IEEE SPI 2027: 31st IEEE Workshop on Signal and Power Integrity Riva del Garda Centro Congressi Riva del Garda, Italy, May 16-19, 2027

About SPI

With a legacy spanning over three decades, the IEEE Workshop on Signal and Power Integrity (SPI) is an annual scientific event in Europe that stands today as a premier forum of exchange on all aspects of Signal and Power Integrity, encompassing the latest research and developments on design, characterization, modeling, simulation, and testing at chip, package, board, and system levels.

The workshop brings together researchers and developers from academia and industry worldwide, providing a key environment to foster cooperation and knowledge exchange. It offers an engaging program to attendees, which includes keynotes on emerging topics presented by renowned experts affiliated with leading institutions and companies, as well as dynamic oral and poster technical sessions on the latest research outcomes, alongside valuable networking moments.

You are welcome to explore our website for further information about SPI 2027 and follow our social media channels to stay updated on the latest news. Feel free to disseminate the workshop within your institution or company, as well as to your fellow colleagues and students. We are delighted to invite you all to send a contribution and attend the 31st IEEE Workshop on Signal and Power Integrity, taking place as an in-person event from May 16-19, 2027, in Riva del Garda, Italy!

Sponsors: IEEE | IEEE Electronics Packaging Society | IEEE Electromagnetic Compatibility Society | IEEE Microwave Theory and Technology Society

Institutional Partners: Politecnico di Torino | Department of Electronics and Telecommunications

Call for Papers

Original and unpublished contributions on all aspects of Signal and Power Integrity are welcomed, related to the following TOPICS of interest:

• Modeling and simulation for SI/PI
• Coupled signal and power integrity analysis
• Noise reduction and equalization techniques
• High-speed link design and modeling
• Power distribution networks
• RF/microwave/mm-wave systems and packaging solutions
• Antennas-in-package and antennas-on-chip
• 3D IC and packages (TSV/SiP/SoC)
• Nano-interconnects and nano-structures
• Electromagnetic theory and modeling
• Transmission line theory and modeling
• Macromodeling, reduced order models
• Electromagnetic compatibility
• Design methodology/flow measurements
• Jitter and noise modeling
• Stochastic/sensitivity analysis
• Electro-thermal modeling
• Chip-package co-design
• Novel CAD concepts
• Optical interconnects
• AI in electronics design

Accepted papers with a Regular or a Student registration paid in full will be included in the workshop’s program and submitted for inclusion into IEEE Xplore® (subject to meeting scope and quality requirements for IEEE Xplore®).

Authors of the best-ranked accepted papers will have the opportunity to submit an extended version of their work for publication in a special section of the IEEE Transactions on Components, Packaging and Manufacturing Technology.

Awards & Grants

• SPI 2027 BEST PAPER AWARD - Recognizes the foremost paper among all papers submitted and presented during the workshop.
• SPI 2027 BEST STUDENT PAPER AWARD - Recognizes excellence in research for submitted papers primarily authored and presented by a student at the workshop.
• IEEE EPS STUDENT TRAVEL GRANTS - The IEEE Electronics Packaging Society is pleased to provide a special Travel Grant to two students presenting their work at the workshop. The Grants are intended to support the costs directly tied to the event’s attendance.

Important Dates

• Paper Submission Opening: October 7, 2026
• Full Paper Submission: January 8, 2027
• Notification of Acceptance: February 1, 2027
• Final Paper Submission: March 1, 2027
• Early Bird Registration: March 1, 2027
• Sponsors Registration: March 1, 2027