IEEE SPI 2025: 29th IEEE Workshop on Signal and Power Integrity Conference Center at Angevin Castle Gaeta, Italy, May 11-14, 2025

Standing for almost three decades, the IEEE Workshop on Signal and Power Integrity (SPI) has evolved into a noteworthy forum of exchange on all aspects of Signal and Power Integrity, comprising the latest research and developments on design, characterization, modeling, simulation and testing at chip, package, board, and system level. The workshop brings together developers and researchers from academia and industry in order to encourage cooperation, and the technical program will include both oral and poster sessions, while several prominent experts will be giving keynotes and tutorials on areas of emerging interest. The 29th Edition of SPI will be held as an in-person event during May 11-14, 2025, at the Angevin Castle’s Conference Center in Gaeta, Italy.

Follow us on LinkedIn and feel free to look into our website for further information about SPI 2025, as well as broadcast the workshop in your institution or company, and to your fellow colleagues and students. It is a pleasure to invite you all to the 29th IEEE Workshop on Signal and Power Integrity and we look forward to your contribution and participation!

Call for Papers

Paper Submission is OPEN: Submit a Paper

Original and unpublished contributions on all aspects of Signal and Power Integrity are welcomed, related to the following topics of interest:

• Modeling and simulation for SI/PI
• Coupled signal and power integrity analysis
• Noise reduction and equalization techniques
• High-speed link design and modeling
• Power distribution networks
• RF/microwave/mm-wave systems and packaging solutions
• Antennas-in-package and antennas-on-chip
• 3D IC and packages (TSV/SiP/SoC)
• Nano-interconnects and nano-structures
• Electromagnetic theory and modeling
• Transmission line theory and modeling
• Macromodeling, reduced order models
• Electromagnetic compatibility
• Design methodology/flow measurements
• Jitter and noise modeling
• Stochastic/sensitivity analysis
• Electro-thermal modeling
• Chip-package co-design
• Novel CAD concepts
• Optical interconnects
• AI in electronics design

Accepted papers will be included in the workshop's program and submitted for inclusion into IEEE Xplore (subject to meeting scope and quality requirements for IEEE Xplore). Authors of the best ranked accepted papers will have the opportunity to submit an extended version of their work for publication in a special section of the IEEE Transactions on Components, Packaging and Manufacturing Technology.

Awards & Grants

• BEST PAPER AWARD - Recognizes the foremost paper among all papers submitted and presented during the workshop.
• BEST STUDENT PAPER AWARD - Recognizes excellence in research for submitted papers primarily authored and presented by a student at the workshop.
• IEEE EPS STUDENT TRAVEL GRANTS - o support costs directly tied to the event’s attendance, the IEEE Electronics Packaging Society will provide a special Travel Grant to two students presenting their work at the workshop.

If you're a student planning to submit a paper, check how to apply: Rules and Procedures

Sponsorships

Companies can actively support SPI 2025 with a sponsorship and take advantage of this key opportunity to promote products and services to our participants! Several sponsorship opportunities are available to choose from, each one with different marketing opportunities and attractive benefits, including Full Regular Registrations for Company representatives.

Registration for Sponsors is OPEN: Join us

Important Dates

• Full Paper Submission: December 20^th, 2024
• Notification of Acceptance: January 31^st, 2025
• Final Paper Submission: March 14^th, 2025
• Student Award & Grants Application: March 14^th, 2025
• Early Bird Registration: March 14^th, 2025
• Sponsors Registration: March 31^st, 2025