Welcome to ESREF 2016 ( abstract )

22FDX and it's application in Energy Efficient Designs, Automotive and IoT - from foundry perspective ( abstract )

Automotive Electronics Roadmap and the Wish List on Electronics ( abstract )

Quantitative model for post-program instabilities in filamentary RRAM ( abstract )

Asymmetric Low Temperature Bonding Structure Using Ultra-Thin Buffer Layer Technique for 3D Integration ( abstract )

Corrosion Mechanisms of Cu Bond Wires on AlSi Pads ( abstract )

Fast Wafer Level Reliability Monitoring as a tool to achieve automotive quality for a wafer process ( abstract )

10 Years Robustness Validation ( abstract )

Laser Voltage Probing – its value and the race against scaling (invited) ( abstract )

Automatic process for Time-Frequency scan of VLSI ( abstract )

Static logic state analysis by TLS on powered logic circuits: Three case studies for suspected stuck-at failure modes ( abstract )

Reliability Management – the central Enabler for Advanced Technologies in Automotive (invited) ( abstract )

Efficient reliability evaluation for combinational circuits ( abstract )

A process-variation-resilient methodology of circuit design by using asymmetrical forward body bias in 28nm FDSOI ( abstract )

Reliability aspects of copper metallization and interconnect technology for power devices (invited) ( abstract )

Power Cycling Test and Failure Analysis of Molded Intelligent Power IGBT Module under Different Temperature Swing Durations ( abstract )

Power electronic assemblies: thermo-mechanical degradations of gold-tin solder for attaching devices ( abstract )

3D LIT calibration tool development ( abstract )

Improvements on localisation techniques for high power devices ( abstract )

New phase Laser Voltage Imaging technique ( abstract )

Micromanipulators in Reliability Testing Environments: Fault Localization, Nanoprobing, and TEM Sample Preparation ( abstract )

Versatile probers for micro and nanoprobing ( abstract )

EBIC and EBAC/RCI techniques ( abstract )

FPGA LUT delay degradation due to HCI : Experiment and simulation results ( abstract )

Impact of Resistive Paths on NVM Array Reliability: Application to Flash & ReRAM Memories ( abstract )

Gate oxide degradation of SiC MOSFET under short-circuit aging tests ( abstract )

Mission-profile-based stress analysis of bond-wires in SiC power modules ( abstract )

Lifetime Estimation of SiC MOSFETs under High Temperature Reverse Bias Test ( abstract )

Power Cycling Analysis Method for High Voltage SiC Diodes ( abstract )

Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules ( abstract )

Scanning Microwave Microscopy for Electronic Device Analysis on Nanometre Scale ( abstract )

Current Imaging, EBIC/EBAC, and Electrical Probing combined for fast and reliable in situ Electrical Fault Isolation ( abstract )

Electrical analysis on implantation-related defect by nanoprobing methodology ( abstract )

Cross-sectional Nanoprobing Fault Isolation Technique on Submicron Devices ( abstract )

Study on non-contact current path formation using charged particle beams ( abstract )

Sample Preparation with the X-Prep ( abstract )

Laser Decap : the sample prep Swiss Army Tool ( abstract )

SELA Sample Preparation Tools ( abstract )

Curtaining-Free Top-Down TEM Lamella Preparation from a Cutting Edge Integrated Circuit ( abstract )

Helios G4: Enabling breakthrough failure analysis for 7 nm design nodes ( abstract )

Preliminary Idea for Preparing 1000’s of TSV’s ( abstract )

Numerical study of destruction phenomena for punch-through IGBTs under unclamped inductive switching ( abstract )

Accelerated Life Test of high luminosity blue LEDs ( abstract )

Reliability Design of Direct Liquid Cooled Power Semiconductor Module for Hybrid and Electric Vehicles ( abstract )

Micro PCB Rogowski coil for current monitoring and protection of high voltage power modules ( abstract )

Effects of stress-loading test methods on the degradation of light-emitting diode modules ( abstract )

Nanowire width dependence of data retention and endurance characteristics in nanowire SONOS flash memory ( abstract )

Novel heatsink for power semiconductor module using high thermal conductive graphite ( abstract )

Mechanisms of metallization degradation in high power diodes ( abstract )

Application of Laser Deprocessing Technique in PFA on Chemical Over-etched on Bond-pad Issue ( abstract )

Avalanche Robustness of SiC Schottky Diode ( abstract )

Application of Fast Laser Deprocessing Techniques on Large Cross-sectional View Area Sample with FIB-SEM Dual Beam System ( abstract )

