EDAPS 2025: IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS

This page contains an index consisting of author-provided keywords.

3
3D stacked IC	Temperature Dependence of Threshold Voltage for Interconnect IDDQ Testing in 3D Stacked ICs Using an Offset-Cancellation-Type Comparator
3D-SiP(System in Package)	Compact 3D-SiP Power IC Packaging with Thermal Performance Improvement
A
Absorptive common-mode filter	Design and Measurement of Ultra-wideband Bidirectional Absorptive Common Mode Filter
Adaptive frequency sampling	Guided by Uncertainty: Adaptive Frequency Sampling Using Gaussian Processes
adhesion	Electrical Performance of Interconnects in an Organic Interposer Targeted for Chiplet Applications
Advanced package	Effect of Wiring Geometry Modification on Signal Integrity in Silicon-Interposer Interconnect Design of Chiplet Interconnects Considering Crosstalk Induced from Meshed Ground Plane
AI
Ansys Simulation
antenna array	Robust High-Frequency Wirebonding of a Power Amplifier to a Wideband D-band Antenna Array Probed Measurement Techniques for 100 Gbit/s D-band Wireless Link Experiments
B
Band stop Filter	Tunable Graphene based Terahertz Bandstop Filter for Semiconductor Packaging Applications
Behavioral models	Memory-Encoded DeepONet (M-DeepONet) for Transient Circuit Behavioral Modeling
bow-tie antenna	High-Performance Horizontally Polarized Bow-Tie Slot Antenna for Next-Generation Wi-Fi 7 Systems
broadband modeling	An Ultra-Lightweight CNT-Aerogel Absorber for Broadband Noise Suppression on High-Speed Packages
broadside coupling	A Novel Structure of Pre-Emphasis Passive Amplifier by Employing Broadside Self Coupling
built-in test circuit	Temperature Dependence of Threshold Voltage for Interconnect IDDQ Testing in 3D Stacked ICs Using an Offset-Cancellation-Type Comparator
C
carbon nanotube	An Ultra-Lightweight CNT-Aerogel Absorber for Broadband Noise Suppression on High-Speed Packages
Chemical Potential	Tunable Graphene based Terahertz Bandstop Filter for Semiconductor Packaging Applications
Chiplet	Chiplet Placement and Routing Agent for UCIe Interfaces Considering Thermal and Signal Integrity Achieving 32 Gbps in UCIe-S 2D-Packaging Based on Microstrip Routing on Glass Substrates
Chiplet interface	Signal Integrity Analysis of High-Speed Chiplet Interconnection Considering Surface Roughness Based on Huray Model
Circuit Model	Physics-Intuitive Micro-Modeling Circuits (MMC) for Fast Analysis of Finite Dielectric Problems
circuit simulation	Memory-Encoded DeepONet (M-DeepONet) for Transient Circuit Behavioral Modeling
Clustering	20-H Rule of Power Ground Plane of Printed Circuit Board and Clustering of Electric Near-Field Distribution
Clustering Algorithm	A Velocity-Aware Density Peaks Clustering Method with Curb Filtering for Millimeter-Wave Radar
Common-Mode Filter	Design of a Hybrid Common-Mode Filter Based on Electromagnetic Bandgap and Defected Ground Structure for Wideband Noise Suppression
common-mode noise	Design and Measurement of Ultra-wideband Bidirectional Absorptive Common Mode Filter
component placement
conic arrays
counterfeit electronic components
Crosstalk	Verification of channel crosstalk suppression effects due to differences in cable length using mode-division multiplexed transmission method Statistical Eye-Diagram Estimation Method for PAM-4 Based High-speed Channel Considering Crosstalk
CTE	Asymmetric Organic Cores to Reduce Semiconductor Substrate Warpage
D
D-band	Robust High-Frequency Wirebonding of a Power Amplifier to a Wideband D-band Antenna Array Probed Measurement Techniques for 100 Gbit/s D-band Wireless Link Experiments
