ESREF 2016: 27TH EUROPEAN SYMPOSIUM ON RELIABILITY OF ELECTRON DEVICES, FAILURE PHYSICS AND ANALYSIS

A
A., Hanß	Transient thermal analysis for accelerated reliability testing of LEDs
Aal, Andreas	Reliability Management – the central Enabler for Advanced Technologies in Automotive (invited)
Ahn, Min Ju	Negative bias illumination stress instability in amorphous InGaZnO thin film transistors with transparent source and drain Device instability of amorphous InGaZnO thin film transistors with transparent source and drain
Alatise, Olayiwola	Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules
Aliyu, Attahir Murtala	Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules
Allard, Bruno	On the need for a new ESD verification methodology to improve the reliability of ICs in advanced 28nm UTBB FDSOI technology
Altes, Andreas	Scanning Microwave Microscopy for Electronic Device Analysis on Nanometre Scale
Altmann, Frank	Novel failure mode of chip corrosion at automotive HALL sensor devices under multiple stress conditions Correlation of gate leakage and local strain distribution in GaN/AlGaN HEMT structures Reliability Evaluation of Si-Dies due to Assembly Issues Detection and Analysis of Stress-induced Voiding in Al-Power lines by Acoustic GHz-Microscopy Magnetic Field and Current Density Imaging using off-line Lock-In Analysis
Ambat, Rajan	Effect of PCBA surface morphology and chemistry on water layer formation under humid conditions and corrosion reliability
Anderson, Harold Anderson	Corrosion Mechanisms of Cu Bond Wires on AlSi Pads
Anderson, Tom Anderson	Corrosion Mechanisms of Cu Bond Wires on AlSi Pads
Andersson, Caroline	Detection of cracks in multilayer ceramic capacitors by X-ray imaging
Ang, Ghim Boon	Electrical analysis on implantation-related defect by nanoprobing methodology
Aoki, Syoho	Power cycle reliability of Cu nanoparticle joint dependent on a mismatch of coefficients of thermal expansion
Appenroth, Tim	Investigating Stress Measurement Capabilities of GHz Scanning Acoustic Microscopy for 3D Failure Analysis
Arabi, Faical	Power electronic assemblies: thermo-mechanical degradations of gold-tin solder for attaching devices
Armagnat, Paul	Evolution of navigation and simulation tools in failure analysis
Arulkumaran, Subramaniam	Role of Two-Dimensional Electron Gas (2DEG) in AlGaN/GaN High Electron Mobility Transistor (HEMT) ON-State Degradation
Auersperg, Juergen	Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
Auerswald, Ellen	Fast and Trusted Intrinsic Stress Measurement to Facilitate Improved Reliability Assessments
Autran, Jean-Luc	Natural Radiation Events in CCD Imagers at Ground Level
Auvray, Etienne	Evolution of navigation and simulation tools in failure analysis
Azimi, Sarah	On the Prediction of Radiation-Induced SETs in Flash-based FPGAs
Aziza, Hassen	Impact of Resistive Paths on NVM Array Reliability: Application to Flash & ReRAM Memories
Aziza, Hassen	Resistive RAM Variability Monitoring using a Ring Oscillator based Test Chip
B
Bae, Min Soo	Instability of oxide thin film transistor under electrical-mechanical hybrid stress for foldable display
Bae, Soohyun	Evaluation of Potential-Induced Degradation in Crystalline Si Solar Cells using Na-Fault Injection
Bafleur, Marise	Impact on Non-linear Capacitances on Transient Waveforms during System Level ESD Stress
Baghdadi, Issam	Chemical rate phenomenon approach applied to Lithium battery capacity fade estimation
Bahat Treidel, Eldad	Temperature Dependent Dynamic ON State Resistance in GaN on Si Based Normally OFF HFETs
Bahman, Amir Sajjad	Mission-profile-based stress analysis of bond-wires in SiC power modules
Banu, Viorel	Power Cycling Analysis Method for High Voltage SiC Diodes
Barataud, Denis	Continuous Time-Domain RF waveforms monitoring under overdrive stress condition of AlGaN/GaN HEMTs
Barrientos, Denise Barrientos	Corrosion Mechanisms of Cu Bond Wires on AlSi Pads
Bascuil, Guillaume	Single Event Transient Acquisition And Mapping For Space Device Characterization
Bayerer, Reinhold	Topologies for inverter like operation of power cycling tests
Beckmeier, D.	Fast Wafer Level Reliability Monitoring as a tool to achieve automotive quality for a wafer process
Beckmeier, Daniel	Plasma Process Induced Damage Detection by Fast Wafer Level Reliability Monitoring for Automotive Applications
Belaid, Mohamed Ali	Evolution study of the ElectroMagnetic Interference for RF LDMOS in series chopper application after thermal accelerated tests
Bellemo, Laura	200V FRED diode with superior ESD capability
Benkouider, A.	Planar FIB Milling of Copper by using the Novel Rocking Stage Technology
Benvegnu, Agostino	Continuous Time-Domain RF waveforms monitoring under overdrive stress condition of AlGaN/GaN HEMTs
Bergonzo, Philippe	Dielectric charging phenomena in diamond films used in RF MEMS capacitive switches: The effect of film thickness
Berthier, Remy	FIB and P-FIB assisted sample preparation for in-situ TEM characterization
Besendörfer, Sven	Structural disturbances in GaN HEMT layers as source of leakage current, influencing device performance and reliability
Bettiati, Mauro	Catastrophic optical damage of high power InGaAs/AlGaAs laser diodes
Bhojani, Riteshkumar	Internal processes in power semiconductors at virtual junction temperature measurement
Binczak, Stéphane	Automatic process for Time-Frequency scan of VLSI
Birmpiliotis, Dimitrios	An in depth analysis of pull-up capacitance-voltage characteristic for dielectric charging assessment of MEMS capacitive switches
Blaabjerg, Frede	Power Cycling Test and Failure Analysis of Molded Intelligent Power IGBT Module under Different Temperature Swing Durations Mission-profile-based stress analysis of bond-wires in SiC power modules
Blanck, Hervé	Correlation of gate leakage and local strain distribution in GaN/AlGaN HEMT structures
Boche, Karl	Versatile probers for micro and nanoprobing
Bolowski, Daniel	Reliability aspects of copper metallization and interconnect technology for power devices (invited)
Boscaro, Anthony	Automatic process for Time-Frequency scan of VLSI
Bosman, Michel	Conductive filament formation at grain boundary locations in polycrystalline HfO2 based MIM stacks- Computational and Physical Insight
Boychenko, Dmitry	The radiation test based assessment of process quality and reliability for conventional 65-nm CMOS technology
Brand, Sebastian	Investigating Stress Measurement Capabilities of GHz Scanning Acoustic Microscopy for 3D Failure Analysis Detection and Analysis of Stress-induced Voiding in Al-Power lines by Acoustic GHz-Microscopy Magnetic Field and Current Density Imaging using off-line Lock-In Analysis
Bravaix, Alain	Potentiality of Healing Techniques in Hot-Carrier Damaged 28nm FDSOI CMOS nodes
Breglio, Giovanni	200V FRED diode with superior ESD capability
Briat, Olivier	Chemical rate phenomenon approach applied to Lithium battery capacity fade estimation
Brincker, Mads	Mechanisms of metallization degradation in high power diodes
Broas, Mikael	Correlation of gate leakage and local strain distribution in GaN/AlGaN HEMT structures
Bruegel, Michael	Evolution of navigation and simulation tools in failure analysis
Brunner, Roland	Automatized Failure Analysis of Tungsten Coated TSVs via Scanning Acoustic Microscopy
Brönnimann, R.	Safe cell, safe battery? Battery fire investigations using FMEA, FTA and practical experiments
Buffolo, Matteo	Experimental observation of TDDB-like behavior in reverse-biased green InGaN LEDs
Burchard, Bernd	Reliability Evaluation of Si-Dies due to Assembly Issues
Burges, Simon	Solutions for semiconductor failure analysis with SEM
Burgess, Simon	Elemental characterisation of 20nm structures in devices using new SEM-EDS technology
Buttay, Cyril	Avalanche Robustness of SiC Schottky Diode
Butzen, Paulo	Reliability analysis of hybrid Spin Transfer Torque Magnetic Tunnel Junction/CMOS Majority Voters
Böckhorst, Stephan	Reliability of automotive LED systems
C
Cacho, Florian	Potentiality of Healing Techniques in Hot-Carrier Damaged 28nm FDSOI CMOS nodes
Cai, Hao	Efficient reliability evaluation for combinational circuits A process-variation-resilient methodology of circuit design by using asymmetrical forward body bias in 28nm FDSOI
Cai, Miao	Effects of stress-loading test methods on the degradation of light-emitting diode modules
Caignet, Fabrice	Impact on Non-linear Capacitances on Transient Waveforms during System Level ESD Stress
Calienes Bartra, Walter Enrique	FDSOI and Bulk CMOS SRAM Cells Resilience to Radiation Effects
Canet, Pierre	Impact of Resistive Paths on NVM Array Reliability: Application to Flash & ReRAM Memories
Carta, Rossano	200V FRED diode with superior ESD capability
Cason, Morgan	Evolution of navigation and simulation tools in failure analysis
Castellazzi, Alberto	Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules Body diode reliability investigation of SiC power MOSFETs Thermal design optimization of novel modular power converter assembly enabling higher performance, reliability and availability
Catelani, Marcantonio	Component Reliability Importance assessment on complex systems using Credible Improvement Potential
