Talk Keyword Index

TALK KEYWORD INDEX

This page contains an index consisting of author-provided keywords.

Shortcuts: 3 A B C D E F G H I L M N O P R S T V W X

3
3D EM simulations	DC/DC Converter Dead-Time Variation Analysis and Far-Field Radiation Estimation
A
active circuit	Shielding Structures for Through Silicon Via (TSV) to Active Circuit Noise Coupling in 3D IC
ALSE	Simulation of Radiated Emission during the Design Phase based on Scattering Parameter Measurement
analog	A Highly-Digitized Automotive CAN Transceiver in 0.14μm High-Voltage SOI CMOS
analog integrated circuits	RF Immunity Investigations of Linear DC Current Regulators
analytic modelling	Simulation model based on JEDEC JS-001-2014 for circuit simulation of HBM ESD pulses on IC level
artificial neural networks	Building Interchangeable Black-Box Models of Integrated Circuits for EMC Simulations
Automatic Control Gain loop	Preliminary Study of Automatic Control Gain Loop Subjected to Pulse-modulated Radiofrequency Interference
Automotive	A Highly-Digitized Automotive CAN Transceiver in 0.14μm High-Voltage SOI CMOS
automotive microcontroller	Role of IC Substrate and ESD Protections in Noise Propagation: Design and Modelling of Dedicated Test Chip in 40 nm Technology
B
Bandgap	Bandgap Failure Study Due To Parasitic Bipolar Substrate Coupling In Smart Power Mixed ICs
bandgap reference	Building Interchangeable Black-Box Models of Integrated Circuits for EMC Simulations
black-box modelling	Building Interchangeable Black-Box Models of Integrated Circuits for EMC Simulations
board-level shield	Improving the Shielding Effectiveness of a Board-Level Shield by Bonding it with the Waveguide-Below-Cutoff Principle
Bulk сurrent injection	Experimental Validation of the Generalized Accurate Modelling Method for System-Level Bulk Current Injection Setups up to 1 GHz
C
CAN	A Highly-Digitized Automotive CAN Transceiver in 0.14μm High-Voltage SOI CMOS
Chopper Amplifier	Susceptibility to EMI of High Side Current Sensors based on Chopper OpAmps
chopping	EMI Improved Chopped Operational Amplifier
circuit simulations	DC/DC Converter Dead-Time Variation Analysis and Far-Field Radiation Estimation
CISPR 25	Simulation of Radiated Emission during the Design Phase based on Scattering Parameter Measurement
Class D Audio Amplifier	Emission Reduction in Class-D Audio Amplifiers by Optimizing Spread Spectrum Modulation
CM-DM signal conversion	Experimental Validation of the Generalized Accurate Modelling Method for System-Level Bulk Current Injection Setups up to 1 GHz
CMOS low offset operational amplifier	EMI Improved Chopped Operational Amplifier
common mode	Resonance Analysis for EMC Improvement in Integrated Circuits
Common Mode Emission	Emission Reduction in Class-D Audio Amplifiers by Optimizing Spread Spectrum Modulation
component level	Simulation model based on JEDEC JS-001-2014 for circuit simulation of HBM ESD pulses on IC level
Component-level RFI	RF Interference Evaluation of Flexible Flat Cables for High-Speed Data Transmission in Mobile Devices
Computational electromagnetics	Computational Electromagnetics in Shielding Analysis of System in Package
Conductecd emissions	Developing a Universal Exchange Format for Integrated Circuit Emission Model – Conducted Emissions
conducted EMI	Role of IC Substrate and ESD Protections in Noise Propagation: Design and Modelling of Dedicated Test Chip in 40 nm Technology
Conducted Emissions “CE”	Analytical Aproach to study Electromagnetic Emission EME Contributors on DC/DC applications Introducing of multiphase Buck converters in automotive analog designs to reduce EME
conducted ESD gun stress	Functional analysis of an integrated communication interface during ESD
Conducted immunity	DPI set-up for ICs with differential inputs
Conducted immunity measurement	Direct power injection on functional and non-functional signals of SPI EEPROM memories
continuous time systems	Simulation model based on JEDEC JS-001-2014 for circuit simulation of HBM ESD pulses on IC level
control theory	Simulation model based on JEDEC JS-001-2014 for circuit simulation of HBM ESD pulses on IC level
Cryptographic IC	Fundamental Study on Randomized Processing in Cryptographic IC Using Variable Clock Against Correlation Power Analysis
