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![]() Title:Assessing Long-Term Reliability through Accelerated Aging Stress Tests on a On-chip Quality and Reliability Platform : A Band Gap Reference case study Conference:ITC 2025 Tags:accelerated aging stress, aging, band gap reference BGR, quality and reliability and test methodology Abstract: This study presents an accelerated aging analysis of a classic bandgap reference (BGR) circuit to evaluate its reliability and performance over time. Implemented on a Quality and Reliability On-Chip (QROC) platform, the BGR demonstrated a temperature coefficient of 0.12 mV/°C from 25°C to 100°C, ensuring stable operation across temperature variations. The output reference voltage (V_ref) remained at 646 mV across a supply range of 0.8 V to 1.4 V, with a variation of ±7.5 ppm/V. After a one-million-second stress test at elevated temperatures and 1.4 V stress voltage, V_ref shifted by only 1%, showing less than 6.5% deviation from post-layout simulations, confirming the circuit’s robustness and long-term precision. Assessing Long-Term Reliability through Accelerated Aging Stress Tests on a On-chip Quality and Reliability Platform : A Band Gap Reference case study ![]() Assessing Long-Term Reliability through Accelerated Aging Stress Tests on a On-chip Quality and Reliability Platform : A Band Gap Reference case study | ||||
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