Days: Tuesday, November 10th Wednesday, November 11th Thursday, November 12th Friday, November 13th
View this program: with abstractssession overviewtalk overview
Welcome and Keynote I
09:30 | Welcome to EMC Compo 2015 ( abstract ) |
09:45 | Maxwell’s Legacy – The Heart and Soul of the EMC Discipline ( abstract ) |
Design for EMC I
11:00 | Emission Reduction in Class-D Audio Amplifiers by Optimizing Spread Spectrum Modulation ( abstract ) |
11:22 | DC/DC Converter Dead-Time Variation Analysis and Far-Field Radiation Estimation ( abstract ) |
11:44 | A Highly-Digitized Automotive CAN Transceiver in 0.14μm High-Voltage SOI CMOS ( abstract ) |
12:06 | EMC and Switching Loss Improvement for Fast Switching Power Stages by di/dt, dv/dt Optimization with 10ns Variable Current Source Gate Driver ( abstract ) |
Measurement techniques I
13:30 | Direct power injection on functional and non-functional signals of SPI EEPROM memories ( abstract ) |
13:52 | Electromagnetic Coupling Circuit Model of a Magnetic Near-Field Probe to a Microstrip Line ( abstract ) |
14:14 | Bandgap Failure Study Due To Parasitic Bipolar Substrate Coupling In Smart Power Mixed ICs ( abstract ) |
14:36 | Fundamental Study on Randomized Processing in Cryptographic IC Using Variable Clock Against Correlation Power Analysis ( abstract ) |
Design for EMC II (poster)
15:30 | An EMI robust LIN Driver with low Electromagnetic Emission ( abstract ) |
15:30 | Analytical Aproach to study Electromagnetic Emission EME Contributors on DC/DC applications Introducing of multiphase Buck converters in automotive analog designs to reduce EME ( abstract ) |
15:30 | EMI Improved Chopped Operational Amplifier ( abstract ) |
15:30 | Methodology for interference analysis during early design stages of high-performance mixed-signal ICs ( abstract ) |
15:30 | On-Chip Watchdog to Monitor RTOS Activity in MPSoC Exposed to Noisy Environment ( abstract ) |
15:30 | Resonance Analysis for EMC Improvement in Integrated Circuits ( abstract ) |
15:30 | Improving the Shielding Effectiveness of a Board-Level Shield by Bonding it with the Waveguide-Below-Cutoff Principle ( abstract ) |
15:30 | Dynamic Multi-Parameter Response Model for SEED Analysis ( abstract ) |
15:30 | Examination of different adder structures concerning di/dt in a 180nm technology ( abstract ) |
15:30 | Role of IC Substrate and ESD Protections in Noise Propagation: Design and Modelling of Dedicated Test Chip in 40 nm Technology ( abstract ) |
15:30 | Analysis of EMI Reduction Methods of DC-DC Buck Converter ( abstract ) |
15:30 | Arbitrary Shape Multilayer Interconnects EMC Modelling and Optimization ( abstract ) |
Welcome event
View this program: with abstractssession overviewtalk overview
Keynote II
09:30 | The Evolution of Commercial EMC Standards ( abstract ) |
Immunity I
11:00 | Preliminary Study of Automatic Control Gain Loop Subjected to Pulse-modulated Radiofrequency Interference ( abstract ) |
11:22 | Susceptibility to EMI of High Side Current Sensors based on Chopper OpAmps ( abstract ) |
11:44 | RF Immunity Investigations of Linear DC Current Regulators ( abstract ) |
12:06 | Functional analysis of an integrated communication interface during ESD ( abstract ) |
CST Workshop
13:30 | Signal/Power Integrity and EMC simulations of chip/package/board (Part I) ( abstract ) |
Immunity II
13:30 | Near-Field Injection on a Safe System Basis Chip at Silicon Level ( abstract ) |
13:52 | Experimental Validation of the Generalized Accurate Modelling Method for System-Level Bulk Current Injection Setups up to 1 GHz ( abstract ) |
14:14 | Relation between Internal Terminal Voltage and Immunity Behavior of LDO Regulator Circuits ( abstract ) |
14:36 | Radiated Electromagnetic Immunity Analysis of VCO Using IC Stripline Method ( abstract ) |
Demonstrations
15:30 | EMC modeling of Integrated Circuits using IC-EMC ( abstract ) |
CST Workshop