current probing structure	TSV-based Current Probing Structure using Magnetic Coupling in 2.5D and 3D IC
Current Sensor	Susceptibility to EMI of High Side Current Sensors based on Chopper OpAmps
Current Source	EMC and Switching Loss Improvement for Fast Switching Power Stages by di/dt, dv/dt Optimization with 10ns Variable Current Source Gate Driver
current waveform reconstruction	TSV-based Current Probing Structure using Magnetic Coupling in 2.5D and 3D IC
D
damping resistor	Analysis of EMI Reduction Methods of DC-DC Buck Converter
Data Exchange	Developing a Universal Exchange Format for Integrated Circuit Emission Model – Conducted Emissions
DC-DC buck converter	Analysis of EMI Reduction Methods of DC-DC Buck Converter
DC-DC converters	Radiation Characteristics of Small Loop Antenna above Perforated Finite Image Plane Analytical Aproach to study Electromagnetic Emission EME Contributors on DC/DC applications Introducing of multiphase Buck converters in automotive analog designs to reduce EME
DC/DC converter	DC/DC Converter Dead-Time Variation Analysis and Far-Field Radiation Estimation
dead-time	DC/DC Converter Dead-Time Variation Analysis and Far-Field Radiation Estimation
Design methodology	Methodology for interference analysis during early design stages of high-performance mixed-signal ICs
di/dt	Examination of different adder structures concerning di/dt in a 180nm technology
differential mode	Resonance Analysis for EMC Improvement in Integrated Circuits
digital design	Examination of different adder structures concerning di/dt in a 180nm technology
direct power injection	Building Interchangeable Black-Box Models of Integrated Circuits for EMC Simulations
direct power injection (DPI)	Smart Power IC Macromodeling for DPI Analysis
DPI	DPI set-up for ICs with differential inputs
DPI measurement	Characterization of the Immunity of Integrated Circuits (ICs) at Wafer Level
dynamic response	Dynamic Multi-Parameter Response Model for SEED Analysis
E
Electrical circuit model	Electromagnetic Coupling Circuit Model of a Magnetic Near-Field Probe to a Microstrip Line
electromagnetic (EM) simulations	Radiation Characteristics of Small Loop Antenna above Perforated Finite Image Plane
electromagnetic attack	Near-Field Injection on a Safe System Basis Chip at Silicon Level
electromagnetic compatibility	Bandgap Failure Study Due To Parasitic Bipolar Substrate Coupling In Smart Power Mixed ICs
electromagnetic compatibility (EMC)	Examination of different adder structures concerning di/dt in a 180nm technology
Electromagnetic coupling	Methodology for interference analysis during early design stages of high-performance mixed-signal ICs
Electromagnetic coupling model	Electromagnetic Coupling Circuit Model of a Magnetic Near-Field Probe to a Microstrip Line
Electromagnetic couplings	Thermal-electromagnetic susceptibility behaviors of PWM patterns used in control electronic circuit
electromagnetic Emission	An EMI robust LIN Driver with low Electromagnetic Emission
Electromagnetic Emissions “EME”	Analytical Aproach to study Electromagnetic Emission EME Contributors on DC/DC applications Introducing of multiphase Buck converters in automotive analog designs to reduce EME
electromagnetic field simulation	Analysis of On-Chip Digital Noise Coupling Path for Wireless Communication IC Test Chip
electromagnetic immunity	Radiated Electromagnetic Immunity Analysis of VCO Using IC Stripline Method
Electromagnetic injection	Electromagnetic Coupling Circuit Model of a Magnetic Near-Field Probe to a Microstrip Line
Electromagnetic Interference	Improving the Shielding Effectiveness of a Board-Level Shield by Bonding it with the Waveguide-Below-Cutoff Principle Susceptibility to EMI of High Side Current Sensors based on Chopper OpAmps
Electromagnetic Interference (EMI)	On-Chip Watchdog to Monitor RTOS Activity in MPSoC Exposed to Noisy Environment
Electromagnetic Interference “EMI”	Analytical Aproach to study Electromagnetic Emission EME Contributors on DC/DC applications Introducing of multiphase Buck converters in automotive analog designs to reduce EME
electromagnetic interferences	RF Immunity Investigations of Linear DC Current Regulators
electromagnetic susceptibility	Preliminary Study of Automatic Control Gain Loop Subjected to Pulse-modulated Radiofrequency Interference
