TENCON 2022: 2022 IEEE Region 10 Conference Hong Kong Convention and Exhibition Centre (HKCEC) Hong Kong, Hong Kong, November 1-4, 2022

Theme: Tech-Biz Intelligence

Submission Guidelines

All papers must be original and not simultaneously submitted to another journal or conference. The following paper categories are welcome:

• Full papers
• Posters

Up to 6-page Summary (including 35-word Abstract) based on IEEE conference template is required for submission.  All presented papers will be submitted to IEEE Xplore and EI Compendex.

List of Topics

• AI & Robotics
• Communications & Signal Processing
• Information Sciences
• Innovation & Entrepreneurship
• Leadership & Management
• Microelectronics
• New Materials
• Photonics
• Smarttech/Fintech/Edtech/Healthtech
• Sustainability & Social Impact

Committees

Program Committee

• Prof Kenneth Kin-Yip Wong, Technical Programme Co-Chair (The University of Hong Kong, Hong Kong)
• Prof Changyuan Yu, Technical Programme Co-Chair (The Hong Kong Polytechnic University, Hong Kong)
• Prof Yongxin Guo, Technical Programme Co-Chair (National University of Singapore, Singapore)
• Prof Oliver Diessel, Technical Programme Co-Chair (The University of New South Wales, Australia)

• T1: AI & Robotics
  • Xiaoling Hu, The Hong Kong Polytechnic University, Hong Kong (Co-Chair)
  • Benjamin Yen, The Hong Kong University, Hong Kong (Co-Chair)
  • Michael Chau, The Hong Kong University, Hong Kong
  • Yuan Yang, The University of Oklahoma, USA
  • Le Li, Northwestern Polytechnical University, China
  • Zengyong Li, National Research Centre for Rehabilitation Technical Aids Beijing, China
  • Yong Hu, The University of Hong Kong, Hong Kong
  • Hongchui Sohn, Northwestern University, USA
  • Cooper Ku, NYCU, Taiwan
• T2: Communications & Signal Processing
• T2 Special Session 1: Antennas for Wireless Connectivity
• T2 Special Session 2: Smart Technologies and Deep Learning for Multimedia Signal Processing
  • Yik-Chung Wu, The University of Hong Kong, Hong Kong (Co-Chair)
  • Qi Yang, Huazhong University of Science and Technology (Co-Chair)
  • Minghua Xia, SUN Yat-sen University, China (Co-Chair)
  • Jing Zhang, University of Electronic Science and Technology, China (Co-Chair)
  • H.K. Kwan, University of Windsor, Ontario, Canada (Co-Chair)
  • Peiran Wu, SUN Yat-sen University, China
  • Fangqing Tan, Guilin University of Electronic Technology, China
  • Lei Cheng, Zhejiang University, China
  • Bin Li, Beijing Institute of Technology, China
  • Fan Li, SUN Yat-sen University, China
  • Lilin Yi Yi, Shanghai Jiao Tong University, China
  • Songnian Fu, Guangdong University of Technology, China
  • Fan Zhang, Peking University, China
• T3: Information Sciences
  • Chung Chan, The City University of Hong Kong, Hong Kong (Co-Chair)
  • Linqi Song, The City University of Hong Kong, Hong Kong (Co-Chair)
  • Cong Wang, The City University of Hong Kong, Hong Kong
  • Chee Wei Tan, The City University of Hong Kong, Hong Kong
  • Pascal Olivier Vontobel, The Chinese University of Hong Kong, Hong Kong
  • Jie Xu, University of Miami, USA
  • Shao-Lun Huang, Tsinghua-Berkeley Shenzhen Institute, China
  • Navin Kashyap, Indian Institute of Science, India
  • Songze Li, Hong Kong University of Science & Technology (Guangzhou), China
  • Ali Al-Bashabsheh, Beihang University, China
• T4: Innovation & Entrepreneurship
  • Carol Liu, Hong Kong Science and Technology Parks Corporation, Hong Kong (Co-Chair)
• T5: Leadership & Management
  • Paulina Chan, Chartered Management Institute (CMI), Hong Kong (Co-Chair)
  • Derek Choi, Chartered Management Institute (CMI), Hong Kong (Co-Chair)
  • Alan Miller, Chartered Management Institute (CMI), Hong Kong (Co-Chair)
• T6: Microelectronics
  • Ray Cheung, The City University of Hong Kong, Hong Kong (Co-Chair)
  • Hang (Steve) Wong, The City University of Hong Kong, Hong Kong (Co-Chair)
  • Wei Lin, University of Technology Sydeny, Australia
  • Shaoyong Zheng, Sun Yat-Sen University, China
  • Yujian Li, Beijing Jiaotong University, China
  • Zhe Chen, Shenzhen University, China
  • Kaixu Wang, Harbin Institute of Technology, China
  • Xue Ren, Shenzhen University, China
  • Wen Jiang, Xidian University, China
  • Jose Carlos Pedro, Universidade de Aveiro, Portugal
  • Withawat Withayachumnankul, The University of Adelaide, Australia
  • Qiang Liu, Tianjin University, China
  • Zhe Liu, Nanjing University of Aeronautics and Astronautics, China
  • Jianguo Huang, Northwestern Polytechnical University, China
  • M. Balakrishnan, Indian Institute of Technology Delhi, India
  • Jiliang Zhang, Hunan University, China
  • Terence Mak, University of Southhampton, UK
• T7: New Materials
  • Qiming Shao, The Hong Kong University of Science and Technology, Hong Kong (Co-Chair)
  • Zhongrui Wang, The University of Hong Kong, Hong Kong (Co-Chair)
  • Ye Zhou, Shenzhen University, China
  • Suting Han, Shenzhen University, China
  • Mitch Guijun Li, The Hong Kong University of Science and Technology, Hong Kong
  • Jiaying Wu, The Hong Kong University of Science and Technology (Guangzhou), China
  • Renjing Xu, The Hong Kong University of Science and Technology (Guangzhou), China
• T8: Photonics
  • Renjie Zhou, The Chinese University of Hong Kong, Hong Kong (Co-Chair)
  • Cheng Wang, The City University of Hong Kong, Hong Kong (Co-Chair)
  • Andrew Poon, The Hong Kong University of Science and Technology, Hong Kong (Co-Chair)
  • Marko Loncar, Harvard University, USA (Co-Chair)
  • Yongkeun (Paul) Park, KAIST, South Korea
  • Jinyang Liang, INRS, Canada
  • Cuifang Kuang, Zhejiang University, China
  • Puxiang Lai, The Hong Kong Polytechnic University, Hong Kong
  • Junqiu Liu, Southern University of Science and Technology, China
  • Toshihiko Baba, Yokohama National University, Japan
  • Jianwei Wang, Peking University, China
  • Chaoran Huang, The Chinese University of Hong Kong
• T9: Smarttech/Fintech/Edtech/Healthtech
  • Raymond Tong, The Chinese University of Hong Kong, Hong Kong (Co-Chair)
  • Kannie WY Chan, The City University of Hong Kong, Hong Kong (Co-Chair)
  • Chwee Teck Lim, National University of Singapore, Singapore (Co-Chair)
  • Lucas Hui, ASTRI, Hong Kong (Co-Chair)
  • Chun Kwong Chan, The Chinese University of Hong Kong, Hong Kong (Co-Chair)
  • Sin Ming Yiu, The University of Hong Kong, Hong Kong (Co-Chair)
  • Leon Lai, The University of Hong Kong, Hong Kong (Co-Chair)
  • KP Mark, The Hong Kong Polytechnic University, Hong Kong (Co-Chair)
  • Gary Wong, The University of Hong Kong, Hong Kong (Co-Chair)
  • Crystal Luo, The Hong Kong University of Science and Technology, Hong Kong
  • Dick Chan, The Hong Kong Polytechnic University, Hong Kong
• T10: Sustainability & Social Impact
  • Wei-Ning Lee, The University of Hong Kong, Hong Kong (Co-Chair)
  • Kenneth Leung, Environmental Protection Department, HKSAR, Hong Kong (Co-Chair)
  • Russell Chan, Gense Technologies, Hong Kong
  • Mathieu Pernot, ESPCI Paris - PSL University, France
  • Jie-Zhi Cheng, United Imaging Intelligence, China
  • Tong Li, United Imaging, China
  • Tong S.P. Feng, The City University of Hong Kong, Hong Kong
  • Yunhe Hou, The University of Hong Kong, Hong Kong
  • Andreea Ioana Niculescu, Institute for Infocomm Research (I2R - A*Star), Singapore

