ITC 2019: INTERNATIONAL TEST CONFERENCE 2019
PROGRAM FOR THURSDAY, NOVEMBER 14TH
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08:30-10:00 Session w1: Special 2: Special Session #2: Bringing Test Standards to Fruition

Organizer: Jeff Rearick, AMD

Moderator: Al Crouch

1. Heiko Ehrenberg (Goepel) : How IEEE P1687.1 and IEEE P2654 can cooperate to access on-chip instruments during system assembly test

2. Jeff Rearick (AMD) : Using IEEE P1687.2 to describe analog DFT and write analog tests

3. Steve Sunter (Mentor, a Siemens Business ) : Defining Analog Defect Coverage with IEEE P2427, as if your life depends on it

 

Location: Washington 1
08:30-10:00 Session w2: Special 3: Special Session #3: Testing and Fault Tolerance of Emerging Memory-Centric Computing Paradigms

Organizer: Mehdi Tahoori, Karlsruhe Institute of Technology

1. Moritz Fieback, Surya Nagarajan, Mottaqiallah Taouil, and Said Hamdioui, Delft University, Netherlands, Title: Testing Computation-in-Memory Circuits

2. Anteneh Gebregiorgis and Mehdi Tahoori, Karlsruhe Institute of Technology, Germany, Title: Testing of Neuromorphic Circuits: Structural vs Functional

3. Krishnendu Chakrabarty, Duke University, USA, Title: Fault-Tolerant Neuromorphic Computing Systems

 

Location: Washington 2
08:30-10:00 Session w3: IPP 3.#: Industrial Practice Papers
Location: Washington 3
08:30
IPP: Efficiency measurement method for Fully Integrated Voltage Regulators used in 4th and 5th generation Intel® microprocessors
PRESENTER: Sarath Makala

ABSTRACT. Fully Integrated Voltage Regulators (FIVRs) are switching voltage regulators integrated on to the same die as the CPU and Graphics cores, in 4th and 5th generation Intel® Core(TM) microprocessors. Practical limitations prevent the application of traditional voltage regulator characterization methods to FIVRs. To overcome these challenges, new methods and techniques had to be developed for the testing and characterization of FIVRs. Power Efficiency (η) is one of the key performance metrics of voltage regulators. In this paper we explain the methods used to measure the Power Efficiency of FIVRs. These methods are applicable to Integrated VRs in general and are not specific to FIVRs alone. Description of power loss components and extraction of the loss coefficients from curve fitting technique is also presented. Measured results show that the proposed methods are highly repeatable with worst-case run-to-run variation of 0.4%. The results also show that the worst-case error is <1% when compared to pre-Si simulation results.

08:52
IPP: The Challenges of Implementing an MBIST Interface: A Practical Application
PRESENTER: Teresa Mclaurin

ABSTRACT. An MBIST interface can enable very high-quality test, which is required by emerging markets such as autonomous automotive, with much less impact to power, performance and area (PPA) than the traditional method of instantiating an MBIST controller. The MBIST interface is able to achieve the improvement in PPA and higher quality test by reusing functional paths to connect to the memories during test. Automation of creating an MBIST controller that understands this way of accessing the memories requires partnership between EDA and the IP provider. This paper discusses practical aspects of implementing an MBIST interface and a 3rd party MBIST controller.

09:14
IPP: High Quality Test Methodology for Highly Reliable Devices
PRESENTER: Hao Chen

ABSTRACT. This paper introduces a high quality screening methodology, using Integrated Passive Device (IPD) as an example device, which has the capability to increase power integrity of Integrated Fan Out Wafer Level Chip Scale Package (InFO WLCSP). InFO WLCSP is a more cost effective solution to achieve “More than Moore’s law” for mobile devices than 3D integrated circuits (3DIC). Ultra-thin IPD with high capacitance density is capable to further shrinking InFO package dimensions and boosting its performance. Although the cost percentage of an IPD in the whole InFO package is negligible, a defective IPD can cause the whole InFO package malfunctioned. Traditional test methods such as good die in a bad cluster (GDBC) and dynamic part averaging testing (DPAT) are used screening IPD devices, however it is insufficient for high quality screen standards. In this paper, we pro-pose a novel methodology that leads to an effective screening method to guarantee high quality and reliable IPD devices for InFO packages. We will show results on some industrial cases to validate our claims.

09:36
IPP: TestDNA: Novel Wafer Defect Signature for Diagnosis and Yield Learning

ABSTRACT. Traditionally, spatial failure patterns in wafer defect maps are used for root cause analysis in order to improve defect diagnosis resolution and yield learning. However, the types of recognizable spatial failure patterns are limited, which restricts the achievable diagnosis resolution. Test items executed in the wafer test process provide useful information regarding the root cause of defects to improve yield; however, the challenge is how to exploit such information for diagnosis. In this paper, we explore to use distribution of data collected from various test items to generate a DNA-like wafer defect signature to uniquely identify wafer defects effectively and efficiently. Experimental results show that the proposed TestDNA method is more robust and can identify more defect types than state-of-art failure pattern recognition, which will lead to more accurate diagnosis. The results will be helpful to achieve zero defects in manufacturing, especially life-critical automotive industry.