electrostatic discharge	Functional analysis of an integrated communication interface during ESD
Electrostatic discharges (ESD)	Simulation model based on JEDEC JS-001-2014 for circuit simulation of HBM ESD pulses on IC level
EM information leakage	Fundamental Study on Randomized Processing in Cryptographic IC Using Variable Clock Against Correlation Power Analysis
EMC	Resonance Analysis for EMC Improvement in Integrated Circuits DPI set-up for ICs with differential inputs Case Study on the Differences between EMI Resilience of Analog ICs against Continuous Wave, Modulated and Transient Disturbances Direct power injection on functional and non-functional signals of SPI EEPROM memories Radiated Electromagnetic Immunity Analysis of VCO Using IC Stripline Method A Highly-Digitized Automotive CAN Transceiver in 0.14μm High-Voltage SOI CMOS EMC and Switching Loss Improvement for Fast Switching Power Stages by di/dt, dv/dt Optimization with 10ns Variable Current Source Gate Driver ESD test at component level
EMC Optimization	EMC and Switching Loss Improvement for Fast Switching Power Stages by di/dt, dv/dt Optimization with 10ns Variable Current Source Gate Driver
EMI	An EMI robust LIN Driver with low Electromagnetic Emission Emission Reduction in Class-D Audio Amplifiers by Optimizing Spread Spectrum Modulation Analysis of EMI Reduction Methods of DC-DC Buck Converter
EMI measurement	Analysis of EMI Reduction Methods of DC-DC Buck Converter
EMI robustness	Case Study on the Differences between EMI Resilience of Analog ICs against Continuous Wave, Modulated and Transient Disturbances EMI Improved Chopped Operational Amplifier
EMI timestamp	Time-domain EMI Measurement Methodology
EMI tolerant circuits	Case Study on the Differences between EMI Resilience of Analog ICs against Continuous Wave, Modulated and Transient Disturbances
Emission model	EMC performance analysis of a Processor/Memory System using PCB and Package-On-Package
ESD	ESD test at component level
ESD operating	Functional analysis of an integrated communication interface during ESD
ESD protections	Role of IC Substrate and ESD Protections in Noise Propagation: Design and Modelling of Dedicated Test Chip in 40 nm Technology
ESD pulse measurements	Functional analysis of an integrated communication interface during ESD
F
failure criteria	Functional analysis of an integrated communication interface during ESD
far-field	DC/DC Converter Dead-Time Variation Analysis and Far-Field Radiation Estimation
far-field zone	Radiation Characteristics of Small Loop Antenna above Perforated Finite Image Plane
Fast Adaption Time	EMC and Switching Loss Improvement for Fast Switching Power Stages by di/dt, dv/dt Optimization with 10ns Variable Current Source Gate Driver
FFC	RF Interference Evaluation of Flexible Flat Cables for High-Speed Data Transmission in Mobile Devices
Finite element method	Arbitrary Shape Multilayer Interconnects EMC Modelling and Optimization
finite reflector	Radiation Characteristics of Small Loop Antenna above Perforated Finite Image Plane
Floating ungrounded EUT model	Experimental Validation of the Generalized Accurate Modelling Method for System-Level Bulk Current Injection Setups up to 1 GHz
FTB	Resonance Analysis for EMC Improvement in Integrated Circuits
G
Gate driver	An EMI robust LIN Driver with low Electromagnetic Emission EMC and Switching Loss Improvement for Fast Switching Power Stages by di/dt, dv/dt Optimization with 10ns Variable Current Source Gate Driver
ground bounce	Examination of different adder structures concerning di/dt in a 180nm technology
H
Hardware-Based Approach	On-Chip Watchdog to Monitor RTOS Activity in MPSoC Exposed to Noisy Environment
high frequency interference	Preliminary Study of Automatic Control Gain Loop Subjected to Pulse-modulated Radiofrequency Interference
high voltage	A Highly-Digitized Automotive CAN Transceiver in 0.14μm High-Voltage SOI CMOS
HMM	ESD test at component level
I
I/O ring	Role of IC Substrate and ESD Protections in Noise Propagation: Design and Modelling of Dedicated Test Chip in 40 nm Technology
IBIS	EMC performance analysis of a Processor/Memory System using PCB and Package-On-Package
IC	ESD test at component level
