EMC COMPO 2015: THE 10TH INTERNATIONAL WORKSHOP ON THE ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUITS

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Abouda, Kamel	Near-Field Injection on a Safe System Basis Chip at Silicon Level Analytical Aproach to study Electromagnetic Emission EME Contributors on DC/DC applications Introducing of multiphase Buck converters in automotive analog designs to reduce EME
Ahaitouf, Ali	Direct power injection on functional and non-functional signals of SPI EEPROM memories
Aldabbagh, Ahmed	Ageing effects on power RF LDMOS reliability using the Transmission Line Matrix method
Amara, Meriem	DPI set-up for ICs with differential inputs
Amellal, Mohamed	Direct power injection on functional and non-functional signals of SPI EEPROM memories
Amschl, Dominik	Characterization of the Immunity of Integrated Circuits (ICs) at Wafer Level
Aoki, Hanae	Analysis of On-Chip Digital Noise Coupling Path for Wireless Communication IC Test Chip
Armstrong, Keith	Improving the Shielding Effectiveness of a Board-Level Shield by Bonding it with the Waveguide-Below-Cutoff Principle
Aulagnier, Guillaume	Analytical Aproach to study Electromagnetic Emission EME Contributors on DC/DC applications Introducing of multiphase Buck converters in automotive analog designs to reduce EME
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Bacher, Yann	Resonance Analysis for EMC Improvement in Integrated Circuits
Ballarin, Fabio	Susceptibility to EMI of High Side Current Sensors based on Chopper OpAmps
Baran, Burak	Case Study on the Differences between EMI Resilience of Analog ICs against Continuous Wave, Modulated and Transient Disturbances
Baric, Adrijan	Radiation Characteristics of Small Loop Antenna above Perforated Finite Image Plane DC/DC Converter Dead-Time Variation Analysis and Far-Field Radiation Estimation Building Interchangeable Black-Box Models of Integrated Circuits for EMC Simulations
Batista, Emmanuel	Thermal-electromagnetic susceptibility behaviors of PWM patterns used in control electronic circuit
Bauer, Susanne	Characterization of the Immunity of Integrated Circuits (ICs) at Wafer Level
Ben Dhia, Sonia	Bandgap Failure Study Due To Parasitic Bipolar Substrate Coupling In Smart Power Mixed ICs
Bhattacharya, Arnab	Signal/Power Integrity and EMC simulations of chip/package/board (Part I) Signal/Power Integrity and EMC simulations of chip/package/board (Part II)
Blecic, Raul	Radiation Characteristics of Small Loop Antenna above Perforated Finite Image Plane DC/DC Converter Dead-Time Variation Analysis and Far-Field Radiation Estimation
Bolzani Poehls, Letícia	On-Chip Watchdog to Monitor RTOS Activity in MPSoC Exposed to Noisy Environment
Boyer, Alexandre	Bandgap Failure Study Due To Parasitic Bipolar Substrate Coupling In Smart Power Mixed ICs
Boyer, Alexandre	EMC performance analysis of a Processor/Memory System using PCB and Package-On-Package Developing a Universal Exchange Format for Integrated Circuit Emission Model – Conducted Emissions Analysis and Modelling of Passive device degradation for a long-term electromagnetic emission study of a DC-DC converter
Boyer, Alexandre	Enhancement of the Spatial Resolution of Near-Field Immunity Maps
Braquet, Henri	Resonance Analysis for EMC Improvement in Integrated Circuits
Brignone, Marco	Smart Power IC Macromodeling for DPI Analysis
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Cavarroc, Manuel	Enhancement of the Spatial Resolution of Near-Field Immunity Maps
Chen, Chiu-Kuo	Time-domain EMI Measurement Methodology
Choi, Sumin	Shielding Structures for Through Silicon Via (TSV) to Active Circuit Noise Coupling in 3D IC TSV-based Current Probing Structure using Magnetic Coupling in 2.5D and 3D IC
Chusseau, Laurent	Electromagnetic Coupling Circuit Model of a Magnetic Near-Field Probe to a Microstrip Line