Decoupling capacitor	Switch Transformer-based Reinforcement Learning Method for Power Supply Induced Jitter (PSIJ) Reduction in High Bandwidth Memory (HBM)
decoupling network (DN)	Suppression of Connector Radiation Coupling to Antenna by Phase Cancellation
DeepONet	Memory-Encoded DeepONet (M-DeepONet) for Transient Circuit Behavioral Modeling
defected ground structure	Design and Measurement of Ultra-wideband Bidirectional Absorptive Common Mode Filter
Defected Ground Structure (DGS)	Design of a Hybrid Common-Mode Filter Based on Electromagnetic Bandgap and Defected Ground Structure for Wideband Noise Suppression
Differential Signaling	Design of a Hybrid Common-Mode Filter Based on Electromagnetic Bandgap and Defected Ground Structure for Wideband Noise Suppression
Differential-mode (DM) noise	Suppression of Connector Radiation Coupling to Antenna by Phase Cancellation
differential-mode signal	Design and Measurement of Ultra-wideband Bidirectional Absorptive Common Mode Filter
DPC	A Velocity-Aware Density Peaks Clustering Method with Curb Filtering for Millimeter-Wave Radar
Dual In-Line Package (DIP)
E
EDAPS2025
efficiency	Compact 3D-SiP Power IC Packaging with Thermal Performance Improvement
elastic modulus	Asymmetric Organic Cores to Reduce Semiconductor Substrate Warpage
electromagnetic absorber	An Ultra-Lightweight CNT-Aerogel Absorber for Broadband Noise Suppression on High-Speed Packages
Electromagnetic Analysis Simulator	20-H Rule of Power Ground Plane of Printed Circuit Board and Clustering of Electric Near-Field Distribution
Electromagnetic Bandgap (EBG)	Design of a Hybrid Common-Mode Filter Based on Electromagnetic Bandgap and Defected Ground Structure for Wideband Noise Suppression
Electromagnetic Interference (EMI)
electromigration
EM problems	Physics-Intuitive Micro-Modeling Circuits (MMC) for Fast Analysis of Finite Dielectric Problems
EMC Design	20-H Rule of Power Ground Plane of Printed Circuit Board and Clustering of Electric Near-Field Distribution
equivalent circuit model	Estimation of Power Bus Resonance Suppression by Lossy Resonator Filter in the Wi-Fi Band Using Equivalent Circuit Model
Eye-diagram estimation	Statistical Eye-Diagram Estimation Method for PAM-4 Based High-speed Channel Considering Crosstalk
F
Field programmable gate array	Compact and robust holographic memory for optically reconfigurable gate arrays
fine-pitch wiring	A Novel Study on the Effect of Temperature Cycle Testing on the Transmission Performance of Sub-2 micron Fine-Wiring for Glass Substrates
finite element method	Asymmetric Organic Cores to Reduce Semiconductor Substrate Warpage
Flexible substrate	Comprehensive Characterization of Inkjet Printer Ag Film on Paper Substrate for Sensor Electrodes
Fourier transform	Vector Fitting Method in Transient Thermal Analysis for Heterogeneous Multilayered Packaging
G
Gaussian processes	Guided by Uncertainty: Adaptive Frequency Sampling Using Gaussian Processes
Generative Adversarial Imitation Learning (GAIL)	Chiplet Placement and Routing Agent for UCIe Interfaces Considering Thermal and Signal Integrity
generative adversarial network
glass interposer	Mem-Village: A Hybrid HBF-HBM Architecture on Glass for Ultra-Scale AI Inference Systems
glass substrate	Achieving 32 Gbps in UCIe-S 2D-Packaging Based on Microstrip Routing on Glass Substrates
graph neural network
Graphene	Tunable Graphene based Terahertz Bandstop Filter for Semiconductor Packaging Applications
graphite carbon	Pressure-Bonding of GaN-HEMT Die to Graphite Carbon for heat dissipation
H
heat dissipation	Pressure-Bonding of GaN-HEMT Die to Graphite Carbon for heat dissipation
