IESS 2021: International Embedded Systems Symposium Online Online, Germany, November 3-5, 2021 |
Conference website | http://www.iess.org |
Submission link | https://easychair.org/conferences/?conf=iess2022 |
Over recent years, embedded systems have gained an enormous amount of processing power and functionality. Computing-intensive tasks (e.g., Artificial Intelligence, deep learning, and forecasting/prediction algorithms) are being increasingly embedded into these systems as the amount of processing and storage resources increases. Many of the formerly external components can now be integrated into a single System-on-Chip. This tendency has resulted in a dramatic reduction in the size and cost of embedded systems. As a unique technology, the design of embedded systems is an essential element of many innovations in modern society.
Embedded systems meet their performance goals, including real-time constraints, through a combination of special-purpose hardware and software components tailored to the system requirements and its expected services. Both the development of new features and the reuse of existing intellectual property components are essential to keeping up with ever-demanding customer requirements and needs. Furthermore, design complexities are steadily growing with an increasing number of components that have to cooperate properly and timely.
Embedded system designers have to cope with multiple goals and constraints simultaneously, including timing, power, reliability, dependability, maintenance, packaging, and, last but not least, price. The significance of these constraints varies depending on the application area a system is targeted for. Typical embedded applications include multimedia, automotive, aerospace, medical and communication devices, robotics, and many others.
The goals of the International Embedded Systems Symposium are to present, exchange and discuss the state of the art, novel ideas, actual research results, and future trends in the field of embedded systems. Contributors and participants from both industry and academia are encouraged to take an active part in this symposium.
Submission Guidelines
All papers must be original and not simultaneously submitted to another journal or conference.
The Proceedings will be published by Springer, the official publisher of IFIP. IMPORTANT: Springer changed the layout for the IFIP series. Full details on how to format your paper can be found on the website of the conference publisher Springer. Springer will contact you if the paper is not in the proposed layout. Accepted full papers have a page limit of 12 pages, short papers of 10 pages. Again, please make sure to use the right paper style.
- All submitted papers will follow a blind review process.
- The Proceedings will be published by Springer, the official publisher of IFIP.
- Top-ranking papers will also be invited for publication in a special edition journal (TBA).
List of Topics
- Design methods and tools for embedded systems design;
- Novel and dedicated architectures for embedded systems (IoT, deep learning, etc);
- Challenges of moving or evolving embedded system architectures to the edge of clouds;
- Application-specific processors: architectures, design tools, and hardware/software co-design;
- Processing/Communication trade-offs at architectural level;
- Domain-Specific Languages at various abstraction levels;
- Model-Based or Model-Driven Engineering (MDE) methods and languages targeting embedded systems design at different abstraction levels;
- Reconfigurable architectures and applications;
- Low power processing and communication architectures;
- Real-time challenges for embedded systems and systems-of-systems;
- Human Machine Interface techniques and methods tailored for Embedded Systems;
- Security issues for embedded and real-time systems;
- Engineering Applications of Artificial Intelligence targeting embedded systems, their sensors/actuators, and the interaction with the physical world.
- Case studies of innovative Embedded Systems;
- Embedded Systems Applications: Automotive, Avionics, Medical, Internet-of-Things (IoT), Industry 4.0, Smart Cities, Smart Grids, Computer Vision, ''Intelligent'' and Autonomous Systems.
Committees
Program Committee
- See the full list of PC members on www.iess.org
Organizing committee
- General Chairs:
- Marcio Kreutz, Federal University of Rio Grande do Norte (UFRN), Brazil
- Stefan Henkler, University of Applied Sciences Hamm-Lippstadt, Germany
- Program Chairs
- Marco Aurelio Wehrmeister, Federal University of Technology - Parana (UTFPR), Brazil
- Publicity Chairs
- Marcelo Götz, Federal University of Rio Grande do Sul (UFRGS), Brazil
- Financial Chair
- Achim Rettberg, University of Applied Sciences Hamm-Lippstadt, Germany
- Web Chair
- Charles Steinmetz, University of Applied Sciences Hamm-Lippstadt, Germany
Contact
All questions about submissions should be emailed to Márcio Eduardo Kreutz <kreutz@dimap.ufrn.br> and Stefan Henkler <Stefan.Henkler@hshl.de>