IC stripline	Radiated Electromagnetic Immunity Analysis of VCO Using IC Stripline Method
IC susceptibility	Characterization of the Immunity of Integrated Circuits (ICs) at Wafer Level
IC susceptibility to EMI	Smart Power IC Macromodeling for DPI Analysis
IC with differential inputs	DPI set-up for ICs with differential inputs
ICEM-CE	Developing a Universal Exchange Format for Integrated Circuit Emission Model – Conducted Emissions
IEC61000-4-2	ESD test at component level
IEC61967	Emission Reduction in Class-D Audio Amplifiers by Optimizing Spread Spectrum Modulation
image theory	Radiation Characteristics of Small Loop Antenna above Perforated Finite Image Plane
immunity	Enhancement of the Spatial Resolution of Near-Field Immunity Maps Relation between Internal Terminal Voltage and Immunity Behavior of LDO Regulator Circuits
Immunity defaults	Thermal-electromagnetic susceptibility behaviors of PWM patterns used in control electronic circuit
Insfrastructure-Intellectual Property (I-IP) Core	On-Chip Watchdog to Monitor RTOS Activity in MPSoC Exposed to Noisy Environment
integrated circuit (IC)	Simulation model based on JEDEC JS-001-2014 for circuit simulation of HBM ESD pulses on IC level Examination of different adder structures concerning di/dt in a 180nm technology
integrated circuit testing	Functional analysis of an integrated communication interface during ESD
integrated circuits	Building Interchangeable Black-Box Models of Integrated Circuits for EMC Simulations Direct power injection on functional and non-functional signals of SPI EEPROM memories
integrated current sensor	Smart Power IC Macromodeling for DPI Analysis
Interference	Methodology for interference analysis during early design stages of high-performance mixed-signal ICs
internal terminal	Relation between Internal Terminal Voltage and Immunity Behavior of LDO Regulator Circuits
IoT-EMI measurement	Time-domain EMI Measurement Methodology
L
LDO voltage regulator	Relation between Internal Terminal Voltage and Immunity Behavior of LDO Regulator Circuits
LF antenna driver	Simulation of Radiated Emission during the Design Phase based on Scattering Parameter Measurement
LIN BUS	An EMI robust LIN Driver with low Electromagnetic Emission
linear DC current regulators	RF Immunity Investigations of Linear DC Current Regulators
M
Macromodeling	Smart Power IC Macromodeling for DPI Analysis
magnetic coupling	TSV-based Current Probing Structure using Magnetic Coupling in 2.5D and 3D IC
Magnetic near-field probe	Electromagnetic Coupling Circuit Model of a Magnetic Near-Field Probe to a Microstrip Line
magnetic thin film	Analysis of On-Chip Digital Noise Coupling Path for Wireless Communication IC Test Chip
measurement	Resonance Analysis for EMC Improvement in Integrated Circuits
Microcontroller	EMC performance analysis of a Processor/Memory System using PCB and Package-On-Package
microcontrollers	Resonance Analysis for EMC Improvement in Integrated Circuits
Mixed analog digital integrated circuits	Methodology for interference analysis during early design stages of high-performance mixed-signal ICs
Modeling	DPI set-up for ICs with differential inputs Developing a Universal Exchange Format for Integrated Circuit Emission Model – Conducted Emissions
Monte Carlo analysis	DC/DC Converter Dead-Time Variation Analysis and Far-Field Radiation Estimation
MPSoC	On-Chip Watchdog to Monitor RTOS Activity in MPSoC Exposed to Noisy Environment
multi-parameter	Dynamic Multi-Parameter Response Model for SEED Analysis
Multi-Stage Current Source	EMC and Switching Loss Improvement for Fast Switching Power Stages by di/dt, dv/dt Optimization with 10ns Variable Current Source Gate Driver
Multilayer interconnection	Arbitrary Shape Multilayer Interconnects EMC Modelling and Optimization
Multiphase Buck Converters	Analytical Aproach to study Electromagnetic Emission EME Contributors on DC/DC applications Introducing of multiphase Buck converters in automotive analog designs to reduce EME
N
Near field scan	EMC performance analysis of a Processor/Memory System using PCB and Package-On-Package
near-field aggression	Thermal-electromagnetic susceptibility behaviors of PWM patterns used in control electronic circuit
Near-Field injection	Near-Field Injection on a Safe System Basis Chip at Silicon Level