Chan, Sung-Il	Evaluation of Potential-Induced Degradation in Crystalline Si Solar Cells using Na-Fault Injection
Chang, George	Corrosion Mechanisms of Cu Bond Wires on AlSi Pads
Chang, Shih-Hsin	Fault isolation at P/N junction by nanoprober Introduction of MA-tek total solution FA
Chang, Te-Fu	Fault isolation at P/N junction by nanoprober
Chang, Yao-Jen	Asymmetric Low Temperature Bonding Structure Using Ultra-Thin Buffer Layer Technique for 3D Integration
Chaujar, Rishu	Investigation of Temperature Variations on Analog/RF Linearity Performance of Stacked Gate GEWE-SiNW MOSFET for Improved Device Reliability
Chen, Changqing	Electrical analysis on implantation-related defect by nanoprobing methodology Cross-sectional Nanoprobing Fault Isolation Technique on Submicron Devices Application of Fast Laser Deprocessing Techniques on Large Cross-sectional View Area Sample with FIB-SEM Dual Beam System
Chen, Kuan-Neng	Asymmetric Low Temperature Bonding Structure Using Ultra-Thin Buffer Layer Technique for 3D Integration
Chen, M.	Quantitative model for post-program instabilities in filamentary RRAM
Chen, Weinan	Internal processes in power semiconductors at virtual junction temperature measurement
Chen, Xianping	Effects of stress-loading test methods on the degradation of light-emitting diode modules
Chen, Xun	Numerical Investigation of the Effects of Phosphorus on the Mechanical Responses of [1 1 0]-oriented Silicon Nano-wires
Chiang, Chih-Feng	Fault isolation at P/N junction by nanoprober
Chien, Wei-Ting	Early Detection and Prediction of HKMG SRAM HTOL Performance by WLR PBTI Tests
Chien, Weiting	Influence of I/O Oxide Process on the NBTI Performance of 28nm HfO2-Based HKMG p-MOSFETs Early Detection and Prediction of HKMG SRAM HTOL Performance by WLR PBTI Tests
Chikuba, Katsuhiro	Novel heatsink for power semiconductor module using high thermal conductive graphite
Chinone, Norimich	Local deep level transient spectroscopy using super-higher-order scanning nonlinear dielectric microscopy
Cho, Won Ju	Negative bias illumination stress instability in amorphous InGaZnO thin film transistors with transparent source and drain Device instability of amorphous InGaZnO thin film transistors with transparent source and drain
Cho, Yasuo	Local deep level transient spectroscopy using super-higher-order scanning nonlinear dielectric microscopy
Choi, Jin Hyung	Nanowire width dependence of data retention and endurance characteristics in nanowire SONOS flash memory
Choi, Ui-Min	Power Cycling Test and Failure Analysis of Molded Intelligent Power IGBT Module under Different Temperature Swing Durations
Chu, Chih-Hsun	Fault isolation at P/N junction by nanoprober
Chua, Chung Tah	Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop
Ciani, Lorenzo	Component Reliability Importance assessment on complex systems using Credible Improvement Potential
Ciliox, Alexander Ciliox	Reliability aspects of copper metallization and interconnect technology for power devices (invited)
Clima, S.	Quantitative model for post-program instabilities in filamentary RRAM
Collet, Christian	Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
Courau, Lionel	On the need for a new ESD verification methodology to improve the reliability of ICs in advanced 28nm UTBB FDSOI technology
Cova, Paolo	Thermal design optimization of novel modular power converter assembly enabling higher performance, reliability and availability
Curutchet, Arnaud	Reliability assessment of ultra-short gate length AlGaN/GaN HEMTs on Si substrate by on-state step stress
Czerny, Bernhard	Fatigue testing method for fine bond wires in an LQFP Package
Czurratis, Peter	Automatized Failure Analysis of Tungsten Coated TSVs via Scanning Acoustic Microscopy New technology approaches in scanning acoustic microscopy for advanced failure analysis
D
Dashdondog, Erdenebaatar	Failure Rate Calculation Method for High Power Devices in Space Applications at Low Earth Orbit
Davydov, Georgii	The radiation test based assessment of process quality and reliability for conventional 65-nm CMOS technology
Dchar, Ilyas	Avalanche Robustness of SiC Schottky Diode
De Jaeger, Jean-Claude	Reliability assessment of ultra-short gate length AlGaN/GaN HEMTs on Si substrate by on-state step stress
De Santi, Carlo	Experimental observation of TDDB-like behavior in reverse-biased green InGaN LEDs Degradation of InGaN-based LEDs related to charge diffusion and build-up Degradation of InGaN laser diodes caused by temperature- and current-driven diffusion processes
De Santi, Carlo	Field- and time dependent degradation of GaN HEMTs
De Wolf, Ingrid	Copper Through Silicon Vias Studied by Photoelastic Scanning Infrared Microscopy Investigating Stress Measurement Capabilities of GHz Scanning Acoustic Microscopy for 3D Failure Analysis
Dean, Thierry	Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
Decoutere, Stefaan	Study of the stability of e-mode GaN HEMTs with p-GaN gate based on combined DC and optical analysis
Defrance, Nicolas	Reliability assessment of ultra-short gate length AlGaN/GaN HEMTs on Si substrate by on-state step stress
Defregger, Stefan	Automatized Failure Analysis of Tungsten Coated TSVs via Scanning Acoustic Microscopy
Degraeve, Robin	Quantitative model for post-program instabilities in filamentary RRAM
Delage, Sylvain	GaN devices: millimeter wave applications challenges (invited)
Deletage, Jean-Yves	Effects of salt spray test on lead-free solder alloy Chemical rate phenomenon approach applied to Lithium battery capacity fade estimation
Deletage, Jean-Yves	Power electronic assemblies: thermo-mechanical degradations of gold-tin solder for attaching devices
Delmonte, Nicola	Thermal design optimization of novel modular power converter assembly enabling higher performance, reliability and availability
Derix, R.	Transient thermal analysis for accelerated reliability testing of LEDs
Dherbecourt, Pascal	Gate oxide degradation of SiC MOSFET under short-circuit aging tests
Di Santo, Natale	200V FRED diode with superior ESD capability
Diaz Reigosa, Paula	Comparison of Thermal Runaway Limits under Different Test Conditions Based on a 4.5 kV IGBT
Divay, Alexis	Effects of drain quiescent voltage on the ageing of AlGaN/GaN HEMT devices in pulsed RF mode
Donnet, David	Helios G4: Enabling breakthrough failure analysis for 7 nm design nodes Innovative TEM sample Preparation on Helios G4 platform
Dua, Christian	GaN devices: millimeter wave applications challenges (invited)
Duangsang, Manita	Improved Etching Recipe for Exposing Cu Wire allowing Reliable Stitch Pull
Duperrier, Cédric	Effects of drain quiescent voltage on the ageing of AlGaN/GaN HEMT devices in pulsed RF mode
E
El Baradai, Nabil	200V FRED diode with superior ESD capability
Elger, Gordon	Transient thermal analysis for accelerated reliability testing of LEDs
Erstling, Marco	Reliability Evaluation of Donut-Tungsten-Via as an Element of the Highly Robust Metallization
Escudié, Fabien	Impact on Non-linear Capacitances on Transient Waveforms during System Level ESD Stress
Estrada, Raleigh	3D Inspection Solutions for 3D DEVICES
F
Fantini, A.	Quantitative model for post-program instabilities in filamentary RRAM
Fayyaz, Asad	Body diode reliability investigation of SiC power MOSFETs
Federspiel, Xavier	Performance vs. Reliability Adaptive Body Bias Scheme in 28nm & 14nm UTBB FDSOI nodes Potentiality of Healing Techniques in Hot-Carrier Damaged 28nm FDSOI CMOS nodes
Felber, Henry	Experimental observation of TDDB-like behavior in reverse-biased green InGaN LEDs
Feng, Hua	Cross-sectional Nanoprobing Fault Isolation Technique on Submicron Devices Application of Fast Laser Deprocessing Techniques on Large Cross-sectional View Area Sample with FIB-SEM Dual Beam System
Fer, Mathieu	On the need for a new ESD verification methodology to improve the reliability of ICs in advanced 28nm UTBB FDSOI technology
Foo, Siew Chuen	Role of Two-Dimensional Electron Gas (2DEG) in AlGaN/GaN High Electron Mobility Transistor (HEMT) ON-State Degradation
Fouquet, François	Gate oxide degradation of SiC MOSFET under short-circuit aging tests
Franke, Jörg	Internal processes in power semiconductors at virtual junction temperature measurement
Frey, Lothar	Structural disturbances in GaN HEMT layers as source of leakage current, influencing device performance and reliability
Friedrich, Jochen	Structural disturbances in GaN HEMT layers as source of leakage current, influencing device performance and reliability
Frieß, Erik	Static logic state analysis by TLS on powered logic circuits: Three case studies for suspected stuck-at failure modes
Frémont, Hélène	Effects of salt spray test on lead-free solder alloy
Furumai, Masaki	Lifetime Estimation of SiC MOSFETs under High Temperature Reverse Bias Test
G
Gachet, David	High Resolution Cathodoluminescence for Defect Inspection and Failure Analysis
Gadhiya, Ghanshyam	Fast and Trusted Intrinsic Stress Measurement to Facilitate Improved Reliability Assessments
Galy, Philippe	On the need for a new ESD verification methodology to improve the reliability of ICs in advanced 28nm UTBB FDSOI technology