Coenen, Mart	Dynamic Multi-Parameter Response Model for SEED Analysis
Colombo, Paolo	Role of IC Substrate and ESD Protections in Noise Propagation: Design and Modelling of Dedicated Test Chip in 40 nm Technology
Cordoni, Martina	Role of IC Substrate and ESD Protections in Noise Propagation: Design and Modelling of Dedicated Test Chip in 40 nm Technology
Coull, Chris	Power, Noise and Reliability: Analysis and Optimisation of High Performance Chip Designs using ANSYS Apache
Cousineau, Marc	Analytical Aproach to study Electromagnetic Emission EME Contributors on DC/DC applications Introducing of multiphase Buck converters in automotive analog designs to reduce EME
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de Oliveira, Christofer	On-Chip Watchdog to Monitor RTOS Activity in MPSoC Exposed to Noisy Environment
Degraeve, Andy	Improving the Shielding Effectiveness of a Board-Level Shield by Bonding it with the Waveguide-Below-Cutoff Principle
Dehaene, Wim	Case Study on the Differences between EMI Resilience of Analog ICs against Continuous Wave, Modulated and Transient Disturbances
Deloge, Matthieu	A Highly-Digitized Automotive CAN Transceiver in 0.14μm High-Voltage SOI CMOS
Deutschmann, Bernd	Emission Reduction in Class-D Audio Amplifiers by Optimizing Spread Spectrum Modulation Simulation of Radiated Emission during the Design Phase based on Scattering Parameter Measurement Characterization of the Immunity of Integrated Circuits (ICs) at Wafer Level EMI Improved Chopped Operational Amplifier
Dienot, Jean-Marc	Thermal-electromagnetic susceptibility behaviors of PWM patterns used in control electronic circuit
Doridant, Adrien	Preliminary Study of Automatic Control Gain Loop Subjected to Pulse-modulated Radiofrequency Interference Near-Field Injection on a Safe System Basis Chip at Silicon Level
Drissi, Mhamed	Direct power injection on functional and non-functional signals of SPI EEPROM memories
Dubois, Tristan	ICIM-CI model of Op. Amp taking into account environment effect for robustness concern
Duffy, Alistair	Ageing effects on power RF LDMOS reliability using the Transmission Line Matrix method
Durier, André	A methodologic project to characterize and model EMC behavior of COTS components after ageing
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Eisenberger, Oliver	Building Interchangeable Black-Box Models of Integrated Circuits for EMC Simulations
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Fan, Peng	Analysis of On-Chip Digital Noise Coupling Path for Wireless Communication IC Test Chip
Fernandez Lopez, Priscila	EMC performance analysis of a Processor/Memory System using PCB and Package-On-Package DPI set-up for ICs with differential inputs
Fiori, Franco	Susceptibility to EMI of High Side Current Sensors based on Chopper OpAmps Smart Power IC Macromodeling for DPI Analysis
Frei, Stephan	Experimental Validation of the Generalized Accurate Modelling Method for System-Level Bulk Current Injection Setups up to 1 GHz
Froidevaux, Nicolas	Resonance Analysis for EMC Improvement in Integrated Circuits
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Gao, Yuan	Near-Field Injection on a Safe System Basis Chip at Silicon Level
Gillon, Renaud	Radiation Characteristics of Small Loop Antenna above Perforated Finite Image Plane DC/DC Converter Dead-Time Variation Analysis and Far-Field Radiation Estimation
Glaesser, Lars	ESD test at component level
Goyal, Shishir	A Highly-Digitized Automotive CAN Transceiver in 0.14μm High-Voltage SOI CMOS
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Hackl, Herbert	Simulation of Radiated Emission during the Design Phase based on Scattering Parameter Measurement
Hai Au, Huynh	Analysis of EMI Reduction Methods of DC-DC Buck Converter
Han, Youngbong	Radiated Electromagnetic Immunity Analysis of VCO Using IC Stripline Method