heterogeneous memory	Mem-Village: A Hybrid HBF-HBM Architecture on Glass for Ultra-Scale AI Inference Systems
heterogeneous multilayered packaging	Vector Fitting Method in Transient Thermal Analysis for Heterogeneous Multilayered Packaging
hierarchical reinforcement learning	Hierarchical Reinforcement Learning-based Co-Optimization of Package Substrate Design for Multiple Power Domain 3D-ICs
high bandwidth flash (HBF)	Mem-Village: A Hybrid HBF-HBM Architecture on Glass for Ultra-Scale AI Inference Systems
high bandwidth memory	Switch Transformer-based Reinforcement Learning Method for Power Supply Induced Jitter (PSIJ) Reduction in High Bandwidth Memory (HBM)
High wire density	Signal Integrity Analysis of High-Speed Chiplet Interconnection Considering Surface Roughness Based on Huray Model
Holographic memory	Compact and robust holographic memory for optically reconfigurable gate arrays
horizontal polarization	High-Performance Horizontally Polarized Bow-Tie Slot Antenna for Next-Generation Wi-Fi 7 Systems
HPC
Huray surface roughness model	Signal Integrity Analysis of High-Speed Chiplet Interconnection Considering Surface Roughness Based on Huray Model
I
IDDQ testing	Temperature Dependence of Threshold Voltage for Interconnect IDDQ Testing in 3D Stacked ICs Using an Offset-Cancellation-Type Comparator
identification
impedance bandwidth	High-Performance Horizontally Polarized Bow-Tie Slot Antenna for Next-Generation Wi-Fi 7 Systems
Inkjet printing	Comprehensive Characterization of Inkjet Printer Ag Film on Paper Substrate for Sensor Electrodes
integrated circuit	Probed Measurement Techniques for 100 Gbit/s D-band Wireless Link Experiments
interconnect test	Temperature Dependence of Threshold Voltage for Interconnect IDDQ Testing in 3D Stacked ICs Using an Offset-Cancellation-Type Comparator
interconnection channel	Mem-Village: A Hybrid HBF-HBM Architecture on Glass for Ultra-Scale AI Inference Systems
interposer	Electrical Performance of Interconnects in an Organic Interposer Targeted for Chiplet Applications
L
Laplace transform	Vector Fitting Method in Transient Thermal Analysis for Heterogeneous Multilayered Packaging
large-scale AI inference	Mem-Village: A Hybrid HBF-HBM Architecture on Glass for Ultra-Scale AI Inference Systems
lossy resonator filter	Estimation of Power Bus Resonance Suppression by Lossy Resonator Filter in the Wi-Fi Band Using Equivalent Circuit Model
M
Machine Learning	Guided by Uncertainty: Adaptive Frequency Sampling Using Gaussian Processes 20-H Rule of Power Ground Plane of Printed Circuit Board and Clustering of Electric Near-Field Distribution
measurement	A Novel Study on the Effect of Temperature Cycle Testing on the Transmission Performance of Sub-2 micron Fine-Wiring for Glass Substrates
measurement setup	Probed Measurement Techniques for 100 Gbit/s D-band Wireless Link Experiments
mesh plane	Electrical Performance of Interconnects in an Organic Interposer Targeted for Chiplet Applications
Meshed ground plane	Design of Chiplet Interconnects Considering Crosstalk Induced from Meshed Ground Plane
Micro-Modeling Circuit (MMC)	Physics-Intuitive Micro-Modeling Circuits (MMC) for Fast Analysis of Finite Dielectric Problems
microstrip line	Design and Measurement of Ultra-wideband Bidirectional Absorptive Common Mode Filter
mmW
mmW Radar	A Velocity-Aware Density Peaks Clustering Method with Curb Filtering for Millimeter-Wave Radar
mode-division multiplexed transmission	Verification of channel crosstalk suppression effects due to differences in cable length using mode-division multiplexed transmission method
multiple power domain	Hierarchical Reinforcement Learning-based Co-Optimization of Package Substrate Design for Multiple Power Domain 3D-ICs