Organizing committee

• Dr Paulina Chan, General Chair (Global Mutal Innovation Consortium)
• Dr Nim K Cheung, IEEE Hong Kong 50th Anniversiary Chair

• Technical Programme Committee
  • Prof Kenneth Kin-Yip Wong, Co-Chair (The University of Hong Kong)
  • Prof Changyuan Yu, Co-Chair (The Hong Kong Polytechnic University)
  • Prof Yongxin Guo, Co-Chair
  • Prof Oliver Diessel, Co-Chair
• Awards & Recognition Committee
  • Prof Wan-chi Siu, Chair
  • Prof KM Luk
  • Prof Paul Cheung
  • Prof PC Ching
  • Prof Vincent Lau
• Special Sessions, Students Forum & SA Exhibits
  • Paul Hodgson, Co-Chair
  • George Woo, Co-Chair
  • Kevin Lam, Co-Chair
  • George Chan, Co-Chair
  • Dr Tim Woo, Co-Chair
  • Adrian Kwan, Co-Chair
• General Secretariat
  • Prof Joseph Ng (Hong Kong Baptist University)
  • Dr Jean Lai
• Treasurer & Finance
  • Dr Eddy Chiu, Co-Chair
  • George Woo, Co-Chair
• Sponsorship
  • Prof Joseph Ng (Hong Kong Baptist University)
  • Dr Ray Cheung (City University of Hong Kong)
  • Dr Albert Lam (Fano Labs)
  • Dr Paulina Chan (Global Mutual Innovation Consortium)
• Industry Liaison
  • Dr Albert Lam (Fano Labs)
  • Dr Eddy Chiuy
• Website
  • Dr Ray Cheung (City University of Hong Kong)
  • Momentous Asia Travel & Events Co. Ltd
• Publications (IEEE Xplore)
  • Dr Gary Wong (Faculty of Education, The University of Hong Kong)
  • Dr Jeff K.T. Tang (Hong Kong Productivity Council)
  • Technical Programme Sub-Committee
• Registration & Payment
  • Dr Gary Wong (Faculty of Education, The University of Hong Kong)
  • Momentous Asia Travel & Events Co. Ltd.
• Local Arrangements
  • Dr Kevin Hung (Hong Kong Metropolitan University)
  • Hong Kong Tourism Board
• Publicity
  • TENCON 2022 Secretariat
  • IEEE Hong Kong Section ExCom
  • IEEE Corporate Communications
  • IEEE Public Visibility Committee

Contact

All questions about submissions should be emailed to TENCON 2022 Secretariat Office: tencon2022@gmail.com.