ICPP-EMS 2020: The 2020 International Workshop on Embedded Multicore Systems Edmonton, AB, Canada, August 17-20, 2020 |
Conference website | https://sites.google.com/view/icpp-ems-2020 |
Submission link | https://easychair.org/conferences/?conf=icppems2020 |
Submission deadline | April 24, 2020 |
Embedded systems with multicore designs are of major focuses from both industry and academia. While embedded multicore systems will look to play an important role ahead for system designs, many challenging issues remain. Applications, programming models, architecture designs, emerging memory architectures, and software tools all need to help for the advance of embedded multicore computing ahead.
The 2020 International Workshop on Embedded Multicore Systems (ICPP-EMS 2020) will bring researchers and experts together to present and discuss the latest developments and technical solutions concerning various aspects of embedded multicore computing.
ICPP-EMS 2020 seeks original unpublished papers focusing on emerging applications, embedded compilers, embedded memory and architecture design, DSP/GPU systems, ESLs, embedded multicore programming models, and WCET analysis. Moreover, ICPP-EMS 2020 also welcomes work-in-progress, case studies, visionary idea, new application challenges, and industrial practice studies.
ICPP-EMS 2020 is organized in conjunction with The 49th International Conference on Parallel Processing (ICPP 2020), Edmonton, AB, Canada during August 17-20, 2020.
Submission Guidelines
All papers must be original and not simultaneously submitted to another journal or conference.
Original papers from the aforementioned and related topics will be considered. Please submit regular full papers (limit to 8 pages) including all figures, tables, and references. Papers should be submitted electronically in PDF format together with a short abstract (approximately 150 words) using the EasyChair Submission system, following the link:
https://www.easychair.org/conferences/?conf=icppems2020
Submitted papers must not have appeared in or be under review/consideration for another workshop, conference or a journal during the review process. Each submission will be reviewed by at least three reviewers. Authors are requested to follow the standard format as ICPP main conference. Please visit the following URL for additional information:
https://jnamaral.github.io/icpp20/callPapers/
List of Topics
Topics of interest are in all areas of (or related to) embedded multicore systems, including, but not limited to
- Memory Architectures for embedded multicore systems
- Design for emerging embedded memory systems
- Compilers for DSP processors
- Embedded multicore processors
- Compilers for heterogeneous embedded multicore systems.
- Compiler Optimizations with SPIR-V
- Programming models for embedded multicore systems
- Signal processing on embedded multicore systems
- Multimedia signal processing algorithms on embedded multicore systems
- Multimedia applications on embedded multicore systems
- Machine learning on embedded multicore systems
- Human-computer interaction on multicore systems
- Augmented reality applications on multicore systems
- Software for multicore, GPU, and embedded architectures
- VM for embedded systems
- 3D IC and multicore architectures
- Real-time system designs for embedded multicore environments
- Compiler for low-power
- ESL designs for embedded multicore systems
- Applications for Automobile electronics of multicore designs
- Embedded OS designs and performance tuning tools
- Hardware/software co-design framework
- Embedded devices + cloud computing framework
- Compiler for worst-case execution time analysis
- Formal method for embedded systems
IMPORTANT DATES
Submission due date: April 22, 2020
Notification date: May 22, 2020
Camera Ready due date: June 8, 2020
Author registration due date: TBA
EMS Workshop date: August 17, 2020 (TBA)
ICPP Conference dates: August 17-20, 2020
Organizers
General Chairs
Jenq Kuen Lee, National Tsing-Hua University, Taiwan
Peng-Sheng Chen, National Chung-Cheng University, Taiwan
Program Chairs
Yung-Chia Lin, MediaTek, Boston, USA
Yi-Ping You, National Chiao Tung University, Taiwan