ITC 2018: INTERNATIONAL TEST CONFERENCE
PROGRAM FOR THURSDAY, NOVEMBER 1ST
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09:00-10:30 Session Room1: Paper 11: Novel Diagnosis Approaches
Chair:
Paul Berndt (NW Test Engineering LLC, United States)
Location: Room 1
09:00
Pallav Gupta (Intel, United States)
An effective methodology for automated diagnosis of functional pattern failures to support silicon debug

ABSTRACT. We present an industrial-grade solution for automated diagnosis of functional patterns failures. The solution has been successfully demonstrated and deployed on multiple products at Intel.

09:30
Sameer Chillarige (Cadence Design Systems, India)
Atul Chhabra (Cadence Design Systems, India)
Anil Malik (Cadence Design Systems, India)
Bharath Nandakumar (Cadence Design Systems, India)
Joseph Swenton (Cadence Design Systems, United States)
Krishna Chakravadhanula (Cadence Design Systems, United States)
Improving Diagnosis Resolution and Performance at High Compression Ratios

ABSTRACT. Techniques to maintain high diagnosis resolution are proposed based on a study conducted on multiple customer designs by varying compression ratios up to 400X.

10:00
I-De Huang (Intel, United States)
Pallav Gupta (Intel, United States)
Loganathan Lingappan (Intel, United States)
Vijay Gangaram (Intel, United States)
Online Scan Diagnosis - A Novel Approach to Volume Diagnosis
SPEAKER: I-De Huang

ABSTRACT. In this paper, we present a novel approach to run scan diagnosis either on production testers directly or on a few compute machines in a high volume manufacturing (HVM) environment.

09:00-10:30 Session Room2: Paper 12: Communication & Interface Testing
Chair:
Pankaj Pant (Intel, United States)
Location: Room 2
09:00
Majid Ahadi Dolatsara (Georgia Institute of Technology, United States)
Huan Yu (Georgia Institute of Technology, United States)
Jose Hejase (IBM, United States)
Wiren Dale Becker (IBM, United States)
Madhavan Swaminathan (Georgia Institute of Technology, United States)
Polynomial Chaos modeling for Jitter estimation in high-speed links

ABSTRACT. Traditional approaches of data dependent jitter estimation in nonlinear high-speed links can be extremely time consuming. Therefore, this paper proposes developing a surrogate model by using the Polynomial Chaos theory to expedite this process.

09:30
Shi Jin (Duke University, United States)
Zhaobo Zhang (Huawei Technologies Co. Ltd., United States)
Krishnendu Chakrabarty (Duke University, United States)
Xinli Gu (Huawei Technologies Co. Ltd., United States)
Self-Learning Health-Status Analysis for a Core Router System

ABSTRACT. Monitoring core routers is essential to ensure high reliability. However, most operational data are unlabeled, necessitating the design of a self-learning framework that iteratively learns and identifies various health status.

10:00
Kiyotaka Ichiyama (ADVANTEST Corporation, Japan)
Takashi Kusaka (ADVANTEST Corporation, Japan)
Masahiro Ishida (ADVANTEST Corporation, Japan)
A Stressed Eye Testing Module for Production Test of 30-Gbps NRZ Signal Interfaces

ABSTRACT. This paper introduces a stressed eye testing module for 30-Gbps NRZ signals. It can inject calibrated random jitter, sinusoidal jitter, and sinusoidal interference. Calibration procedures for the module are also presented.

09:00-10:30 Session Room3: Special 4: Beyond System Test
Chair:
Nilanjan Mukherjee (Mentor, United States)
Location: Room 3
09:00
Fadi Daou (MultiLane Inc, Lebanon)
Challenges of At-Speed testing of 112Gbps devices

ABSTRACT. As the industry gears up to deploy 100Gb/Lambda for Data Center Interconnect to support the massive growth of data handling, new testing challenges are presented. Signal modulation is more complex, the frequency of signals increases, the signal margin decreases, the channel losses for connecting a DUT to the instrument becomes very critical. At-speed testing of 112GGbps components now requires new measurements capabilities and new instrumentation integration concepts.

09:30
John Yi (AMD, United States)
Evolution of System-Level Test at AMD

ABSTRACT. System-Level Test has been used at AMD for multiple generations of microprocessors. This presentation will focus on core power & performance and high-speed I/Os coverage evolution over the years and the recent challenges as new power management features and higher speed I/Os require new test strategies without exploding test costs.

10:00
Harry Chen (Mediatek, Taiwan)
What would it take to achieve cost-effective system-level test?

ABSTRACT. System-level testing (SLT) has become necessary to ensure reliable operation of ever more complex electronics-based systems. Yet the practice of SLT has not advanced much from the early days of functional test. With rising complexity, containing SLT cost while achieving higher quality is a major challenge. This talk will examine ideas and approaches to develop a comprehensive methodology to cost-effectively scale SLT with rising system complexity.