Influence of I/O Oxide Process on the NBTI Performance of 28nm HfO2-Based HKMG p-MOSFETs ( abstract )

Numerical Investigation of the Effects of Phosphorus on the Mechanical Responses of [1 1 0]-oriented Silicon Nano-wires ( abstract )

Failure Rate Calculation Method for High Power Devices in Space Applications at Low Earth Orbit ( abstract )

Evolution of navigation and simulation tools in failure analysis ( abstract )

Elemental characterisation of 20nm structures in devices using new SEM-EDS technology ( abstract )

Automatized Failure Analysis of Tungsten Coated TSVs via Scanning Acoustic Microscopy ( abstract )

Improved Etching Recipe for Exposing Cu Wire allowing Reliable Stitch Pull ( abstract )

Thermal design optimization of novel modular power converter assembly enabling higher performance, reliability and availability ( abstract )

Lifetime and Manufacturability of Integrated Power Electronics ( abstract )

On the Prediction of Radiation-Induced SETs in Flash-based FPGAs ( abstract )

Online computation of IGBT on-state resistance for off-shelf three-phase two-level power converter systems ( abstract )

Fault isolation at P/N junction by nanoprober ( abstract )

Effect of H/Ar treatment on ZnO:B transparent conducting oxide for flexible a-Si:H/μc-Si:H photovoltaic modules under damp heat stress ( abstract )

Investigation of Temperature Variations on Analog/RF Linearity Performance of Stacked Gate GEWE-SiNW MOSFET for Improved Device Reliability ( abstract )

Improving the short circuit ruggedness of IGBTs ( abstract )

Comparison of Thermal Runaway Limits under Different Test Conditions Based on a 4.5 kV IGBT ( abstract )

Body diode reliability investigation of SiC power MOSFETs ( abstract )

Evaluation of Potential-Induced Degradation in Crystalline Si Solar Cells using Na-Fault Injection ( abstract )

A run-time built-in approach of TID test in SRAM based FPGAs ( abstract )

Reliability analysis of hybrid Spin Transfer Torque Magnetic Tunnel Junction/CMOS Majority Voters ( abstract )

Application of the Defect Clustering Model for Forming, SET and RESET Statistics in RRAM Devices ( abstract )

Resistive RAM Variability Monitoring using a Ring Oscillator based Test Chip ( abstract )

Permanent and Single Event Transient Faults Reliability Evaluation EDA tool ( abstract )

200V FRED diode with superior ESD capability ( abstract )

Charging–discharging characteristics of a wound aluminum polymer capacitor ( abstract )

Ga contamination in silicon by focused ion beam milling: Atom Probe Tomography and simulation with dynamic model ( abstract )

Micro mechanical robustness tests of 28nm BEOL layer stack ( abstract )

Laser based sample preparation for advanced packaging applications ( abstract )

Planar FIB Milling of Copper by using the Novel Rocking Stage Technology ( abstract )

Fast, Reliable, Intuitive TEM Sample Preparation using a Load-Lockable Platform Combined with Smart Control Software ( abstract )

Introduction of MA-tek total solution FA ( abstract )

Failure Analysis and Failure Prevention on Ceramic Capacitors ( abstract )

New technology approaches in scanning acoustic microscopy for advanced failure analysis ( abstract )

Multiple Pass/Fail Detection Scheme ( abstract )

Below 10nm technology analysis solution ( abstract )

High Resolution Cathodoluminescence for Defect Inspection and Failure Analysis ( abstract )

Natural Radiation Events in CCD Imagers at Ground Level ( abstract )

Single Event Transient Acquisition And Mapping For Space Device Characterization ( abstract )

Topologies for inverter like operation of power cycling tests ( abstract )

End of life and acceleration modelling for power diodes under High Temperature Reverse Bias stress ( abstract )

Internal processes in power semiconductors at virtual junction temperature measurement ( abstract )

3D Inspection Solutions for 3D DEVICES ( abstract )

Innovative TEM sample Preparation on Helios G4 platform ( abstract )

FIB and P-FIB assisted sample preparation for in-situ TEM characterization ( abstract )

Device to circuit reliability correlations for Metal Gate / High-k transistors in scaled CMOS technologies (invited) ( abstract )

FDSOI and Bulk CMOS SRAM Cells Resilience to Radiation Effects ( abstract )

Performance vs. Reliability Adaptive Body Bias Scheme in 28nm & 14nm UTBB FDSOI nodes ( abstract )

Potentiality of Healing Techniques in Hot-Carrier Damaged 28nm FDSOI CMOS nodes ( abstract )

Electromagnetic susceptibility characterization of double SOI device ( abstract )

