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Author:Taehee Jung

Publications
Failure-Analysis Method of Soldering Interfaces in Light-Emitting Diode Packages Based on Time-Domain Transient Thermal Response
Byongjin Ma, Taehee Jung, Sungson Choi and Kwanhun Lee
EasyChair Preprint 4373

Keyphrases

failure analysis, junction temperature, Solder crack, Transient thermal response.

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