Hanssen, Marcel	Methodology for interference analysis during early design stages of high-performance mixed-signal ICs
Hayashi, Yuichi	Fundamental Study on Randomized Processing in Cryptographic IC Using Variable Clock Against Correlation Power Analysis
Herrmann, Helmut	Smart Power IC Macromodeling for DPI Analysis
Hisakado, Takashi	Relation between Internal Terminal Voltage and Immunity Behavior of LDO Regulator Circuits
Hoang, Thi Quynh Van	DPI set-up for ICs with differential inputs
Hoffmann, Patrick	Preliminary Study of Automatic Control Gain Loop Subjected to Pulse-modulated Radiofrequency Interference Large domain validity of MOSFET Microwave Rectification Response
Horchler, Wolfgang	Smart Power IC Macromodeling for DPI Analysis
Hwang, Jongtae	Radiated Electromagnetic Immunity Analysis of VCO Using IC Stripline Method
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Ikehara, Nobuaki	Relation between Internal Terminal Voltage and Immunity Behavior of LDO Regulator Circuits
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Jacquemod, Gilles	Resonance Analysis for EMC Improvement in Integrated Circuits
Jahn, Stefan	Experimental Validation of the Generalized Accurate Modelling Method for System-Level Bulk Current Injection Setups up to 1 GHz
Janschitz, Johannes	An EMI robust LIN Driver with low Electromagnetic Emission
Jarrix, Sylvie	Preliminary Study of Automatic Control Gain Loop Subjected to Pulse-modulated Radiofrequency Interference
Jiang, Mei	Arbitrary Shape Multilayer Interconnects EMC Modelling and Optimization
Jung, Daniel H.	Shielding Structures for Through Silicon Via (TSV) to Active Circuit Noise Coupling in 3D IC TSV-based Current Probing Structure using Magnetic Coupling in 2.5D and 3D IC
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Kam, Dong Gun	RF Interference Evaluation of Flexible Flat Cables for High-Speed Data Transmission in Mobile Devices
Kapora, Sergei	Methodology for interference analysis during early design stages of high-performance mixed-signal ICs
Karaca, Timucin	Emission Reduction in Class-D Audio Amplifiers by Optimizing Spread Spectrum Modulation
Kaufmann, Manuel	Simulation model based on JEDEC JS-001-2014 for circuit simulation of HBM ESD pulses on IC level
Kim, Heegon	TSV-based Current Probing Structure using Magnetic Coupling in 2.5D and 3D IC
Kim, Jiseong	RF Interference Evaluation of Flexible Flat Cables for High-Speed Data Transmission in Mobile Devices
Kim, Jonghoon J.	Shielding Structures for Through Silicon Via (TSV) to Active Circuit Noise Coupling in 3D IC TSV-based Current Probing Structure using Magnetic Coupling in 2.5D and 3D IC
Kim, Joungho	Shielding Structures for Through Silicon Via (TSV) to Active Circuit Noise Coupling in 3D IC TSV-based Current Probing Structure using Magnetic Coupling in 2.5D and 3D IC
Kim, Soyoung	Radiated Electromagnetic Immunity Analysis of VCO Using IC Stripline Method Analysis of EMI Reduction Methods of DC-DC Buck Converter
Klotz, Frank	RF Immunity Investigations of Linear DC Current Regulators Smart Power IC Macromodeling for DPI Analysis
Klotz, Frank	Experimental Validation of the Generalized Accurate Modelling Method for System-Level Bulk Current Injection Setups up to 1 GHz
Koenig, Sven	ESD test at component level
Koeppl, Benno	EMC and Switching Loss Improvement for Fast Switching Power Stages by di/dt, dv/dt Optimization with 10ns Variable Current Source Gate Driver
Kong, Sunkyu	TSV-based Current Probing Structure using Magnetic Coupling in 2.5D and 3D IC
Kwakernaat, Gerald	A Highly-Digitized Automotive CAN Transceiver in 0.14μm High-Voltage SOI CMOS
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Lafon, Frederic	EMC performance analysis of a Processor/Memory System using PCB and Package-On-Package Developing a Universal Exchange Format for Integrated Circuit Emission Model – Conducted Emissions DPI set-up for ICs with differential inputs