Gamarra, Piero	GaN devices: millimeter wave applications challenges (invited)
Gan, Chee Lip	Role of Two-Dimensional Electron Gas (2DEG) in AlGaN/GaN High Electron Mobility Transistor (HEMT) ON-State Degradation Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop
Ganesh, Ulrike	Laser Voltage Probing – its value and the race against scaling (invited)
Gao, Chuang	Electromagnetic susceptibility characterization of double SOI device
Gao, Jiantou	Electromagnetic susceptibility characterization of double SOI device
Gautier, Cyrille	Experimental study of the short-circuit robustness of 600V E-mode GaN transistors
Glueck, Joachim	Application of high frequency scanning acoustic microscopy for the failure analysis and reliability assessment of MEMS sensors (invited)
Glück, J.	Static logic state analysis by TLS on powered logic circuits: Three case studies for suspected stuck-at failure modes
Godignon, Philippe	Power Cycling Analysis Method for High Voltage SiC Diodes
Goetz, Kay	Application of high frequency scanning acoustic microscopy for the failure analysis and reliability assessment of MEMS sensors (invited)
Goetze, Bernhard	3D Inspection Solutions for 3D DEVICES
Gorine, G.	Quantitative model for post-program instabilities in filamentary RRAM
Gottschalk, Volkmar	Reliability Evaluation of Si-Dies due to Assembly Issues
Goux, L.	Quantitative model for post-program instabilities in filamentary RRAM
Govoreanu, B.	Quantitative model for post-program instabilities in filamentary RRAM
Graff, Andreas	Correlation of gate leakage and local strain distribution in GaN/AlGaN HEMT structures
Gruber, Jürgen	Failure Analysis and Failure Prevention on Ceramic Capacitors
Grübl, Wolfgang	Requirements for Reliability and new Solutions for Transmission Control Units
Grünwald, Eva	Automatized Failure Analysis of Tungsten Coated TSVs via Scanning Acoustic Microscopy
Gu, Allen	3D Inspection Solutions for 3D DEVICES
Gupta, Neha	Investigation of Temperature Variations on Analog/RF Linearity Performance of Stacked Gate GEWE-SiNW MOSFET for Improved Device Reliability
Gustin, Wolfgang	Degradation and Recovery of variability due to BTI
Guth, Karsten	Reliability aspects of copper metallization and interconnect technology for power devices (invited)
Guédon-Gracia, Alexandrine	Effects of salt spray test on lead-free solder alloy
Gyan, Philippe	Chemical rate phenomenon approach applied to Lithium battery capacity fade estimation
H
Ha, Seok Geun	Charging–discharging characteristics of a wound aluminum polymer capacitor
Hahn, Daniel	Requirements for the Application of ECUs in E-mobility Originally Qualified for Gasoline Cars
Hammer, Renè	Automatized Failure Analysis of Tungsten Coated TSVs via Scanning Acoustic Microscopy
Hamon, Benoit	LED Degradation: from component to system (invited)
Harada, Shinsuke	Local deep level transient spectroscopy using super-higher-order scanning nonlinear dielectric microscopy
Hartner, Walter	77Ghz Automotive RADAR in eWLB package: from consumer to automotive packaging
Hasegawa, Kazunori	Temperature rise measurement for power-loss comparison of an aluminium electrolytic capacitor between sinusoidal and square current injections
Haubner, Gerhard	77Ghz Automotive RADAR in eWLB package: from consumer to automotive packaging
He, Ran	Application of Fast Laser Deprocessing Techniques on Large Cross-sectional View Area Sample with FIB-SEM Dual Beam System
Heikkinen, Hannele	Optimization of contact metallizations for reliable wafer level Au-Sn bonds
Hein, Verena	Reliability Evaluation of Donut-Tungsten-Via as an Element of the Highly Robust Metallization
Held, Marcel	Safe cell, safe battery? Battery fire investigations using FMEA, FTA and practical experiments
Helfmeier, Clemens	Static logic state analysis by TLS on powered logic circuits: Three case studies for suspected stuck-at failure modes
Hellenthal, Berthold	Automotive Electronics Roadmap and the Wish List on Electronics
Herlitschka, Sabine	Power and industry electronics – future perspectives for Europe
Herms, Martin	Copper Through Silicon Vias Studied by Photoelastic Scanning Infrared Microscopy
Hernes, Magnar	Improving the short circuit ruggedness of IGBTs
Herold, Christian	Topologies for inverter like operation of power cycling tests Internal processes in power semiconductors at virtual junction temperature measurement
Heuck, Nicolas	Reliability aspects of copper metallization and interconnect technology for power devices (invited)
Hille, Frank	Reliability aspects of copper metallization and interconnect technology for power devices (invited)
Hilt, Oliver	Temperature Dependent Dynamic ON State Resistance in GaN on Si Based Normally OFF HFETs
Hiyoshi, Toru	Lifetime Estimation of SiC MOSFETs under High Temperature Reverse Bias Test
Hommel, Sören	Scanning Microwave Microscopy for Electronic Device Analysis on Nanometre Scale
Horstmann, Manfred	22FDX and it's application in Energy Efficient Designs, Automotive and IoT - from foundry perspective
Hrnčíř, T.	Planar FIB Milling of Copper by using the Novel Rocking Stage Technology
Hu, Weiwei	A novel correlative model of failure mechanisms for evaluating MEMS devices reliability
Huang, Jianlin	Effects of stress-loading test methods on the degradation of light-emitting diode modules
Huang, Jin	Ga contamination in silicon by focused ion beam milling: Atom Probe Tomography and simulation with dynamic model
Huang, Yamin	Application of Fast Laser Deprocessing Techniques on Large Cross-sectional View Area Sample with FIB-SEM Dual Beam System
Huard, Vincent	Performance vs. Reliability Adaptive Body Bias Scheme in 28nm & 14nm UTBB FDSOI nodes Potentiality of Healing Techniques in Hot-Carrier Damaged 28nm FDSOI CMOS nodes
Hyung, Jae Phil	Charging–discharging characteristics of a wound aluminum polymer capacitor
Häberlen, Oliver	Scanning Microwave Microscopy for Electronic Device Analysis on Nanometre Scale
Höche, Thomas	Laser based sample preparation for advanced packaging applications
I
I Made, Riko	Role of Two-Dimensional Electron Gas (2DEG) in AlGaN/GaN High Electron Mobility Transistor (HEMT) ON-State Degradation
Iannuzzo, Francesco	Power Cycling Test and Failure Analysis of Molded Intelligent Power IGBT Module under Different Temperature Swing Durations Mission-profile-based stress analysis of bond-wires in SiC power modules Comparison of Thermal Runaway Limits under Different Test Conditions Based on a 4.5 kV IGBT
Infante, Fulvio	Use of Lock-in Thermography and Magnetic Current Imaging as complemetary techniques for localization of shorts in GaN transistors Single Event Transient Acquisition And Mapping For Space Device Characterization
Ingman, Jonny	Detection of cracks in multilayer ceramic capacitors by X-ray imaging
Irace, Andrea	200V FRED diode with superior ESD capability
Ishizaki, Toshitaka	Power cycle reliability of Cu nanoparticle joint dependent on a mismatch of coefficients of thermal expansion
Izumi, Masato	Numerical study of destruction phenomena for punch-through IGBTs under unclamped inductive switching
J
Jacob, Pit	Failure mechanisms and precautions in plug connectors and relays Early life field failures in modern automotive electronics – An overview, root causes and precautions
Jacquet, Jean-Claude	GaN devices: millimeter wave applications challenges (invited)
Jacquir, Sabir	Automatic process for Time-Frequency scan of VLSI
Jaepel, Tom	Curtaining-Free Top-Down TEM Lamella Preparation from a Cutting Edge Integrated Circuit
Jammy, Raj	3D Inspection Solutions for 3D DEVICES
Jang, Hyun Jun	Impact of work function of the silicon bottom-gates on electrical instability in InGaZnO thin film transistors
Jatzkowski, Jörg	Detection and Analysis of Stress-induced Voiding in Al-Power lines by Acoustic GHz-Microscopy
Jayampathi Gajanayakeb, Chandana	Online computation of IGBT on-state resistance for off-shelf three-phase two-level power converter systems
Jeong, Jae-Seong	Effect of H/Ar treatment on ZnO:B transparent conducting oxide for flexible a-Si:H/μc-Si:H photovoltaic modules under damp heat stress
Jeong, Ui Hyo	Charging–discharging characteristics of a wound aluminum polymer capacitor
Jiang, Yu	Fatigue Life Prediction Model for Accelerated Testing of Electronic Components under Non-Gaussian Random Vibration Excitations Numerical Investigation of the Effects of Phosphorus on the Mechanical Responses of [1 1 0]-oriented Silicon Nano-wires
Jimenez, Juan	Catastrophic optical damage of high power InGaAs/AlGaAs laser diodes
Jiruše, J.	Planar FIB Milling of Copper by using the Novel Rocking Stage Technology
Jothi, Maheshwaran	Evolution of navigation and simulation tools in failure analysis
Jourczak, M.	Quantitative model for post-program instabilities in filamentary RRAM
Jung, Helmut	Correlation of gate leakage and local strain distribution in GaN/AlGaN HEMT structures
Jørgensen, Søren	Power Cycling Test and Failure Analysis of Molded Intelligent Power IGBT Module under Different Temperature Swing Durations
K
Kalya, Shubhakar	Analysis of Quantum Conductance, Read Disturb and Switching Statistics in HfO2 RRAM Using Conductive AFM Conductive filament formation at grain boundary locations in polycrystalline HfO2 based MIM stacks- Computational and Physical Insight
