ESREF 2016: 27TH EUROPEAN SYMPOSIUM ON RELIABILITY OF ELECTRON DEVICES, FAILURE PHYSICS AND ANALYSIS

This page contains an index consisting of author-provided keywords.

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(cross-sectional nanoprobing)	Cross-sectional Nanoprobing Fault Isolation Technique on Submicron Devices
(electrical failure analysis)	Cross-sectional Nanoprobing Fault Isolation Technique on Submicron Devices
(fault isolation)	Cross-sectional Nanoprobing Fault Isolation Technique on Submicron Devices
(nanoprobing)	Cross-sectional Nanoprobing Fault Isolation Technique on Submicron Devices
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- automotive electronics failures on system level	Early life field failures in modern automotive electronics – An overview, root causes and precautions
- automotive electronics reliability	Early life field failures in modern automotive electronics – An overview, root causes and precautions
- early life automotive electronics failures	Early life field failures in modern automotive electronics – An overview, root causes and precautions
2
28nm UTBB FD-SOI	On the need for a new ESD verification methodology to improve the reliability of ICs in advanced 28nm UTBB FDSOI technology
2DEG	Scanning Microwave Microscopy for Electronic Device Analysis on Nanometre Scale
3
3D integration	Fast and Trusted Intrinsic Stress Measurement to Facilitate Improved Reliability Assessments
3D-Integration	Automatized Failure Analysis of Tungsten Coated TSVs via Scanning Acoustic Microscopy
4
4H-SiC	Lifetime Estimation of SiC MOSFETs under High Temperature Reverse Bias Test
6
65 nm	Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop
A
abalanche breakdown	UIS test of high-voltage GaN-HEMTs with p-type gate structure
AC stress	Channel width dependence of AC stress on bulk nMOSFETs
accelerated aging	Microcontroller susceptibility variations to EFT burst during accelerated aging
Accelerated Life Test	Accelerated Life Test of high luminosity blue LEDs
acceleration modelling	End of life and acceleration modelling for power diodes under High Temperature Reverse Bias stress
Acid decapsulation	Improved Etching Recipe for Exposing Cu Wire allowing Reliable Stitch Pull
Acoustic Microscopy	Detection and Analysis of Stress-induced Voiding in Al-Power lines by Acoustic GHz-Microscopy
activation energy	End of life and acceleration modelling for power diodes under High Temperature Reverse Bias stress
AEC-Q006	Improved Etching Recipe for Exposing Cu Wire allowing Reliable Stitch Pull
AFM-based nanoprober	Fault isolation at P/N junction by nanoprober
aging	Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop Gate oxide degradation of SiC MOSFET under short-circuit aging tests
Aging Law	Chemical rate phenomenon approach applied to Lithium battery capacity fade estimation
Aging tests	Effects of drain quiescent voltage on the ageing of AlGaN/GaN HEMT devices in pulsed RF mode
Al Power metal lines	Detection and Analysis of Stress-induced Voiding in Al-Power lines by Acoustic GHz-Microscopy
AlGaN/GaN	Correlation of gate leakage and local strain distribution in GaN/AlGaN HEMT structures Structural disturbances in GaN HEMT layers as source of leakage current, influencing device performance and reliability Role of Two-Dimensional Electron Gas (2DEG) in AlGaN/GaN High Electron Mobility Transistor (HEMT) ON-State Degradation
AlGaN/GaN High Electron Mobility Transistor (HEMT)	Reliability assessment of ultra-short gate length AlGaN/GaN HEMTs on Si substrate by on-state step stress
Aluminium Graphite	Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules
Aluminum	Mechanisms of metallization degradation in high power diodes
anomaly detection	FESeR: a data-driven framework to enhance sensor reliability for the system condition monitoring
Arrhenius law	End of life and acceleration modelling for power diodes under High Temperature Reverse Bias stress
Assembly	Reliability Evaluation of Si-Dies due to Assembly Issues
Assessment method	An in depth analysis of pull-up capacitance-voltage characteristic for dielectric charging assessment of MEMS capacitive switches
Atmospheric radiation	Natural Radiation Events in CCD Imagers at Ground Level
Atom probe tomography	Ga contamination in silicon by focused ion beam milling: Atom Probe Tomography and simulation with dynamic model
AuSn 8020	Power electronic assemblies: thermo-mechanical degradations of gold-tin solder for attaching devices
AuSn interconnection	Optimization of contact metallizations for reliable wafer level Au-Sn bonds
Autoclave	Moisture absorption by molding compounds under extreme conditions: impact on accelerated reliability tests
Autocorrelation	Automatic process for Time-Frequency scan of VLSI
Automatization	Automatized Failure Analysis of Tungsten Coated TSVs via Scanning Acoustic Microscopy
Avalanche	Avalanche Robustness of SiC Schottky Diode
B
Bending test	Detection of cracks in multilayer ceramic capacitors by X-ray imaging
BEOL	Detection and Analysis of Stress-induced Voiding in Al-Power lines by Acoustic GHz-Microscopy
bias stress	Instability of oxide thin film transistor under electrical-mechanical hybrid stress for foldable display
Binary collision approximation	Ga contamination in silicon by focused ion beam milling: Atom Probe Tomography and simulation with dynamic model
board level reliability	77Ghz Automotive RADAR in eWLB package: from consumer to automotive packaging
Body diode	Body diode reliability investigation of SiC power MOSFETs
body effect	Electrical analysis on implantation-related defect by nanoprobing methodology
Bodybias	Performance vs. Reliability Adaptive Body Bias Scheme in 28nm & 14nm UTBB FDSOI nodes
Bond wire	Mission-profile-based stress analysis of bond-wires in SiC power modules
bond-pad	Application of Laser Deprocessing Technique in PFA on Chemical Over-etched on Bond-pad Issue
Breakdown voltage	200V FRED diode with superior ESD capability
breakdown voltage drift	End of life and acceleration modelling for power diodes under High Temperature Reverse Bias stress
Brittle and ductile failure	Numerical Investigation of the Effects of Phosphorus on the Mechanical Responses of [1 1 0]-oriented Silicon Nano-wires
BTI	Degradation and Recovery of variability due to BTI Performance vs. Reliability Adaptive Body Bias Scheme in 28nm & 14nm UTBB FDSOI nodes
Buffer layer	200V FRED diode with superior ESD capability
Bulk CMOS	FDSOI and Bulk CMOS SRAM Cells Resilience to Radiation Effects
C
CAD navigation	Evolution of navigation and simulation tools in failure analysis
CAFM	Analysis of Quantum Conductance, Read Disturb and Switching Statistics in HfO2 RRAM Using Conductive AFM
Calendar ageing	Chemical rate phenomenon approach applied to Lithium battery capacity fade estimation
Cantilever	Scanning Microwave Microscopy for Electronic Device Analysis on Nanometre Scale
capability of heat dissipation	Effects of stress-loading test methods on the degradation of light-emitting diode modules
capacitor	Charging–discharging characteristics of a wound aluminum polymer capacitor
catastrophic damage	Catastrophic optical damage of high power InGaAs/AlGaAs laser diodes
Cathodoluminescence	Catastrophic optical damage of high power InGaAs/AlGaAs laser diodes
charge injection	Study on non-contact current path formation using charged particle beams
Charged Coupled Devices	Natural Radiation Events in CCD Imagers at Ground Level
charged particle beam	Study on non-contact current path formation using charged particle beams
charging-discharging	Charging–discharging characteristics of a wound aluminum polymer capacitor
Chemical Over-etched on Bond-pad issue	Application of Laser Deprocessing Technique in PFA on Chemical Over-etched on Bond-pad Issue
Clustering model	Application of the Defect Clustering Model for Forming, SET and RESET Statistics in RRAM Devices
CMOS 6T SRAM	FDSOI and Bulk CMOS SRAM Cells Resilience to Radiation Effects
Cohesive Zone Model	Delamination of polyimide/Cu films under mixed mode loading
Collected Charge	FDSOI and Bulk CMOS SRAM Cells Resilience to Radiation Effects
Computational Modeling	Natural Radiation Events in CCD Imagers at Ground Level
condition monitoring	FESeR: a data-driven framework to enhance sensor reliability for the system condition monitoring DRES: Data recovery for condition monitoring to enhance system reliability
conductive anodic filament	Lifetime and Manufacturability of Integrated Power Electronics