15:30 | Signal/Power Integrity and EMC simulations of chip/package/board (Part II) ( abstract ) |
EMC I (poster)
15:30 | Analysis of On-Chip Digital Noise Coupling Path for Wireless Communication IC Test Chip ( abstract ) |
15:30 | TSV-based Current Probing Structure using Magnetic Coupling in 2.5D and 3D IC ( abstract ) |
15:30 | Case Study on the Differences between EMI Resilience of Analog ICs against Continuous Wave, Modulated and Transient Disturbances ( abstract ) |
15:30 | Simulation model based on JEDEC JS-001-2014 for circuit simulation of HBM ESD pulses on IC level ( abstract ) |
15:30 | Characterization of the Immunity of Integrated Circuits (ICs) at Wafer Level ( abstract ) |
15:30 | Thermal-electromagnetic susceptibility behaviors of PWM patterns used in control electronic circuit ( abstract ) |
15:30 | DPI set-up for ICs with differential inputs ( abstract ) |
15:30 | Computational Electromagnetics in Shielding Analysis of System in Package ( abstract ) |
15:30 | Time-domain EMI Measurement Methodology ( abstract ) |
15:30 | RF Interference Evaluation of Flexible Flat Cables for High-Speed Data Transmission in Mobile Devices ( abstract ) |
15:30 | Enhancement of the Spatial Resolution of Near-Field Immunity Maps ( abstract ) |
15:30 | Ageing effects on power RF LDMOS reliability using the Transmission Line Matrix method ( abstract ) |
15:30 | ESD test at component level ( abstract ) |
Visits to James Clerk Maxwell's house
View this program: with abstractssession overviewtalk overview
Keynote III
09:30 | Future needs in EMC of ICs - Are you hearing the voice of industry ? ( abstract ) |
Modelling I
11:00 | Radiation Characteristics of Small Loop Antenna above Perforated Finite Image Plane ( abstract ) |
11:22 | Simulation of Radiated Emission during the Design Phase based on Scattering Parameter Measurement ( abstract ) |
11:44 | Large domain validity of MOSFET Microwave Rectification Response ( abstract ) |
12:06 | EMC performance analysis of a Processor/Memory System using PCB and Package-On-Package ( abstract ) |
ANSYS Workshop (Part I)
13:30 | Assessment and improvement of the EMC behaviour for Printed Circuit Boards ( abstract ) |
Modelling II
13:30 | Smart Power IC Macromodeling for DPI Analysis ( abstract ) |
13:52 | Shielding Structures for Through Silicon Via (TSV) to Active Circuit Noise Coupling in 3D IC ( abstract ) |
14:14 | Developing a Universal Exchange Format for Integrated Circuit Emission Model – Conducted Emissions ( abstract ) |
14:36 | Building Interchangeable Black-Box Models of Integrated Circuits for EMC Simulations ( abstract ) |
EMC behaviour of COTS components after ageing (Workshop)
15:30 | A methodologic project to characterize and model EMC behavior of COTS components after ageing ( abstract ) |
16:00 | Analysis and Modelling of Passive device degradation for a long-term electromagnetic emission study of a DC-DC converter ( abstract ) |
16:30 | ICIM-CI model of Op. Amp taking into account environment effect for robustness concern ( abstract ) |
ANSYS Workshop (Part II)
15:30 | Power, Noise and Reliability: Analysis and Optimisation of High Performance Chip Designs using ANSYS Apache ( abstract ) |
EMC Compo Gala Dinner at Ghillie Dhu including presentation of best paper awards.
View this program: with abstractssession overviewtalk overview
System decoupling capacitor selection and placement to minimize radiation and immunity issues Part I (Workshop)
09:00 | Introduction ( abstract ) |
09:15 | The power delivery system ( abstract ) |
10:00 | Simple test board measurements and results ( abstract ) |
System decoupling capacitor selection and placement to minimize radiation and immunity issues Part II (Workshop)
11:00 | ST Microcontroller pcb and measurement results ( abstract ) |
11:45 | Demonstration of optimization of the power delivery system on a large design ( abstract ) |
12:15 | Summary and further discussion ( abstract ) |