Analysis of Quantum Conductance, Read Disturb and Switching Statistics in HfO2 RRAM Using Conductive AFM ( abstract )

Failure mechanisms and precautions in plug connectors and relays ( abstract )

FEM Modelling of piezo- and thermo-mechanical interaction in GaN power devices – the twofold impact of metallization layers ( abstract )

Reliability of AlGaN/GaN High Electron Mobility Transistors (HEMTs) on Si Substrate ( abstract )

Device reliability of Geiger-mode Single Photon Avalanche Diode ( abstract )

Photon Emission of MOSFET with Parasitic Bipolar Operation ( abstract )

Improvement of Failure Analysis equipments by incorporating signal/image processing tools ( abstract )

Investigating Stress Measurement Capabilities of GHz Scanning Acoustic Microscopy for 3D Failure Analysis ( abstract )

Impurities in electroplated Cu and void formation in Cu-Sn micro-connects ( abstract )

The southeast automotive hub and Georgia Tech’s automotive electronics ecosystem ( abstract )

77Ghz Automotive RADAR in eWLB package: from consumer to automotive packaging ( abstract )

Reliability of automotive LED systems ( abstract )

LED Degradation: from component to system (invited) ( abstract )

Transient thermal analysis for accelerated reliability testing of LEDs ( abstract )

Power and industry electronics – future perspectives for Europe ( abstract )

Reliability - becoming the key factor for electronics in Europe? (Panel Discussion) ( abstract )

Degradation and Recovery of variability due to BTI ( abstract )

Early Detection and Prediction of HKMG SRAM HTOL Performance by WLR PBTI Tests ( abstract )

Automotive Memory Trends and System Reliability Concepts ( abstract )

Powertrain electronics reliability ( abstract )

Requirements for Reliability and new Solutions for Transmission Control Units ( abstract )

Cu-wire Bond Reliability in Automotive Electronics ( abstract )

Experimental observation of TDDB-like behavior in reverse-biased green InGaN LEDs ( abstract )

Degradation of InGaN-based LEDs related to charge diffusion and build-up ( abstract )

ESD tests on 850 nm GaAs-based VCSELs ( abstract )

Degradation of InGaN laser diodes caused by temperature- and current-driven diffusion processes ( abstract )

Catastrophic optical damage of high power InGaAs/AlGaAs laser diodes ( abstract )

Reliability Testing ( abstract )

Fault Isolation at 5um Resolution using Electro-Optical TDR with 6ps Rise Time ( abstract )

Use of Lock-in Thermography and Magnetic Current Imaging as complemetary techniques for localization of shorts in GaN transistors ( abstract )

Scribing, Scribless and Cleaving Reinvented ( abstract )

Solutions for semiconductor failure analysis with SEM ( abstract )

Exhibitor Workshop: Reliability Testing - talk 3 ( abstract )

Plasma Process Induced Damage Detection by Fast Wafer Level Reliability Monitoring for Automotive Applications ( abstract )

Channel width dependence of AC stress on bulk nMOSFETs ( abstract )

Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop ( abstract )

Conductive filament formation at grain boundary locations in polycrystalline HfO2 based MIM stacks- Computational and Physical Insight ( abstract )

Microcontroller susceptibility variations to EFT burst during accelerated aging ( abstract )

Si IGBT reliability for HVs ( abstract )

Power modules in automotive powertrains: qualification and test ( abstract )

Reliability of inverters and DC Link capacitors for e-mobility ( abstract )

Estimation of IGBT power module reliability in pre-design phase ( abstract )

Safe cell, safe battery? Battery fire investigations using FMEA, FTA and practical experiments ( abstract )

Copper Through Silicon Vias Studied by Photoelastic Scanning Infrared Microscopy ( abstract )

Investigating Stress Measurement Capabilities of GHz Scanning Acoustic Microscopy for 3D Failure Analysis ( abstract )

Detection and Analysis of Stress-induced Voiding in Al-Power lines by Acoustic GHz-Microscopy ( abstract )

Magnetic Field and Current Density Imaging using off-line Lock-In Analysis ( abstract )

Detection of cracks in multilayer ceramic capacitors by X-ray imaging ( abstract )

Application of high frequency scanning acoustic microscopy for the failure analysis and reliability assessment of MEMS sensors (invited) ( abstract )

Dielectric charging phenomena in diamond films used in RF MEMS capacitive switches: The effect of film thickness ( abstract )

Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor ( abstract )

A novel correlative model of failure mechanisms for evaluating MEMS devices reliability ( abstract )