Conductive filament	Application of the Defect Clustering Model for Forming, SET and RESET Statistics in RRAM Devices
constant stress accelerated degradation testing	Effects of stress-loading test methods on the degradation of light-emitting diode modules
copper corrosion	Tutorial: Creeping corrosion of copper on printed circuit board assemblies
correlative model	A novel correlative model of failure mechanisms for evaluating MEMS devices reliability
corrosion	Tutorial: Creeping corrosion of copper on printed circuit board assemblies Effect of PCBA surface morphology and chemistry on water layer formation under humid conditions and corrosion reliability Mechanisms of metallization degradation in high power diodes Effects of salt spray test on lead-free solder alloy
Cosmic rays	Natural Radiation Events in CCD Imagers at Ground Level
crack guidance	Crack-guided effect on dynamic mechanical stress for foldable low temperature polycrystalline silicon thin film transistors
cracking risk	Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
Credible Improvement Potential	Component Reliability Importance assessment on complex systems using Credible Improvement Potential
creeping corrosion	Tutorial: Creeping corrosion of copper on printed circuit board assemblies
critical charge	Reliability analysis of hybrid Spin Transfer Torque Magnetic Tunnel Junction/CMOS Majority Voters
Critical degradation voltage	Reliability assessment of ultra-short gate length AlGaN/GaN HEMTs on Si substrate by on-state step stress
Critical energy	Avalanche Robustness of SiC Schottky Diode
critical sensor application	Novel failure mode of chip corrosion at automotive HALL sensor devices under multiple stress conditions
cross section curve	Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop
Cross-section	Detection of cracks in multilayer ceramic capacitors by X-ray imaging
CTE adjustment	77Ghz Automotive RADAR in eWLB package: from consumer to automotive packaging
Cu nanoparticle joint	Power cycle reliability of Cu nanoparticle joint dependent on a mismatch of coefficients of thermal expansion
current density distribution	Magnetic Field and Current Density Imaging using off-line Lock-In Analysis
current filament	Numerical study of destruction phenomena for punch-through IGBTs under unclamped inductive switching
current imaging	Current Imaging, EBIC/EBAC, and Electrical Probing combined for fast and reliable in situ Electrical Fault Isolation
current sensor	Micro PCB Rogowski coil for current monitoring and protection of high voltage power modules
Custom I/O ring	On the need for a new ESD verification methodology to improve the reliability of ICs in advanced 28nm UTBB FDSOI technology
D
damp heat	Effect of H/Ar treatment on ZnO:B transparent conducting oxide for flexible a-Si:H/μc-Si:H photovoltaic modules under damp heat stress
Dark line defect (DLD)	Catastrophic optical damage of high power InGaAs/AlGaAs laser diodes
data recovery	DRES: Data recovery for condition monitoring to enhance system reliability
DC-link capacitors	Temperature rise measurement for power-loss comparison of an aluminium electrolytic capacitor between sinusoidal and square current injections
decay path	Effects of stress-loading test methods on the degradation of light-emitting diode modules
decay rate	Effects of stress-loading test methods on the degradation of light-emitting diode modules
Defect	Elemental characterisation of 20nm structures in devices using new SEM-EDS technology
Defect density	Application of the Defect Clustering Model for Forming, SET and RESET Statistics in RRAM Devices
degradation	Degradation of InGaN laser diodes caused by temperature- and current-driven diffusion processes Effects of stress-loading test methods on the degradation of light-emitting diode modules Degradation and Recovery of variability due to BTI Gate oxide degradation of SiC MOSFET under short-circuit aging tests Charging–discharging characteristics of a wound aluminum polymer capacitor Degradation of InGaN-based LEDs related to charge diffusion and build-up
Delamination	Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor Delamination of polyimide/Cu films under mixed mode loading
design for higher robustness	Reliability Evaluation of Donut-Tungsten-Via as an Element of the Highly Robust Metallization
design for reliability	77Ghz Automotive RADAR in eWLB package: from consumer to automotive packaging Component Reliability Importance assessment on complex systems using Credible Improvement Potential
design recommendations	Requirements for the Application of ECUs in E-mobility Originally Qualified for Gasoline Cars
Destructive	Experimental study of the short-circuit robustness of 600V E-mode GaN transistors
device degradation	Impact of work function of the silicon bottom-gates on electrical instability in InGaZnO thin film transistors
device instability	Device instability of amorphous InGaZnO thin film transistors with transparent source and drain
Device Reliability	Investigation of Temperature Variations on Analog/RF Linearity Performance of Stacked Gate GEWE-SiNW MOSFET for Improved Device Reliability
device under test	Topologies for inverter like operation of power cycling tests
Diagnosis tools	Evolution of navigation and simulation tools in failure analysis
DIC	Fast and Trusted Intrinsic Stress Measurement to Facilitate Improved Reliability Assessments
Die strength testing	Reliability Evaluation of Si-Dies due to Assembly Issues
Dielectric charging	An in depth analysis of pull-up capacitance-voltage characteristic for dielectric charging assessment of MEMS capacitive switches Dielectric charging phenomena in diamond films used in RF MEMS capacitive switches: The effect of film thickness
Diffusion	Degradation of InGaN laser diodes caused by temperature- and current-driven diffusion processes
Digital combinational circuit	Efficient reliability evaluation for combinational circuits
Diode	Internal processes in power semiconductors at virtual junction temperature measurement Power Cycling Analysis Method for High Voltage SiC Diodes
Direct liquid cooled	Reliability Design of Direct Liquid Cooled Power Semiconductor Module for Hybrid and Electric Vehicles
Dislocations	Catastrophic optical damage of high power InGaAs/AlGaAs laser diodes Structural disturbances in GaN HEMT layers as source of leakage current, influencing device performance and reliability
Dispersal	Experimental study of the short-circuit robustness of 600V E-mode GaN transistors
DLTS	Degradation of InGaN-based LEDs related to charge diffusion and build-up
Donut Via	Reliability Evaluation of Donut-Tungsten-Via as an Element of the Highly Robust Metallization
Double SOI	Electromagnetic susceptibility characterization of double SOI device
dynamic mechanical stress test	Crack-guided effect on dynamic mechanical stress for foldable low temperature polycrystalline silicon thin film transistors
E
e-mobility	Requirements for the Application of ECUs in E-mobility Originally Qualified for Gasoline Cars
e-mode	Study of the stability of e-mode GaN HEMTs with p-GaN gate based on combined DC and optical analysis
ebic	Current Imaging, EBIC/EBAC, and Electrical Probing combined for fast and reliable in situ Electrical Fault Isolation
EDA	Permanent and Single Event Transient Faults Reliability Evaluation EDA tool
EDA tools	Evolution of navigation and simulation tools in failure analysis
EDS	Elemental characterisation of 20nm structures in devices using new SEM-EDS technology
Electrical and Physical Failure Analysis	Evolution of navigation and simulation tools in failure analysis
electrical fast transient	Microcontroller susceptibility variations to EFT burst during accelerated aging
Electrical properties	Dielectric charging phenomena in diamond films used in RF MEMS capacitive switches: The effect of film thickness
Electro Optical Probing	Automatic process for Time-Frequency scan of VLSI
electrolytic capacitors	Temperature rise measurement for power-loss comparison of an aluminium electrolytic capacitor between sinusoidal and square current injections
ElectroMagnetic Interference	Evolution study of the ElectroMagnetic Interference for RF LDMOS in series chopper application after thermal accelerated tests
Electromagnetic susceptibility	Electromagnetic susceptibility characterization of double SOI device Microcontroller susceptibility variations to EFT burst during accelerated aging
