe Interfaces Considering Thermal and Signal Integrity Switch Transformer-based Reinforcement Learning Method for Power Supply Induced Jitter (PSIJ) Reduction in High Bandwidth Memory (HBM)
Kim, Joungho	Mem-Village: A Hybrid HBF-HBM Architecture on Glass for Ultra-Scale AI Inference Systems
Kim, Sungbum	Signal Integrity Analysis of High-Speed Chiplet Interconnection Considering Surface Roughness Based on Huray Model
Kim, Taei	Statistical Eye-Diagram Estimation Method for PAM-4 Based High-speed Channel Considering Crosstalk Design of Chiplet Interconnects Considering Crosstalk Induced from Meshed Ground Plane
Kim, Uichan	Signal Integrity Analysis of High-Speed Chiplet Interconnection Considering Surface Roughness Based on Huray Model
Kim, Yigyeong	Design of Chiplet Interconnects Considering Crosstalk Induced from Meshed Ground Plane
Kim, Youngwoo	Statistical Eye-Diagram Estimation Method for PAM-4 Based High-speed Channel Considering Crosstalk Design of Chiplet Interconnects Considering Crosstalk Induced from Meshed Ground Plane Signal Integrity Analysis of High-Speed Chiplet Interconnection Considering Surface Roughness Based on Huray Model
Kindaichi, Rimpei	Asymmetric Organic Cores to Reduce Semiconductor Substrate Warpage
Kurahashi, Shunsuke	Asymmetric Organic Cores to Reduce Semiconductor Substrate Warpage
Kuramochi, Satoru	A Novel Study on the Effect of Temperature Cycle Testing on the Transmission Performance of Sub-2 micron Fine-Wiring for Glass Substrates
L
Lee, Hyuni	Mem-Village: A Hybrid HBF-HBM Architecture on Glass for Ultra-Scale AI Inference Systems
Lee, Jaehun	Mem-Village: A Hybrid HBF-HBM Architecture on Glass for Ultra-Scale AI Inference Systems
Lee, Jinwook	Hierarchical Reinforcement Learning-based Co-Optimization of Package Substrate Design for Multiple Power Domain 3D-ICs Design of a Hybrid Common-Mode Filter Based on Electromagnetic Bandgap and Defected Ground Structure for Wideband Noise Suppression
Lee, Jonghyeon	Signal Integrity Analysis of High-Speed Chiplet Interconnection Considering Surface Roughness Based on Huray Model
Lee, Jonghyeon	Statistical Eye-Diagram Estimation Method for PAM-4 Based High-speed Channel Considering Crosstalk Design of Chiplet Interconnects Considering Crosstalk Induced from Meshed Ground Plane
Lee, Junghyun	Chiplet Placement and Routing Agent for UCIe Interfaces Considering Thermal and Signal Integrity Mem-Village: A Hybrid HBF-HBM Architecture on Glass for Ultra-Scale AI Inference Systems
Lee, Sanguk	Hierarchical Reinforcement Learning-based Co-Optimization of Package Substrate Design for Multiple Power Domain 3D-ICs Design of a Hybrid Common-Mode Filter Based on Electromagnetic Bandgap and Defected Ground Structure for Wideband Noise Suppression
Lee, Seonghi	Hierarchical Reinforcement Learning-based Co-Optimization of Package Substrate Design for Multiple Power Domain 3D-ICs Design of a Hybrid Common-Mode Filter Based on Electromagnetic Bandgap and Defected Ground Structure for Wideband Noise Suppression
Lemey, Sam	Probed Measurement Techniques for 100 Gbit/s D-band Wireless Link Experiments Robust High-Frequency Wirebonding of a Power Amplifier to a Wideband D-band Antenna Array
Li, Yufeng	Achieving 32 Gbps in UCIe-S 2D-Packaging Based on Microstrip Routing on Glass Substrates
Lim, Ying Ying	Electrical Performance of Interconnects in an Organic Interposer Targeted for Chiplet Applications
Lin, Chien-Min	Vector Fitting Method in Transient Thermal Analysis for Heterogeneous Multilayered Packaging
Lindemans, Yens	Guided by Uncertainty: Adaptive Frequency Sampling Using Gaussian Processes
Linn, Phoo Pyae Pyae	Memory-Encoded DeepONet (M-DeepONet) for Transient Circuit Behavioral Modeling
Lu, Cheng-Yuan	Vector Fitting Method in Transient Thermal Analysis for Heterogeneous Multilayered Packaging
Lu, Shihwen	Compact 3D-SiP Power IC Packaging with Thermal Performance Improvement
Lu, Shyue-Kung	Temperature Dependence of Threshold Voltage for Interconnect IDDQ Testing in 3D Stacked ICs Using an Offset-Cancellation-Type Comparator
Luo, Wenbo	Achieving 32 Gbps in UCIe-S 2D-Packaging Based on Microstrip Routing on Glass Substrates
M
Manhas, Sanjeev Kumar	Comprehensive Characterization of Inkjet Printer Ag Film on Paper Substrate for Sensor Electrodes
Masuko, Takashi	Asymmetric Organic Cores to Reduce Semiconductor Substrate Warpage
