PROGRAM FOR MONDAY, DECEMBER 15TH
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11:30-12:30Lunch
12:30-12:50 Session 1: Sponsor Seminar 1
【Sponsor Seminar 1】AI driven design and 3D-IC design automation
Tadaaki Hitomi （Cadence）
Chair:
Location: Small Auditorium, 1st floor
12:50-13:00Break
13:00-13:45 Session 2: Keynote Speech 1
【Keynote Speech 1】Beyond Moore's Law: The Chiplet Revolution in Semiconductor Packaging
Yasumitsu Orii (Rapidus)
Chair:
Location: Small Auditorium, 1st floor
13:45-14:00Break
14:00-15:00 Session 3: Tutorial 1
【Tutorial 1】Fundamentals of Electrical Design for Advance Packaging and Heterogeneous Integration
Rohit Sharma (Indian Institute of Technology Ropar)
Chair:
Location: Small Auditorium, 1st floor
15:00-15:15Break
15:15-16:15 Session 4: Tutorial 2
【Tutorial 2】The Evolution of mmWaveAntenna in Package Toward a Connected Intelligent Future
Atom O. Watanabe (IBM T.J. Watson Research Center)
Chair:
Location: Small Auditorium, 1st floor
16:15-16:30Break
16:30-17:30 Session 5: Tutorial 3
【Tutorial 3】Fundamentals of Machine Learning and Macromodeling for High-Speed Interconnects and Advanced Packaging
Tom Dhaene and Thijs Ullrick (Ghent University - imec)
Chair:
Location: Small Auditorium, 1st floor
17:30-18:00Break