Elemental Characterization	Elemental characterisation of 20nm structures in devices using new SEM-EDS technology
end of life Weibull statistics	End of life and acceleration modelling for power diodes under High Temperature Reverse Bias stress
end-of-life criterium	Internal processes in power semiconductors at virtual junction temperature measurement
endurance	Nanowire width dependence of data retention and endurance characteristics in nanowire SONOS flash memory
Energy release rate	Delamination of polyimide/Cu films under mixed mode loading
Energy storage systems	Chemical rate phenomenon approach applied to Lithium battery capacity fade estimation
ESD	200V FRED diode with superior ESD capability ESD tests on 850 nm GaAs-based VCSELs
ESD Network	On the need for a new ESD verification methodology to improve the reliability of ICs in advanced 28nm UTBB FDSOI technology
ESD protection strategy	On the need for a new ESD verification methodology to improve the reliability of ICs in advanced 28nm UTBB FDSOI technology
eWLB	77Ghz Automotive RADAR in eWLB package: from consumer to automotive packaging
F
Failure	Avalanche Robustness of SiC Schottky Diode Experimental study of the short-circuit robustness of 600V E-mode GaN transistors Structural disturbances in GaN HEMT layers as source of leakage current, influencing device performance and reliability
Failure Analysis	Evolution of navigation and simulation tools in failure analysis Elemental characterisation of 20nm structures in devices using new SEM-EDS technology Fault isolation at P/N junction by nanoprober Power Cycling Test and Failure Analysis of Molded Intelligent Power IGBT Module under Different Temperature Swing Durations Current Imaging, EBIC/EBAC, and Electrical Probing combined for fast and reliable in situ Electrical Fault Isolation Study on non-contact current path formation using charged particle beams Automatic process for Time-Frequency scan of VLSI
Failure Inspection	Copper Through Silicon Vias Studied by Photoelastic Scanning Infrared Microscopy
failure mechanism	A novel correlative model of failure mechanisms for evaluating MEMS devices reliability
Failure Mechanisms	Accelerated Life Test of high luminosity blue LEDs
Failure rate	Failure Rate Calculation Method for High Power Devices in Space Applications at Low Earth Orbit
Failure-Characterization	Automatized Failure Analysis of Tungsten Coated TSVs via Scanning Acoustic Microscopy
falsh memory	Nanowire width dependence of data retention and endurance characteristics in nanowire SONOS flash memory
Fast recovery Diode	200V FRED diode with superior ESD capability
FDSOI	Performance vs. Reliability Adaptive Body Bias Scheme in 28nm & 14nm UTBB FDSOI nodes Electromagnetic susceptibility characterization of double SOI device A process-variation-resilient methodology of circuit design by using asymmetrical forward body bias in 28nm FDSOI FDSOI and Bulk CMOS SRAM Cells Resilience to Radiation Effects
FEA	Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
FEM simulations	Power electronic assemblies: thermo-mechanical degradations of gold-tin solder for attaching devices
FIB	Fast and Trusted Intrinsic Stress Measurement to Facilitate Improved Reliability Assessments Application of Fast Laser Deprocessing Techniques on Large Cross-sectional View Area Sample with FIB-SEM Dual Beam System
FIB-SEM	Elemental characterisation of 20nm structures in devices using new SEM-EDS technology
FIB/SEM/TEM	Novel failure mode of chip corrosion at automotive HALL sensor devices under multiple stress conditions
Finite Element Method	Mission-profile-based stress analysis of bond-wires in SiC power modules
finite element simulation	Novel failure mode of chip corrosion at automotive HALL sensor devices under multiple stress conditions
Fishbone pattern	Micro PCB Rogowski coil for current monitoring and protection of high voltage power modules
Flash	Impact of Resistive Paths on NVM Array Reliability: Application to Flash & ReRAM Memories
Flex crack	Detection of cracks in multilayer ceramic capacitors by X-ray imaging
flexible a-Si:H/μc-Si:H PV	Effect of H/Ar treatment on ZnO:B transparent conducting oxide for flexible a-Si:H/μc-Si:H photovoltaic modules under damp heat stress
flip flop	Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop
Focused ion beam	Ga contamination in silicon by focused ion beam milling: Atom Probe Tomography and simulation with dynamic model
foldable device	Crack-guided effect on dynamic mechanical stress for foldable low temperature polycrystalline silicon thin film transistors
Forward body bias	A process-variation-resilient methodology of circuit design by using asymmetrical forward body bias in 28nm FDSOI
forward gate bias overstress	Study of the stability of e-mode GaN HEMTs with p-GaN gate based on combined DC and optical analysis
FPGA	FPGA LUT delay degradation due to HCI : Experiment and simulation results
Fracture mechanics	Delamination of polyimide/Cu films under mixed mode loading
Fracture mechanism	Power cycle reliability of Cu nanoparticle joint dependent on a mismatch of coefficients of thermal expansion
Fracture Strength estimation	Reliability Evaluation of Si-Dies due to Assembly Issues
Full-frame CCD	Natural Radiation Events in CCD Imagers at Ground Level
Fully Depleted SOI	FDSOI and Bulk CMOS SRAM Cells Resilience to Radiation Effects
G
Ga contamination	Ga contamination in silicon by focused ion beam milling: Atom Probe Tomography and simulation with dynamic model
Gallium Nitride	Continuous Time-Domain RF waveforms monitoring under overdrive stress condition of AlGaN/GaN HEMTs Experimental observation of TDDB-like behavior in reverse-biased green InGaN LEDs
Gallium Nitride (GaN)	Reliability assessment of ultra-short gate length AlGaN/GaN HEMTs on Si substrate by on-state step stress
Gamma	The radiation test based assessment of process quality and reliability for conventional 65-nm CMOS technology
GaN	Scanning Microwave Microscopy for Electronic Device Analysis on Nanometre Scale Temperature Dependent Dynamic ON State Resistance in GaN on Si Based Normally OFF HFETs Structural disturbances in GaN HEMT layers as source of leakage current, influencing device performance and reliability
GaN HEMT	Effects of drain quiescent voltage on the ageing of AlGaN/GaN HEMT devices in pulsed RF mode Experimental study of the short-circuit robustness of 600V E-mode GaN transistors
GaN HEMTs	Study of the stability of e-mode GaN HEMTs with p-GaN gate based on combined DC and optical analysis
GaN-HEMT	UIS test of high-voltage GaN-HEMTs with p-type gate structure
Gate Electrode Workfunction Engineered (GEWE)	Investigation of Temperature Variations on Analog/RF Linearity Performance of Stacked Gate GEWE-SiNW MOSFET for Improved Device Reliability
gate oxide	Gate oxide degradation of SiC MOSFET under short-circuit aging tests
gate workfunction	Impact of work function of the silicon bottom-gates on electrical instability in InGaZnO thin film transistors
gerneric model	Requirements for the Application of ECUs in E-mobility Originally Qualified for Gasoline Cars
GHz SAM	Detection and Analysis of Stress-induced Voiding in Al-Power lines by Acoustic GHz-Microscopy Investigating Stress Measurement Capabilities of GHz Scanning Acoustic Microscopy for 3D Failure Analysis
Grain boundary	Conductive filament formation at grain boundary locations in polycrystalline HfO2 based MIM stacks- Computational and Physical Insight Application of the Defect Clustering Model for Forming, SET and RESET Statistics in RRAM Devices
Graphite	Novel heatsink for power semiconductor module using high thermal conductive graphite
H
H/Ar treatment	Effect of H/Ar treatment on ZnO:B transparent conducting oxide for flexible a-Si:H/μc-Si:H photovoltaic modules under damp heat stress
handling	Reliability Evaluation of Si-Dies due to Assembly Issues
Hardness	The radiation test based assessment of process quality and reliability for conventional 65-nm CMOS technology
HAST	Moisture absorption by molding compounds under extreme conditions: impact on accelerated reliability tests
HCI	Performance vs. Reliability Adaptive Body Bias Scheme in 28nm & 14nm UTBB FDSOI nodes FPGA LUT delay degradation due to HCI : Experiment and simulation results
healing phases	Potentiality of Healing Techniques in Hot-Carrier Damaged 28nm FDSOI CMOS nodes
heat pipe	Lifetime and Manufacturability of Integrated Power Electronics