Matsushima, Tohlu	Verification of channel crosstalk suppression effects due to differences in cable length using mode-division multiplexed transmission method
Matsuura, Hiroki	Design and Measurement of Ultra-wideband Bidirectional Absorptive Common Mode Filter
Moon, Jiwoon	Signal Integrity Analysis of High-Speed Chiplet Interconnection Considering Surface Roughness Based on Huray Model
Moon, Jiwoon	Statistical Eye-Diagram Estimation Method for PAM-4 Based High-speed Channel Considering Crosstalk Design of Chiplet Interconnects Considering Crosstalk Induced from Meshed Ground Plane
Murai, Kosuke	Asymmetric Organic Cores to Reduce Semiconductor Substrate Warpage
Muroga, Sho	An Ultra-Lightweight CNT-Aerogel Absorber for Broadband Noise Suppression on High-Speed Packages
N
Nara, Shigeo	20-H Rule of Power Ground Plane of Printed Circuit Board and Clustering of Electric Near-Field Distribution
Narushima, Akihiro	Design and Measurement of Ultra-wideband Bidirectional Absorptive Common Mode Filter
Nemoto, Shunsuke	Electrical Performance of Interconnects in an Organic Interposer Targeted for Chiplet Applications
Nomura, Ken-Ichi	Electrical Performance of Interconnects in an Organic Interposer Targeted for Chiplet Applications
O
Ohkawa, Takeshi	Effect of Wiring Geometry Modification on Signal Integrity in Silicon-Interposer Interconnect
Ohmori, Haruto	Temperature Dependence of Threshold Voltage for Interconnect IDDQ Testing in 3D Stacked ICs Using an Offset-Cancellation-Type Comparator
P
Park, Dongryul	Hierarchical Reinforcement Learning-based Co-Optimization of Package Substrate Design for Multiple Power Domain 3D-ICs
Park, Junho	Chiplet Placement and Routing Agent for UCIe Interfaces Considering Thermal and Signal Integrity Switch Transformer-based Reinforcement Learning Method for Power Supply Induced Jitter (PSIJ) Reduction in High Bandwidth Memory (HBM)
Park, Siwook	Statistical Eye-Diagram Estimation Method for PAM-4 Based High-speed Channel Considering Crosstalk
Peng, Hongli	A Velocity-Aware Density Peaks Clustering Method with Curb Filtering for Millimeter-Wave Radar High-Performance Horizontally Polarized Bow-Tie Slot Antenna for Next-Generation Wi-Fi 7 Systems
R
Rhee, Jaewon	Design of a Hybrid Common-Mode Filter Based on Electromagnetic Bandgap and Defected Ground Structure for Wideband Noise Suppression
Rimbaut, Samuel	Probed Measurement Techniques for 100 Gbit/s D-band Wireless Link Experiments Robust High-Frequency Wirebonding of a Power Amplifier to a Wideband D-band Antenna Array
Rogier, Hendrik	Probed Measurement Techniques for 100 Gbit/s D-band Wireless Link Experiments Robust High-Frequency Wirebonding of a Power Amplifier to a Wideband D-band Antenna Array
Ryu, Seunghun	Hierarchical Reinforcement Learning-based Co-Optimization of Package Substrate Design for Multiple Power Domain 3D-ICs Design of a Hybrid Common-Mode Filter Based on Electromagnetic Bandgap and Defected Ground Structure for Wideband Noise Suppression
S
Sakida, Ryoma	Verification of channel crosstalk suppression effects due to differences in cable length using mode-division multiplexed transmission method
Saneeva Reddy, B R	Tunable Graphene based Terahertz Bandstop Filter for Semiconductor Packaging Applications
Seo, Eunji	Chiplet Placement and Routing Agent for UCIe Interfaces Considering Thermal and Signal Integrity Switch Transformer-based Reinforcement Learning Method for Power Supply Induced Jitter (PSIJ) Reduction in High Bandwidth Memory (HBM)
Shin, Taein	Switch Transformer-based Reinforcement Learning Method for Power Supply Induced Jitter (PSIJ) Reduction in High Bandwidth Memory (HBM)
Singh, Nishant	Probed Measurement Techniques for 100 Gbit/s D-band Wireless Link Experiments Robust High-Frequency Wirebonding of a Power Amplifier to a Wideband D-band Antenna Array
Son, Keeyoung	Switch Transformer-based Reinforcement Learning Method for Power Supply Induced Jitter (PSIJ) Reduction in High Bandwidth Memory (HBM)
Song, Sangsub	Hierarchical Reinforcement Learning-based Co-Optimization of Package Substrate Design for Multiple Power Domain 3D-ICs
Su, Shixian	A Velocity-Aware Density Peaks Clustering Method with Curb Filtering for Millimeter-Wave Radar High-Performance Horizontally Polarized Bow-Tie Slot Antenna for Next-Generation Wi-Fi 7 Systems