O
Optoelectronic VLSI	Compact and robust holographic memory for optically reconfigurable gate arrays
organic core	Asymmetric Organic Cores to Reduce Semiconductor Substrate Warpage
P
package substrate	Hierarchical Reinforcement Learning-based Co-Optimization of Package Substrate Design for Multiple Power Domain 3D-ICs Asymmetric Organic Cores to Reduce Semiconductor Substrate Warpage
package-level EMC	An Ultra-Lightweight CNT-Aerogel Absorber for Broadband Noise Suppression on High-Speed Packages
PAM-4	Statistical Eye-Diagram Estimation Method for PAM-4 Based High-speed Channel Considering Crosstalk
partial element equivalent circuit (PEEC)	Physics-Intuitive Micro-Modeling Circuits (MMC) for Fast Analysis of Finite Dielectric Problems
passive amplifier	A Novel Structure of Pre-Emphasis Passive Amplifier by Employing Broadside Self Coupling
PCB
PCB layout
Physics-informed kernels	Guided by Uncertainty: Adaptive Frequency Sampling Using Gaussian Processes
polynomial chaos expansion	Uncertainty Quantification Using Riemannian Tensor Train Completion for Polynomial Chaos
power
power amplifier	Robust High-Frequency Wirebonding of a Power Amplifier to a Wideband D-band Antenna Array Probed Measurement Techniques for 100 Gbit/s D-band Wireless Link Experiments
power bus resonance	Estimation of Power Bus Resonance Suppression by Lossy Resonator Filter in the Wi-Fi Band Using Equivalent Circuit Model
power distribution network	Switch Transformer-based Reinforcement Learning Method for Power Supply Induced Jitter (PSIJ) Reduction in High Bandwidth Memory (HBM)
power supply induced jitter	Switch Transformer-based Reinforcement Learning Method for Power Supply Induced Jitter (PSIJ) Reduction in High Bandwidth Memory (HBM)
pre emphasis	A Novel Structure of Pre-Emphasis Passive Amplifier by Employing Broadside Self Coupling
pressure bonding	Pressure-Bonding of GaN-HEMT Die to Graphite Carbon for heat dissipation
printed circuit board	Probed Measurement Techniques for 100 Gbit/s D-band Wireless Link Experiments 20-H Rule of Power Ground Plane of Printed Circuit Board and Clustering of Electric Near-Field Distribution
Printed electrodes	Comprehensive Characterization of Inkjet Printer Ag Film on Paper Substrate for Sensor Electrodes
R
Radio Frequency Interference (RFI)	Suppression of Connector Radiation Coupling to Antenna by Phase Cancellation
radome
RAM	A Velocity-Aware Density Peaks Clustering Method with Curb Filtering for Millimeter-Wave Radar
Rational macromodeling	Guided by Uncertainty: Adaptive Frequency Sampling Using Gaussian Processes
recurrent neural network	Memory-Encoded DeepONet (M-DeepONet) for Transient Circuit Behavioral Modeling
resistive open defect	Temperature Dependence of Threshold Voltage for Interconnect IDDQ Testing in 3D Stacked ICs Using an Offset-Cancellation-Type Comparator
S
S-parameter	Effect of Wiring Geometry Modification on Signal Integrity in Silicon-Interposer Interconnect
SEM
Semiconductor Packaging	Tunable Graphene based Terahertz Bandstop Filter for Semiconductor Packaging Applications
server
Shielded twisted quad cable	Verification of channel crosstalk suppression effects due to differences in cable length using mode-division multiplexed transmission method
shielding effectiveness	An Ultra-Lightweight CNT-Aerogel Absorber for Broadband Noise Suppression on High-Speed Packages
Signal integrity	Effect of Wiring Geometry Modification on Signal Integrity in Silicon-Interposer Interconnect Design of Chiplet Interconnects Considering Crosstalk Induced from Meshed Ground Plane Achieving 32 Gbps in UCIe-S 2D-Packaging Based on Microstrip Routing on Glass Substrates Signal Integrity Analysis of High-Speed Chiplet Interconnection Considering Surface Roughness Based on Huray Model