Heatsink	Novel heatsink for power semiconductor module using high thermal conductive graphite
Heavy-Ion Impact	FDSOI and Bulk CMOS SRAM Cells Resilience to Radiation Effects
HEMT	Correlation of gate leakage and local strain distribution in GaN/AlGaN HEMT structures Structural disturbances in GaN HEMT layers as source of leakage current, influencing device performance and reliability Role of Two-Dimensional Electron Gas (2DEG) in AlGaN/GaN High Electron Mobility Transistor (HEMT) ON-State Degradation
heterostructure	Structural disturbances in GaN HEMT layers as source of leakage current, influencing device performance and reliability
HFETs	Temperature Dependent Dynamic ON State Resistance in GaN on Si Based Normally OFF HFETs
HfO2	Analysis of Quantum Conductance, Read Disturb and Switching Statistics in HfO2 RRAM Using Conductive AFM
HfO2 dielectric	Conductive filament formation at grain boundary locations in polycrystalline HfO2 based MIM stacks- Computational and Physical Insight
high frequency layer	77Ghz Automotive RADAR in eWLB package: from consumer to automotive packaging
High luminosity blue LEDs	Accelerated Life Test of high luminosity blue LEDs
High power device	Failure Rate Calculation Method for High Power Devices in Space Applications at Low Earth Orbit
High power laser diode	Catastrophic optical damage of high power InGaAs/AlGaAs laser diodes
high temperature	Power Cycling Analysis Method for High Voltage SiC Diodes Temperature Dependent Dynamic ON State Resistance in GaN on Si Based Normally OFF HFETs
high temperature and current	Reliability Evaluation of Donut-Tungsten-Via as an Element of the Highly Robust Metallization
High temperature applications	Power electronic assemblies: thermo-mechanical degradations of gold-tin solder for attaching devices
High Temperature Operation Life (HTOL)	Early Detection and Prediction of HKMG SRAM HTOL Performance by WLR PBTI Tests
High Temperature Reverse Bias	End of life and acceleration modelling for power diodes under High Temperature Reverse Bias stress
High Temperature Reverse Bias test	Lifetime Estimation of SiC MOSFETs under High Temperature Reverse Bias Test
high voltage	Micro PCB Rogowski coil for current monitoring and protection of high voltage power modules Power Cycling Analysis Method for High Voltage SiC Diodes
high-k dielectric	Conductive filament formation at grain boundary locations in polycrystalline HfO2 based MIM stacks- Computational and Physical Insight
High-κ Metal Gate (HKMG)	Early Detection and Prediction of HKMG SRAM HTOL Performance by WLR PBTI Tests
HKMG	Influence of I/O Oxide Process on the NBTI Performance of 28nm HfO2-Based HKMG p-MOSFETs
hot carrier	Plasma Process Induced Damage Detection by Fast Wafer Level Reliability Monitoring for Automotive Applications
hot carrier degradation	Device instability of amorphous InGaZnO thin film transistors with transparent source and drain
hot-carrier	Evolution study of the ElectroMagnetic Interference for RF LDMOS in series chopper application after thermal accelerated tests
Hot-carrier degradation	Potentiality of Healing Techniques in Hot-Carrier Damaged 28nm FDSOI CMOS nodes
Hybrid and Electric Vehicles	Reliability Design of Direct Liquid Cooled Power Semiconductor Module for Hybrid and Electric Vehicles
hydrostatic load	Novel failure mode of chip corrosion at automotive HALL sensor devices under multiple stress conditions
I
IC reliability	On the need for a new ESD verification methodology to improve the reliability of ICs in advanced 28nm UTBB FDSOI technology
IGBT	Numerical study of destruction phenomena for punch-through IGBTs under unclamped inductive switching Internal processes in power semiconductors at virtual junction temperature measurement Topologies for inverter like operation of power cycling tests Comparison of Thermal Runaway Limits under Different Test Conditions Based on a 4.5 kV IGBT
IGBT Aging	Online computation of IGBT on-state resistance for off-shelf three-phase two-level power converter systems
IGBT Module	Power Cycling Test and Failure Analysis of Molded Intelligent Power IGBT Module under Different Temperature Swing Durations
III-V semiconductor	Role of Two-Dimensional Electron Gas (2DEG) in AlGaN/GaN High Electron Mobility Transistor (HEMT) ON-State Degradation
Impact ionization	200V FRED diode with superior ESD capability
implantation	Electrical analysis on implantation-related defect by nanoprobing methodology
Infrared microscopy	Application of high frequency scanning acoustic microscopy for the failure analysis and reliability assessment of MEMS sensors (invited)
InGaN	Degradation of InGaN laser diodes caused by temperature- and current-driven diffusion processes Degradation of InGaN-based LEDs related to charge diffusion and build-up
InGaZnO thin film transistor	Negative bias illumination stress instability in amorphous InGaZnO thin film transistors with transparent source and drain Impact of work function of the silicon bottom-gates on electrical instability in InGaZnO thin film transistors Device instability of amorphous InGaZnO thin film transistors with transparent source and drain
InGaZnO thin film transistor reliability	Impact of work function of the silicon bottom-gates on electrical instability in InGaZnO thin film transistors
instability	Instability of oxide thin film transistor under electrical-mechanical hybrid stress for foldable display
Insulated Gate Bipolar Transistor	Reliability Design of Direct Liquid Cooled Power Semiconductor Module for Hybrid and Electric Vehicles
Integrated Circuit Failure Analysis	Static logic state analysis by TLS on powered logic circuits: Three case studies for suspected stuck-at failure modes
integrated power switch	Thermal design optimization of novel modular power converter assembly enabling higher performance, reliability and availability
interconnect reliability	Reliability Evaluation of Donut-Tungsten-Via as an Element of the Highly Robust Metallization
Intermetallics	Power electronic assemblies: thermo-mechanical degradations of gold-tin solder for attaching devices
invisible defect	Electrical analysis on implantation-related defect by nanoprobing methodology
J
JBS Diode	Power Cycling Analysis Method for High Voltage SiC Diodes
Junction Temperature estimation	Online computation of IGBT on-state resistance for off-shelf three-phase two-level power converter systems
K
Kernel Principle Component Analysis	FESeR: a data-driven framework to enhance sensor reliability for the system condition monitoring
L
Laser	The radiation test based assessment of process quality and reliability for conventional 65-nm CMOS technology
Laser deprocessing	Application of Fast Laser Deprocessing Techniques on Large Cross-sectional View Area Sample with FIB-SEM Dual Beam System
Laser Deprocessing Technique	Application of Laser Deprocessing Technique in PFA on Chemical Over-etched on Bond-pad Issue
Laser diode	Degradation of InGaN laser diodes caused by temperature- and current-driven diffusion processes
Laser Modulation	Automatic process for Time-Frequency scan of VLSI
lead-free solder	Effects of salt spray test on lead-free solder alloy
leakage	Fault isolation at P/N junction by nanoprober Structural disturbances in GaN HEMT layers as source of leakage current, influencing device performance and reliability
Leakage current	Experimental study of the short-circuit robustness of 600V E-mode GaN transistors Correlation of gate leakage and local strain distribution in GaN/AlGaN HEMT structures
Leakage current measurement	Comparison of Thermal Runaway Limits under Different Test Conditions Based on a 4.5 kV IGBT
LED	Transient thermal analysis for accelerated reliability testing of LEDs Degradation of InGaN-based LEDs related to charge diffusion and build-up
LED module	Effects of stress-loading test methods on the degradation of light-emitting diode modules
Life Prediction	Fatigue Life Prediction Model for Accelerated Testing of Electronic Components under Non-Gaussian Random Vibration Excitations
life-time	Internal processes in power semiconductors at virtual junction temperature measurement
Lifetime	Mission-profile-based stress analysis of bond-wires in SiC power modules
lifetime modelling	Fatigue testing method for fine bond wires in an LQFP Package
Light emitting diode	Transient thermal analysis for accelerated reliability testing of LEDs
light-emitting diode	Experimental observation of TDDB-like behavior in reverse-biased green InGaN LEDs