09:00-10:30 Session Room4: Paper 13: Analog Safety & BIST for Automotive
Chair:
Gordon Roberts (McGill University, Canada)
Location: Room 4
09:00
Peter Wohl (Synopsys, United States)
Jon Colburn (Nvidia, United States)
John Waicukauski (Synopsys, United States)
Greg Maston (Synopsys, Inc, United States)
XLBIST: X-Tolerant Logic BIST
SPEAKER: Peter Wohl

ABSTRACT. We present a high-coverage, X-tolerant LBIST solution which uses compressor/decompressor structures, including X-control logic, that have already been inserted in the design for scan-compression deterministic patterns.

09:30
Jerzy Tyszer (Poznan University of Technology, Poland)
Yingdi Liu (University of Iowa, United States)
Nilanjan Mukherjee (Mentor, A Siemens Buisiness, United States)
Janusz Rajski (Mentor, A Siemens Business, United States)
Sudhakar Reddy (University of Iowa, United States)
*Distinguished Paper: Deterministic Stellar BIST for In-System Automotive Test
SPEAKER: Yingdi Liu

ABSTRACT. The paper presents a compression scheme for in-system automotive test. It generates vectors by complementing scan slices of encodable patterns. The scheme provides significant trade-offs between area and time.

10:00
Fei Su (Intel, United States)
Prashant Goteti (Intel, United States)
Improving Analog Functional Safety Using Data-Driven Anomaly Detection
SPEAKER: Fei Su

ABSTRACT. We propose a machine learning method using data-driven anomaly detection for functional safety of analog automotive circuits, with mining dynamic time series in-field data in the context of system operation.

09:00-10:30 Session Room5: AI 5: AI-Enabled ATE
Chair:
Jeff Rearick (AMD, United States)
Location: Room 5
09:00
Keith Schaub (Advantest, United States)
Ira Leventhal (Advantest, United States)
AI Engineering Assistants for ATE
SPEAKER: Keith Schaub

ABSTRACT. It’s common practice today to have Alexa turn on a light or play music and get traffic information from Siri. These simple tasks are only just the beginning. Machine learning and Deep learning have enabled dramatic progress with vision recognition, and NLP. Industries can integrate these technologies into their existing business process and products and over time, enhance them with their own custom IP.

2019 will be a year of development for the AI assistant. In this paper, we outline an AI engineering assistance model with some early prototypes and use cases that could be applied to test systems, which we believe will not only make for a richer experience, it will improve engineering and production efficiency as well as enhance production floor security. By integrating both vision and NLP AI with products and software interfaces enabling simple voice and gesture commands, engineers would be able to tackle more complex engineering tasks. A first step could be enabling engineers to speak the most commonly performed commands as they interact with the test system thus freeing them up to focus on the task at hand. Vision recognition AI could be used to enhance production floor login security, which would be quite valuable during post yield analysis. As the AI learns and improves, it can begin assisting with test debug, content searches, and even test program development.

09:45
Marc Hutner (Teradyne Inc, Canada)
Eddy Cheng (Teradyne Inc, Taiwan)
Gustavo Melchert (Teradyne Inc, United States)
Is it possible to impact quality of test with machine learning?
SPEAKER: Marc Hutner

ABSTRACT. Data Analysis is an important tool for Test and Product Engineers to improve coverage, product quality and operational efficiency of the equipment. Automated test equipment generates a vast amount of data with respect to the part being tested and the system doing the testing. In parallel to the test industry, many other technology sectors have been adopting various forms of Artificial Intelligence or Machine Learning to analyze vast data sets for new insights. Is it possible to leverage these new techniques back into a test application? In this presentation we will discuss infrastructure for impacting quality of test and how machine learning fits into the framework.

10:15
Dave Armstrong (Advantest, United States)
Moving Adaptive Test to “AI Test”

ABSTRACT. For years the industry has been focused on the use of Adaptive Test techniques to streamline and focus our test efforts for maximum value (and minimum test times). With the advent of Neural Network techniques (i.e. AI) new possibilities are coming to light for focusing our vision on areas where improvements can provide value. This presentation provides an overview of Adaptive Test and Neural Network techniques and then shares a vision for merging the two techniques together in order to improve our device quality, reduce our cost of test, and automate the control of functions best left to the computers supporting us.

10:30-11:00Break
11:00-12:00 Session keynote 3: Mini keynotes - elevator talks each to give a perspective on AI

Instead of a regular keynote, this plenary session comprises several elevator talks to provide different perspectives on AI in Test. A follow-up panel will be held in the afternoon for further discussion.

The speakers include:

Ken Butler, Founder, Engineering Tools and Analytics Team, Texas Instruments, Dallas, Texas - A Semiconductor Test Perspective

       As we all know, semiconductor manufacturing is a complex process with many interacting components, any one of which can negatively impact quality and cost.  AI techniques have already shown great promise as a means to detect, diagnose, and correct for these issues quickly in volume production.  We will examine what is in use today and aspects that are being investigated for future deployment.

Anne E Gattiker, Principal Research Staff Member, IBM - Deep Learning perspective

      Recently Deep Learning, e.g. employing many-layered neural networks, has revolutionized fields such as Computer Vision and Natural Language Processing. What factors have lead to such remarkable advances in these fields and could the test field achieve similar gains?

