Failure-Analysis Method of Soldering Interfaces in Light-Emitting Diode Packages Based on Time-Domain Transient Thermal Response

EasyChair Preprint 4373

Abstract

New soldering-interface failure-analysis method based on the transient thermal of the LED packages are proposed. This method is based on a physical property that the change of the junction temperature, which is monitored by voltage, represents the change of thermal gradient in the LED packages. Fast time-domain algorithm for failure-sensitivity enhancement was developed. And the feasibility of this algorithm was verified using a two-point measurement method during a thermal shock test.

Keyphrases: Solder crack, Transient thermal response, failure analysis, junction temperature

@booklet{EasyChair:4373,
  author    = {Byongjin Ma and Taehee Jung and Sungson Choi and Kwanhun Lee},
  title     = {Failure-Analysis Method of Soldering Interfaces in Light-Emitting Diode Packages Based on Time-Domain Transient Thermal Response},
  howpublished = {EasyChair Preprint 4373},
  year      = {EasyChair, 2020}}