CFP
DCAI'22: 19th International Conference on Distributed Computing and Artificial Intelligence University of L'Aquila L'Aquila, Italy, July 13-15, 2022 |
Conference website | https://www.dcai-conference.net/ |
Submission link | https://easychair.org/conferences/?conf=dcai22 |
Submission deadline | April 22, 2022 |
SCOPE
The 19th International Conference on Distributed Computing and Artificial Intelligence 2022 is an annual forum that will bring together ideas, projects, lessons, etc. associated with distributed computing and artificial intelligence, and their application in different areas. This meeting will be held in L'Aquila (Italy) within PAAMS'22 in 13th-15th July, 2022.
Nowadays, most computing systems, ranging from personal laptops/computers to cluster/grid /cloud computing systems, are capable of parallel and distributed computing. Distributed computing performs an increasingly important role in modern signal/data processing, information fusion and electronics engineering (e.g., electronic commerce, mobile communications and wireless devices). Particularly, applying artificial intelligence in distributed environments is becoming an element of high added value and economic potential. Research on Intelligent Distributed Systems has matured over the last decade and many effective applications are now being deployed. Artificial intelligence is changing our society. Its application in distributed environments, such as the Internet, electronic commerce, mobile communications, wireless devices, distributed computing, is becoming more widespread, and is becoming an element of high added value and economic potential, in both industry and research. These technologies are changing constantly as a result of the large research and technical effort being undertaken in both universities and businesses. The exchange of ideas between scientists and technicians from both academic and business backgrounds is essential to facilitating the development of systems that meet the demands of today's society. Technology transfer in this field is still a challenge and for that reason this type of contributions will be given special consideration at this symposium.
TOPICS
At least one of the authors will be required to register and attend the symposium where they will present the paper, this will allow for its inclusion in conference proceedings.
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INVITED SPEAKERS
Hugues Bersini, Université Libre de Bruxelles, Co-Director of the IRIDIA laboratory (Belgium)
Tiziana Catarci, Computer Science and Engineering at Sapienza University of Roma (Italy)
Danny Weyns, Katholieke Universiteit Leuven (Belgium) / Linnaeus University (Sweden)
SPECIAL ISSUES
The Scientific Committee of the co-located conferences in collaboration with the guest editors will select the best papers from those presented in the conferences to be considered for publication in the following Special Issues:
∎ Special Issue published in the International Journal of Interactive Multimedia and Artificial Intelligence (ISSN: 1989 - 1660, JCR (2020): 3,137 (Q2))
∎ Special Issue published in the MDPI Electronics Journal (ISSN: 2079-9292, JCR (2020): 2.397 (Q3))
∎ Special Issue published in the MDPI Systems Journal (ISSN: 2079-8954, JCI (2020): 1.27 (Q1))
∎ Special Issue published in ADCAIJ (ISSN: 2255-2863, JCI (2020): 0.06 (Q4))
To be updated
LIST OF SPECIAL SESSIONS IN DCAI 2022
AIMPM
CompLingInfoReasAI'22
MaTe-AI&ML
SMITE
TECTONIC
AWARDS
- MDPI Systems Best Paper Awards
- MDPI Electronics Best Paper Awards
COMMITTEE
Honorary Chair
- Sigeru Omatu - Hiroshima University (Japan)
Program Committee
- Rashid Mehmood - King Abdulaziz University (Saudi Arabia)
- Pawel Sitek - Kielce University of Technology (Poland)
Organizing Committee
- Sara Rodríguez - University of Salamanca (Spain)
- Serafino Cicerone - University of L'Aquila (Italy)
- Pablo Chamoso - University of Salamanca (Spain)
- José Manuel Machado - University of Minho (Portugal)
Advisory Board
- Yuncheng Dong - Sichuan University (China)
- Francisco Herrera - University of Granada (Spain)
- Kenji Matsui - Osaka Institute of Technology (Japan)
- Tan Yigitcanlar - Queensland University of Technology (Australia)
- Tiancheng Li - Northwestern Polytechnical University (China)
DOCTORAL CONSORTIUM
The aim of the Doctoral Consortium is to provide a framework as part of which students can present their ongoing research work and meet other students and researchers and obtain feedback on lines of research for the future.
The Doctoral Consortium is intended for students who have a specific research proposal and some preliminary results, but who are still far from completing their dissertation.
All proposals submitted to the Doctoral Consortium will undergo a thorough reviewing process with the aim of providing detailed and constructive feedback. The accepted submissions will be presented at the Doctoral Consortium and published in the conference proceedings.
FORMAT
DCAI papers must be formatted according to the Springer LNNS Template, with a maximum length of 10 pages (6 pages for Doctoral Consortia), including figures and references.
SUBMISSION
All proposed papers must be submitted in electronic form (PDF format) using the DCAI 2022 conference management system.
PUBLICATION
Accepted papers will be included in DCAI Proceedings.
At least one of the authors will be required to register and attend the symposium, where they will present the paper, this will allow for its inclusion in conference proceedings. All the accepted papers will be published by LNNS series of Springer Verlag.
** Indexing: The books of this series are submitted to SCOPUS, INSPEC, WTI Frankfurt eG, zbMATH, SCImago.**
IMPORTANT DATES
- Submission date:
22nd April, 202229th April, 202210th May, 2022 - Doctoral Consortium deadline:
13th May, 202220th May, 2022 - Notification of acceptance: 30th May, 2022
- Camera-Ready papers due: 17th June, 2022
- Conference Celebration: 13th-15th July, 2022
ORGANIZERS
Hiroshima University (Japan)
King Abdulaziz University (Saudi Arabia)
Kielce University of Technology (Poland)
University of Granada (Spain)
University of Minho (Portugal)
Osaka Institute of Technology (Japan)
Sichuan University (China)
University of Salamanca (Spain)
Northwestern Polytechnical University (China)
Queensland University of Technology (Australia)
SPONSORS
SUPPORT FROM NATIONAL ASSOCIATIONS