08:30-10:00 Session w4: Paper 12.#: Automotive Track - Regular Papers
Location: Washington 4
08:30
Resiliency of automotive detection networks on GPU architectures
PRESENTER: Atieh Lotfi

ABSTRACT. Safety is the most important aspect of an autonomous driving platform. Deep neural networks (DNNs) play an increasingly critical role in localization, perception, and control in these systems. The object detection and classification inference are of particular importance to construct a precise picture of a vehicle's surrounding objects. Graphics Processing Units (GPU) are well-suited to accelerate such DNN-based inference applications since they leverage data and thread-level parallelism in GPU architectures. Understanding the vulnerability of such DNNs to random hardware faults (including transient and permanent faults) in GPU-based systems is essential to meet the safety requirements of auto safety standards such as the ISO 26262, as well as to influence the design of hardware and software-based safety features in current and future generations of GPU architectures and GPU-based automotive platforms. In this paper, we assess the vulnerability of object detection and classification DNNs to permanent and transient faults using fault injection experiments and accelerated neutron beam testing respectively. We also evaluate the effectiveness of chip-level safety mechanisms in GPU architectures, such as ECC and parity, in detecting these random hardware faults. Our studies demonstrate that such object detection networks tend to be vulnerable to random hardware faults, which cause incorrect or mispredicted object detection outcomes. The neutron beam experiments show that existing chip-level protections successfully mitigate all silent data corruption events caused by transient faults. For permanent faults, while ECC and parity are effective in some cases, our results suggest the need for exploring other complementary detection methods, such as periodic online and offline diagnostic testing.

09:00
On Freedom from Interference in Mixed-Criticality Systems: A Causal Learning Approach
PRESENTER: Fei Su

ABSTRACT. Freedom from Interference (FFI) is one of the critical criteria in a mixed-criticality system. In this paper we propose a causal learning approach using field anomaly data mining to address challenges of FFI verification.

09:30
Safety Design of a Weight Stationary Convolutional Neural Network Accelerator
PRESENTER: Zheng Xu

ABSTRACT. Recently neural network accelerators have grown into prominence with significant power and performance efficiency improvements over CPU and GPU. In this paper, we proposed and analyzed two safety design techniques include Algorithm Based Atomic Error Checking-1 (ABAEC-1) and ABAEC-2 for a Weight Stationary (WS) Convolutional Neural Network (CNN) accelerator focusing on low latency and low overhead error detection and error correction with no performance degradation. The proposed design techniques not only detect the errors on-the-fly but also perform error diagnosis to localize the errors to a Processing Element (PE) for online fault management and error recovery. We applied the design techniques on an industry quality CNN accelerator and demonstrated that we could achieve the required Diagnostic Coverage (DC) goal with minimal area and power and runtime error recovery overhead and no functional performance degradation for selected configurations.

08:30-10:00 Session w5: AI Track: AI Special Session: The New Comers

This last session of the AI track includes two invited talks from the new comers (under age 30) in the test community, followed by a 30-minute brainstorming from the audiences to provide their perspectives to the new comers on AI in Test.

Invited Talks:

1. Apik Zorian, Basim Shanyour, and Milir Vaseekar, Synopsys Inc., Title: Machine Learning-Based DFT Recommendation System for ATPG QOR

2. Jay Shan, IE3A, Inc., Title: Intent-Driven Analytics: To Talk or Not To Talk?

3. Brainstorming (By Audience) - Your Perspective of AI in Test

Location: Washington 5
10:30-11:30 Session KV5: 5th Keynote and 5th Visionary Talk

Keynote:

Giovanni De Micheli, Director IEE Center, EPFL

Visionary:

Greg Smith, President Semiconductor Test, Teradyne

For keynote and Visionary, please see ITC site for more information:

http://www.itctestweek.org/2019-keynote-and-visionary-talks/

13:00-14:00 Session KV6: 6th Keynote and 6th Visionary Talk

Keynote:

Andreas Aal, Semiconductor Strategy & Reliability, Volkswagen AG

Visionary:

Keith Schaub, Vice President Applied Research and Technology, Advantest

For keynote and Visionary, please see ITC site for more information:

http://www.itctestweek.org/2019-keynote-and-visionary-talks/

14:30-16:00 Session w2: Special 5: Special Session #5 - HIR

Title: Special Session on Heterogeneous Integration Technology Roadmap (HIR)

Description: This session begins with a Sky Talk to provide an overview of the current state of HIR, followed by a panel discussion.

Moderator: Marc Hutner, Teradyne

Sky Talk: Dr. Bill Bottoms, HIR Chairman, 3MTS

Panelists: 

Dave Armstrong, Advantest 

Brady Benware, Mentor, a  Siemens Business

Bill Bottoms, 3MTS

Erik Jan Marinissen, IMEC

Location: Washington 2
14:30-16:00 Session w4: Auto Track: Automotive Special Session: Automotive Safety

Title: Automotive Special Session: Reliability & Safety

Organizer: Yervant Zorian, Synopsys

1. Sky Talk: Vilas Sridharan, Senior Fellow, AMD, Title: From Research to Product: RAS Features in EPYC and Radeon Instinct

2. Invited Talk: G. Boschi, H. Shaheen, D. Luongo, D. Lazzarotti, Intel, H. Grigoryan, G. Harutyunyan , S. Shoukourian, Synopsys.
    Title: Memory FIT Rate Mitigation Technique for Automotive SoCs

3. Invited Talk: Nelly Feldman, Arnaud Sanson (STMicroelectronics), Karen Darbinyan, Arun Kuma (Synopsys). Title: Manufacturing screening and diagnostic flow for advanced technologies automotive system-on-chips

 

Location: Washington 4