Linear Energy Transfer	FDSOI and Bulk CMOS SRAM Cells Resilience to Radiation Effects On the Prediction of Radiation-Induced SETs in Flash-based FPGAs
Lithium batteries	Chemical rate phenomenon approach applied to Lithium battery capacity fade estimation
local deep level transient spectroscopy	Local deep level transient spectroscopy using super-higher-order scanning nonlinear dielectric microscopy
Lock-In Analysis	Magnetic Field and Current Density Imaging using off-line Lock-In Analysis
Lock-in-thermography	Lifetime and Manufacturability of Integrated Power Electronics
Long-term experiment	Natural Radiation Events in CCD Imagers at Ground Level
LUT	FPGA LUT delay degradation due to HCI : Experiment and simulation results
M
magnetic current imaging	Magnetic Field and Current Density Imaging using off-line Lock-In Analysis
Magnetic Flip-Flop	A process-variation-resilient methodology of circuit design by using asymmetrical forward body bias in 28nm FDSOI
magnetoresistive sensors	Magnetic Field and Current Density Imaging using off-line Lock-In Analysis
Majority voters	Reliability analysis of hybrid Spin Transfer Torque Magnetic Tunnel Junction/CMOS Majority Voters
MCI	Magnetic Field and Current Density Imaging using off-line Lock-In Analysis
mechanical fatigue testing	Fatigue testing method for fine bond wires in an LQFP Package
Mechanical reliability	Optimization of contact metallizations for reliable wafer level Au-Sn bonds
mechanism	Effect of H/Ar treatment on ZnO:B transparent conducting oxide for flexible a-Si:H/μc-Si:H photovoltaic modules under damp heat stress
Memory Cell	FDSOI and Bulk CMOS SRAM Cells Resilience to Radiation Effects
MEMS	A novel correlative model of failure mechanisms for evaluating MEMS devices reliability Fast and Trusted Intrinsic Stress Measurement to Facilitate Improved Reliability Assessments
MEMS inertial sensors	Application of high frequency scanning acoustic microscopy for the failure analysis and reliability assessment of MEMS sensors (invited)
MEMS sensor	Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
metalization systems	Detection and Analysis of Stress-induced Voiding in Al-Power lines by Acoustic GHz-Microscopy
Metallization degradation	Mechanisms of metallization degradation in high power diodes
microclimate	Tutorial: Creeping corrosion of copper on printed circuit board assemblies
microcontroller	Microcontroller susceptibility variations to EFT burst during accelerated aging
Mismatch of coefficients of thermal expansion	Power cycle reliability of Cu nanoparticle joint dependent on a mismatch of coefficients of thermal expansion
Mission profile	Mission-profile-based stress analysis of bond-wires in SiC power modules
modeling	Instability of oxide thin film transistor under electrical-mechanical hybrid stress for foldable display Impact on Non-linear Capacitances on Transient Waveforms during System Level ESD Stress
Modelling	FPGA LUT delay degradation due to HCI : Experiment and simulation results
Moisture	Moisture absorption by molding compounds under extreme conditions: impact on accelerated reliability tests
Molding compounds	Moisture absorption by molding compounds under extreme conditions: impact on accelerated reliability tests
Molecular dynamics	Numerical Investigation of the Effects of Phosphorus on the Mechanical Responses of [1 1 0]-oriented Silicon Nano-wires
Monitoring	Plasma Process Induced Damage Detection by Fast Wafer Level Reliability Monitoring for Automotive Applications
MOS transistor	Plasma Process Induced Damage Detection by Fast Wafer Level Reliability Monitoring for Automotive Applications
MOSFET	Lifetime Estimation of SiC MOSFETs under High Temperature Reverse Bias Test
Multilayer ceramic capacitor	Detection of cracks in multilayer ceramic capacitors by X-ray imaging
multiple stress conditions	Novel failure mode of chip corrosion at automotive HALL sensor devices under multiple stress conditions
multivariable linear regression	DRES: Data recovery for condition monitoring to enhance system reliability
mutual information	FESeR: a data-driven framework to enhance sensor reliability for the system condition monitoring DRES: Data recovery for condition monitoring to enhance system reliability
N
Na fault injection	Evaluation of Potential-Induced Degradation in Crystalline Si Solar Cells using Na-Fault Injection
Nano Filament	Analysis of Quantum Conductance, Read Disturb and Switching Statistics in HfO2 RRAM Using Conductive AFM
Nano-Crystalline Diamond	Dielectric charging phenomena in diamond films used in RF MEMS capacitive switches: The effect of film thickness
nano-probing	Study on non-contact current path formation using charged particle beams
Nano-wire	Numerical Investigation of the Effects of Phosphorus on the Mechanical Responses of [1 1 0]-oriented Silicon Nano-wires
nanoprobing	Current Imaging, EBIC/EBAC, and Electrical Probing combined for fast and reliable in situ Electrical Fault Isolation Electrical analysis on implantation-related defect by nanoprobing methodology
nanowire	Nanowire width dependence of data retention and endurance characteristics in nanowire SONOS flash memory
NBED	Correlation of gate leakage and local strain distribution in GaN/AlGaN HEMT structures
NBTI	Degradation and Recovery of variability due to BTI
NBTI model	Influence of I/O Oxide Process on the NBTI Performance of 28nm HfO2-Based HKMG p-MOSFETs
NDT	Detection and Analysis of Stress-induced Voiding in Al-Power lines by Acoustic GHz-Microscopy
negative bias illumination stress	Negative bias illumination stress instability in amorphous InGaZnO thin film transistors with transparent source and drain
neutral trap	Channel width dependence of AC stress on bulk nMOSFETs
nickel palladium	Tutorial: Creeping corrosion of copper on printed circuit board assemblies
nMOSFETs	Channel width dependence of AC stress on bulk nMOSFETs
non-destructive analysis	Static logic state analysis by TLS on powered logic circuits: Three case studies for suspected stuck-at failure modes
Non-Gaussian	Fatigue Life Prediction Model for Accelerated Testing of Electronic Components under Non-Gaussian Random Vibration Excitations
Normally-off	Temperature Dependent Dynamic ON State Resistance in GaN on Si Based Normally OFF HFETs
Numerical Simulation	Natural Radiation Events in CCD Imagers at Ground Level
NVM array reliability	Impact of Resistive Paths on NVM Array Reliability: Application to Flash & ReRAM Memories
O
ON-state	Role of Two-Dimensional Electron Gas (2DEG) in AlGaN/GaN High Electron Mobility Transistor (HEMT) ON-State Degradation
On-state resistance computation	Online computation of IGBT on-state resistance for off-shelf three-phase two-level power converter systems
Open circuit	Avalanche Robustness of SiC Schottky Diode
Optical power	Degradation of InGaN-based LEDs related to charge diffusion and build-up
Oscillations	Experimental study of the short-circuit robustness of 600V E-mode GaN transistors
Oxide based RRAM	Resistive RAM Variability Monitoring using a Ring Oscillator based Test Chip
Oxide Electrifc Field	Lifetime Estimation of SiC MOSFETs under High Temperature Reverse Bias Test
oxide thin film transistor	Instability of oxide thin film transistor under electrical-mechanical hybrid stress for foldable display
OxRAM	Analysis of Quantum Conductance, Read Disturb and Switching Statistics in HfO2 RRAM Using Conductive AFM
P
p-GaN	Temperature Dependent Dynamic ON State Resistance in GaN on Si Based Normally OFF HFETs
p-GaN gate	Study of the stability of e-mode GaN HEMTs with p-GaN gate based on combined DC and optical analysis
package board interaction	77Ghz Automotive RADAR in eWLB package: from consumer to automotive packaging
Passive thermal cycling	Mechanisms of metallization degradation in high power diodes
PCB embedded	Lifetime and Manufacturability of Integrated Power Electronics
PCBA	Tutorial: Creeping corrosion of copper on printed circuit board assemblies
PEDOT:PSS	Charging–discharging characteristics of a wound aluminum polymer capacitor
Percolation	Application of the Defect Clustering Model for Forming, SET and RESET Statistics in RRAM Devices
performance	Structural disturbances in GaN HEMT layers as source of leakage current, influencing device performance and reliability
Permanent Faults	Permanent and Single Event Transient Faults Reliability Evaluation EDA tool
Phosphorus	Numerical Investigation of the Effects of Phosphorus on the Mechanical Responses of [1 1 0]-oriented Silicon Nano-wires