Near-Field Scan	Enhancement of the Spatial Resolution of Near-Field Immunity Maps
NFS measurement	EMC performance analysis of a Processor/Memory System using PCB and Package-On-Package
noise coupling	Shielding Structures for Through Silicon Via (TSV) to Active Circuit Noise Coupling in 3D IC
noise integrity	Role of IC Substrate and ESD Protections in Noise Propagation: Design and Modelling of Dedicated Test Chip in 40 nm Technology
noise reduction	Analysis of EMI Reduction Methods of DC-DC Buck Converter
noise suppression	Shielding Structures for Through Silicon Via (TSV) to Active Circuit Noise Coupling in 3D IC
nonlinearities	Large domain validity of MOSFET Microwave Rectification Response
O
Operational Amplifier	Susceptibility to EMI of High Side Current Sensors based on Chopper OpAmps
Optimisation	Computational Electromagnetics in Shielding Analysis of System in Package
P
Package on package	EMC performance analysis of a Processor/Memory System using PCB and Package-On-Package
Parasitic capacitance	Arbitrary Shape Multilayer Interconnects EMC Modelling and Optimization
PCB	Thermal-electromagnetic susceptibility behaviors of PWM patterns used in control electronic circuit Analysis of EMI Reduction Methods of DC-DC Buck Converter
power supply	Resonance Analysis for EMC Improvement in Integrated Circuits
pre-compliance simulation	Simulation of Radiated Emission during the Design Phase based on Scattering Parameter Measurement
Pulse modulated signal	Preliminary Study of Automatic Control Gain Loop Subjected to Pulse-modulated Radiofrequency Interference
Pulse Width Modulation	Thermal-electromagnetic susceptibility behaviors of PWM patterns used in control electronic circuit
R
radiated emission	Simulation of Radiated Emission during the Design Phase based on Scattering Parameter Measurement
Radiated Immunity	Near-Field Injection on a Safe System Basis Chip at Silicon Level
radiative noise	Radiated Electromagnetic Immunity Analysis of VCO Using IC Stripline Method
Real-Time Operating System	On-Chip Watchdog to Monitor RTOS Activity in MPSoC Exposed to Noisy Environment
rectification effect	Large domain validity of MOSFET Microwave Rectification Response
Resolution enhancement	Enhancement of the Spatial Resolution of Near-Field Immunity Maps
resonance	Resonance Analysis for EMC Improvement in Integrated Circuits
response surface methodology	DC/DC Converter Dead-Time Variation Analysis and Far-Field Radiation Estimation
RF	Dynamic Multi-Parameter Response Model for SEED Analysis
RF design	Direct power injection on functional and non-functional signals of SPI EEPROM memories
RF IC	Analysis of On-Chip Digital Noise Coupling Path for Wireless Communication IC Test Chip
RF immunity	RF Immunity Investigations of Linear DC Current Regulators
RF injection	An EMI robust LIN Driver with low Electromagnetic Emission
RFI Evaluation	RF Interference Evaluation of Flexible Flat Cables for High-Speed Data Transmission in Mobile Devices
S
scattering parameter	Simulation of Radiated Emission during the Design Phase based on Scattering Parameter Measurement
SEED	Dynamic Multi-Parameter Response Model for SEED Analysis
semi-empirical model	Large domain validity of MOSFET Microwave Rectification Response
semiconductor ageing	Ageing effects on power RF LDMOS reliability using the Transmission Line Matrix method
shielding effectiveness	Improving the Shielding Effectiveness of a Board-Level Shield by Bonding it with the Waveguide-Below-Cutoff Principle Computational Electromagnetics in Shielding Analysis of System in Package
shielding structure	Shielding Structures for Through Silicon Via (TSV) to Active Circuit Noise Coupling in 3D IC
Side-channel attack	Fundamental Study on Randomized Processing in Cryptographic IC Using Variable Clock Against Correlation Power Analysis
simulation	Simulation model based on JEDEC JS-001-2014 for circuit simulation of HBM ESD pulses on IC level Examination of different adder structures concerning di/dt in a 180nm technology
Simulation of EMC tests	Experimental Validation of the Generalized Accurate Modelling Method for System-Level Bulk Current Injection Setups up to 1 GHz
simulation speed-up	Building Interchangeable Black-Box Models of Integrated Circuits for EMC Simulations