Kandasamy, Karthik	Online computation of IGBT on-state resistance for off-shelf three-phase two-level power converter systems
Kanert, Werner	10 Years Robustness Validation
Kang, Bongkoo	Channel width dependence of AC stress on bulk nMOSFETs
Kang, Byungjun	Evaluation of Potential-Induced Degradation in Crystalline Si Solar Cells using Na-Fault Injection
Kang, Yongha	Channel width dependence of AC stress on bulk nMOSFETs
Karbowski, U.	Transient thermal analysis for accelerated reliability testing of LEDs
Kemmler, Matthias	Fast, Reliable, Intuitive TEM Sample Preparation using a Load-Lockable Platform Combined with Smart Control Software
Kempers, Thijs	3D LIT calibration tool development
Kerber, Andreas	Device to circuit reliability correlations for Metal Gate / High-k transistors in scaled CMOS technologies (invited)
Kessarinskiy, Leonid	The radiation test based assessment of process quality and reliability for conventional 65-nm CMOS technology
Khaled, Ahmad	Investigating Stress Measurement Capabilities of GHz Scanning Acoustic Microscopy for 3D Failure Analysis
Khatibi, Golta	Fatigue testing method for fine bond wires in an LQFP Package Delamination of polyimide/Cu films under mixed mode loading
Killat, Nicole	Scanning Microwave Microscopy for Electronic Device Analysis on Nanometre Scale
Kim, Donghwan	Evaluation of Potential-Induced Degradation in Crystalline Si Solar Cells using Na-Fault Injection
Kim, Gang-Jun	Channel width dependence of AC stress on bulk nMOSFETs
Kim, Jae Won	Negative bias illumination stress instability in amorphous InGaZnO thin film transistors with transparent source and drain
Kim, Junhee	Evaluation of Potential-Induced Degradation in Crystalline Si Solar Cells using Na-Fault Injection
Kim, Sang Min	Device instability of amorphous InGaZnO thin film transistors with transparent source and drain
King Jet, Tseng	Online computation of IGBT on-state resistance for off-shelf three-phase two-level power converter systems
Kino, Takuma	Power cycle reliability of Cu nanoparticle joint dependent on a mismatch of coefficients of thermal expansion
Kiviniemi, Mika	Detection of cracks in multilayer ceramic capacitors by X-ray imaging
Klein, Jacques-Olivier	A process-variation-resilient methodology of circuit design by using asymmetrical forward body bias in 28nm FDSOI
Kleindiek, Stephan	Current Imaging, EBIC/EBAC, and Electrical Probing combined for fast and reliable in situ Electrical Fault Isolation Fast, Reliable, Intuitive TEM Sample Preparation using a Load-Lockable Platform Combined with Smart Control Software
Ko, Min Ji	Charging–discharging characteristics of a wound aluminum polymer capacitor
Koch, Matthias	Automatized Failure Analysis of Tungsten Coated TSVs via Scanning Acoustic Microscopy
Kocman, M.	Planar FIB Milling of Copper by using the Novel Rocking Stage Technology
Koga, Masahiro	Micro PCB Rogowski coil for current monitoring and protection of high voltage power modules
Konno, Atsushi	Fault Isolation at 5um Resolution using Electro-Optical TDR with 6ps Rise Time
Kosugi, Ryoji	Local deep level transient spectroscopy using super-higher-order scanning nonlinear dielectric microscopy
Koutsoureli, Matroni	Dielectric charging phenomena in diamond films used in RF MEMS capacitive switches: The effect of film thickness An in depth analysis of pull-up capacitance-voltage characteristic for dielectric charging assessment of MEMS capacitive switches
Kozuma, Kentaro	Temperature rise measurement for power-loss comparison of an aluminium electrolytic capacitor between sinusoidal and square current injections
Kraft, Jochen	Automatized Failure Analysis of Tungsten Coated TSVs via Scanning Acoustic Microscopy
Krause, Michael	Laser based sample preparation for advanced packaging applications
Kristensen, Peter Kjær	Mechanisms of metallization degradation in high power diodes
Krueger, Michael	Requirements for the Application of ECUs in E-mobility Originally Qualified for Gasoline Cars
Kumar, Ajay	Investigation of Temperature Variations on Analog/RF Linearity Performance of Stacked Gate GEWE-SiNW MOSFET for Improved Device Reliability
Kuno, Atsuki	Power cycle reliability of Cu nanoparticle joint dependent on a mismatch of coefficients of thermal expansion
Kuo, Pau-Sheng	Fault isolation at P/N junction by nanoprober
Kögel, Michael	Investigating Stress Measurement Capabilities of GHz Scanning Acoustic Microscopy for 3D Failure Analysis Detection and Analysis of Stress-induced Voiding in Al-Power lines by Acoustic GHz-Microscopy Magnetic Field and Current Density Imaging using off-line Lock-In Analysis
L
La Grassa, Marco	Degradation of InGaN-based LEDs related to charge diffusion and build-up
Labat, Nathalie	Reliability assessment of ultra-short gate length AlGaN/GaN HEMTs on Si substrate by on-state step stress
Labrousse, Denis	Experimental study of the short-circuit robustness of 600V E-mode GaN transistors
Lakhdhar, Hadhemi	Reliability assessment of ultra-short gate length AlGaN/GaN HEMTs on Si substrate by on-state step stress
Lam, Jeffrey	Application of Laser Deprocessing Technique in PFA on Chemical Over-etched on Bond-pad Issue
Landel, Matthieu	Experimental study of the short-circuit robustness of 600V E-mode GaN transistors
Landin, Trevan	Innovative TEM sample Preparation on Helios G4 platform
Lang, Klaus-Dieter	Requirements for the Application of ECUs in E-mobility Originally Qualified for Gasoline Cars
Langer, Eckhard	Micro mechanical robustness tests of 28nm BEOL layer stack
Langer, Tim	Reliability of inverters and DC Link capacitors for e-mobility
Laruelle, Francois	Catastrophic optical damage of high power InGaAs/AlGaAs laser diodes
Latry, Olivier	Gate oxide degradation of SiC MOSFET under short-circuit aging tests Effects of drain quiescent voltage on the ageing of AlGaN/GaN HEMT devices in pulsed RF mode
Laurent, Sylvain	Continuous Time-Domain RF waveforms monitoring under overdrive stress condition of AlGaN/GaN HEMTs
Lechner, Lorenz	3D Inspection Solutions for 3D DEVICES
Lederer, Martin	Delamination of polyimide/Cu films under mixed mode loading
Lee, Dong Hyuk	Charging–discharging characteristics of a wound aluminum polymer capacitor
Lee, Hae-Seok	Evaluation of Potential-Induced Degradation in Crystalline Si Solar Cells using Na-Fault Injection
Lee, Jong Hoon	Negative bias illumination stress instability in amorphous InGaZnO thin film transistors with transparent source and drain
Lee, Kyung Dong	Evaluation of Potential-Induced Degradation in Crystalline Si Solar Cells using Na-Fault Injection
Lee, Nam-Hyun	Channel width dependence of AC stress on bulk nMOSFETs
Lee, Sang Myung	Crack-guided effect on dynamic mechanical stress for foldable low temperature polycrystalline silicon thin film transistors
Lefebvre, Stephane	Experimental study of the short-circuit robustness of 600V E-mode GaN transistors
Leitner, Klaus	End of life and acceleration modelling for power diodes under High Temperature Reverse Bias stress
Lesceq, Marie	Reliability assessment of ultra-short gate length AlGaN/GaN HEMTs on Si substrate by on-state step stress
Li, Binhong	Electromagnetic susceptibility characterization of double SOI device Microcontroller susceptibility variations to EFT burst during accelerated aging
Li, Chuangwei	Microcontroller susceptibility variations to EFT burst during accelerated aging
Li, Xiaobing	Elemental characterisation of 20nm structures in devices using new SEM-EDS technology
Li, Yaqiu	A novel correlative model of failure mechanisms for evaluating MEMS devices reliability
Liang, Hao-Wen	Asymmetric Low Temperature Bonding Structure Using Ultra-Thin Buffer Layer Technique for 3D Integration
Lim, Hong Woo	Charging–discharging characteristics of a wound aluminum polymer capacitor
Limbecker, Pascal	Current Imaging, EBIC/EBAC, and Electrical Probing combined for fast and reliable in situ Electrical Fault Isolation
Lin, Rung-Jiun	Fault isolation at P/N junction by nanoprober
Lindner, Achim	Novel failure mode of chip corrosion at automotive HALL sensor devices under multiple stress conditions
Linten, D.	Quantitative model for post-program instabilities in filamentary RRAM
Liu, Bin	Numerical Investigation of the Effects of Phosphorus on the Mechanical Responses of [1 1 0]-oriented Silicon Nano-wires
Liu, Binghai	Application of Fast Laser Deprocessing Techniques on Large Cross-sectional View Area Sample with FIB-SEM Dual Beam System
Liu, Datong	FESeR: a data-driven framework to enhance sensor reliability for the system condition monitoring
Liu, E.	Transient thermal analysis for accelerated reliability testing of LEDs
Liu, Evan	Improved Etching Recipe for Exposing Cu Wire allowing Reliable Stitch Pull
Liu, Kaikai	Efficient reliability evaluation for combinational circuits
Liu, Liansheng	DRES: Data recovery for condition monitoring to enhance system reliability FESeR: a data-driven framework to enhance sensor reliability for the system condition monitoring
Liu, Wan-Yi	Fault isolation at P/N junction by nanoprober
Llacer Martinez, Jaume	Moisture absorption by molding compounds under extreme conditions: impact on accelerated reliability tests