Laurin, Jean-Jacques	Preliminary Study of Automatic Control Gain Loop Subjected to Pulse-modulated Radiofrequency Interference
Lavarda, Andrea	Characterization of the Immunity of Integrated Circuits (ICs) at Wafer Level EMI Improved Chopped Operational Amplifier
Lee, Hyunsuk	Shielding Structures for Through Silicon Via (TSV) to Active Circuit Noise Coupling in 3D IC
Lee, Manho	Shielding Structures for Through Silicon Via (TSV) to Active Circuit Noise Coupling in 3D IC
Levant, Jean-Luc	Developing a Universal Exchange Format for Integrated Circuit Emission Model – Conducted Emissions
Liberali, Valentino	Role of IC Substrate and ESD Protections in Noise Propagation: Design and Modelling of Dedicated Test Chip in 40 nm Technology
Lim, Jae-Deok	RF Interference Evaluation of Flexible Flat Cables for High-Speed Data Transmission in Mobile Devices
Lim, Jaemin	Shielding Structures for Through Silicon Via (TSV) to Active Circuit Noise Coupling in 3D IC TSV-based Current Probing Structure using Magnetic Coupling in 2.5D and 3D IC
Lu, Junwei	Computational Electromagnetics in Shielding Analysis of System in Package Arbitrary Shape Multilayer Interconnects EMC Modelling and Optimization
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Ma, Jingyan	Analysis of On-Chip Digital Noise Coupling Path for Wireless Communication IC Test Chip
Magerl, Marko	Building Interchangeable Black-Box Models of Integrated Circuits for EMC Simulations
Mandic, Tvrtko	DC/DC Converter Dead-Time Variation Analysis and Far-Field Radiation Estimation
Marek, Tomas	Near-Field Injection on a Safe System Basis Chip at Silicon Level
Marier, Nicolas	EMC performance analysis of a Processor/Memory System using PCB and Package-On-Package
Marot, Christian	Developing a Universal Exchange Format for Integrated Circuit Emission Model – Conducted Emissions
Matsushima, Tohlu	Relation between Internal Terminal Voltage and Immunity Behavior of LDO Regulator Circuits
Merlo, Mauro	Role of IC Substrate and ESD Protections in Noise Propagation: Design and Modelling of Dedicated Test Chip in 40 nm Technology
Minixhofer, Rainer	Building Interchangeable Black-Box Models of Integrated Circuits for EMC Simulations
Miropolsky, Sergey	Experimental Validation of the Generalized Accurate Modelling Method for System-Level Bulk Current Injection Setups up to 1 GHz
Miyahara, Hidetoshi	Relation between Internal Terminal Voltage and Immunity Behavior of LDO Regulator Circuits
Mizuki, Takaaki	Fundamental Study on Randomized Processing in Cryptographic IC Using Variable Clock Against Correlation Power Analysis
Muff, Simon	Assessment and improvement of the EMC behaviour for Printed Circuit Boards
Muroga, Sho	Analysis of On-Chip Digital Noise Coupling Path for Wireless Communication IC Test Chip
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Nagata, Makoto	Analysis of On-Chip Digital Noise Coupling Path for Wireless Communication IC Test Chip
Nah, Wansoo	Radiated Electromagnetic Immunity Analysis of VCO Using IC Stripline Method
Nauwelaers, Bart	Radiation Characteristics of Small Loop Antenna above Perforated Finite Image Plane
Negra, Renato	Functional analysis of an integrated communication interface during ESD
Niehof, Jan	Methodology for interference analysis during early design stages of high-performance mixed-signal ICs
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O'Leary, Kieran	Welcome to EMC Compo 2015
Omarouayache, Rachid	Electromagnetic Coupling Circuit Model of a Magnetic Near-Field Probe to a Microstrip Line
Op'T Land, Sjoerd	Direct power injection on functional and non-functional signals of SPI EEPROM memories