signal integrity (SI)	Mem-Village: A Hybrid HBF-HBM Architecture on Glass for Ultra-Scale AI Inference Systems Chiplet Placement and Routing Agent for UCIe Interfaces Considering Thermal and Signal Integrity
Silicon interposer	Effect of Wiring Geometry Modification on Signal Integrity in Silicon-Interposer Interconnect
simulation analysis	A Novel Study on the Effect of Temperature Cycle Testing on the Transmission Performance of Sub-2 micron Fine-Wiring for Glass Substrates
slot antenna	High-Performance Horizontally Polarized Bow-Tie Slot Antenna for Next-Generation Wi-Fi 7 Systems
Statistical analysis	Statistical Eye-Diagram Estimation Method for PAM-4 Based High-speed Channel Considering Crosstalk
Stepped Impedance Resonator (SIR)	Tunable Graphene based Terahertz Bandstop Filter for Semiconductor Packaging Applications
Surface Plasmon Polaritons (SPPs)	Tunable Graphene based Terahertz Bandstop Filter for Semiconductor Packaging Applications
Surface roughness	Signal Integrity Analysis of High-Speed Chiplet Interconnection Considering Surface Roughness Based on Huray Model
Switch Transformer	Switch Transformer-based Reinforcement Learning Method for Power Supply Induced Jitter (PSIJ) Reduction in High Bandwidth Memory (HBM)
T
TA-Ag nanoparticles	Comprehensive Characterization of Inkjet Printer Ag Film on Paper Substrate for Sensor Electrodes
temperature cycle test	A Novel Study on the Effect of Temperature Cycle Testing on the Transmission Performance of Sub-2 micron Fine-Wiring for Glass Substrates
tensor train decomposition	Uncertainty Quantification Using Riemannian Tensor Train Completion for Polynomial Chaos
test
test1
test2
test3
test4
Thermal Integrity (TI)	Chiplet Placement and Routing Agent for UCIe Interfaces Considering Thermal and Signal Integrity
thermal management solution	Compact 3D-SiP Power IC Packaging with Thermal Performance Improvement
transformer models	Mem-Village: A Hybrid HBF-HBM Architecture on Glass for Ultra-Scale AI Inference Systems
transient thermal analysis	Vector Fitting Method in Transient Thermal Analysis for Heterogeneous Multilayered Packaging
transmission performance	A Novel Study on the Effect of Temperature Cycle Testing on the Transmission Performance of Sub-2 micron Fine-Wiring for Glass Substrates
U
UCIe(Universal Chiplet Interconnect express)	Effect of Wiring Geometry Modification on Signal Integrity in Silicon-Interposer Interconnect
UCIe-S	Achieving 32 Gbps in UCIe-S 2D-Packaging Based on Microstrip Routing on Glass Substrates
uncertainty quantification	Uncertainty Quantification Using Riemannian Tensor Train Completion for Polynomial Chaos
Universal chiplet interconnect express	Design of Chiplet Interconnects Considering Crosstalk Induced from Meshed Ground Plane
Universial Chiplet Interconnect Express (UCIe)	Chiplet Placement and Routing Agent for UCIe Interfaces Considering Thermal and Signal Integrity
V
vector fitting method	Vector Fitting Method in Transient Thermal Analysis for Heterogeneous Multilayered Packaging
VPD
VRM
W
warpage	Asymmetric Organic Cores to Reduce Semiconductor Substrate Warpage
wirebonding	Robust High-Frequency Wirebonding of a Power Amplifier to a Wideband D-band Antenna Array
wireless link	Probed Measurement Techniques for 100 Gbit/s D-band Wireless Link Experiments
X
x-y footprint	Compact 3D-SiP Power IC Packaging with Thermal Performance Improvement
Ψ
ΨJB	Compact 3D-SiP Power IC Packaging with Thermal Performance Improvement

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