ICMEE 2026: 2026 the 12th International Conference on Mechanical and Electronics Engineering Guangzhou, China, December 29-31, 2026 |
| Conference website | https://www.icmee.org/ |
| Submission link | https://easychair.org/conferences/?conf=icmee2026 |
| Submission deadline | June 30, 2026 |
2026 the 12th International Conference on Mechanical and Electronics Engineering (ICMEE) is to be held in Guangzhou, China on December 29-31, 2026, which will be Sponsored by South China University Of Technology, China and hosted by School of Automation Science and Engineering, South China University Of Technology, China. ICMEE 2026 remains a premier interdisciplinary platform for researchers and engineers to explore the integration of mechanical principles, electronics, and computer technology. Since its inception in 2009, the conference has traveled to global hubs such as Chennai(India), Kyoto(Japan), Hefei, Tianjin, Beijing, Xi'an and Shenzhen, consistently fostering innovation in robotics, smart materials, and intelligent systems.
Submission Guidelines
Preparation of the Manuscript
- All manuscripts must be written in English.
- The minimum page limit for all manuscripts is 4 full pages, and the maximum limit is 12 pages.
- Standard registration covers up to 6 pages. Each additional page will be chargeable.
- Manuscripts should state clearly and concisely the problem, methodology, and central conclusions.
- A bibliography must be included to place the contributions into context.
Submission of the Manuscript
- Electronic Submission: Please submit your document via the iConf conference system link below.
- Manuscripts will be visually inspected by staff to ensure formatting requirements are met for ICMEE proceedings.
- Papers passing inspection will enter the technical review process by the committee.
- Reviewers will rate papers on relevance, contribution, and originality. Decisions will be sent via email with review forms.
List of Topics
- Biomedical Electronics and Biomechanical Devices
- Wearable Electronics for Motion and Health Monitoring
- Bio-inspired Electro-Mechanical Systems
- High Voltage Systems and Insulation
- Analog, Digital, and Mixed-Signal Circuits
- Power Electronics for Mechanical Drives
- Smart Materials for Electronics and Mechanics
- Composite Materials for Lightweight Structures
- Advanced Manufacturing for Integrated Systems
- Non-destructive Testing for Reliability
- Precision Engineering
- 3D Printing Technologies
- ...
Committees
Advisory Chair
Yangquan Chen, University California Merced
Conference Chairs
Yongsheng Ma, Southern University of Science and Technology
Maode Yan, Chang'an University
Song Gao, Xi'an University of Technology
Conference Co-Chair
Dan Zhang, The Hong Kong Polytechnic University
Program Chairs
Zhihai He, Southern University of Science and Technology, IEEE FELLOW
Junsuo Qu, Xi'an University of Posts and Telecommunications
Chaobo Chen, Xi'an University of Technology
Fei Hui, Chang'an University
Program Committee
Junfeng Jing, Xi'an Polytechnic University
Pai Zheng, The Hong Kong Polytechnic University
Yi Xiong, Southern University of Science and Technology
Panpan Yang, Chang'an University
International Program Committee
Jiehan Zhou, University of Oulu
Xian Sun, University of New Mexico
Jiangzhuo Ren, Chang'an University
Yirui Qiu, Xiamen University of Technology
Academic Committee Chairs
Min Ye, Chang'an University
Xiaoru Song, Xi'an Technological University
Ting Zhang, Soochow University
Shaojie Tang, Xi'an University of Posts and Telecommunications
Invited Speakers
- Speaker 1 Prof. Ruxandra Mihaela Botez, ÉTS - Quebec Universitys, Canada
- Speaker 2 Assoc. Prof. Shaoke Wan, Xi'an Jiaotong University, China
- Speaker 3 Assoc. Prof. Panpan Yang, Chang’an University, China
- Speaker 4 Assoc. Prof. Junxing Zhang, Guizhou University, China
Publication
All accepted papers will be published on Conference Proceedings, which will be included in Digital Xplore and indexed by EI Compendex and Scopus, etc.
Contact
Hannah Xu