ICEC 2020: 30TH INTERNATIONAL CONFERENCE ON ELECTRICAL CONTACTS 2020
PROGRAM FOR TUESDAY, JUNE 8TH
Days:
previous day
next day
all days

View: session overviewtalk overview

12:00-12:30 Session 15: Keynote
Chair:
Werner Johler (Littelfuse, Switzerland)
Location: Stage 1
12:00
Xingwen Li (Xi'an Jiaotong University, China)
Silei Chen (Xi'an University of Technology, China)
Jing Wang (Shenzhen Power Supply Bureau Shenzhen, P.R.China, China)
PV Arc Fault Diagnosis and Modeling Methods: State of the Art and Perspectives
PRESENTER: Xingwen Li
12:30-12:50 Session 16A
Chair:
Werner Johler (Littelfuse, Switzerland)
Location: Stage 1
12:30
Chomrong Ou (Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Japan)
Huang Yinming (Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Japan)
Koichi Yasuoka (Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Japan)
Threshold Current of Arc-Free Commutation For Copper-Carbon Contact in a DC Hybrid Switch
PRESENTER: Chomrong Ou
12:30-12:50 Session 16B
Chair:
Dominique Freckmann (TE, Switzerland)
Location: Stage 2
12:30
Peter Jacob (Empa Swiss Fed Labs for Materials Testing and Research, Switzerland)
Failure- and degradation mechanisms in plug connectors
12:50-13:10 Session 17A
Chair:
Werner Johler (Littelfuse, Switzerland)
Location: Stage 1
12:50
Yinming Huang (Tokyo Institute of Technology, Japan)
Chomrong Ou (Tokyo Institute of Technology, Japan)
Koichi Yasuoka (Tokyo Institute of Technology, Japan)
Hybrid DC switch with a Four-block Copper-Based Tungsten Contact
PRESENTER: Yinming Huang
12:50-13:10 Session 17B
Chair:
Dominique Freckmann (TE, Switzerland)
Location: Stage 2
12:50
Yanyan Luo (Hebei University of Technology, China)
Pengyu Gao (Hebei University of Technology, China)
Hong Liang (Maintenance Company of State Grid Tianjin Electric Power Company, China)
Zihang Sun (Hebei University of Technology, China)
Jingqin Wang (Hebei University of Technology, China)
Jingying Zhao (Hebei University of Technology, China)
Jiaomin Liu (Hebei University of Technology, China)
Research on Ultrasonic Testing Technology for Wear Debris Caused by Fretting Wear of Electrical Connectors
PRESENTER: Yanyan Luo
13:10-13:30 Session 18A
Chair:
Werner Johler (Littelfuse, Switzerland)
Location: Stage 1
13:10
Frederik Anspach (TU Braunschweig, Germany)
Patrick Vieth (TU Braunschweig, Germany)
Lars Claaßen (TU Braunschweig, Institute of Highvoltage Technology and Electrical Power Systems, Germany)
Ernst-Dieter Wilkening (TU Braunschweig, Germany)
Michael Kurrat (TUBS, Germany)
Investigation and optimization of a hybrid circuit breaker for low- and medium-voltage DC-Grids
PRESENTER: Frederik Anspach
13:10-13:30 Session 18B
Chair:
Dominique Freckmann (TE, Switzerland)
Location: Stage 2
13:10
Mack Mavuni (APTIV/UNIVERSITE DE RENNES 1, France)
Erwann Carvou (UNIVERSTE DE RENNES 1, France)
Gregory Lalet (APTIV, France)
Study of vibration transfer in automotive connectors for understanding of fretting corrosion damage
PRESENTER: Mack Mavuni
13:30-13:50 Session 19A
Chair:
Werner Johler (Littelfuse, Switzerland)
Location: Stage 1
13:30
Wolfgang Hauer (Eaton Industrie Austria GmbH, Austria)
Michael Bartonek (Eaton Industrie Austria GmbH, Austria)
Hartwig Stammberger (Eaton Industrie Germany GmbH, Germany)
New Switching Technology for DC Grids
PRESENTER: Wolfgang Hauer
13:30-13:50 Session 19B
Chair:
Dominique Freckmann (TE, Switzerland)
Location: Stage 2
13:30
Marcel Mainka (Weidmüller Group, Germany)
Thomas Wielsch (Weidmüller Group, Germany)
Ralph Würtele (Klüber Lubrication, Germany)
Martin Dr. Schweigkofler (Klüber Lubrication, Germany)
Influence of PFPE lubricant modifications on tribo-electrical properties of a tin contact system
PRESENTER: Marcel Mainka
13:50-14:10 Session 20A
Chair:
Werner Johler (Littelfuse, Switzerland)
Location: Stage 1
13:50
Arnd Ehrhardt (DEHN SE + Co KG, Germany)
Sven Wolfram (Technische Universität Ilmenau, Germany)
Switchgear Combination of Pyrotechnic Switch and Fuse
PRESENTER: Arnd Ehrhardt
13:50-14:10 Session 20B
Chair:
Dominique Freckmann (TE, Switzerland)
Location: Stage 2
13:50
Ana Torrealba (Laboratoire de Génie Electrique et Electronique de Paris, France)
Sophie Noël (Laboratoire de Génie Electrique et Electronique de Paris, France)
Antoine Fares Karam (Amphenol FCI, France)
Aurore Brezard-Oudot (Laboratoire de Génie Electrique et Electronique de Paris, France)
Damien Comte (Amphenol ICC, France)
Anthony Franchini (Amphenol ICC, France)
Jeffrey Toran (Amphenol ICC, United States)
Durability of some asymmetrical contact pairs for connector application
PRESENTER: Ana Torrealba
14:10-14:30 Session 21A
Chair:
Werner Johler (Littelfuse, Switzerland)
Location: Stage 1
14:10
Maosong Zhang (Ximen Hongfa Electroacoustic Co.,ltd, China)
Yiqing Zhu (Ximen Hongfa Electroacoustic Co.,ltd, China)
Design of an electromechanical relay for 5G power supply application which withstand high lightning-stroke-current
PRESENTER: Yiqing Zhu
14:10-14:30 Session 21B
Chair:
Dominique Freckmann (TE, Switzerland)
Location: Stage 2
14:10
Tobias Dyck (WAGO Kontakttechnik GmbH & Co. KG, Germany)
Andreas Bund (Technische Universität Ilmenau, Germany)
Investigation of the contact resistance as a function of the temperature for connectors and wire terminals
PRESENTER: Tobias Dyck
14:30-15:00Break
15:00-15:30 Session 22: Keynote
Chair:
Dominique Freckmann (TE, Switzerland)
Location: Stage 1
15:00
Volker Behrens (DODUCO Contacts and Refining GmbH, Germany)
Contact Materials for Electromechanical Devices – Established Technologies and Improvements to Face Future Requirements

