2.5D Systems-on-Package (SoPs) are composed by several chiplets placed on an interposer. They are becoming increasingly popular as they enable easy integration of electronic components in the same package and high fabrication yields. Nevertheless, they introduce a new bottleneck in inter-chiplet communication, which must be routed through the interposer. Such a constraint favors mapping related tasks on computing cores within the same chiplet, leading to thermal hotspots. In-package wireless technology holds promise to reconsider such a position because integrated wireless antennas provide low-latency and high-bandwidth communication paths, thus bypassing the interposer bottleneck. Furthermore, in this work, we propose a new task mapping heuristic that leverages in-package wireless technology to improve the thermal behavior of 2.5D SoPs executing complex applications. Combining system simulation and thermal modeling, our results show that we can distribute computation in wireless 2.5D SoPs to reduce peak temperatures by up to 24% through task mapping with a negligible performance impact.