Keyword:strain

Papers
Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications Joshua Depiver, Sabuj Mallik, Yiling Lu and Emeka Amalu EasyChair Preprint no. 5719
Modeling Film Conductivity for Ion Migration Analysis in Perovskite Solar Cells Nima E. Gorji, Amir Mosavi, Arash Rouhi, Pezhman Darvishzadeh and Mahdi Ghadiri EasyChair Preprint no. 3693