PID	Plasma Process Induced Damage Detection by Fast Wafer Level Reliability Monitoring for Automotive Applications
Plasma charging	Plasma Process Induced Damage Detection by Fast Wafer Level Reliability Monitoring for Automotive Applications
PMOS	Influence of I/O Oxide Process on the NBTI Performance of 28nm HfO2-Based HKMG p-MOSFETs
Polyimide	Delamination of polyimide/Cu films under mixed mode loading
polymer	Charging–discharging characteristics of a wound aluminum polymer capacitor
Positive Bias Temperature Instability (PBTI)	Early Detection and Prediction of HKMG SRAM HTOL Performance by WLR PBTI Tests
Potential induced degradation	Evaluation of Potential-Induced Degradation in Crystalline Si Solar Cells using Na-Fault Injection
power converter	Thermal design optimization of novel modular power converter assembly enabling higher performance, reliability and availability
Power cycle	Power cycle reliability of Cu nanoparticle joint dependent on a mismatch of coefficients of thermal expansion Novel heatsink for power semiconductor module using high thermal conductive graphite
power cycling	Lifetime and Manufacturability of Integrated Power Electronics Internal processes in power semiconductors at virtual junction temperature measurement Power Cycling Analysis Method for High Voltage SiC Diodes Topologies for inverter like operation of power cycling tests
Power cycling test	Power Cycling Test and Failure Analysis of Molded Intelligent Power IGBT Module under Different Temperature Swing Durations
power density	Lifetime and Manufacturability of Integrated Power Electronics
power device	Charging–discharging characteristics of a wound aluminum polymer capacitor
Power Diode	200V FRED diode with superior ESD capability
power electric converters	Temperature rise measurement for power-loss comparison of an aluminium electrolytic capacitor between sinusoidal and square current injections
power electronics	Lifetime and Manufacturability of Integrated Power Electronics
power loss	Temperature rise measurement for power-loss comparison of an aluminium electrolytic capacitor between sinusoidal and square current injections
power module	Micro PCB Rogowski coil for current monitoring and protection of high voltage power modules Reliability Design of Direct Liquid Cooled Power Semiconductor Module for Hybrid and Electric Vehicles
Power modules assembly	Power electronic assemblies: thermo-mechanical degradations of gold-tin solder for attaching devices
Power MOSFET	Body diode reliability investigation of SiC power MOSFETs
Power semiconductor module	Novel heatsink for power semiconductor module using high thermal conductive graphite
power semiconductor reliability	End of life and acceleration modelling for power diodes under High Temperature Reverse Bias stress
Pressure Packaging	Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules
printed circuit board assembly	Tutorial: Creeping corrosion of copper on printed circuit board assemblies
Prited circuit board	Micro PCB Rogowski coil for current monitoring and protection of high voltage power modules
Probabilistic transfer matrix	Efficient reliability evaluation for combinational circuits
process assessment	The radiation test based assessment of process quality and reliability for conventional 65-nm CMOS technology
Process variation resilient	A process-variation-resilient methodology of circuit design by using asymmetrical forward body bias in 28nm FDSOI
Propagation delay	A run-time built-in approach of TID test in SRAM based FPGAs
Proton induced single event upset	Failure Rate Calculation Method for High Power Devices in Space Applications at Low Earth Orbit
pull test	Improved Etching Recipe for Exposing Cu Wire allowing Reliable Stitch Pull
pulsed laser	Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop Single Event Transient Acquisition And Mapping For Space Device Characterization
PV modules	Evaluation of Potential-Induced Degradation in Crystalline Si Solar Cells using Na-Fault Injection
Q
qualification	Requirements for the Application of ECUs in E-mobility Originally Qualified for Gasoline Cars
Quantum Subconductance	Analysis of Quantum Conductance, Read Disturb and Switching Statistics in HfO2 RRAM Using Conductive AFM
quantum well	Catastrophic optical damage of high power InGaAs/AlGaAs laser diodes
R
Radiation	The radiation test based assessment of process quality and reliability for conventional 65-nm CMOS technology Reliability analysis of hybrid Spin Transfer Torque Magnetic Tunnel Junction/CMOS Majority Voters On the Prediction of Radiation-Induced SETs in Flash-based FPGAs
radiation effect	Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop
Radiation effects	Natural Radiation Events in CCD Imagers at Ground Level FDSOI and Bulk CMOS SRAM Cells Resilience to Radiation Effects
Rayleigh wave	Investigating Stress Measurement Capabilities of GHz Scanning Acoustic Microscopy for 3D Failure Analysis
Read Disturb	Analysis of Quantum Conductance, Read Disturb and Switching Statistics in HfO2 RRAM Using Conductive AFM
RECOVERY	Degradation and Recovery of variability due to BTI Potentiality of Healing Techniques in Hot-Carrier Damaged 28nm FDSOI CMOS nodes
Reistive paths	Impact of Resistive Paths on NVM Array Reliability: Application to Flash & ReRAM Memories
Reliability	Accelerated Life Test of high luminosity blue LEDs Evolution study of the ElectroMagnetic Interference for RF LDMOS in series chopper application after thermal accelerated tests Reliability Evaluation of Si-Dies due to Assembly Issues Power Cycling Test and Failure Analysis of Molded Intelligent Power IGBT Module under Different Temperature Swing Durations Permanent and Single Event Transient Faults Reliability Evaluation EDA tool Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop Effects of drain quiescent voltage on the ageing of AlGaN/GaN HEMT devices in pulsed RF mode Internal processes in power semiconductors at virtual junction temperature measurement Electromagnetic susceptibility characterization of double SOI device FPGA LUT delay degradation due to HCI : Experiment and simulation results Crack-guided effect on dynamic mechanical stress for foldable low temperature polycrystalline silicon thin film transistors Continuous Time-Domain RF waveforms monitoring under overdrive stress condition of AlGaN/GaN HEMTs Body diode reliability investigation of SiC power MOSFETs Requirements for the Application of ECUs in E-mobility Originally Qualified for Gasoline Cars Plasma Process Induced Damage Detection by Fast Wafer Level Reliability Monitoring for Automotive Applications Reliability Design of Direct Liquid Cooled Power Semiconductor Module for Hybrid and Electric Vehicles Transient thermal analysis for accelerated reliability testing of LEDs Power electronic assemblies: thermo-mechanical degradations of gold-tin solder for attaching devices Mission-profile-based stress analysis of bond-wires in SiC power modules Chemical rate phenomenon approach applied to Lithium battery capacity fade estimation Structural disturbances in GaN HEMT layers as source of leakage current, influencing device performance and reliability Reliability assessment of ultra-short gate length AlGaN/GaN HEMTs on Si substrate by on-state step stress Role of Two-Dimensional Electron Gas (2DEG) in AlGaN/GaN High Electron Mobility Transistor (HEMT) ON-State Degradation Improving the short circuit ruggedness of IGBTs
reliability analysis	Reliability analysis of hybrid Spin Transfer Torque Magnetic Tunnel Junction/CMOS Majority Voters
reliability evaluation	A novel correlative model of failure mechanisms for evaluating MEMS devices reliability
Reliability evaluation efficiency	Efficient reliability evaluation for combinational circuits
Reliability Importance	Component Reliability Importance assessment on complex systems using Credible Improvement Potential
reliability of electronics	Effect of PCBA surface morphology and chemistry on water layer formation under humid conditions and corrosion reliability
Reliability-aware simulation	Efficient reliability evaluation for combinational circuits
Repetition	Experimental study of the short-circuit robustness of 600V E-mode GaN transistors
ReRAM	Impact of Resistive Paths on NVM Array Reliability: Application to Flash & ReRAM Memories
Residual stress	Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
