2018 IEEE INTERCON: 2018 IEEE XXV International Conference on Electronics, Electrical Engineering and Computing Universidad Nacional Mayor de San Marcos Lima, Peru, August 8-10, 2018

2018 IEEE INTERCON

The IEEE XXV International Congress on Electronics, Electrical Engineering and Computing (INTERCON 2018) aims to bring together researchers, professionals, students and entrepreneurs to promote the exchange of ideas and the promotion and production of research in various technological fields. INTERCON facilitate the approach, identification and commitment to joint challenges that allow greater access to and development of technologies for the benefit of humanity, as it is the vision of the IEEE.

INTERCON 2018 will be held in Lima, World Heritage Site. Museums with great works of art, archaeological sites, beaches, the boardwalk, valleys, natural reserves, the nightlife, the thrill of adventure sports, and the exquisite cuisine gives Peru’s capital an authentic personality and makes tourism in Lima a unique experience in the country.

Submission

The official language of 2018 IEEE INTERCON is ENGLISH. Papers must be submitted in PDF and should be no longer than 04 pages, following the IEEE Conference format, available on: Manuscript Templates for Conference Proceedings.

Papers can be submitted using the Easychair System by accessing the following address: Go to Conference EasyChair website.

Accepted technical papers will be submitted to the IEEE Xplore Digital Library.

Topics

The Conference Organizing Committee invites you to submit a full length original research contributions from engineering professionals from industries, R&D organizations, academic institutions, government departments and research scholars from across the world. The conference scopes covers the following general topics (included but not limited to):

Computing (C)

• Algorithms and Complexity.
• Architecture and Organization.
• Graphics and Visualization.
• Human-Computer Interaction.
• Information Assurance and Security.
• Information Management.
• Intelligent Systems.
• Networking and Communications.
• Operating Systems.
• Parallel and Distributed Computing.
• Software Engineering.
• Social Issues and Professional Practice.

Electronics and Communication (EC)

• Broad Band Communication.
• Computer and Intelligent Communication.
• Mobile and Optical Communication.
• Wireless Communication.
• Mobile and Optical Networks.
• Wireless Sensor Networks.
• Network Security.
• Advanced VLSI Systems.
• Embedded Wireless Systems.
• Signal and Image Processsing.
• Artificial Intelligence.
• Aerospace Technology.
• Biomedical Engineering.
• Control Systems.
• Robotics.

• Geo-informative Systems.
• Soft Computing Techniques in Power Systems.
• Feedback Control Systems.
• Power Electronics and Energy Efficient Drives.
• Renewable Power Conversion Technologies.
• Instrumentation and Control.
• Power Quality Improvement Techniques.
• Expert Systems and Artificial Intelligence Techniques.

Importand Dates

Venue

The conference will be held on August 08-10, 2018 at Universidad Nacional Mayor de San Marcos (Lima - Peru).

Contact

All questions about submissions should be emailed to joseduran@ieee.org.

Further information can be found on the conference website: intercon.org.pe.

We look forward to your participation in 2018 IEEE INTERCON and welcoming you to Lima, Peru!