Ostermann, Timm	Examination of different adder structures concerning di/dt in a 180nm technology Simulation model based on JEDEC JS-001-2014 for circuit simulation of HBM ESD pulses on IC level
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Pagnoux, Didier	Near-Field Injection on a Safe System Basis Chip at Silicon Level
Pamato, Marco	RF Immunity Investigations of Linear DC Current Regulators
Park, Hark-Byeong	RF Interference Evaluation of Flexible Flat Cables for High-Speed Data Transmission in Mobile Devices
Park, Hyun Ho	RF Interference Evaluation of Flexible Flat Cables for High-Speed Data Transmission in Mobile Devices
Park, Hyunho	Radiated Electromagnetic Immunity Analysis of VCO Using IC Stripline Method
Park, Yong Bae	RF Interference Evaluation of Flexible Flat Cables for High-Speed Data Transmission in Mobile Devices
Payet, Pierre	Electromagnetic Coupling Circuit Model of a Magnetic Near-Field Probe to a Microstrip Line
Perdriau, Richard	Direct power injection on functional and non-functional signals of SPI EEPROM memories
Phillips, John	Simple test board measurements and results
Pissoort, Davy	Improving the Shielding Effectiveness of a Board-Level Shield by Bonding it with the Waveguide-Below-Cutoff Principle
Pouant, Clovis	Large domain validity of MOSFET Microwave Rectification Response
Pues, Hugo	Case Study on the Differences between EMI Resilience of Analog ICs against Continuous Wave, Modulated and Transient Disturbances
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Ramanujan, Abhishek	Developing a Universal Exchange Format for Integrated Circuit Emission Model – Conducted Emissions
Ramdani, Mohamed	Direct power injection on functional and non-functional signals of SPI EEPROM memories
Ramos, Ioav	Thermal-electromagnetic susceptibility behaviors of PWM patterns used in control electronic circuit
Raoult, Jérémy	Preliminary Study of Automatic Control Gain Loop Subjected to Pulse-modulated Radiofrequency Interference Large domain validity of MOSFET Microwave Rectification Response Electromagnetic Coupling Circuit Model of a Magnetic Near-Field Probe to a Microstrip Line
Rauchenecker, Andreas	Examination of different adder structures concerning di/dt in a 180nm technology
Rolland, Eric	Analytical Aproach to study Electromagnetic Emission EME Contributors on DC/DC applications Introducing of multiphase Buck converters in automotive analog designs to reduce EME
Rotigni, Mario	ST Microcontroller pcb and measurement results Role of IC Substrate and ESD Protections in Noise Propagation: Design and Modelling of Dedicated Test Chip in 40 nm Technology
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Saito, Megumi	Fundamental Study on Randomized Processing in Cryptographic IC Using Variable Clock Against Correlation Power Analysis
Sandifort, Quino	Methodology for interference analysis during early design stages of high-performance mixed-signal ICs
Sanghyeok, Park	Analysis of EMI Reduction Methods of DC-DC Buck Converter
Schindler, Alexis	EMC and Switching Loss Improvement for Fast Switching Power Stages by di/dt, dv/dt Optimization with 10ns Variable Current Source Gate Driver
Schoof, Adrien	A Highly-Digitized Automotive CAN Transceiver in 0.14μm High-Voltage SOI CMOS
Schröter, Philipp	Susceptibility to EMI of High Side Current Sensors based on Chopper OpAmps RF Immunity Investigations of Linear DC Current Regulators Smart Power IC Macromodeling for DPI Analysis
Schwartz, Stefan	Smart Power IC Macromodeling for DPI Analysis
Scully, Bob	Maxwell’s Legacy – The Heart and Soul of the EMC Discipline
Sicard, Etienne	EMC performance analysis of a Processor/Memory System using PCB and Package-On-Package Developing a Universal Exchange Format for Integrated Circuit Emission Model – Conducted Emissions EMC modeling of Integrated Circuits using IC-EMC
Sicard, Etienne	Future needs in EMC of ICs - Are you hearing the voice of industry ?
