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Author
:
Taehee Jung
Publications
Failure-Analysis Method of Soldering Interfaces in Light-Emitting Diode Packages Based on Time-Domain Transient Thermal Response
Byongjin Ma
,
Taehee Jung
,
Sungson Choi
and
Kwanhun Lee
EasyChair Preprint 4373
Keyphrases
failure analysis
,
junction temperature
,
Solder crack
,
Transient thermal response
.
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