Loeffler, Markus	Ga contamination in silicon by focused ion beam milling: Atom Probe Tomography and simulation with dynamic model
Lorenz, Georg	Novel failure mode of chip corrosion at automotive HALL sensor devices under multiple stress conditions
Luo, Jiajun	Electromagnetic susceptibility characterization of double SOI device
Lutz, Josef	Improving the short circuit ruggedness of IGBTs Topologies for inverter like operation of power cycling tests Internal processes in power semiconductors at virtual junction temperature measurement
M
Ma, Ning	A run-time built-in approach of TID test in SRAM based FPGAs
Ma, Yinzhe	Application of Fast Laser Deprocessing Techniques on Large Cross-sectional View Area Sample with FIB-SEM Dual Beam System
Mai, Zhi Hong	Cross-sectional Nanoprobing Fault Isolation Technique on Submicron Devices Application of Fast Laser Deprocessing Techniques on Large Cross-sectional View Area Sample with FIB-SEM Dual Beam System Application of Laser Deprocessing Technique in PFA on Chemical Over-etched on Bond-pad Issue
Malbert, Nathalie	Reliability assessment of ultra-short gate length AlGaN/GaN HEMTs on Si substrate by on-state step stress
Mantz, Ulrich	3D Inspection Solutions for 3D DEVICES
Marc, François	FPGA LUT delay degradation due to HCI : Experiment and simulation results
Marcello, Giulia	ESD tests on 850 nm GaAs-based VCSELs
Marcon, Denis	Study of the stability of e-mode GaN HEMTs with p-GaN gate based on combined DC and optical analysis
Maresca, Luca	200V FRED diode with superior ESD capability
Martin, Andreas	Fast Wafer Level Reliability Monitoring as a tool to achieve automotive quality for a wafer process Plasma Process Induced Damage Detection by Fast Wafer Level Reliability Monitoring for Automotive Applications
Martin, Andreas	Degradation and Recovery of variability due to BTI
Martineau, Donatien	Power electronic assemblies: thermo-mechanical degradations of gold-tin solder for attaching devices
Mashiko, Yoji	Study on non-contact current path formation using charged particle beams
Masmoudi, Mohamed	Gate oxide degradation of SiC MOSFET under short-circuit aging tests
Mavinkurve, Amar	Moisture absorption by molding compounds under extreme conditions: impact on accelerated reliability tests
Mawby, Philip	Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules
Mazloum-Nejadari, Ali	Fatigue testing method for fine bond wires in an LQFP Package
Mbarek, Safa	Gate oxide degradation of SiC MOSFET under short-circuit aging tests
McCarthy, Conor	Elemental characterisation of 20nm structures in devices using new SEM-EDS technology
McVey, Shawn	3D Inspection Solutions for 3D DEVICES
Mei, Sen	Conductive filament formation at grain boundary locations in polycrystalline HfO2 based MIM stacks- Computational and Physical Insight
Meinhardt, Cristina	Permanent and Single Event Transient Faults Reliability Evaluation EDA tool
Meißner, Elke	Structural disturbances in GaN HEMT layers as source of leakage current, influencing device performance and reliability
Melendez, Kevin	Automatic process for Time-Frequency scan of VLSI
Meneghesso, Gaudenzio	Experimental observation of TDDB-like behavior in reverse-biased green InGaN LEDs Degradation of InGaN laser diodes caused by temperature- and current-driven diffusion processes
Meneghesso, Gaudenzio	Field- and time dependent degradation of GaN HEMTs
Meneghesso, Gaudenzio	Study of the stability of e-mode GaN HEMTs with p-GaN gate based on combined DC and optical analysis Degradation of InGaN-based LEDs related to charge diffusion and build-up
Meneghini, Matteo	Continuous Time-Domain RF waveforms monitoring under overdrive stress condition of AlGaN/GaN HEMTs
Meneghini, Matteo	Degradation of InGaN laser diodes caused by temperature- and current-driven diffusion processes
Meneghini, Matteo	Study of the stability of e-mode GaN HEMTs with p-GaN gate based on combined DC and optical analysis Experimental observation of TDDB-like behavior in reverse-biased green InGaN LEDs Degradation of InGaN-based LEDs related to charge diffusion and build-up
Meneghini, Matteo	Field- and time dependent degradation of GaN HEMTs
Mer-Calfati, Christine	Dielectric charging phenomena in diamond films used in RF MEMS capacitive switches: The effect of film thickness
Meyer, Andreas	Current Imaging, EBIC/EBAC, and Electrical Probing combined for fast and reliable in situ Electrical Fault Isolation
Mhira, Souhir	Potentiality of Healing Techniques in Hot-Carrier Damaged 28nm FDSOI CMOS nodes
Michalas, Loukas	Dielectric charging phenomena in diamond films used in RF MEMS capacitive switches: The effect of film thickness An in depth analysis of pull-up capacitance-voltage characteristic for dielectric charging assessment of MEMS capacitive switches
Middendorf, Andreas	Requirements for the Application of ECUs in E-mobility Originally Qualified for Gasoline Cars
Mikamura, Yasuki	Lifetime Estimation of SiC MOSFETs under High Temperature Reverse Bias Test
Millán, José	Power Cycling Analysis Method for High Voltage SiC Diodes
Mirone, Paolo	200V FRED diode with superior ESD capability
Mitchell, A.	Fast Wafer Level Reliability Monitoring as a tool to achieve automotive quality for a wafer process
Miura, Daiki	Novel heatsink for power semiconductor module using high thermal conductive graphite
Miura, Daiki	Power cycle reliability of Cu nanoparticle joint dependent on a mismatch of coefficients of thermal expansion
Moeller, Wolfhard	Ga contamination in silicon by focused ion beam milling: Atom Probe Tomography and simulation with dynamic model
Mohamed Sathik, Mohamed Halick	Online computation of IGBT on-state resistance for off-shelf three-phase two-level power converter systems
Moindjie, Soilihi	Natural Radiation Events in CCD Imagers at Ground Level
Moldovan, Grigore	EBIC and EBAC/RCI techniques
Molina, Joel	Analysis of Quantum Conductance, Read Disturb and Switching Statistics in HfO2 RRAM Using Conductive AFM
Montserrat, Josep	Power Cycling Analysis Method for High Voltage SiC Diodes
Morel, Hervé	Avalanche Robustness of SiC Schottky Diode
Munk-Nielsen, Stig	Power Cycling Test and Failure Analysis of Molded Intelligent Power IGBT Module under Different Temperature Swing Durations
Munteanu, Daniela	Natural Radiation Events in CCD Imagers at Ground Level
Mura, Giovanna	ESD tests on 850 nm GaAs-based VCSELs Single Event Transient Acquisition And Mapping For Space Device Characterization
Müller, Dominik	Transient thermal analysis for accelerated reliability testing of LEDs
N
Nagao, Ryota	Power cycle reliability of Cu nanoparticle joint dependent on a mismatch of coefficients of thermal expansion
Naka, Toshiyuki	UIS test of high-voltage GaN-HEMTs with p-type gate structure
Nakamura, Kazutoshi	Numerical study of destruction phenomena for punch-through IGBTs under unclamped inductive switching
Nakashima, Kenta	Micro PCB Rogowski coil for current monitoring and protection of high voltage power modules
Naouss, Mohammad	FPGA LUT delay degradation due to HCI : Experiment and simulation results
Naretto, Marco	200V FRED diode with superior ESD capability
Naumann, Falk	Reliability Evaluation of Si-Dies due to Assembly Issues
Naviner, Jean-François	Efficient reliability evaluation for combinational circuits
Naviner, Lirida	Efficient reliability evaluation for combinational circuits A process-variation-resilient methodology of circuit design by using asymmetrical forward body bias in 28nm FDSOI Reliability analysis of hybrid Spin Transfer Torque Magnetic Tunnel Junction/CMOS Majority Voters
Ndiaye, Cheikh	Performance vs. Reliability Adaptive Body Bias Scheme in 28nm & 14nm UTBB FDSOI nodes
Ndiaye, Cheikh	Potentiality of Healing Techniques in Hot-Carrier Damaged 28nm FDSOI CMOS nodes
Neches, Stuart	Fault Isolation at 5um Resolution using Electro-Optical TDR with 6ps Rise Time
Ng, Geok Ing	Role of Two-Dimensional Electron Gas (2DEG) in AlGaN/GaN High Electron Mobility Transistor (HEMT) ON-State Degradation
Ng, Pengtiong	Electrical analysis on implantation-related defect by nanoprobing methodology
Nica, Mihai	Powertrain electronics reliability
Nielen, H.	Fast Wafer Level Reliability Monitoring as a tool to achieve automotive quality for a wafer process
Nikiforov, Alexander	The radiation test based assessment of process quality and reliability for conventional 65-nm CMOS technology
Nishiguchi, Taro	Lifetime Estimation of SiC MOSFETs under High Temperature Reverse Bias Test
Nishizawa, Shin-Ichi	Temperature rise measurement for power-loss comparison of an aluminium electrolytic capacitor between sinusoidal and square current injections
Nogueira, Eduardo	Accelerated Life Test of high luminosity blue LEDs
Nolhier, Nicolas	Impact on Non-linear Capacitances on Transient Waveforms during System Level ESD Stress
Novak, Michael	Requirements for Reliability and new Solutions for Transmission Control Units
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O'Halloran, Orla	Improved Etching Recipe for Exposing Cu Wire allowing Reliable Stitch Pull
O'Shea, Sean	Analysis of Quantum Conductance, Read Disturb and Switching Statistics in HfO2 RRAM Using Conductive AFM