Smart Power IC	Bandgap Failure Study Due To Parasitic Bipolar Substrate Coupling In Smart Power Mixed ICs
SOI	A Highly-Digitized Automotive CAN Transceiver in 0.14μm High-Voltage SOI CMOS
Spread Spectrum Modulation	Emission Reduction in Class-D Audio Amplifiers by Optimizing Spread Spectrum Modulation
spurious noise	Analysis of On-Chip Digital Noise Coupling Path for Wireless Communication IC Test Chip
Standarization	Developing a Universal Exchange Format for Integrated Circuit Emission Model – Conducted Emissions
substrate modelling	Role of IC Substrate and ESD Protections in Noise Propagation: Design and Modelling of Dedicated Test Chip in 40 nm Technology
Substrate noise	Role of IC Substrate and ESD Protections in Noise Propagation: Design and Modelling of Dedicated Test Chip in 40 nm Technology
substrate noise coupling	Bandgap Failure Study Due To Parasitic Bipolar Substrate Coupling In Smart Power Mixed ICs
substrate parasitic bipolar structures	Bandgap Failure Study Due To Parasitic Bipolar Substrate Coupling In Smart Power Mixed ICs
Susceptibility	Thermal-electromagnetic susceptibility behaviors of PWM patterns used in control electronic circuit Near-Field Injection on a Safe System Basis Chip at Silicon Level
SW-dependent EMI	Time-domain EMI Measurement Methodology
SW/HW-co-measurement	Time-domain EMI Measurement Methodology
Switched-Mode Power Supply “SMPS”	Analytical Aproach to study Electromagnetic Emission EME Contributors on DC/DC applications Introducing of multiphase Buck converters in automotive analog designs to reduce EME
Switching Loss	EMC and Switching Loss Improvement for Fast Switching Power Stages by di/dt, dv/dt Optimization with 10ns Variable Current Source Gate Driver
System efficient ESD design	Dynamic Multi-Parameter Response Model for SEED Analysis
System in package	Computational Electromagnetics in Shielding Analysis of System in Package
System-on-chip	Methodology for interference analysis during early design stages of high-performance mixed-signal ICs
T
Taylor-series	Large domain validity of MOSFET Microwave Rectification Response
TEM	Thermal-electromagnetic susceptibility behaviors of PWM patterns used in control electronic circuit
TEM-cell	Analysis of EMI Reduction Methods of DC-DC Buck Converter
Thermal Cycling Test (TCT)	Ageing effects on power RF LDMOS reliability using the Transmission Line Matrix method
Thermal impacts	Thermal-electromagnetic susceptibility behaviors of PWM patterns used in control electronic circuit
through silicon va(TSV)	Shielding Structures for Through Silicon Via (TSV) to Active Circuit Noise Coupling in 3D IC
through silicon via (TSV)	TSV-based Current Probing Structure using Magnetic Coupling in 2.5D and 3D IC
time - frequency domain	Dynamic Multi-Parameter Response Model for SEED Analysis
TLP	Dynamic Multi-Parameter Response Model for SEED Analysis
Transceiver	A Highly-Digitized Automotive CAN Transceiver in 0.14μm High-Voltage SOI CMOS
transient disturbance	Case Study on the Differences between EMI Resilience of Analog ICs against Continuous Wave, Modulated and Transient Disturbances
transistor	Large domain validity of MOSFET Microwave Rectification Response
Transmission Line Matrix (TLM)	Ageing effects on power RF LDMOS reliability using the Transmission Line Matrix method
transmission line pulse	Dynamic Multi-Parameter Response Model for SEED Analysis
V
Variable Current Source	EMC and Switching Loss Improvement for Fast Switching Power Stages by di/dt, dv/dt Optimization with 10ns Variable Current Source Gate Driver
VCO	Radiated Electromagnetic Immunity Analysis of VCO Using IC Stripline Method
VectFit macromodeling	Experimental Validation of the Generalized Accurate Modelling Method for System-Level Bulk Current Injection Setups up to 1 GHz
W
wafer level testing	Characterization of the Immunity of Integrated Circuits (ICs) at Wafer Level
waveguide-below-cutoff	Improving the Shielding Effectiveness of a Board-Level Shield by Bonding it with the Waveguide-Below-Cutoff Principle
wireless communication	Analysis of On-Chip Digital Noise Coupling Path for Wireless Communication IC Test Chip
X
XML	Developing a Universal Exchange Format for Integrated Circuit Emission Model – Conducted Emissions