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Author
:
Zhang Hongze
Publications
A Silicon-Based Fanout Technology with High Aspect Ratio TSV for RF Heterogenous Integration Applications
Jiao Zonglei
,
Li Jie
,
Wang Zhengyan
and
Zhang Hongze
EasyChair Preprint 13440
Keyphrases
Fanout
,
RF microsystem
,
TSV interposer
.
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