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Numerical Analysis on Thermal Conductivity of Vapor Chamber Using an Iterative Approach

10 pagesPublished: August 5, 2017

Abstract

Technological developments have resulted in a growing demand for high power electronic devices. Although these high power devices meet the high performance requirements, they also generate a very large amount of heat which adversely affects their operating efficiency. Most part of the heat within a package is generated at the chip and hence it is important to keep junction temperature as low as possible. This is commonly achieved by using heat sinks mounted directly on top of the package. Using a vapor chamber can reduce thermal resistance by better spreading heat across the heat sink base. This work presents a parametric study of vapor chambers as heat spreaders and discusses the merits of using this technology especially in high power devices through CFD modeling. Iterative method is used to finalize the value of Ks and Kl by considering the orthotropic approach.

Keyphrases: Isotropic approach, iterative method, thermal conductivity, Vapor chamber

In: Ajitkumar Shukla, J. M. Patel, P. D. Solanki, K. B. Judal, R. K. Shukla, R. A. Thakkar, N. P. Gajjar, N. J. Kothari, Sukanta Saha, S. K. Joshi, Sanjay R. Joshi, Pranav Darji, Sanjay Dambhare, Bhupendra R. Parekh, P. M. George, Amit M. Trivedi, T. D. Pawar, Mehul B. Shah, Vinay J. Patel, Mehfuza S. Holia, Rashesh P. Mehta, Jagdish M. Rathod, Bhargav C. Goradiya and Dharita K. Patel (editors). ICRISET2017. International Conference on Research and Innovations in Science, Engineering and Technology. Selected Papers in Engineering, vol 1, pages 316--325

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BibTeX entry
@inproceedings{ICRISET2017:Numerical_Analysis_on_Thermal,
  author    = {Deepak Jani and Mukesh Keshwani and Amarish Badgujar and Ajit Chaudhari},
  title     = {Numerical Analysis on Thermal Conductivity of Vapor Chamber Using an Iterative Approach},
  booktitle = {ICRISET2017. International Conference on Research and Innovations in  Science, Engineering and Technology. Selected Papers in Engineering},
  editor    = {Ajitkumar Shukla and J. M. Patel and P. D. Solanki and K. B. Judal and R. K. Shukla and R. A. Thakkar and N. P. Gajjar and N. J. Kothari and Sukanta Saha and S. K. Joshi and Sanjay R. Joshi and Pranav Darji and Sanjay Dambhare and Bhupendra R. Parekh and P. M. George and Amit M. Trivedi and T. D. Pawar and Mehul B. Shah and Vinay J. Patel and Mehfuza S. Holia and Rashesh P. Mehta and Jagdish M. Rathod and Bhargav C. Goradiya and Dharita K. Patel},
  series    = {Kalpa Publications in Engineering},
  volume    = {1},
  pages     = {316--325},
  year      = {2017},
  publisher = {EasyChair},
  bibsource = {EasyChair, http://www.easychair.org},
  issn      = {2515-1770},
  url       = {https://easychair.org/publications/paper/vKLp},
  doi       = {10.29007/wt1h}}
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