Suh, Haeseok	Chiplet Placement and Routing Agent for UCIe Interfaces Considering Thermal and Signal Integrity Switch Transformer-based Reinforcement Learning Method for Power Supply Induced Jitter (PSIJ) Reduction in High Bandwidth Memory (HBM)
Sun, Yu	Achieving 32 Gbps in UCIe-S 2D-Packaging Based on Microstrip Routing on Glass Substrates
Suzuki, Dan	An Ultra-Lightweight CNT-Aerogel Absorber for Broadband Noise Suppression on High-Speed Packages
T
Takahashi, Shotaro	An Ultra-Lightweight CNT-Aerogel Absorber for Broadband Noise Suppression on High-Speed Packages
Tanaka, Masaya	A Novel Study on the Effect of Temperature Cycle Testing on the Transmission Performance of Sub-2 micron Fine-Wiring for Glass Substrates
Tanaka, Motoshi	An Ultra-Lightweight CNT-Aerogel Absorber for Broadband Noise Suppression on High-Speed Packages
Thieme, Ethan	Memory-Encoded DeepONet (M-DeepONet) for Transient Circuit Behavioral Modeling
Torfs, Guy	Probed Measurement Techniques for 100 Gbit/s D-band Wireless Link Experiments Robust High-Frequency Wirebonding of a Power Amplifier to a Wideband D-band Antenna Array
Toyota, Yoshitaka	Estimation of Power Bus Resonance Suppression by Lossy Resonator Filter in the Wi-Fi Band Using Equivalent Circuit Model
Tsai, Poyu	Compact 3D-SiP Power IC Packaging with Thermal Performance Improvement
U
Ueno, Tomonaga	An Ultra-Lightweight CNT-Aerogel Absorber for Broadband Noise Suppression on High-Speed Packages
Uhm, Hyunseo	Chiplet Placement and Routing Agent for UCIe Interfaces Considering Thermal and Signal Integrity Switch Transformer-based Reinforcement Learning Method for Power Supply Induced Jitter (PSIJ) Reduction in High Bandwidth Memory (HBM)
Ullrick, Thijs	Guided by Uncertainty: Adaptive Frequency Sampling Using Gaussian Processes
Urashima, Kosuke	Asymmetric Organic Cores to Reduce Semiconductor Substrate Warpage
W
Wada, Koji	Design and Measurement of Ultra-wideband Bidirectional Absorptive Common Mode Filter
Wakejima, Akio	Pressure-Bonding of GaN-HEMT Die to Graphite Carbon for heat dissipation
Wang, Yatong	Physics-Intuitive Micro-Modeling Circuits (MMC) for Fast Analysis of Finite Dielectric Problems
Wang, Ziyuan	Uncertainty Quantification Using Riemannian Tensor Train Completion for Polynomial Chaos
Watanabe, Minoru	Compact and robust holographic memory for optically reconfigurable gate arrays
Watanabe, Nobuya	Compact and robust holographic memory for optically reconfigurable gate arrays
Wu, Ruey-Beei	Vector Fitting Method in Transient Thermal Analysis for Heterogeneous Multilayered Packaging
Wu, Tzong-Lin	Suppression of Connector Radiation Coupling to Antenna by Phase Cancellation
Y
Yambe, Ryota	Asymmetric Organic Cores to Reduce Semiconductor Substrate Warpage
Yanaka, Yuichi	Asymmetric Organic Cores to Reduce Semiconductor Substrate Warpage
Yang, Chaemin	Mem-Village: A Hybrid HBF-HBM Architecture on Glass for Ultra-Scale AI Inference Systems
Yang, Yuchi	Achieving 32 Gbps in UCIe-S 2D-Packaging Based on Microstrip Routing on Glass Substrates
Yang, Zhonghua	Achieving 32 Gbps in UCIe-S 2D-Packaging Based on Microstrip Routing on Glass Substrates
Yatabe, Hayato	Verification of channel crosstalk suppression effects due to differences in cable length using mode-division multiplexed transmission method
Yong, Seokbeom	Hierarchical Reinforcement Learning-based Co-Optimization of Package Substrate Design for Multiple Power Domain 3D-ICs
Yoon, Jiwon	Switch Transformer-based Reinforcement Learning Method for Power Supply Induced Jitter (PSIJ) Reduction in High Bandwidth Memory (HBM)
Yoon, Youngsu	Chiplet Placement and Routing Agent for UCIe Interfaces Considering Thermal and Signal Integrity Switch Transformer-based Reinforcement Learning Method for Power Supply Induced Jitter (PSIJ) Reduction in High Bandwidth Memory (HBM)
Yoshikawa, Takefumi	Verification of channel crosstalk suppression effects due to differences in cable length using mode-division multiplexed transmission method
Yotsuyanagi, Hiroyuki	Temperature Dependence of Threshold Voltage for Interconnect IDDQ Testing in 3D Stacked ICs Using an Offset-Cancellation-Type Comparator
Z
Zhang, Wanli	Achieving 32 Gbps in UCIe-S 2D-Packaging Based on Microstrip Routing on Glass Substrates
Zhou, Weiyu	Design and Measurement of Ultra-wideband Bidirectional Absorptive Common Mode Filter

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