Ira Leventhal, Vice President, New Concept Product Initiative, Advantest America, Inc. - ATE perspective

       I will discuss how Machine Learning, while showing great promise to solve challenging test-related problems, is not a one-size-fits-all solution. Separating the reality from the hype on how this technology can be successfully applied requires a solid understanding of the strengths/weaknesses of machine learning algorithms, and which applications are the best fit to the strengths. I’ll present real-world successes with applying AI-based semiconductor data analytics and show how these algorithms can outperform other approaches, when applied to the right class of problems.

Xinli Gu, Huawei - AI from a system builder perspective

      AI/ML (Machine Learning) is a tool that promotes formal data collection and value discovery. In a large telecom company with thousands of products, end-to-end data collection and analysis using ML technology is proven to be huge values and gradually becomes a “MUST” in the company process. This talk will use an example to demonstrate the framework in one of the applications.

Cheng-Wen Wu, Tsing Hua Distinguished Chair Professor with the EE Dept., NTHU, Hsinchu, Taiwan. - AI on Taiwan Semiconductor Industry

      The financial tsunami a decade ago had somewhat slowed down the global semiconductor business, until late 2016 when AI suddenly gave everybody new hope. In the same period, however, the semiconductor business in Taiwan continued its growing trend, though on a slightly different track as the industry had expected. Like a chameleon, sort of, the industry has to quickly adjust itself to survive in the global market trend of cloud, IOT, and AI. In my speech, I will give my perspective on the strengths and surviving skills of the semiconductor industry in Taiwan, and give the outlook of the industry in the AI age.

Chair:
Rob Aitken (ARM Ltd., United States)
Location: Ball Room
12:00-13:30Lunch
13:30-15:00 Session Room1: Special 5: Invited - Advanced Memory
Chair:
Krishna Chakravadhanula (Cadence Design Systems, United States)
Location: Room 1
13:30
Sarath M. Nair (Karlsruhe Institute of Technology, Germany)
Rajendra Bishnoi (Karlsruhe Institute of Technology, Germany)
Mehdi Tahoori (Karlsruhe Institute of Technology, Germany)
Grigor Tshagharyan (Synopsys, Armenia)
Hayk Grigoryan (Synopsys, Armenia)
Gurgen Harutyunyan (Synopsys, Armenia)
Defect Injection, Fault Modeling and Test Algorithm Generation Methodology for STT-MRAM
SPEAKER: Mehdi Tahoori
14:15
Moritz Fieback (Delft University of Technology, Netherlands)
Mottaqiallah Taouil (Delft University of Technology, Netherlands)
Said Hamdioui (Delft University of Technology, Netherlands)
Testing Resistive Memories: Where we are standing and what is still missing?
SPEAKER: Said Hamdioui
13:30-15:00 Session Room2: ITC 50 Panel: ITC 50 - Remember The Past and Imagine The Future

Remember the 1968 film "2001: A Space Odyssey?" Did you know ITC was born in 1969? As the film industry is celebrating the 50-year-old birthday of "2001: A Space Odyssey," ITC will be entering its 50th year in 2019. What has changed in the last 50 years in ITC and in our industry? Moving forward, what shall we expect? How ITC and the test community as a whole will change in the next 25 years?

Do you remember the fun in the past ITC? Will the machine HAL become the general chair for ITC 75?

Check out the MP4 promotion video for AI program this year: http://www.itctestweek.org/AI/

Let's bring back our fun memories and use a little bit imagination in this panel. 

The 2019 ITC-50 committee will be there to hear from you!

13:30-15:00 Session Room4: Automotive 3: Embedded Tutorial: Automotive Reliability
Chair:
Mike Vachon (Cadence, United States)
Location: Room 4
13:30
Grigor Tshagharyan (Synopsys, Armenia)
Anteneh Gebregiorgis (Karlsruhe Institute of Technology, Germany)
Saber Golanbari (Karlsruhe Institute of Technology, Germany)
Rajendra Bishnoi (Karlsruhe Institute of Technology, Germany)
Mehdi Tahoori (Karlsruhe Institute of Technology, Germany)
Modeling and Testing of Aging Faults in FinFET Memories for Automotive Applications
14:15
Hayk Grigoryan (Synopsys, Armenia)
Samvel Shoukourian (Synopsys, Armenia)
Gurgen Harutyunyan (Synopsys, Armenia)
Costas Argyrides (AMD, United States)
ECC-Based FIT Rate Mitigation Technique for Automotive SoCs
13:30-15:00 Session Room5: AI Panel: Could AI eliminate the need for test engineering?

Following the AI mini-keynotes in the morning, this afternoon panel provides a forum to have more in-depth discussion.

AI has become an inevitable force to affect many industries. How do we see AI might transforms our industry? The most extreme question perhaps is: Will AI eventually eliminate test engineering? If not 100%, to what extent and when?

There are many questions surrounding AI and most importantly, do we really understand what AI is?

After hearing different perspectives in the morning, come and share your thoughts in this panel.

Chair:
Rob Aitken (ARM Ltd., United States)