Resilience	FDSOI and Bulk CMOS SRAM Cells Resilience to Radiation Effects
Resistive switching	Conductive filament formation at grain boundary locations in polycrystalline HfO2 based MIM stacks- Computational and Physical Insight Application of the Defect Clustering Model for Forming, SET and RESET Statistics in RRAM Devices
Resitive RAM	Resistive RAM Variability Monitoring using a Ring Oscillator based Test Chip
retentation	Nanowire width dependence of data retention and endurance characteristics in nanowire SONOS flash memory
reverse-bias stress	Experimental observation of TDDB-like behavior in reverse-biased green InGaN LEDs
RF LDMOS	Evolution study of the ElectroMagnetic Interference for RF LDMOS in series chopper application after thermal accelerated tests
RF MEMS capacitive switches	An in depth analysis of pull-up capacitance-voltage characteristic for dielectric charging assessment of MEMS capacitive switches Dielectric charging phenomena in diamond films used in RF MEMS capacitive switches: The effect of film thickness
Ring Oscillator	A run-time built-in approach of TID test in SRAM based FPGAs
Ring oscillators	Resistive RAM Variability Monitoring using a Ring Oscillator based Test Chip
Ringoscillator	Performance vs. Reliability Adaptive Body Bias Scheme in 28nm & 14nm UTBB FDSOI nodes
Robustness	Avalanche Robustness of SiC Schottky Diode Experimental study of the short-circuit robustness of 600V E-mode GaN transistors
Rogowski coil	Micro PCB Rogowski coil for current monitoring and protection of high voltage power modules
RRAM	Conductive filament formation at grain boundary locations in polycrystalline HfO2 based MIM stacks- Computational and Physical Insight
Ruggedness	Improving the short circuit ruggedness of IGBTs
S
salt spray test	Effects of salt spray test on lead-free solder alloy
SAM	Detection and Analysis of Stress-induced Voiding in Al-Power lines by Acoustic GHz-Microscopy Automatized Failure Analysis of Tungsten Coated TSVs via Scanning Acoustic Microscopy
Scanning acoustic microscopy	Application of high frequency scanning acoustic microscopy for the failure analysis and reliability assessment of MEMS sensors (invited) Investigating Stress Measurement Capabilities of GHz Scanning Acoustic Microscopy for 3D Failure Analysis
Scanning Infrared Stress Explorer	Copper Through Silicon Vias Studied by Photoelastic Scanning Infrared Microscopy
Scanning Microwave Microscopy	Scanning Microwave Microscopy for Electronic Device Analysis on Nanometre Scale
scanning nonlinear dielectric microscopy	Local deep level transient spectroscopy using super-higher-order scanning nonlinear dielectric microscopy
Schottky Diode	Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules
second bond	Improved Etching Recipe for Exposing Cu Wire allowing Reliable Stitch Pull
second level reliability	77Ghz Automotive RADAR in eWLB package: from consumer to automotive packaging
semiconductor	Influence of I/O Oxide Process on the NBTI Performance of 28nm HfO2-Based HKMG p-MOSFETs
sensor selection	FESeR: a data-driven framework to enhance sensor reliability for the system condition monitoring
SET	Reliability analysis of hybrid Spin Transfer Torque Magnetic Tunnel Junction/CMOS Majority Voters
SET Cartography	Single Event Transient Acquisition And Mapping For Space Device Characterization
SEU	Reliability analysis of hybrid Spin Transfer Torque Magnetic Tunnel Junction/CMOS Majority Voters
SEU mapping	Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop
Severe aging cycles	Power electronic assemblies: thermo-mechanical degradations of gold-tin solder for attaching devices
Short circuit	Avalanche Robustness of SiC Schottky Diode Improving the short circuit ruggedness of IGBTs
short-circuit	Gate oxide degradation of SiC MOSFET under short-circuit aging tests Experimental study of the short-circuit robustness of 600V E-mode GaN transistors
shrinkage	Charging–discharging characteristics of a wound aluminum polymer capacitor
SiC	Power Cycling Analysis Method for High Voltage SiC Diodes
SiC MOSFET	Gate oxide degradation of SiC MOSFET under short-circuit aging tests
SiC power module	Mission-profile-based stress analysis of bond-wires in SiC power modules
SiC Schottky diode	Avalanche Robustness of SiC Schottky Diode
Silicon	Numerical Investigation of the Effects of Phosphorus on the Mechanical Responses of [1 1 0]-oriented Silicon Nano-wires Reliability assessment of ultra-short gate length AlGaN/GaN HEMTs on Si substrate by on-state step stress
silicon and oxide corrosion	Novel failure mode of chip corrosion at automotive HALL sensor devices under multiple stress conditions
Silicon Carbide	Lifetime and Manufacturability of Integrated Power Electronics Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules Power Cycling Analysis Method for High Voltage SiC Diodes Body diode reliability investigation of SiC power MOSFETs
Silicon Nanowire (SiNW)	Investigation of Temperature Variations on Analog/RF Linearity Performance of Stacked Gate GEWE-SiNW MOSFET for Improved Device Reliability
silver corrosion	Tutorial: Creeping corrosion of copper on printed circuit board assemblies
silver sinter	Lifetime and Manufacturability of Integrated Power Electronics
Simulation	Conductive filament formation at grain boundary locations in polycrystalline HfO2 based MIM stacks- Computational and Physical Insight Numerical study of destruction phenomena for punch-through IGBTs under unclamped inductive switching Micro PCB Rogowski coil for current monitoring and protection of high voltage power modules FPGA LUT delay degradation due to HCI : Experiment and simulation results Improving the short circuit ruggedness of IGBTs
Single Event Transient	Permanent and Single Event Transient Faults Reliability Evaluation EDA tool Single Event Transient Acquisition And Mapping For Space Device Characterization
Single Event Transients	On the Prediction of Radiation-Induced SETs in Flash-based FPGAs
single event upset	Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop
Single-Event Transients	FDSOI and Bulk CMOS SRAM Cells Resilience to Radiation Effects
Single-Event Upsets	FDSOI and Bulk CMOS SRAM Cells Resilience to Radiation Effects
SiO2/SiC interface	Local deep level transient spectroscopy using super-higher-order scanning nonlinear dielectric microscopy
SMM	Scanning Microwave Microscopy for Electronic Device Analysis on Nanometre Scale
solar cells	Evaluation of Potential-Induced Degradation in Crystalline Si Solar Cells using Na-Fault Injection
Solder cracking	Power electronic assemblies: thermo-mechanical degradations of gold-tin solder for attaching devices
solder fatigue	77Ghz Automotive RADAR in eWLB package: from consumer to automotive packaging
Solder joint	Transient thermal analysis for accelerated reliability testing of LEDs
solder joint reliability	77Ghz Automotive RADAR in eWLB package: from consumer to automotive packaging
Solid-liquid interdiffusion (SLID) bonding	Optimization of contact metallizations for reliable wafer level Au-Sn bonds
Space Proton Flux	Failure Rate Calculation Method for High Power Devices in Space Applications at Low Earth Orbit
spectral analysis	Study of the stability of e-mode GaN HEMTs with p-GaN gate based on combined DC and optical analysis
SRAM	FDSOI and Bulk CMOS SRAM Cells Resilience to Radiation Effects
SRAM FPGA	A run-time built-in approach of TID test in SRAM based FPGAs
SRIM	Ga contamination in silicon by focused ion beam milling: Atom Probe Tomography and simulation with dynamic model
Stacked Gate	Investigation of Temperature Variations on Analog/RF Linearity Performance of Stacked Gate GEWE-SiNW MOSFET for Improved Device Reliability
STANDARD DEVIATIONS	Degradation and Recovery of variability due to BTI
static mechanical stress	Instability of oxide thin film transistor under electrical-mechanical hybrid stress for foldable display
STEM	ESD tests on 850 nm GaAs-based VCSELs
Step stress	Reliability assessment of ultra-short gate length AlGaN/GaN HEMTs on Si substrate by on-state step stress
step-down stress accelerated degradation testing	Effects of stress-loading test methods on the degradation of light-emitting diode modules
step-up stress accelerated degradation testing	Effects of stress-loading test methods on the degradation of light-emitting diode modules
stitch peel	Improved Etching Recipe for Exposing Cu Wire allowing Reliable Stitch Pull
stitch pull	Improved Etching Recipe for Exposing Cu Wire allowing Reliable Stitch Pull