Skytte, Kristoffer	Introduction The power delivery system Demonstration of optimization of the power delivery system on a large design Summary and further discussion
Sone, Hideaki	Fundamental Study on Randomized Processing in Cryptographic IC Using Variable Clock Against Correlation Power Analysis
Song, Eakhwan	RF Interference Evaluation of Flexible Flat Cables for High-Speed Data Transmission in Mobile Devices
Stijnen, Kristof	Case Study on the Differences between EMI Resilience of Analog ICs against Continuous Wave, Modulated and Transient Disturbances
Stockreiter, Christian	Building Interchangeable Black-Box Models of Integrated Circuits for EMC Simulations
Sun, Haiyan	Computational Electromagnetics in Shielding Analysis of System in Package
Sun, Ling	Computational Electromagnetics in Shielding Analysis of System in Package
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Tanaka, Satoshi	Analysis of On-Chip Digital Noise Coupling Path for Wireless Communication IC Test Chip
Tang, Yung-Chi	Time-domain EMI Measurement Methodology
Tomasevic, Veljko	Bandgap Failure Study Due To Parasitic Bipolar Substrate Coupling In Smart Power Mixed ICs
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Ungru, Thomas	Functional analysis of an integrated communication interface during ESD
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van der Wel, Arnoud	A Highly-Digitized Automotive CAN Transceiver in 0.14μm High-Voltage SOI CMOS
Vargas, Fabian	On-Chip Watchdog to Monitor RTOS Activity in MPSoC Exposed to Noisy Environment
Vrignon, Bertrand	Near-Field Injection on a Safe System Basis Chip at Silicon Level
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Wada, Osami	Relation between Internal Terminal Voltage and Immunity Behavior of LDO Regulator Circuits
Wainwright, Nick	The Evolution of Commercial EMC Standards
Walker, Steffen	Functional analysis of an integrated communication interface during ESD
Wicht, Bernhard	EMC and Switching Loss Improvement for Fast Switching Power Stages by di/dt, dv/dt Optimization with 10ns Variable Current Source Gate Driver
Wilkening, Wolfgang	Functional analysis of an integrated communication interface during ESD
Winkler, Gunter	Emission Reduction in Class-D Audio Amplifiers by Optimizing Spread Spectrum Modulation Simulation of Radiated Emission during the Design Phase based on Scattering Parameter Measurement
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Yamaguchi, Masahiro	Analysis of On-Chip Digital Noise Coupling Path for Wireless Communication IC Test Chip
Ye, Ming	Dynamic Multi-Parameter Response Model for SEED Analysis
Yeh, Ting-Wei	Time-domain EMI Measurement Methodology
Yu, Huichun	Dynamic Multi-Parameter Response Model for SEED Analysis
Yuan, Shih-Yi	Time-domain EMI Measurement Methodology
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Zhou, An	EMC performance analysis of a Processor/Memory System using PCB and Package-On-Package
Zhu, Boyuan	Computational Electromagnetics in Shielding Analysis of System in Package Arbitrary Shape Multilayer Interconnects EMC Modelling and Optimization
Zhu, Mengcheng	Arbitrary Shape Multilayer Interconnects EMC Modelling and Optimization

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