Tentative Agenda

8:00am-4:00pm

8:00-9:00am: AI Methodology + 2 Application Talks (organized by Synopsys)

9:00-10:00am: Panel - How AI affect DFT practices?

10:30-12:00: Skill developments and customer applications (organized by Siemens)

13:00-14:15: AI in test chips in view of heterogeneous integration, from 2.5D interposers and CoWoS to
hybrid bond (organized by PDF Solutions)

14:30-15:45: Pactical reality of building and deploying an AI-native debug assistant for ATE (organized by Teradyne)

15:45-16:00: Closing remark