Strain	Correlation of gate leakage and local strain distribution in GaN/AlGaN HEMT structures
stress measurement	Fast and Trusted Intrinsic Stress Measurement to Facilitate Improved Reliability Assessments
Stress-induced Birefringence	Copper Through Silicon Vias Studied by Photoelastic Scanning Infrared Microscopy
STT-MTJ	Reliability analysis of hybrid Spin Transfer Torque Magnetic Tunnel Junction/CMOS Majority Voters
stuck-at failure modes	Static logic state analysis by TLS on powered logic circuits: Three case studies for suspected stuck-at failure modes
surface morphology	Effect of PCBA surface morphology and chemistry on water layer formation under humid conditions and corrosion reliability
switching	Topologies for inverter like operation of power cycling tests
system level ESD	Impact on Non-linear Capacitances on Transient Waveforms during System Level ESD Stress
system reliability	DRES: Data recovery for condition monitoring to enhance system reliability
T
T-Cad device simulation	Failure Rate Calculation Method for High Power Devices in Space Applications at Low Earth Orbit
TCAD	FDSOI and Bulk CMOS SRAM Cells Resilience to Radiation Effects
TCOB	77Ghz Automotive RADAR in eWLB package: from consumer to automotive packaging
TED	Structural disturbances in GaN HEMT layers as source of leakage current, influencing device performance and reliability
Telluric radiation	Natural Radiation Events in CCD Imagers at Ground Level
TEM	Fault isolation at P/N junction by nanoprober
temperatur cycling on board	77Ghz Automotive RADAR in eWLB package: from consumer to automotive packaging
Temperature Compensation Point (TCP)	Investigation of Temperature Variations on Analog/RF Linearity Performance of Stacked Gate GEWE-SiNW MOSFET for Improved Device Reliability
Tensile properties	Numerical Investigation of the Effects of Phosphorus on the Mechanical Responses of [1 1 0]-oriented Silicon Nano-wires
Test bench	Experimental study of the short-circuit robustness of 600V E-mode GaN transistors
Thermal accelerated tests	Evolution study of the ElectroMagnetic Interference for RF LDMOS in series chopper application after thermal accelerated tests
Thermal conductivity	Catastrophic optical damage of high power InGaAs/AlGaAs laser diodes
Thermal Laser Stimulation	Static logic state analysis by TLS on powered logic circuits: Three case studies for suspected stuck-at failure modes
Thermal resistance	Transient thermal analysis for accelerated reliability testing of LEDs
Thermal runaway	Comparison of Thermal Runaway Limits under Different Test Conditions Based on a 4.5 kV IGBT
thermal simulation	Thermal design optimization of novel modular power converter assembly enabling higher performance, reliability and availability
thermal stress	Power cycle reliability of Cu nanoparticle joint dependent on a mismatch of coefficients of thermal expansion Negative bias illumination stress instability in amorphous InGaZnO thin film transistors with transparent source and drain
thermal transient procedure	Lifetime and Manufacturability of Integrated Power Electronics
Thermo-mechanical fatigue	Mechanisms of metallization degradation in high power diodes
thermo-mechanical finite element analysis	Fatigue testing method for fine bond wires in an LQFP Package
Thermo-mechanical stress	Mission-profile-based stress analysis of bond-wires in SiC power modules
threshold voltage	Gate oxide degradation of SiC MOSFET under short-circuit aging tests
Threshold voltage drop	Impact of Resistive Paths on NVM Array Reliability: Application to Flash & ReRAM Memories
Through Silicon Vias	Copper Through Silicon Vias Studied by Photoelastic Scanning Infrared Microscopy
TID	The radiation test based assessment of process quality and reliability for conventional 65-nm CMOS technology
TID test	A run-time built-in approach of TID test in SRAM based FPGAs
time dependent breakdown	Experimental observation of TDDB-like behavior in reverse-biased green InGaN LEDs
time-domain waveform measurement	Continuous Time-Domain RF waveforms monitoring under overdrive stress condition of AlGaN/GaN HEMTs
Time-Frequency Acquisition	Automatic process for Time-Frequency scan of VLSI
Tip	Scanning Microwave Microscopy for Electronic Device Analysis on Nanometre Scale
Total ionizing dose	Electromagnetic susceptibility characterization of double SOI device
Transconductance	Effects of drain quiescent voltage on the ageing of AlGaN/GaN HEMT devices in pulsed RF mode
Transient simulation	Impact on Non-linear Capacitances on Transient Waveforms during System Level ESD Stress
Transient thermal analysis	Transient thermal analysis for accelerated reliability testing of LEDs
transparent source and drain	Negative bias illumination stress instability in amorphous InGaZnO thin film transistors with transparent source and drain Device instability of amorphous InGaZnO thin film transistors with transparent source and drain
Traps	Effects of drain quiescent voltage on the ageing of AlGaN/GaN HEMT devices in pulsed RF mode
TRIDYN	Ga contamination in silicon by focused ion beam milling: Atom Probe Tomography and simulation with dynamic model
TRIM	Ga contamination in silicon by focused ion beam milling: Atom Probe Tomography and simulation with dynamic model
TSD	Structural disturbances in GaN HEMT layers as source of leakage current, influencing device performance and reliability
TSV	Fast and Trusted Intrinsic Stress Measurement to Facilitate Improved Reliability Assessments
TSVs	Automatized Failure Analysis of Tungsten Coated TSVs via Scanning Acoustic Microscopy
U
UIS	Numerical study of destruction phenomena for punch-through IGBTs under unclamped inductive switching
UIS test	UIS test of high-voltage GaN-HEMTs with p-type gate structure
Ultra-short gate length	Reliability assessment of ultra-short gate length AlGaN/GaN HEMTs on Si substrate by on-state step stress
V
Variability	Resistive RAM Variability Monitoring using a Ring Oscillator based Test Chip Degradation and Recovery of variability due to BTI
Vccmin	Early Detection and Prediction of HKMG SRAM HTOL Performance by WLR PBTI Tests
VCE(T)-method	Internal processes in power semiconductors at virtual junction temperature measurement
VCSEL	ESD tests on 850 nm GaAs-based VCSELs
Verification tool	On the need for a new ESD verification methodology to improve the reliability of ICs in advanced 28nm UTBB FDSOI technology
Vibration Fatigue	Fatigue Life Prediction Model for Accelerated Testing of Electronic Components under Non-Gaussian Random Vibration Excitations
VLSI devices	On the Prediction of Radiation-Induced SETs in Flash-based FPGAs
Voids	Power electronic assemblies: thermo-mechanical degradations of gold-tin solder for attaching devices
voltage stress	Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop
VTH DISTRIBUTIONS	Degradation and Recovery of variability due to BTI
W
Wafer level bonding	Optimization of contact metallizations for reliable wafer level Au-Sn bonds
wafer level packaging	77Ghz Automotive RADAR in eWLB package: from consumer to automotive packaging
water film	Effect of PCBA surface morphology and chemistry on water layer formation under humid conditions and corrosion reliability
Wavelets Transform	Automatic process for Time-Frequency scan of VLSI
wide band-gap semiconductor	Role of Two-Dimensional Electron Gas (2DEG) in AlGaN/GaN High Electron Mobility Transistor (HEMT) ON-State Degradation
wide bandgap	Body diode reliability investigation of SiC power MOSFETs
width dependence	Channel width dependence of AC stress on bulk nMOSFETs
wire bond fatigue	Fatigue testing method for fine bond wires in an LQFP Package
WLR	Plasma Process Induced Damage Detection by Fast Wafer Level Reliability Monitoring for Automotive Applications
X
X-Ray	The radiation test based assessment of process quality and reliability for conventional 65-nm CMOS technology Detection of cracks in multilayer ceramic capacitors by X-ray imaging
XFEM	Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
XSEM	Application of Fast Laser Deprocessing Techniques on Large Cross-sectional View Area Sample with FIB-SEM Dual Beam System
Y
Yield enhancement	Evolution of navigation and simulation tools in failure analysis
Z
ZnO:B TCO thin film	Effect of H/Ar treatment on ZnO:B transparent conducting oxide for flexible a-Si:H/μc-Si:H photovoltaic modules under damp heat stress

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