Optimization of contact metallizations for reliable wafer level Au-Sn bonds ( abstract )

Tutorial: Creeping corrosion of copper on printed circuit board assemblies ( abstract )

Field- and time dependent degradation of GaN HEMTs ( abstract )

Effects of salt spray test on lead-free solder alloy ( abstract )

Novel failure mode of chip corrosion at automotive HALL sensor devices under multiple stress conditions ( abstract )

Moisture absorption by molding compounds under extreme conditions: impact on accelerated reliability tests ( abstract )

Effect of PCBA surface morphology and chemistry on water layer formation under humid conditions and corrosion reliability ( abstract )

GaN devices: millimeter wave applications challenges (invited) ( abstract )

Continuous Time-Domain RF waveforms monitoring under overdrive stress condition of AlGaN/GaN HEMTs ( abstract )

Correlation of gate leakage and local strain distribution in GaN/AlGaN HEMT structures ( abstract )

Early life field failures in modern automotive electronics – An overview, root causes and precautions ( abstract )

Crack-guided effect on dynamic mechanical stress for foldable low temperature polycrystalline silicon thin film transistors ( abstract )

Impact on Non-linear Capacitances on Transient Waveforms during System Level ESD Stress ( abstract )

Evolution study of the ElectroMagnetic Interference for RF LDMOS in series chopper application after thermal accelerated tests ( abstract )

Temperature rise measurement for power-loss comparison of an aluminium electrolytic capacitor between sinusoidal and square current injections ( abstract )

Reliability Evaluation of Donut-Tungsten-Via as an Element of the Highly Robust Metallization ( abstract )

Reliability Evaluation of Si-Dies due to Assembly Issues ( abstract )

Fatigue testing method for fine bond wires in an LQFP Package ( abstract )

Fast and Trusted Intrinsic Stress Measurement to Facilitate Improved Reliability Assessments ( abstract )

Delamination of polyimide/Cu films under mixed mode loading ( abstract )

Study of the stability of e-mode GaN HEMTs with p-GaN gate based on combined DC and optical analysis ( abstract )

UIS test of high-voltage GaN-HEMTs with p-type gate structure ( abstract )

Temperature Dependent Dynamic ON State Resistance in GaN on Si Based Normally OFF HFETs ( abstract )

Experimental study of the short-circuit robustness of 600V E-mode GaN transistors ( abstract )

Local deep level transient spectroscopy using super-higher-order scanning nonlinear dielectric microscopy ( abstract )

Power cycle reliability of Cu nanoparticle joint dependent on a mismatch of coefficients of thermal expansion ( abstract )

Impact of work function of the silicon bottom-gates on electrical instability in InGaZnO thin film transistors ( abstract )

Device instability of amorphous InGaZnO thin film transistors with transparent source and drain ( abstract )

Negative bias illumination stress instability in amorphous InGaZnO thin film transistors with transparent source and drain ( abstract )

Effects of drain quiescent voltage on the ageing of AlGaN/GaN HEMT devices in pulsed RF mode ( abstract )

On the need for a new ESD verification methodology to improve the reliability of ICs in advanced 28nm UTBB FDSOI technology ( abstract )

Instability of oxide thin film transistor under electrical-mechanical hybrid stress for foldable display ( abstract )

FESeR: a data-driven framework to enhance sensor reliability for the system condition monitoring ( abstract )

An in depth analysis of pull-up capacitance-voltage characteristic for dielectric charging assessment of MEMS capacitive switches ( abstract )

Role of Two-Dimensional Electron Gas (2DEG) in AlGaN/GaN High Electron Mobility Transistor (HEMT) ON-State Degradation ( abstract )

Structural disturbances in GaN HEMT layers as source of leakage current, influencing device performance and reliability ( abstract )

Component Reliability Importance assessment on complex systems using Credible Improvement Potential ( abstract )

Fatigue Life Prediction Model for Accelerated Testing of Electronic Components under Non-Gaussian Random Vibration Excitations ( abstract )

DRES: Data recovery for condition monitoring to enhance system reliability ( abstract )

The radiation test based assessment of process quality and reliability for conventional 65-nm CMOS technology ( abstract )

Chemical rate phenomenon approach applied to Lithium battery capacity fade estimation ( abstract )

Reliability assessment of ultra-short gate length AlGaN/GaN HEMTs on Si substrate by on-state step stress ( abstract )

Requirements for the Application of ECUs in E-mobility Originally Qualified for Gasoline Cars ( abstract )

Best Paper / Best Poster Awards - ESREF 2016 ( abstract )

Advance Information on ESREF 2017 ( abstract )