O'Shea, Sean Joseph	Conductive filament formation at grain boundary locations in polycrystalline HfO2 based MIM stacks- Computational and Physical Insight
Oberhoff, Stefan	Application of high frequency scanning acoustic microscopy for the failure analysis and reliability assessment of MEMS sensors (invited)
Oboňa, J. Vincenc	Planar FIB Milling of Copper by using the Novel Rocking Stage Technology
Ochoa, Jorge	Accelerated Life Test of high luminosity blue LEDs
Oh, Wonwook	Evaluation of Potential-Induced Degradation in Crystalline Si Solar Cells using Na-Fault Injection
Ohshima, Yuta	Power cycle reliability of Cu nanoparticle joint dependent on a mismatch of coefficients of thermal expansion
Okumura, Hajime	Local deep level transient spectroscopy using super-higher-order scanning nonlinear dielectric microscopy
Omura, Ichiro	Temperature rise measurement for power-loss comparison of an aluminium electrolytic capacitor between sinusoidal and square current injections Micro PCB Rogowski coil for current monitoring and protection of high voltage power modules Failure Rate Calculation Method for High Power Devices in Space Applications at Low Earth Orbit
Ong, Hock Guan	Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop
Orlando, Vincenzo	Accelerated Life Test of high luminosity blue LEDs
Ortiz Gonzalez, Jose Angel	Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules
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Papaioannou, George	Dielectric charging phenomena in diamond films used in RF MEMS capacitive switches: The effect of film thickness An in depth analysis of pull-up capacitance-voltage characteristic for dielectric charging assessment of MEMS capacitive switches
Para, Isabella	200V FRED diode with superior ESD capability
Park, Cheon Taek	Crack-guided effect on dynamic mechanical stress for foldable low temperature polycrystalline silicon thin film transistors
Park, Jong Tae	Negative bias illumination stress instability in amorphous InGaZnO thin film transistors with transparent source and drain Device instability of amorphous InGaZnO thin film transistors with transparent source and drain Impact of work function of the silicon bottom-gates on electrical instability in InGaZnO thin film transistors Nanowire width dependence of data retention and endurance characteristics in nanowire SONOS flash memory
Patard, Olivier	GaN devices: millimeter wave applications challenges (invited)
Paulasto-Kröckel, Mervi	Optimization of contact metallizations for reliable wafer level Au-Sn bonds
Pedersen, Kristian Bondeup	Mechanisms of metallization degradation in high power diodes
Peng, Yu	A run-time built-in approach of TID test in SRAM based FPGAs
Perdu, Philippe	Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop
Perdu, Philippe	Automatic process for Time-Frequency scan of VLSI
Petzold, Matthias	Reliability - becoming the key factor for electronics in Europe? (Panel Discussion) Welcome to ESREF 2016 Best Paper / Best Poster Awards - ESREF 2016 Advance Information on ESREF 2017
Pey, Kin Leong	Conductive filament formation at grain boundary locations in polycrystalline HfO2 based MIM stacks- Computational and Physical Insight
Pey, Kin Leong	Analysis of Quantum Conductance, Read Disturb and Switching Statistics in HfO2 RRAM Using Conductive AFM
Pfefer, Yvan	Laser Decap : the sample prep Swiss Army Tool
Pilia, Roberta	Single Event Transient Acquisition And Mapping For Space Device Characterization
Piotrowicz, Stéphane	GaN devices: millimeter wave applications challenges (invited)
Piotrowska, Kamila	Effect of PCBA surface morphology and chemistry on water layer formation under humid conditions and corrosion reliability
Plano, Bernard	Effects of salt spray test on lead-free solder alloy
Pohlmann, Wolfgang	Reliability of automotive LED systems
Popok, Vladimir	Mechanisms of metallization degradation in high power diodes
Poppitz, David	Correlation of gate leakage and local strain distribution in GaN/AlGaN HEMT structures
Portal, Jean-Michel	Resistive RAM Variability Monitoring using a Ring Oscillator based Test Chip
Portius, Rainhard	Detection and Analysis of Stress-induced Voiding in Al-Power lines by Acoustic GHz-Microscopy
Postel-Pellerin, Jérémy	Impact of Resistive Paths on NVM Array Reliability: Application to Flash & ReRAM Memories
Posthuma, Niels	Study of the stability of e-mode GaN HEMTs with p-GaN gate based on combined DC and optical analysis
Prasanth, Sundararajan	Online computation of IGBT on-state resistance for off-shelf three-phase two-level power converter systems
Pribahsnik, Florian	FEM Modelling of piezo- and thermo-mechanical interaction in GaN power devices – the twofold impact of metallization layers Reliability of AlGaN/GaN High Electron Mobility Transistors (HEMTs) on Si Substrate Device reliability of Geiger-mode Single Photon Avalanche Diode Photon Emission of MOSFET with Parasitic Bipolar Operation Improvement of Failure Analysis equipments by incorporating signal/image processing tools Investigating Stress Measurement Capabilities of GHz Scanning Acoustic Microscopy for 3D Failure Analysis Impurities in electroplated Cu and void formation in Cu-Sn micro-connects Scribing, Scribless and Cleaving Reinvented Exhibitor Workshop: Reliability Testing - talk 3
Principe, E.	Planar FIB Milling of Copper by using the Novel Rocking Stage Technology
Prindle, Daniel	Comparison of Thermal Runaway Limits under Different Test Conditions Based on a 4.5 kV IGBT
Proebster, Fabian	Degradation and Recovery of variability due to BTI
Pura, Jose Luis	Catastrophic optical damage of high power InGaAs/AlGaAs laser diodes
Pâques, Gontran	Comparison of Thermal Runaway Limits under Different Test Conditions Based on a 4.5 kV IGBT
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Qian, Yi	Numerical Investigation of the Effects of Phosphorus on the Mechanical Responses of [1 1 0]-oriented Silicon Nano-wires
Qin, Wantao	Corrosion Mechanisms of Cu Bond Wires on AlSi Pads
Quadros de Aguiar, Ygor	Permanent and Single Event Transient Faults Reliability Evaluation EDA tool
Quere, Raymond	Continuous Time-Domain RF waveforms monitoring under overdrive stress condition of AlGaN/GaN HEMTs
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Rafiee, Peyman	Delamination of polyimide/Cu films under mixed mode loading
Raghavan, Nagarajan	Conductive filament formation at grain boundary locations in polycrystalline HfO2 based MIM stacks- Computational and Physical Insight
Raghavan, Nagarajan	Analysis of Quantum Conductance, Read Disturb and Switching Statistics in HfO2 RRAM Using Conductive AFM Application of the Defect Clustering Model for Forming, SET and RESET Statistics in RRAM Devices
Rahimo, Munaf	Comparison of Thermal Runaway Limits under Different Test Conditions Based on a 4.5 kV IGBT
Ran, Li	Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules
Randoll, Richard	Lifetime and Manufacturability of Integrated Power Electronics
Ranjan, Alok	Analysis of Quantum Conductance, Read Disturb and Switching Statistics in HfO2 RRAM Using Conductive AFM
Ranjan, Alok	Conductive filament formation at grain boundary locations in polycrystalline HfO2 based MIM stacks- Computational and Physical Insight
Rautiainen, Antti	Optimization of contact metallizations for reliable wafer level Au-Sn bonds
Reis, Ricardo	FDSOI and Bulk CMOS SRAM Cells Resilience to Radiation Effects Permanent and Single Event Transient Faults Reliability Evaluation EDA tool
Reisinger, Hans	Degradation and Recovery of variability due to BTI
Reverdy, Antoine	New phase Laser Voltage Imaging technique
Riccio, Michele	200V FRED diode with superior ESD capability
Richardson, Chris	Sample Preparation with the X-Prep
Ries, Roland	Preliminary Idea for Preparing 1000’s of TSV’s
Rittner, Martin	Power modules in automotive powertrains: qualification and test
Rivai, Fransiscus	Cross-sectional Nanoprobing Fault Isolation Technique on Submicron Devices Application of Fast Laser Deprocessing Techniques on Large Cross-sectional View Area Sample with FIB-SEM Dual Beam System
Rizzato, Vanessa	Study of the stability of e-mode GaN HEMTs with p-GaN gate based on combined DC and optical analysis
Romano, Gianpaolo	Body diode reliability investigation of SiC power MOSFETs
Rongen, Rene	Cu-wire Bond Reliability in Automotive Electronics
Rosc, Jördis	Automatized Failure Analysis of Tungsten Coated TSVs via Scanning Acoustic Microscopy
Rossetto, Isabella	Field- and time dependent degradation of GaN HEMTs
Rossetto, Isabella	Study of the stability of e-mode GaN HEMTs with p-GaN gate based on combined DC and optical analysis
Roth, Roman	Reliability aspects of copper metallization and interconnect technology for power devices (invited)
Rott, Karina Rott	Reliability aspects of copper metallization and interconnect technology for power devices (invited)
Roussel, P.	Quantitative model for post-program instabilities in filamentary RRAM
Roux, Jean-Luc	Continuous Time-Domain RF waveforms monitoring under overdrive stress condition of AlGaN/GaN HEMTs
Rummel, Andreas	Fast, Reliable, Intuitive TEM Sample Preparation using a Load-Lockable Platform Combined with Smart Control Software