ABSTRACT. With electromechanical devices as connectors and switchgear, the contact material used is a crucial component to fulfill technical and commercial requirements. With connectors and switches for information technology, contact surface layers with thicknesses in the µm range are used in very most cases. Due to arcing with switching operations in power engineering applications, thin layers are not sufficient – thus, contact material thicknesses ranging from some hundred µm up to some cm are applied. The present paper gives an overview regarding different contact material families for power engineering as silver/nickel, silver/refractory, copper/tungsten, silver/metal oxide, and silver graphite, including the different physical mechanisms leading to their specific switching behavior. On the background of climate change and measures to reduce greenhouse gas emissions, the generation and use of electrical power undergo remarkable changes. Thus, switching devices have to meet modified or new tasks as switching of highly energy-efficient electric motors, more demanding DC applications, and combinations of electromechanical and solid-state switching devices. This paper discusses possible consequences for contact materials to fit better to these changing requirements.

15:30-15:50 Session 23
Chair:
Dominique Freckmann (TE, Switzerland)
Location: Stage 1
15:30
Philip Lees (Littelfuse, United States)
Eric Hafenstein (Littelfuse, United States)
Joshua Koeppel (Littelfuse, United States)
Tony Spies (Littelfuse, United States)
The Development of Sputtered Contact Systems Replacing Electroplated Systems in Reed Switch Applications
PRESENTER: Philip Lees
15:50-16:10 Session 24
Chair:
Dominique Freckmann (TE, Switzerland)
Location: Stage 1
15:50
Sönke Sachs (TE Connectivity, Germany)
Helge Schmidt (TE Connectivity, Germany)
Marjorie Myers (TE Connectivity, United States)
Michael Leidner (TE Connectivity, Germany)
Waldemar Staborth (TE Connecitivity, Germany)
Frank Ostendorf (TE Connecitivity, Germany)
Highly durable silver-based physically deposited contact finish for the application in socket connectors
PRESENTER: Sönke Sachs
16:10-16:30 Session 25
Chair:
Dominique Freckmann (TE, Switzerland)
Location: Stage 1
16:10
Frédéric Hilty (Collini AG Switzerland, Switzerland)
Johannes Herrmann (Collini AG Switzerland, Switzerland)
An innovative silver-based coating system with high wear resistance for electrical connectors
PRESENTER: Frédéric Hilty
16:30-16:50 Session 26
Chair:
Dominique Freckmann (TE, Switzerland)
Location: Stage 1
16:30
Reinhard Wagner (Rosenberger Hochfrequenztechnik GmbH & Co. KG, Germany)
Christian Dandl (Rosenberger Hochfrequenztechnik GmbH & Co. KG, Germany)
Andreas Gruber (Rosenberger Hochfrequenztechnik GmbH & Co. KG, Germany)
Reinhard Hogger (Rosenberger Hochfrequenztechnik GmbH & Co. KG, Germany)
Michael Eicher (Rosenberger Hochfrequenztechnik GmbH & Co. KG, Germany)
Investigations on cold welding and galling of various connector platings
PRESENTER: Reinhard Wagner
16:50-17:10 Session 27
Chair:
Dominique Freckmann (TE, Switzerland)
Location: Stage 1
16:50
Haomiao Yuan (Ostwestfalen-Lippe University of Applied Sciences and Arts, Germany)
Jian Song (Ostwestfalen-Lippe University of Applied Sciences and Arts, Germany)
A Cu/Sn Multilayer System and its Fretting Corrosion Behavior
PRESENTER: Haomiao Yuan
17:10-17:30 Session 28
Chair:
Dominique Freckmann (TE, Switzerland)
Location: Stage 1
17:10
Bernd Roelfs (Atotech Deutschland GmbH, Germany)
Markus Hoerburger (Atotech Deutschland GmbH, Germany)
Alexander Spoerrer (Atotech Deutschland GmbH, Germany)
Bruno Wibberg (Atotech Deutschland GmbH, Germany)
Silver Plating for Connectors - The right combination of new gal-vanic Silver processes and anti–tarnishes
PRESENTER: Bernd Roelfs