EDAPS 2025: IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS
PROGRAM FOR MONDAY, DECEMBER 15TH
Days:
next day
all days

View: session overviewtalk overview

11:30-12:30Lunch
12:50-13:00Break
13:00-13:45 Session 2: Keynote Speech 1

【Keynote Speech 1】Beyond Moore's Law: The Chiplet Revolution in Semiconductor Packaging

Dr. Yasumitsu Orii (Rapidus)

13:45-14:00Break
14:00-15:00 Session 3: Tutorial 1

【Tutorial 1】Fundamentals of Electrical Design for Advance Packaging and Heterogeneous Integration

Prof. Rohit Sharma (Indian Institute of Technology Ropar)

15:00-15:15Break
15:15-16:15 Session 4: Tutorial 2

【Tutorial 2】The Evolution of mmWaveAntenna in Package Toward a Connected Intelligent Future

Dr. Atom O. Watanabe (IBM T.J. Watson Research Center)

16:15-16:30Break
16:30-17:30 Session 5: Tutorial 3

【Tutorial 3】TBD

Tom Dhaene and Thijs Ullrick (Ghent University - imec)

17:30-18:00Break