Rummel, Andreas	Current Imaging, EBIC/EBAC, and Electrical Probing combined for fast and reliable in situ Electrical Fault Isolation
Rzepka, Sven	Fast and Trusted Intrinsic Stress Measurement to Facilitate Improved Reliability Assessments
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Saad Saoud, Tarek	Natural Radiation Events in CCD Imagers at Ground Level
Saada, Samuel	Dielectric charging phenomena in diamond films used in RF MEMS capacitive switches: The effect of film thickness
Saito, Wataru	UIS test of high-voltage GaN-HEMTs with p-type gate structure
Sanchez, Kevin	Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop
Sanchez, Kevin	Automatic process for Time-Frequency scan of VLSI Single Event Transient Acquisition And Mapping For Space Device Characterization
Sasangka, Wardhana A.	Role of Two-Dimensional Electron Gas (2DEG) in AlGaN/GaN High Electron Mobility Transistor (HEMT) ON-State Degradation
Schilling, Oliver	End of life and acceleration modelling for power diodes under High Temperature Reverse Bias stress
Schletz, Andreas	Lifetime and Manufacturability of Integrated Power Electronics
Schlünder, Christian	Degradation and Recovery of variability due to BTI
Schmid, M.	Transient thermal analysis for accelerated reliability testing of LEDs
Schmitt-Landsiedel, Doris	Scanning Microwave Microscopy for Electronic Device Analysis on Nanometre Scale
Schock, Klaus	Current Imaging, EBIC/EBAC, and Electrical Probing combined for fast and reliable in situ Electrical Fault Isolation
Schuch, Bernhard	Requirements for Reliability and new Solutions for Transmission Control Units
Schulmeyer, Ingo	3D Inspection Solutions for 3D DEVICES
Schulze, Holger	Reliability aspects of copper metallization and interconnect technology for power devices (invited)
Schulze, Karl-Dietger	End of life and acceleration modelling for power diodes under High Temperature Reverse Bias stress
Schweinboeck, Thomas	Scanning Microwave Microscopy for Electronic Device Analysis on Nanometre Scale
Schäffer, Carsten	Reliability aspects of copper metallization and interconnect technology for power devices (invited)
Seidel, Peter	Topologies for inverter like operation of power cycling tests
Seo, Ji-Hoon	Channel width dependence of AC stress on bulk nMOSFETs
Sethu, Raj Sekar	Reliability Evaluation of Donut-Tungsten-Via as an Element of the Highly Robust Metallization
Sharang, Sharang	Planar FIB Milling of Copper by using the Novel Rocking Stage Technology
Shih, Shen-Rong	Fault isolation at P/N junction by nanoprober
Shin, Dongseok	Instability of oxide thin film transistor under electrical-mechanical hybrid stress for foldable display
Shohei, Harada	Failure Rate Calculation Method for High Power Devices in Space Applications at Low Earth Orbit
Sikula, Marek	Curtaining-Free Top-Down TEM Lamella Preparation from a Cutting Edge Integrated Circuit
Silvestri, Marco	Scanning Microwave Microscopy for Electronic Device Analysis on Nanometre Scale
Simanjorang, Rejeki	Online computation of IGBT on-state resistance for off-shelf three-phase two-level power converter systems
Simon-Najasek, Michél	Novel failure mode of chip corrosion at automotive HALL sensor devices under multiple stress conditions Correlation of gate leakage and local strain distribution in GaN/AlGaN HEMT structures Detection and Analysis of Stress-induced Voiding in Al-Power lines by Acoustic GHz-Microscopy
Slimani, Mariem	Reliability analysis of hybrid Spin Transfer Torque Magnetic Tunnel Junction/CMOS Majority Voters
Smith, Andrew Jonathan	Fast, Reliable, Intuitive TEM Sample Preparation using a Load-Lockable Platform Combined with Smart Control Software
Smith, Andrew Jonathan	Micromanipulators in Reliability Testing Environments: Fault Localization, Nanoprobing, and TEM Sample Preparation Current Imaging, EBIC/EBAC, and Electrical Probing combined for fast and reliable in situ Electrical Fault Isolation
Soler, Victor	Power Cycling Analysis Method for High Voltage SiC Diodes
Solomon, Adane Kassa	Thermal design optimization of novel modular power converter assembly enabling higher performance, reliability and availability
Son, Donghee	Channel width dependence of AC stress on bulk nMOSFETs
Soon, Jang Joong	Charging–discharging characteristics of a wound aluminum polymer capacitor
Souto, Jorge	Catastrophic optical damage of high power InGaAs/AlGaAs laser diodes
Stegink, Richart	Improved Etching Recipe for Exposing Cu Wire allowing Reliable Stitch Pull
Stendahl Jellesen, Morten	Effect of PCBA surface morphology and chemistry on water layer formation under humid conditions and corrosion reliability
Stern, Lewis	3D Inspection Solutions for 3D DEVICES
Sterpone, Luca	On the Prediction of Radiation-Induced SETs in Flash-based FPGAs
Stewart, Diane	3D Inspection Solutions for 3D DEVICES
Stoffels, Steve	Study of the stability of e-mode GaN HEMTs with p-GaN gate based on combined DC and optical analysis
Stomp, Romain	Multiple Pass/Fail Detection Scheme
Straube, Stefan	Requirements for the Application of ECUs in E-mobility Originally Qualified for Gasoline Cars
Su, Jianwei	Electromagnetic susceptibility characterization of double SOI device
Sulyok, David	Reliability Testing
Sun, Yufeng	A novel correlative model of failure mechanisms for evaluating MEMS devices reliability
Sundaram, Venky	The southeast automotive hub and Georgia Tech’s automotive electronics ecosystem
Syaranamual, Govindo J.	Role of Two-Dimensional Electron Gas (2DEG) in AlGaN/GaN High Electron Mobility Transistor (HEMT) ON-State Degradation
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Tai, Ching Yu	Below 10nm technology analysis solution
Tamaki, Tomohiro	Numerical study of destruction phenomena for punch-through IGBTs under unclamped inductive switching
Tan, Hao	Cross-sectional Nanoprobing Fault Isolation Technique on Submicron Devices Application of Fast Laser Deprocessing Techniques on Large Cross-sectional View Area Sample with FIB-SEM Dual Beam System Application of Laser Deprocessing Technique in PFA on Chemical Over-etched on Bond-pad Issue
Tan, Pik Kee	Cross-sectional Nanoprobing Fault Isolation Technique on Submicron Devices Application of Fast Laser Deprocessing Techniques on Large Cross-sectional View Area Sample with FIB-SEM Dual Beam System Application of Laser Deprocessing Technique in PFA on Chemical Over-etched on Bond-pad Issue
Tanaka, Yasunori	Local deep level transient spectroscopy using super-higher-order scanning nonlinear dielectric microscopy
Tao, Junyong	Fatigue Life Prediction Model for Accelerated Testing of Electronic Components under Non-Gaussian Random Vibration Excitations Numerical Investigation of the Effects of Phosphorus on the Mechanical Responses of [1 1 0]-oriented Silicon Nano-wires
Temcamani, Farid	Effects of drain quiescent voltage on the ageing of AlGaN/GaN HEMT devices in pulsed RF mode
Thean, A.	Quantitative model for post-program instabilities in filamentary RRAM
Theolier, Loic	Power electronic assemblies: thermo-mechanical degradations of gold-tin solder for attaching devices
Thionville, Amelie	Estimation of IGBT power module reliability in pre-design phase
Thompson, Carl V.	Role of Two-Dimensional Electron Gas (2DEG) in AlGaN/GaN High Electron Mobility Transistor (HEMT) ON-State Degradation
Tinschert, Lukas	Improving the short circuit ruggedness of IGBTs
Tismer, Sebastian	Magnetic Field and Current Density Imaging using off-line Lock-In Analysis
Torres, Alfredo	Catastrophic optical damage of high power InGaAs/AlGaAs laser diodes
Traving, M.	Fast Wafer Level Reliability Monitoring as a tool to achieve automotive quality for a wafer process
Trojan, Karin	Application of high frequency scanning acoustic microscopy for the failure analysis and reliability assessment of MEMS sensors (invited)
Tsai, Hui-Jhen	Fault isolation at P/N junction by nanoprober
Tsukuda, Masanori	Micro PCB Rogowski coil for current monitoring and protection of high voltage power modules
Tsuno, Takashi	Lifetime Estimation of SiC MOSFETs under High Temperature Reverse Bias Test
Tsuzaki, Kousuke	Temperature rise measurement for power-loss comparison of an aluminium electrolytic capacitor between sinusoidal and square current injections
Tummala, Rao	The southeast automotive hub and Georgia Tech’s automotive electronics ecosystem
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Uchida, Kosuke	Lifetime Estimation of SiC MOSFETs under High Temperature Reverse Bias Test
Ud Din, Rameez	Effect of PCBA surface morphology and chemistry on water layer formation under humid conditions and corrosion reliability
Uhrenfeldt, Christian	Power Cycling Test and Failure Analysis of Molded Intelligent Power IGBT Module under Different Temperature Swing Durations
Umbach, Frank	End of life and acceleration modelling for power diodes under High Temperature Reverse Bias stress
Umbach, Frank Umbach	Reliability aspects of copper metallization and interconnect technology for power devices (invited)
Usui, Masanori	Power cycle reliability of Cu nanoparticle joint dependent on a mismatch of coefficients of thermal expansion
