SIES 2018: 13th International Symposium on Industrial Embedded Systems Graz University of Technology Graz, Austria, June 6-8, 2018 |
Conference website | http://sies2018.tugraz.at |
Submission link | https://easychair.org/conferences/?conf=sies2018 |
Submission deadline | February 25, 2018 |
The IEEE Symposium on Industrial Embedded Systems (SIES) is a highly selective single-track international conference focusing on premier research results for embedded systems - an area of highest relevance for visionary technologies such as the Internet of Things (IoT) and applications such as Industry 4.0, Smart Production, Smart Cities, Connected Cars, etc.
The aim of the symposium is to bring together researchers and practitioners from industry and academia. SIES provides a platform to report on recent developments, deployments, technology trends and research results, as well as to discuss and start initiatives related to embedded systems and their applications in a variety of industrial environments.
Submission Guidelines
All papers must be original and not simultaneously submitted to another journal or conference. The following paper categories are welcomed:
- Full papers
The papers are expected to report on novel developments, not published yet elsewhere, with a prospect for a tangible impact on the research area and, hopefully, a potential for practical implementations. The need for the work done has to be established: why important, and who is going to benefit from it. It is important that the work is put in the framework of the works published by others, if relevant – outlining the differences, novelty, and arising benefits.
- Work-in-Progress papers
Work-in-Progress papers describe research that has not yet produced results required for a regular paper, but due to novelty and potential impact deserves to be shared with the community at an early stage. Accepted WIP papers will be published in the conference proceedings.
- Posters
Along with full research papers, SIES 2018 solicits submissions of poster abstracts whose contribution will be publicly presented during the conference. The poster session will provide a forum for researchers to present their work in progress and to receive feedback from experts attending the conference. The areas of interest for poster abstracts are the same as for full research papers.
List of Topics
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Embedded Systems
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System-on-Chip and Network-on-Chip
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Networked Embedded Systems
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Embedded Applications
Committees
General Co-Chairs
- Marcel Baunach, TU Graz, Austria
- Roman Obermaisser, University of Siegen, Germany
Program Committee Co-Chairs
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Roberto Passerone, Univ of Trento, Italy
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Stig Petersen, SINTEF, Norway
- Roman Obermaisser, University of Siegen, Germany
WiP and Posters Co-Chairs
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Tobias Hoßfeld, University of Duisburg, Germany
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Haibo Zeng, VirginiaTech, USA
Publication
SIES 2018 proceedings will be published in IEEE Xplore.
Venue
The conference will take place at the Graz University of Technology, Austria.
Contact
All questions about submissions should be emailed to sies2018@iti.tugraz.at.
Sponsors
IEEE; CEDA (IEEE Council on Electronic Design Automation); Embedded Automotive Systems Group, TU Graz, Austria; AVL List GmbH