EAAI Conference 2018: Engineering Applications of Artificial Intelligence Conference Sutera Harbour Resort Kota Kinabalu, Malaysia, December 3-5, 2018 |
Conference website | http://www.inv.com.my/eaai-conference |
Submission link | https://easychair.org/conferences/?conf=eaaiconference2018 |
Poster | download |
Abstract registration deadline | June 30, 2018 |
Submission deadline | August 31, 2018 |
Engineering Applications of Artificial Intelligence (EAAI) Conference 2018 is a conference that is held to bring together scientists, engineers, researchers and practitioners to share latest information, trends & technology in the field of engineering applications of machine learning and artificial intelligence.
Submission Guidelines
All papers must be original and not simultaneously submitted to another journal or conference. The following paper categories are welcome:
- Full papers describing that authors should submit the full paper in Microsoft Word format (e.g., PaperID_EAAIC001.doc). The paper should be FIVE (5) to SIX (6) pages and clearly state the objectives, methods, results, and conclusion of the research work. The paper should emphasize the novel aspects of the work.
- Posters describing call for paper for submission abstract to the Engineering Applications of Artificial Intelligence Conference (EAAIC 2018) which is scheduled on 3rd - 5th December at the Sutera Harbour Resort, Kota Kinabalu, Sabah, Malaysia. EAAIC 2018 is a conference that is held to bring together scientists, engineers, researchers and practitioners to share latest information, trends and technology in the field of engineering applications of machine learning and artificial intelligence.
List of Topics
- Machinery Condition Monitoring; Engineering Assets Management; Non-Destructive Testing; Structural Health Monitoring;
- Autonomous Vehicle & Transportation System; Advanced Manufacturing ; Robotics and Control; Sensors and Actuators; Signal Processing;
- Deep learning & Big Data Analytic; Speech Recognition; Computer Aided-Design; Smart Building; Industrial 4.0;
- Wireless Sensor Networks; Internet of Thing; Smart Material;Bio-medicals Engineering; and Other related engineering applications.
Committees
Program Committee
- Dr Salman Leong
- Dr Goran Pavić
- Dr Ong Pauline
- Dr Ngui Wai Keng
- Dr Lim Meng Hee
- Dr Raja Ishak Raja Hamzah
- Dr Zair Asrar Bin Ahmad
- Dr Jiang Xiaoxia
- Dr K. Sudhakar
- Dr Ponnambalam Sivalinga Govin
Organizing committee
-
ADVISOR - Prof Dr Salman Leong
CHAIRMAN - Dr Lim Meng Hee
SECRETARY - Dr Zair Asrar bin Ahmad
- Muhammad Firdaus bin Isham
TREASURER - Hui Kar Hoou
- Ooi Ching Sheng
PUBLICATION - Dr Salah Al-Obaidi
- Mohd Syahril Ramadhan bin Mohd Saufi
MARKETING & PUBLICITY - Dr Ngui Wai Keng
- Muhammad Danial bin Abu Hasan
PROGRAM & FOOD - Yap Jee Siang
- Mohd Naqiuddin bin Mohd Salleh
TECHNICAL & LOGISTICS - Somia AlfatihMohamed Saeed
- Mohd Fadzil bin Hassan
Publication
All paper will be published in the conference proceedings indexed by SCOPUS. Selected papers will be recommended to the following SCOPUS Indexed Journals:
- Jurnal Teknologi UTM
- Pertanika Journal of Science & Technology (JST)
- Journal of Telecommunication, Electronic and Computer Engineering (JTEC)
Venue
EAAI Conference 2018 is planned to be held at Sutera Harbour Resort, Kota Kinabalu, Sabah, Malaysia. Sabah, also known as “The World’s Top Dive Sites & A Nature Lover’s Paradise”, is a destination that is totally unexpected, offering the world’s oldest rainforest – 130 million years old, 70 million years older than the Amazon Rainforest, crystal-clear waters with the largest marina bio-diversity, unique flora and fauna, and also the highest mountain between the Himalayas and New Guinea, Mount Kinabalu, towering at 4,095m (13,435 feet). Visitors attractions in Sabah includes Tunku Abdul Rahman Marine Park, Mount Kinabalu, Garama Wetland, Sipadan Island, Gomantong Cave, Danum Valley, Sepilok Orang Hutan Sanctuary and so much more.
Contact
All questions about submissions should be emailed to our EAAI Conference Secretariat : eaai.conference@gmail.com.