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van Driel, Willem	LED Degradation: from component to system (invited)
Van Hove, Marleen	Study of the stability of e-mode GaN HEMTs with p-GaN gate based on combined DC and optical analysis
van Soestbergen, Michiel	Moisture absorption by molding compounds under extreme conditions: impact on accelerated reliability tests
Vanzi, Massimo	ESD tests on 850 nm GaAs-based VCSELs
Varescon, Elise	Detection of cracks in multilayer ceramic capacitors by X-ray imaging
Venzi, Matteo	Component Reliability Importance assessment on complex systems using Credible Improvement Potential
Viale, Benjamin	On the need for a new ESD verification methodology to improve the reliability of ICs in advanced 28nm UTBB FDSOI technology
Villa, Emanuele	Evolution of navigation and simulation tools in failure analysis
Vinassa, Jean-Michel	Chemical rate phenomenon approach applied to Lithium battery capacity fade estimation
Vladimirescu, Andrei	FDSOI and Bulk CMOS SRAM Cells Resilience to Radiation Effects
Vo, Minh	Improvements on localisation techniques for high power devices
Vogel, Dietmar	Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor Fast and Trusted Intrinsic Stress Measurement to Facilitate Improved Reliability Assessments
Vogel, Gert	Tutorial: Creeping corrosion of copper on printed circuit board assemblies
Vollertsen, R.-P.	Fast Wafer Level Reliability Monitoring as a tool to achieve automotive quality for a wafer process
Vuorinen, Vesa	Optimization of contact metallizations for reliable wafer level Au-Sn bonds
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Wagner, Matthias	Copper Through Silicon Vias Studied by Photoelastic Scanning Infrared Microscopy
Walter, Thomas	Delamination of polyimide/Cu films under mixed mode loading
Wang, Dandan	Application of Fast Laser Deprocessing Techniques on Large Cross-sectional View Area Sample with FIB-SEM Dual Beam System
Wang, Hongyi	Microcontroller susceptibility variations to EFT burst during accelerated aging
Wang, Huai	Power Cycling Test and Failure Analysis of Molded Intelligent Power IGBT Module under Different Temperature Swing Durations
Wang, Qijie	Application of Fast Laser Deprocessing Techniques on Large Cross-sectional View Area Sample with FIB-SEM Dual Beam System
Wang, Shaojun	A run-time built-in approach of TID test in SRAM based FPGAs
Wang, Yangang	Reliability Design of Direct Liquid Cooled Power Semiconductor Module for Hybrid and Electric Vehicles
Wang, You	A process-variation-resilient methodology of circuit design by using asymmetrical forward body bias in 28nm FDSOI
Wang, Zili	A novel correlative model of failure mechanisms for evaluating MEMS devices reliability
Weide, Kirsten	Effects of salt spray test on lead-free solder alloy Reliability Evaluation of Donut-Tungsten-Via as an Element of the Highly Robust Metallization
Weigl, Reinhard	Automotive Memory Trends and System Reliability Concepts
Weiss, Laurens	Fatigue testing method for fine bond wires in an LQFP Package
Winkler, Thomas	Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
Woirgard, Eric	Power electronic assemblies: thermo-mechanical degradations of gold-tin solder for attaching devices
Wolfgang, Eckhard	10 Years Robustness Validation
Wolter, Klaus-Juergen	The southeast automotive hub and Georgia Tech’s automotive electronics ecosystem
Wondrak, Wolfgang	Lifetime and Manufacturability of Integrated Power Electronics
Wu, Jianfei	Microcontroller susceptibility variations to EFT burst during accelerated aging
Wu, Jianfei	Electromagnetic susceptibility characterization of double SOI device
Wu, Tian-Li	Study of the stability of e-mode GaN HEMTs with p-GaN gate based on combined DC and optical analysis
Würfl, Joachim	Temperature Dependent Dynamic ON State Resistance in GaN on Si Based Normally OFF HFETs
X
Xiao, Kunhui	ESD tests on 850 nm GaAs-based VCSELs
Y
Yabuuchi, Yoshinori	Numerical study of destruction phenomena for punch-through IGBTs under unclamped inductive switching
Yamada, Yasushi	Novel heatsink for power semiconductor module using high thermal conductive graphite Power cycle reliability of Cu nanoparticle joint dependent on a mismatch of coefficients of thermal expansion
Yamamoto, Hirofumi	Lifetime Estimation of SiC MOSFETs under High Temperature Reverse Bias Test
Yanase, Masashi	Novel heatsink for power semiconductor module using high thermal conductive graphite
Yang, Daoguo	Effects of stress-loading test methods on the degradation of light-emitting diode modules
Yap, Huei Hao	Cross-sectional Nanoprobing Fault Isolation Technique on Submicron Devices Application of Fast Laser Deprocessing Techniques on Large Cross-sectional View Area Sample with FIB-SEM Dual Beam System Application of Laser Deprocessing Technique in PFA on Chemical Over-etched on Bond-pad Issue
Yasuda, Satoshi	Si IGBT reliability for HVs
Yasuhara, Norio	Numerical study of destruction phenomena for punch-through IGBTs under unclamped inductive switching
Yen, Chia-Hsiang	Fault isolation at P/N junction by nanoprober
Yoon, Yang Gi	Charging–discharging characteristics of a wound aluminum polymer capacitor
Yu, Chong Gun	Impact of work function of the silicon bottom-gates on electrical instability in InGaZnO thin film transistors Nanowire width dependence of data retention and endurance characteristics in nanowire SONOS flash memory
Yu, Seul Ki	Negative bias illumination stress instability in amorphous InGaZnO thin film transistors with transparent source and drain
Yu, Ting-Yang	Asymmetric Low Temperature Bonding Structure Using Ultra-Thin Buffer Layer Technique for 3D Integration
Yuji, Shiba	Failure Rate Calculation Method for High Power Devices in Space Applications at Low Earth Orbit
Yun, Ilgu	Crack-guided effect on dynamic mechanical stress for foldable low temperature polycrystalline silicon thin film transistors Instability of oxide thin film transistor under electrical-mechanical hybrid stress for foldable display
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Zaal, Jeroen	Moisture absorption by molding compounds under extreme conditions: impact on accelerated reliability tests
Zanoni, Enrico	Study of the stability of e-mode GaN HEMTs with p-GaN gate based on combined DC and optical analysis Degradation of InGaN-based LEDs related to charge diffusion and build-up Degradation of InGaN laser diodes caused by temperature- and current-driven diffusion processes
Zanoni, Enrico	Continuous Time-Domain RF waveforms monitoring under overdrive stress condition of AlGaN/GaN HEMTs
Zanoni, Enrico	Field- and time dependent degradation of GaN HEMTs Experimental observation of TDDB-like behavior in reverse-biased green InGaN LEDs
Zehetbauer, Michael	Fatigue testing method for fine bond wires in an LQFP Package
Zevgolatis, Athanasios	Dielectric charging phenomena in diamond films used in RF MEMS capacitive switches: The effect of film thickness
Zhang, Guoqi	Effects of stress-loading test methods on the degradation of light-emitting diode modules
Zhang, Yujie	DRES: Data recovery for condition monitoring to enhance system reliability
Zhang, Yun'An	Fatigue Life Prediction Model for Accelerated Testing of Electronic Components under Non-Gaussian Random Vibration Excitations Numerical Investigation of the Effects of Phosphorus on the Mechanical Responses of [1 1 0]-oriented Silicon Nano-wires
Zhao, Atman	Influence of I/O Oxide Process on the NBTI Performance of 28nm HfO2-Based HKMG p-MOSFETs Early Detection and Prediction of HKMG SRAM HTOL Performance by WLR PBTI Tests
Zhao, Kai	Electromagnetic susceptibility characterization of double SOI device
Zhao, Weisheng	A process-variation-resilient methodology of circuit design by using asymmetrical forward body bias in 28nm FDSOI
Zhao, Xing	Electromagnetic susceptibility characterization of double SOI device
Zhao, Yuzhe	Cross-sectional Nanoprobing Fault Isolation Technique on Submicron Devices Application of Fast Laser Deprocessing Techniques on Large Cross-sectional View Area Sample with FIB-SEM Dual Beam System
Zheleznyak, Vladimir	SELA Sample Preparation Tools
Zhu, Lei	Application of Fast Laser Deprocessing Techniques on Large Cross-sectional View Area Sample with FIB-SEM Dual Beam System Application of Laser Deprocessing Technique in PFA on Chemical Over-etched on Bond-pad Issue
Zhu, Wei	Microcontroller susceptibility variations to EFT burst during accelerated aging
Zhu, Yueqin	Influence of I/O Oxide Process on the NBTI Performance of 28nm HfO2-Based HKMG p-MOSFETs Early Detection and Prediction of HKMG SRAM HTOL Performance by WLR PBTI Tests
Zimpeck, Alexandra	Permanent and Single Event Transient Faults Reliability Evaluation EDA tool
Zoeller, Martin	Application of high frequency scanning acoustic microscopy for the failure analysis and reliability assessment of MEMS sensors (invited)
Zschech, Ehrenfried	Ga contamination in silicon by focused ion beam milling: Atom Probe Tomography and simulation with dynamic model
Zschornack, Michael	Current Imaging, EBIC/EBAC, and Electrical Probing combined for fast and reliable in situ Electrical Fault Isolation

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